Modeling electrodeposition in LIGA microfabrication using an arbitrary-Lagrangian-Eulerian formulation for moving-boundary tracking with repeated re-meshing.

Conference · Sun Jun 01 00:00:00 EDT 2003

OSTI ID:1002030

Chen, Ken Shuang

Electrodeposition is a key process in LIGA (Lithographie, Galvanoformung, Abformung - German words for lithography, electroplating and molding) - microfabrication, which is increasingly demonstrated to be a viable technology for fabricating micro-devices or parts. LIGA Electrodeposition involves complex multi-physics phenomena: (1) diffusion, migration, and convection of charged species in a centimeter-scale electrolyte-bath region and in micron-scale featurecavity or trench regions; (2) homogeneous and heterogeneous electrochemical reactions; and (3) moving deposition surface or surfaces on which metal ions (e.g., {approx} i) are electrochemically reduced to form a pure metal or an alloy.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 1002030
• Report Number(s): SAND2003-2700C; TRN: US201102%%484
• Resource Relation: Conference: Proposed for presentation at the Moving Boundaries 2003 Conference held November 4-6, 2003 in Santa Fe, NM.
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ELECTRODEPOSITION
MATHEMATICAL MODELS
FABRICATION
MINIATURIZATION
KINETICS