Measurement of Sn and In Solidification Undercooling and Lattice Expansion Using in situ x-ray diffraction
- Lawrence Livermore National Laboratory (LLNL)
- ORNL
Undercooling of low melting point metals, Sn and In, on graphite, Cu, and Au-coated Cu surfaces is examined using an in-situ x-ray diffraction technique. Undercoolings of up to 56.1 C were observed for Sn solidified on graphite, which is a non-wetting substrate, while lower undercoolings were observed for Sn of 17.3 C on Au/Ni/Cu and 10.5 C on Cu surfaces. Indium behaved quite differently, showing undercoolings of less than 4 C on all three substrates. In addition, lattice expansion/contraction behavior of Sn, In and intermetallic compounds (IMCs) that formed during the reaction of Sn with the Au/Ni/Cu surface were measured. Results showed anisotropic and non-linear expansion of both Sn and In, with a contraction, rather than expansion, of the basal planes of In during heating. The principal IMC that formed between Sn and the Au/Ni/Cu surface was characterized as CuSn and had an average expansion coefficient of 13.6x10-6/ C, which is less than that of Sn or Cu.
- Research Organization:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC)
- DOE Contract Number:
- DE-AC05-00OR22725
- OSTI ID:
- 1001292
- Journal Information:
- Journal of Electronic Materials, Vol. 40, Issue 2; ISSN 0361--5235
- Country of Publication:
- United States
- Language:
- English
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