Technologies 2
Abstract
Advanced Packaging in Leti. Topics include wafter level packaging, key processes & technologies, applications examples, 3D integration, key processes & technologies, and applications examples.
- Authors:
- Publication Date:
- OSTI Identifier:
- 1012145
- Resource Type:
- Multimedia
- Country of Publication:
- CERN
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; LETI; CEA; ATOMS; PACKAGING; BONDING; 3D INTEGRATION
Citation Formats
Henry, David. Technologies 2. CERN: N. p., 2011.
Web.
Henry, David. Technologies 2. CERN.
Henry, David. Mon .
"Technologies 2". CERN. https://www.osti.gov/servlets/purl/1012145.
@article{osti_1012145,
title = {Technologies 2},
author = {Henry, David},
abstractNote = {Advanced Packaging in Leti. Topics include wafter level packaging, key processes & technologies, applications examples, 3D integration, key processes & technologies, and applications examples.},
doi = {},
journal = {},
number = ,
volume = ,
place = {CERN},
year = {Mon Mar 14 00:00:00 EDT 2011},
month = {Mon Mar 14 00:00:00 EDT 2011}
}