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Title: Thermal conductance measurements of bolted copper joints for SuperCDMS

Abstract

Joint thermal conductance testing has been undertaken for bolted copper to copper connections from 60 mK to 26 K. This testing was performed to validate an initial design basis for the SuperCDMS experiment, where a dilution refrigerator will be coupled to a cryostat via multiple bolted connections. Copper used during testing was either gold plated or passivated with citric acid to prevent surface oxidation. Finally, the results we obtained are well fit by a power law regression of joint thermal conductance to temperature and match well with data collected during a literature review.

Authors:
 [1];  [1];  [1];  [2];  [3];  [3];  [4];  [4]
  1. Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
  2. California Inst. of Technology (CalTech), Pasadena, CA (United States)
  3. Univ. of California, Berkeley, CA (United States)
  4. Pacific Northwest National Lab. (PNNL), Richland, WA (United States)
Publication Date:
Research Org.:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States); Pacific Northwest National Lab. (PNNL), Richland, WA (United States)
Sponsoring Org.:
USDOE Office of Science (SC), High Energy Physics (HEP)
Contributing Org.:
SuperCDMS
OSTI Identifier:
1253011
Alternate Identifier(s):
OSTI ID: 1372953
Report Number(s):
FERMILAB-PUB-14-522-PPD
Journal ID: ISSN 0011-2275; 1402733
Grant/Contract Number:  
AC02-07CH11359; De-AC02-07CH11359; FERMILAB-PUB-14-522-PPD
Resource Type:
Accepted Manuscript
Journal Name:
Cryogenics
Additional Journal Information:
Journal Volume: 70; Journal ID: ISSN 0011-2275
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
43 PARTICLE ACCELERATORS; Joint conductance; Contact; Bolt; Copper; Boundary resistance

Citation Formats

Schmitt, R. L., Tatkowski, G., Ruschman, M., Golwala, S., Kellaris, N., Daal, M., Hall, J., and Hoppe, E. W. Thermal conductance measurements of bolted copper joints for SuperCDMS. United States: N. p., 2015. Web. doi:10.1016/j.cryogenics.2015.04.006.
Schmitt, R. L., Tatkowski, G., Ruschman, M., Golwala, S., Kellaris, N., Daal, M., Hall, J., & Hoppe, E. W. Thermal conductance measurements of bolted copper joints for SuperCDMS. United States. https://doi.org/10.1016/j.cryogenics.2015.04.006
Schmitt, R. L., Tatkowski, G., Ruschman, M., Golwala, S., Kellaris, N., Daal, M., Hall, J., and Hoppe, E. W. Tue . "Thermal conductance measurements of bolted copper joints for SuperCDMS". United States. https://doi.org/10.1016/j.cryogenics.2015.04.006. https://www.osti.gov/servlets/purl/1253011.
@article{osti_1253011,
title = {Thermal conductance measurements of bolted copper joints for SuperCDMS},
author = {Schmitt, R. L. and Tatkowski, G. and Ruschman, M. and Golwala, S. and Kellaris, N. and Daal, M. and Hall, J. and Hoppe, E. W.},
abstractNote = {Joint thermal conductance testing has been undertaken for bolted copper to copper connections from 60 mK to 26 K. This testing was performed to validate an initial design basis for the SuperCDMS experiment, where a dilution refrigerator will be coupled to a cryostat via multiple bolted connections. Copper used during testing was either gold plated or passivated with citric acid to prevent surface oxidation. Finally, the results we obtained are well fit by a power law regression of joint thermal conductance to temperature and match well with data collected during a literature review.},
doi = {10.1016/j.cryogenics.2015.04.006},
journal = {Cryogenics},
number = ,
volume = 70,
place = {United States},
year = {Tue Apr 28 00:00:00 EDT 2015},
month = {Tue Apr 28 00:00:00 EDT 2015}
}

Journal Article:

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Cited by: 4 works
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