Impact of pulse thermal processing on the properties of inkjet printed metal and flexible sensors
Abstract
In this paper, we report on the low temperature processing of environmental sensors employing pulse thermal processing (PTP) technique to define a path toward flexible sensor technology on plastic, paper, and fabric substrates. Inkjet printing and pulse thermal processing technique were used to realize mask-less, additive integration of low-cost sensors on polymeric substrates with specific focus on temperature, humidity, and strain sensors. The printed metal line performance was evaluated in terms of the electrical conductivity characteristics as a function of post-deposition thermal processing conditions. The PTP processed Ag metal lines exhibited high conductivity with metal sheet resistance values below 100 mΩ/{whitesquare} using a pulse width as short as 250 μs. The flexible temperature and relative humidity sensors were defined on flexible polyimide substrates by direct printing of Ag metal structures. The printed resistive temperature sensor and capacitive humidity sensor were characterized for their sensitivity with focus on future smart-building applications. Strain gauges were printed on polyimide substrate to determine the mechanical properties of the silver nanoparticle films. Finally, the observed electrical properties of the printed metal lines and the sensitivity of the flexible sensors show promise for the realization of a high performance print-on-demand technology exploiting low thermal-budget PTP technique.
- Authors:
-
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Publication Date:
- Research Org.:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- Sponsoring Org.:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE), Energy Efficiency Office. Building Technologies Office; USDOE Laboratory Directed Research and Development (LDRD) Program
- OSTI Identifier:
- 1185477
- Grant/Contract Number:
- AC05-00OR22725
- Resource Type:
- Accepted Manuscript
- Journal Name:
- ECS Journal of Solid State Science and Technology
- Additional Journal Information:
- Journal Volume: 4; Journal Issue: 4; Journal ID: ISSN 2162-8769
- Publisher:
- Electrochemical Society
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; printed electronics; pulse thermal processing; sensors
Citation Formats
Joshi, Pooran C., Kuruganti, Teja, and Killough, Stephen M. Impact of pulse thermal processing on the properties of inkjet printed metal and flexible sensors. United States: N. p., 2015.
Web. doi:10.1149/2.0161504jss.
Joshi, Pooran C., Kuruganti, Teja, & Killough, Stephen M. Impact of pulse thermal processing on the properties of inkjet printed metal and flexible sensors. United States. https://doi.org/10.1149/2.0161504jss
Joshi, Pooran C., Kuruganti, Teja, and Killough, Stephen M. Wed .
"Impact of pulse thermal processing on the properties of inkjet printed metal and flexible sensors". United States. https://doi.org/10.1149/2.0161504jss. https://www.osti.gov/servlets/purl/1185477.
@article{osti_1185477,
title = {Impact of pulse thermal processing on the properties of inkjet printed metal and flexible sensors},
author = {Joshi, Pooran C. and Kuruganti, Teja and Killough, Stephen M.},
abstractNote = {In this paper, we report on the low temperature processing of environmental sensors employing pulse thermal processing (PTP) technique to define a path toward flexible sensor technology on plastic, paper, and fabric substrates. Inkjet printing and pulse thermal processing technique were used to realize mask-less, additive integration of low-cost sensors on polymeric substrates with specific focus on temperature, humidity, and strain sensors. The printed metal line performance was evaluated in terms of the electrical conductivity characteristics as a function of post-deposition thermal processing conditions. The PTP processed Ag metal lines exhibited high conductivity with metal sheet resistance values below 100 mΩ/{whitesquare} using a pulse width as short as 250 μs. The flexible temperature and relative humidity sensors were defined on flexible polyimide substrates by direct printing of Ag metal structures. The printed resistive temperature sensor and capacitive humidity sensor were characterized for their sensitivity with focus on future smart-building applications. Strain gauges were printed on polyimide substrate to determine the mechanical properties of the silver nanoparticle films. Finally, the observed electrical properties of the printed metal lines and the sensitivity of the flexible sensors show promise for the realization of a high performance print-on-demand technology exploiting low thermal-budget PTP technique.},
doi = {10.1149/2.0161504jss},
journal = {ECS Journal of Solid State Science and Technology},
number = 4,
volume = 4,
place = {United States},
year = {Wed Mar 11 00:00:00 EDT 2015},
month = {Wed Mar 11 00:00:00 EDT 2015}
}
Free Publicly Available Full Text
Publisher's Version of Record
Other availability
Search WorldCat to find libraries that may hold this journal
Cited by: 10 works
Citation information provided by
Web of Science
Web of Science
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
Organic Semiconductor Devices with Enhanced Field and Environmental Responses for Novel Applications
journal, July 2008
- Someya, Takao; Pal, Bholanath; Huang, Jia
- MRS Bulletin, Vol. 33, Issue 7
Generation of nitrogen acceptors in ZnO using pulse thermal processing
journal, April 2008
- Xu, Jun; Ott, Ronald; Sabau, Adrian S.
- Applied Physics Letters, Vol. 92, Issue 15
RFID Tag and RF Structures on a Paper Substrate Using Inkjet-Printing Technology
journal, December 2007
- Yang, Li; Rida, Amin; Vyas, Rushi
- IEEE Transactions on Microwave Theory and Techniques, Vol. 55, Issue 12, p. 2894-2901
Development of inkjet printed strain sensors
journal, September 2013
- Correia, V.; Caparros, C.; Casellas, C.
- Smart Materials and Structures, Vol. 22, Issue 10
Review Article: Methods for Fault Detection, Diagnostics, and Prognostics for Building Systems—A Review, Part I
journal, January 2005
- Katipamula, Srinivas; Brambley, Michael
- HVAC&R Research, Vol. 11, Issue 1
3-D printing: The new industrial revolution
journal, March 2012
- Berman, Barry
- Business Horizons, Vol. 55, Issue 2
30.2: Invited Paper : Advancements in Inkjet Printing for OLED Mass Production
journal, June 2014
- Madigan, Conor F.; Hauf, Chris R.; Barkley, Lucas D.
- SID Symposium Digest of Technical Papers, Vol. 45, Issue 1
Why Do We Use So Much Energy, and What For?
book, January 2011
- Sioshansi, Fereidoon P.
- Energy, Sustainability and the Environment
Low temperature nanoparticle sintering with continuous wave and pulse lasers
journal, April 2011
- Kumpulainen, Tero; Pekkanen, Jussi; Valkama, Jani
- Optics & Laser Technology, Vol. 43, Issue 3
Transparent conductors composed of nanomaterials
journal, January 2014
- Layani, Michael; Kamyshny, Alexander; Magdassi, Shlomo
- Nanoscale, Vol. 6, Issue 11
Highly Sensitive Skin-Mountable Strain Gauges Based Entirely on Elastomers
journal, June 2012
- Lu, Nanshu; Lu, Chi; Yang, Shixuan
- Advanced Functional Materials, Vol. 22, Issue 19, p. 4044-4050
Fully Printed, Highly Sensitive Multifunctional Artificial Electronic Whisker Arrays Integrated with Strain and Temperature Sensors
journal, March 2014
- Harada, Shingo; Honda, Wataru; Arie, Takayuki
- ACS Nano, Vol. 8, Issue 4
Inkjetting dielectric layer for electronic applications
journal, October 2010
- Kaija, Kimmo; Pekkanen, Ville; Mäntysalo, Matti
- Microelectronic Engineering, Vol. 87, Issue 10
Challenges and perspectives of printed electronics
conference, August 2006
- Schmidt, G.; Kempa, H.; Fuegmann, U.
- SPIE Optics + Photonics, SPIE Proceedings
Conductivity enhancement of aerosol-jet printed electronics by using silver nanoparticles ink with carbon nanotubes
journal, August 2012
- Zhao, Da; Liu, Tao; Park, Jin Gyu
- Microelectronic Engineering, Vol. 96
Standard Practice for Evaluating Ink or Coating Adhesion to Flexible Packaging Materials Using Tape--ASTM F2252/F2252M-13(2018)
standard, November 2018
- ,
- ASTM Book of Standards Volume: 15.10
A highly sensitive 3D-shaped tactile sensor
conference, July 2013
- Koiva, Risto; Zenker, Matthias; Schurmann, Carsten
- 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM)
Printed electronic on flexible and glass substrates
conference, September 2010
- Futera, Konrad; Jakubowska, Małgorzata; Kozioł, Grażyna
- Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2010, SPIE Proceedings
Inkjet printing of 3D metal–insulator–metal crossovers
journal, June 2008
- Sanchez-Romaguera, Veronica; Madec, Marie-Beatrice; Yeates, Stephen G.
- Reactive and Functional Polymers, Vol. 68, Issue 6
All-Inkjet-Printed, All-Air-Processed Solar Cells
journal, May 2014
- Jung, Sungjune; Sou, Antony; Banger, Kulbinder
- Advanced Energy Materials, Vol. 4, Issue 14
Air stable high resolution organic transistors by selective laser sintering of ink-jet printed metal nanoparticles
journal, April 2007
- Ko, Seung H.; Pan, Heng; Grigoropoulos, Costas P.
- Applied Physics Letters, Vol. 90, Issue 14
Embedded 3D Printing of Strain Sensors within Highly Stretchable Elastomers
journal, June 2014
- Muth, Joseph T.; Vogt, Daniel M.; Truby, Ryan L.
- Advanced Materials, Vol. 26, Issue 36, p. 6307-6312
All-printed smart structures: a viable option?
conference, March 2014
- O'Donnell, John; Ahmadkhanlou, Farzad; Yoon, Hwan-Sik
- SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, SPIE Proceedings
Large Area Electronics Using Printing Methods
journal, July 2005
- Parashkov, R.; Becker, E.; Riedl, T.
- Proceedings of the IEEE, Vol. 93, Issue 7
Pulse-thermal processing for electronic applications
journal, June 2006
- Ott, Ronald
- JOM, Vol. 58, Issue 6
Why Going Towards Plastic and Flexible Sensors?
journal, January 2011
- Briand, Danick; Molina-Lopez, Francisco; Quintero, Andrés Vásquez
- Procedia Engineering, Vol. 25
Flexible, plastic transistor-based chemical sensors
journal, May 2009
- Roberts, Mark E.; Mannsfeld, Stefan C. B.; Stoltenberg, Randall M.
- Organic Electronics, Vol. 10, Issue 3
Flexible embedded circuitry: A novel process for high density, cost effective electronics
journal, October 2010
- van den Brand, Jeroen; Kusters, Roel; Barink, Marco
- Microelectronic Engineering, Vol. 87, Issue 10
High resolution patterning for flexible electronics via roll-to-roll nanoimprint lithography
conference, March 2014
- Sabik, Sami; de Riet, Joris; Yakimets, Iryna
- SPIE Advanced Lithography, SPIE Proceedings
IR-sintering of ink-jet printed metal-nanoparticles on paper
journal, January 2012
- Tobjörk, Daniel; Aarnio, Harri; Pulkkinen, Petri
- Thin Solid Films, Vol. 520, Issue 7
Works referencing / citing this record:
A review of fault detection and diagnostics methods for building systems
journal, April 2017
- Kim, Woohyun; Katipamula, Srinivas
- Science and Technology for the Built Environment, Vol. 24, Issue 1
Laser Sintering of Printed Anodes for Al-Air Batteries
journal, January 2018
- Yu, Yongchao; Chen, Min; Wang, Shutong
- Journal of The Electrochemical Society, Vol. 165, Issue 3