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Title: Effect of the nature of the substrate on the surface chemistry of atomic layer deposition precursors

Abstract

The thermal chemistry of Cu(I)-sec-butyl-2-iminopyrrolidinate, a promising copper amidinate complex for atomic layer deposition (ALD) applications, was explored comparatively on several surfaces by using a combination of surface-sensitive techniques, specifically temperature-programmed desorption and x-ray photoelectron spectroscopy (XPS). The substrates explored include single crystals of transition metals (Ni(110) and Cu(110)), thin oxide films (NiO/Ni(110) and SiO2/Ta), and oxygen-treated metals (O/Cu(110)). Decomposition of the pyrrolidinate ligand leads to the desorption of several gas-phase products, including CH3CN, HCN and butene from the metals and CO and CO2 from the oxygen-containing surfaces. In all cases dehydrogenation of the organic moieties is accompanied by hydrogen removal from the surface, in the form of H2 on metals and mainly as water from the metal oxides, but the threshold for this chemistry varies wildly, from 270 K on Ni(110) to 430 K on O/Cu(110), 470 K on Cu(110), 500 K on NiO/Ni(110), and 570 K on SiO2/Ta. Here, copper reduction is also observed in both the Cu 2p3/2 XPS and the Cu L3VV Auger (AES) spectra, reaching completion by 300 K on Ni(110) but occurring only between 500 and 600 K on Cu(110). On NiO/Ni(110), both Cu(I) and Cu(0) coexist between 200 and 500 K, and onmore » SiO2/Ta a change happens between 500 and 600 K but the reduction is limited, with the copper atoms retaining a significant ionic character. Additional experiments to test adsorption at higher temperatures led to the identification of temperature windows for the self-limiting precursor uptake required for ALD between approximately 300 and 450 K on both Ni(110) and NiO/Ni(110); the range on SiO2 had been previously determined to be wider, reaching an upper limit at about 500 K. Finally, deposition of copper metal films via ALD cycles with O2 as the co-reactant was successfully accomplished on the Ni(110) substrate.« less

Authors:
 [1];  [2];  [2];  [1]
  1. Univ. of California, Riverside, CA (United States). Dept. of Chemistry
  2. Carleton Univ., Ottawa, ON (Canada). Dept. of Chemistry
Publication Date:
Research Org.:
Univ. of California, Riverside, CA (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
OSTI Identifier:
1474074
Alternate Identifier(s):
OSTI ID: 1330595
Grant/Contract Number:  
FG02-03ER46599; SC0001839
Resource Type:
Accepted Manuscript
Journal Name:
Journal of Chemical Physics
Additional Journal Information:
Journal Volume: 146; Journal Issue: 5; Journal ID: ISSN 0021-9606
Publisher:
American Institute of Physics (AIP)
Country of Publication:
United States
Language:
English
Subject:
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY

Citation Formats

Yao, Yunxi, Coyle, Jason P., Barry, Seán T., and Zaera, Francisco. Effect of the nature of the substrate on the surface chemistry of atomic layer deposition precursors. United States: N. p., 2016. Web. doi:10.1063/1.4966201.
Yao, Yunxi, Coyle, Jason P., Barry, Seán T., & Zaera, Francisco. Effect of the nature of the substrate on the surface chemistry of atomic layer deposition precursors. United States. https://doi.org/10.1063/1.4966201
Yao, Yunxi, Coyle, Jason P., Barry, Seán T., and Zaera, Francisco. Tue . "Effect of the nature of the substrate on the surface chemistry of atomic layer deposition precursors". United States. https://doi.org/10.1063/1.4966201. https://www.osti.gov/servlets/purl/1474074.
@article{osti_1474074,
title = {Effect of the nature of the substrate on the surface chemistry of atomic layer deposition precursors},
author = {Yao, Yunxi and Coyle, Jason P. and Barry, Seán T. and Zaera, Francisco},
abstractNote = {The thermal chemistry of Cu(I)-sec-butyl-2-iminopyrrolidinate, a promising copper amidinate complex for atomic layer deposition (ALD) applications, was explored comparatively on several surfaces by using a combination of surface-sensitive techniques, specifically temperature-programmed desorption and x-ray photoelectron spectroscopy (XPS). The substrates explored include single crystals of transition metals (Ni(110) and Cu(110)), thin oxide films (NiO/Ni(110) and SiO2/Ta), and oxygen-treated metals (O/Cu(110)). Decomposition of the pyrrolidinate ligand leads to the desorption of several gas-phase products, including CH3CN, HCN and butene from the metals and CO and CO2 from the oxygen-containing surfaces. In all cases dehydrogenation of the organic moieties is accompanied by hydrogen removal from the surface, in the form of H2 on metals and mainly as water from the metal oxides, but the threshold for this chemistry varies wildly, from 270 K on Ni(110) to 430 K on O/Cu(110), 470 K on Cu(110), 500 K on NiO/Ni(110), and 570 K on SiO2/Ta. Here, copper reduction is also observed in both the Cu 2p3/2 XPS and the Cu L3VV Auger (AES) spectra, reaching completion by 300 K on Ni(110) but occurring only between 500 and 600 K on Cu(110). On NiO/Ni(110), both Cu(I) and Cu(0) coexist between 200 and 500 K, and on SiO2/Ta a change happens between 500 and 600 K but the reduction is limited, with the copper atoms retaining a significant ionic character. Additional experiments to test adsorption at higher temperatures led to the identification of temperature windows for the self-limiting precursor uptake required for ALD between approximately 300 and 450 K on both Ni(110) and NiO/Ni(110); the range on SiO2 had been previously determined to be wider, reaching an upper limit at about 500 K. Finally, deposition of copper metal films via ALD cycles with O2 as the co-reactant was successfully accomplished on the Ni(110) substrate.},
doi = {10.1063/1.4966201},
journal = {Journal of Chemical Physics},
number = 5,
volume = 146,
place = {United States},
year = {Tue Nov 01 00:00:00 EDT 2016},
month = {Tue Nov 01 00:00:00 EDT 2016}
}

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Works referenced in this record:

Thermal chemistry of Mn 2 (CO) 10 during deposition of thin manganese films on silicon oxide and on copper surfaces
journal, January 2012

  • Qin, Xiangdong; Sun, Huaxing; Zaera, Francisco
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 30, Issue 1
  • DOI: 10.1116/1.3658373

Xenon as a probe for minority sites on solid surfaces
journal, May 2006

  • Guo, Hansheng; Zaera, Francisco
  • Nature Materials, Vol. 5, Issue 6
  • DOI: 10.1038/nmat1654

Copper Iminopyrrolidinates: A Study of Thermal and Surface Chemistry
journal, January 2013

  • Coyle, Jason P.; Pallister, Peter J.; Kurek, Agnieszka
  • Inorganic Chemistry, Vol. 52, Issue 2
  • DOI: 10.1021/ic3021035

X-ray-Initiated Metal-Promoted Thin Film Growth
journal, April 2012

  • Kim, Taeseung; Zaera, Francisco
  • The Journal of Physical Chemistry C, Vol. 116, Issue 15
  • DOI: 10.1021/jp2123339

Surface Chemistry of Copper(I) Acetamidinates in Connection with Atomic Layer Deposition (ALD) Processes
journal, July 2011

  • Ma, Qiang; Guo, Hansheng; Gordon, Roy G.
  • Chemistry of Materials, Vol. 23, Issue 14
  • DOI: 10.1021/cm200432t

Dissociative hydrogen adsorption and its reaction with oxygen on Cu(110)
journal, October 1989


Initial surface reactions of atomic layer deposition
journal, June 2009


The surface chemistry of thin film atomic layer deposition (ALD) processes for electronic device manufacturing
journal, January 2008

  • Zaera, Francisco
  • Journal of Materials Chemistry, Vol. 18, Issue 30
  • DOI: 10.1039/b803832e

Current Trends in Patterning with Copper
journal, May 2002

  • Rickerby, J.; Steinke, J. H. G.
  • Chemical Reviews, Vol. 102, Issue 5
  • DOI: 10.1021/cr0104476

In Situ Studies on Reaction Mechanisms in Atomic Layer Deposition
journal, January 2013


On the nature of the active site in catalysis: the reactivity of surface oxygen on Cu(110)
journal, September 2010


Influence of Oxygen Exposure on the Nucleation of Platinum Atomic Layer Deposition: Consequences for Film Growth, Nanopatterning, and Nanoparticle Synthesis
journal, April 2013

  • Mackus, Adriaan J. M.; Verheijen, Marcel A.; Leick, Noémi
  • Chemistry of Materials, Vol. 25, Issue 9
  • DOI: 10.1021/cm400562u

Thermal Decomposition of Copper Iminopyrrolidinate Atomic Layer Deposition (ALD) Precursors on Silicon Oxide Surfaces
journal, June 2016

  • Yao, Yunxi; Coyle, Jason P.; Barry, Seán T.
  • The Journal of Physical Chemistry C, Vol. 120, Issue 26
  • DOI: 10.1021/acs.jpcc.6b03818

Thermal chemistry of copper(I)- N,N ′ -di- sec -butylacetamidinate on Cu(110) single-crystal surfaces
journal, January 2012

  • Ma, Qiang; Zaera, Francisco; Gordon, Roy G.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 30, Issue 1
  • DOI: 10.1116/1.3658381

Heteroleptic iminopyrrolidinates of aluminium
journal, January 2010

  • Wasslen, Yamile A.; Kurek, Agnieszka; Johnson, Paul A.
  • Dalton Transactions, Vol. 39, Issue 38
  • DOI: 10.1039/c0dt00267d

Energy-enhanced atomic layer deposition for more process and precursor versatility
journal, December 2013


Size Dependent Effects in Nucleation of Ru and Ru Oxide Thin Films by Atomic Layer Deposition Measured by Synchrotron Radiation X-ray Diffraction
journal, August 2013

  • Methaapanon, Rungthiwa; Geyer, Scott M.; Brennan, Sean
  • Chemistry of Materials, Vol. 25, Issue 17
  • DOI: 10.1021/cm401585k

Thermal chemistry of the Cu-KI5 atomic layer deposition precursor on a copper surface
journal, January 2015

  • Ma, Qiang; Zaera, Francisco
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 33, Issue 1
  • DOI: 10.1116/1.4896940

Atomic Layer Deposition: An Overview
journal, January 2010

  • George, Steven M.
  • Chemical Reviews, Vol. 110, Issue 1, p. 111-131
  • DOI: 10.1021/cr900056b

Mechanisms of surface reactions in thin solid film chemical deposition processes
journal, December 2013


A thermal desorption and x‐ray photoelectron spectroscopy study of the surface chemistry of iron pentacarbonyl
journal, May 1989

  • Zaera, Francisco
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 7, Issue 3
  • DOI: 10.1116/1.575858

Surface Defect Characterization in Oxygen-Dosed Nickel Surfaces and in NiO Thin Films by CO Adsorption−Desorption Experiments
journal, October 1997

  • Öfner, Helmut; Zaera, Francisco
  • The Journal of Physical Chemistry B, Vol. 101, Issue 44
  • DOI: 10.1021/jp971854h

Adsorption states of carbon monoxide on oxygenated Cu(110) faces
journal, January 1992

  • Schneider, T.; Hirschwald, W.
  • Catalysis Letters, Vol. 16, Issue 3
  • DOI: 10.1007/BF00764345

Thermal Conversion of 2-Propyl Iodide on O/Ni(100): Changes in Product Distribution with Varying Oxygen Coverages
journal, July 1997


The Surface Chemistry of Atomic Layer Depositions of Solid Thin Films
journal, May 2012

  • Zaera, Francisco
  • The Journal of Physical Chemistry Letters, Vol. 3, Issue 10
  • DOI: 10.1021/jz300125f

A brief review of atomic layer deposition: from fundamentals to applications
journal, June 2014


History of atomic layer deposition and its relationship with the American Vacuum Society
journal, September 2013

  • Parsons, Gregory N.; Elam, Jeffrey W.; George, Steven M.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 31, Issue 5
  • DOI: 10.1116/1.4816548

Thermal Chemistry of Cu(I)-Iminopyrrolidinate and Cu(I)-Guanidinate Atomic Layer Deposition (ALD) Precursors on Ni(110) Single-Crystal Surfaces
journal, August 2013

  • Kim, Taeseung; Yao, Yunxi; Coyle, Jason P.
  • Chemistry of Materials, Vol. 25, Issue 18
  • DOI: 10.1021/cm401707h

Atomic Layer Deposition of Noble Metals and Their Oxides
journal, September 2013

  • Hämäläinen, Jani; Ritala, Mikko; Leskelä, Markku
  • Chemistry of Materials, Vol. 26, Issue 1
  • DOI: 10.1021/cm402221y

Chemistry of Cu(acac) 2 on Ni(110) and Cu(110) surfaces: Implications for atomic layer deposition processes
journal, January 2013

  • Ma, Qiang; Zaera, Francisco
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 31, Issue 1
  • DOI: 10.1116/1.4763358

Reliability of copper low-k interconnects
journal, March 2010

  • Tőkei, Zsolt; Croes, Kristof; Beyer, Gerald P.
  • Microelectronic Engineering, Vol. 87, Issue 3
  • DOI: 10.1016/j.mee.2009.06.025

Uptake of Copper Acetamidinate ALD Precursors on Nickel Surfaces
journal, January 2010

  • Ma, Qiang; Guo, Hansheng; Gordon, Roy G.
  • Chemistry of Materials, Vol. 22, Issue 2
  • DOI: 10.1021/cm9027447

Surface chemistry of a Cu(I) beta-diketonate precursor and the atomic layer deposition of Cu 2 O on SiO 2 studied by x-ray photoelectron spectroscopy
journal, July 2014

  • Dhakal, Dileep; Waechtler, Thomas; Schulz, Stefan E.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 32, Issue 4
  • DOI: 10.1116/1.4878815

Works referencing / citing this record:

Role of oligomer structures in the surface chemistry of amidinate metal complexes used for atomic layer deposition of thin films
journal, October 2019

  • Guerrero-Sánchez, Jonathan; Chen, Bo; Takeuchi, Noboru
  • Journal of Materials Research, Vol. 35, Issue 7
  • DOI: 10.1557/jmr.2019.293