Creep deformation mechanism mapping in nickel base disk superalloys
Abstract
We investigated the creep deformation mechanisms at intermediate temperature in ME3, a modern Ni-based disk superalloy, using diffraction contrast imaging. Both conventional transmission electron microscopy (TEM) and scanning TEM were utilised. Distinctly different deformation mechanisms become operative during creep at temperatures between 677-815 °C and at stresses ranging from 274 to 724 MPa. Both polycrystalline and single-crystal creep tests were conducted. The single-crystal tests provide new insight into grain orientation effects on creep response and deformation mechanisms. Creep at lower temperatures (≤760 °C) resulted in the thermally activated shearing modes such as microtwinning, stacking fault ribbons and isolated superlattice extrinsic stacking faults. In contrast, these faulting modes occurred much less frequently during creep at 815 °C under lower applied stresses. Instead, the principal deformation mode was dislocation climb bypass. In addition to the difference in creep behaviour and creep deformation mechanisms as a function of stress and temperature, it was also observed that microstructural evolution occurs during creep at 760 °C and above, where the secondary coarsened and the tertiary precipitates dissolved. Based on this work, a creep deformation mechanism map is proposed, emphasising the influence of stress and temperature on the underlying creep mechanisms.
- Authors:
-
- The Ohio State Univ., Columbus, OH (United States). Center for Electron Microscopy and Analysis
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Center for Nanophase Materials Science (CNMS)
- Publication Date:
- Research Org.:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Sponsoring Org.:
- USDOE Office of Science (SC); GE University Strategic Alliance
- OSTI Identifier:
- 1328294
- Grant/Contract Number:
- AC05-00OR22725; 1534826
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Materials at High Temperatures
- Additional Journal Information:
- Journal Volume: 33; Journal Issue: 4-5; Journal ID: ISSN 0960-3409
- Publisher:
- Maney Publishing
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; Ni-base Superalloys; SEM; TEM; STEM; Mechanism map; Creep deformation,
Citation Formats
Smith, Timothy M., Unocic, Raymond R., Deutchman, Hallee, and Mills, Michael J. Creep deformation mechanism mapping in nickel base disk superalloys. United States: N. p., 2016.
Web. doi:10.1080/09603409.2016.1180858.
Smith, Timothy M., Unocic, Raymond R., Deutchman, Hallee, & Mills, Michael J. Creep deformation mechanism mapping in nickel base disk superalloys. United States. https://doi.org/10.1080/09603409.2016.1180858
Smith, Timothy M., Unocic, Raymond R., Deutchman, Hallee, and Mills, Michael J. Tue .
"Creep deformation mechanism mapping in nickel base disk superalloys". United States. https://doi.org/10.1080/09603409.2016.1180858. https://www.osti.gov/servlets/purl/1328294.
@article{osti_1328294,
title = {Creep deformation mechanism mapping in nickel base disk superalloys},
author = {Smith, Timothy M. and Unocic, Raymond R. and Deutchman, Hallee and Mills, Michael J.},
abstractNote = {We investigated the creep deformation mechanisms at intermediate temperature in ME3, a modern Ni-based disk superalloy, using diffraction contrast imaging. Both conventional transmission electron microscopy (TEM) and scanning TEM were utilised. Distinctly different deformation mechanisms become operative during creep at temperatures between 677-815 °C and at stresses ranging from 274 to 724 MPa. Both polycrystalline and single-crystal creep tests were conducted. The single-crystal tests provide new insight into grain orientation effects on creep response and deformation mechanisms. Creep at lower temperatures (≤760 °C) resulted in the thermally activated shearing modes such as microtwinning, stacking fault ribbons and isolated superlattice extrinsic stacking faults. In contrast, these faulting modes occurred much less frequently during creep at 815 °C under lower applied stresses. Instead, the principal deformation mode was dislocation climb bypass. In addition to the difference in creep behaviour and creep deformation mechanisms as a function of stress and temperature, it was also observed that microstructural evolution occurs during creep at 760 °C and above, where the secondary coarsened and the tertiary precipitates dissolved. Based on this work, a creep deformation mechanism map is proposed, emphasising the influence of stress and temperature on the underlying creep mechanisms.},
doi = {10.1080/09603409.2016.1180858},
journal = {Materials at High Temperatures},
number = 4-5,
volume = 33,
place = {United States},
year = {Tue May 10 00:00:00 EDT 2016},
month = {Tue May 10 00:00:00 EDT 2016}
}
Web of Science
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Works referencing / citing this record:
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