skip to main content

DOE PAGESDOE PAGES

This content will become publicly available on August 19, 2017

Title: Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology

Authors:
 [1] ;  [2] ;  [2] ;  [3] ;  [3] ;  [1]
  1. Department of Materials Science and Engineering, UCLA, Los Angeles, California 90095-1595, USA
  2. Qualcomm, San Diego, California 92121, USA
  3. Advanced Light Source, Lawrence Berkeley National Laboratory, Berkeley, California 94720, USA
Publication Date:
OSTI Identifier:
1299437
Grant/Contract Number:
AC02-05CH11231
Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Volume: 120; Journal Issue: 7; Related Information: CHORUS Timestamp: 2016-08-19 13:20:57; Journal ID: ISSN 0021-8979
Publisher:
American Institute of Physics
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English