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Title: Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology

Authors:
ORCiD logo [1];  [2]; ORCiD logo [2];  [3];  [3];  [1]
+ Show Author Affiliations
  1. Department of Materials Science and Engineering, UCLA, Los Angeles, California 90095-1595, USA
  2. Qualcomm, San Diego, California 92121, USA
  3. Advanced Light Source, Lawrence Berkeley National Laboratory, Berkeley, California 94720, USA
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1299437
Grant/Contract Number:  
AC02-05CH11231
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Name: Journal of Applied Physics Journal Volume: 120 Journal Issue: 7; Journal ID: ISSN 0021-8979
Publisher:
American Institute of Physics
Country of Publication:
United States
Language:
English

Citation Formats

Li, Menglu, Kim, Dong Wook, Gu, Sam, Parkinson, Dilworth Y., Barnard, Harold, and Tu, K. N. Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology. United States: N. p., 2016. Web. doi:10.1063/1.4961219.
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Li, Menglu, Kim, Dong Wook, Gu, Sam, Parkinson, Dilworth Y., Barnard, Harold, & Tu, K. N. Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology. United States. https://doi.org/10.1063/1.4961219
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Li, Menglu, Kim, Dong Wook, Gu, Sam, Parkinson, Dilworth Y., Barnard, Harold, and Tu, K. N. Sun . "Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology". United States. https://doi.org/10.1063/1.4961219.
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@article{osti_1299437,
title = {Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology},
author = {Li, Menglu and Kim, Dong Wook and Gu, Sam and Parkinson, Dilworth Y. and Barnard, Harold and Tu, K. N.},
abstractNote = {},
doi = {10.1063/1.4961219},
journal = {Journal of Applied Physics},
number = 7,
volume = 120,
place = {United States},
year = {Sun Aug 21 00:00:00 EDT 2016},
month = {Sun Aug 21 00:00:00 EDT 2016}
}
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Journal Article:
Free Publicly Available Full Text
Accepted Manuscript (Publisher)
Publisher's Version of Record
https://doi.org/10.1063/1.4961219
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Cited by: 15 works
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Works referenced in this record:

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Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5D integrated circuits
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journal, April 2006

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Electromigration induced failure on lead-free micro bumps in three-dimensional integrated circuits packaging
journal, July 2012

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Thermal-gradient induced abnormal Ni3Sn4 interfacial growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits
journal, December 2013

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