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Title: Robust Ag nanoplate ink for flexible electronics packaging

Nanoinks are currently a topic of heightened interest with respect to low temperature bonding processes and printable electronics. We have developed an innovative polyvinylpyrrolidone (PVP)-stabilized Ag nanoplate ink amenable to very strong low temperature packaging, and investigated the relationship between bonding strength and electrical conductivity post-bonding. PVP shell plastic deformations observed in failure microcracks with the formation of PVP nanofibers, revealed bonding strength at low temperatures (<250 °C) was primarily due to adhesive bonding. It is found that, utilizing photonic sintering, ~70 °C reduction of transformation temperature from adhesive to metallic bonding was achieved compared to that of thermal sintering. A numerical simulation was developed to better understand the influences of the light-induced heat generation, which demonstrated near-infrared light can facilitate sintering. Bonding strengths of 27 MPa were achieved at room temperatures, and 29.4 MPa at 210 °C with photonic sintering. Moreover, the anisotropic resistivity was observed with different thermal dependences. Furthermore, these results demonstrate Ag nanoplate inks have potential for low temperature 3D interconnections in lead-free microcircuits, flexible electronic packaging, and diverse sensing applications.
Authors:
 [1] ;  [2] ;  [2] ;  [3] ;  [4] ;  [4] ;  [4] ;  [4] ;  [5]
  1. Southeast Univ., Key Lab. of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, Nanjing (China); Univ. of Tennessee, Knoxville, TN (United States); Suzhou Research Institute of Southeast Univ., Suzhou (China)
  2. Univ. of Tennessee, Knoxville, TN (United States)
  3. Cape Breton Univ. Sydney (Canada)
  4. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  5. Southeast Univ., Key Lab. of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, Nanjing (China); Suzhou Research Institute of Southeast Univ., Suzhou (China)
Publication Date:
OSTI Identifier:
1266026
Grant/Contract Number:
AC05-00OR22725
Type:
Accepted Manuscript
Journal Name:
Nanoscale
Additional Journal Information:
Journal Volume: 7; Journal Issue: 16; Journal ID: ISSN 2040-3364
Publisher:
Royal Society of Chemistry
Research Org:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Center for Nanophase Materials Sciences (CNMS)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English