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Title: Crystal structure of laser-induced subsurface modifications in Si

Laser-induced subsurface modification of dielectric materials is a well-known technology. Applications include the production of optical components and selective etching. In addition to dielectric materials, the subsurface modification technology can be applied to silicon, by employing near to mid-infrared radiation. An application of subsurface modifications in silicon is laser-induced subsurface separation, which is a method to separate wafers into individual dies. Other applications for which proofs of concept exist are the formation of waveguides and resistivity tuning. However, limited knowledge is available about the crystal structure of subsurface modifications in silicon. In this paper, we investigate the geometry and crystal structure of laser-induced subsurface modifications in monocrystalline silicon wafers. Finally, in addition to the generation of lattice defects, we found that transformations to amorphous silicon and Si-iii/Si-xii occur as a result of the laser irradiation.
Authors:
 [1] ;  [2] ;  [1] ;  [3] ;  [2] ;  [2] ;  [1]
  1. Univ. of Twente, Enschede (Netherlands). Faculty of Engineering Technology. Chair of Applied Laser Technology
  2. Australian National Univ., Canberra, ACT (Australia). Research School of Physics and Engineering
  3. Australian National Univ., Canberra, ACT (Australia). Research School of Physics and Engineering; Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Chemical and Engineering Materials Division
Publication Date:
OSTI Identifier:
1265519
Type:
Accepted Manuscript
Journal Name:
Applied Physics. A, Materials Science and Processing
Additional Journal Information:
Journal Volume: 120; Journal Issue: 2; Journal ID: ISSN 0947-8396
Publisher:
Springer
Research Org:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org:
USDOE
Contributing Orgs:
Univ. of Twente, Enschede (Netherlands); Australian National Univ., Canberra, ACT (Australia)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 38 RADIATION CHEMISTRY, RADIOCHEMISTRY, AND NUCLEAR CHEMISTRY