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Title: A metastable phase of tin in 3D integrated circuit solder microbumps

Authors:
; ; ; ;
Publication Date:
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
OSTI Identifier:
1251503
Grant/Contract Number:  
AC02-05CH11231
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Scripta Materialia
Additional Journal Information:
Journal Name: Scripta Materialia Journal Volume: 102 Journal Issue: C; Journal ID: ISSN 1359-6462
Publisher:
Elsevier
Country of Publication:
United States
Language:
English

Citation Formats

Liu, Yingxia, Tamura, Nobumichi, Kim, Dong Wook, Gu, Sam, and Tu, K. N. A metastable phase of tin in 3D integrated circuit solder microbumps. United States: N. p., 2015. Web. doi:10.1016/j.scriptamat.2015.02.009.
Liu, Yingxia, Tamura, Nobumichi, Kim, Dong Wook, Gu, Sam, & Tu, K. N. A metastable phase of tin in 3D integrated circuit solder microbumps. United States. https://doi.org/10.1016/j.scriptamat.2015.02.009
Liu, Yingxia, Tamura, Nobumichi, Kim, Dong Wook, Gu, Sam, and Tu, K. N. Mon . "A metastable phase of tin in 3D integrated circuit solder microbumps". United States. https://doi.org/10.1016/j.scriptamat.2015.02.009.
@article{osti_1251503,
title = {A metastable phase of tin in 3D integrated circuit solder microbumps},
author = {Liu, Yingxia and Tamura, Nobumichi and Kim, Dong Wook and Gu, Sam and Tu, K. N.},
abstractNote = {},
doi = {10.1016/j.scriptamat.2015.02.009},
journal = {Scripta Materialia},
number = C,
volume = 102,
place = {United States},
year = {Mon Jun 01 00:00:00 EDT 2015},
month = {Mon Jun 01 00:00:00 EDT 2015}
}

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Cited by: 15 works
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Works referenced in this record:

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