A metastable phase of tin in 3D integrated circuit solder microbumps
- Authors:
- Publication Date:
- Sponsoring Org.:
- USDOE Office of Science (SC), Basic Energy Sciences (BES)
- OSTI Identifier:
- 1251503
- Grant/Contract Number:
- AC02-05CH11231
- Resource Type:
- Publisher's Accepted Manuscript
- Journal Name:
- Scripta Materialia
- Additional Journal Information:
- Journal Name: Scripta Materialia Journal Volume: 102 Journal Issue: C; Journal ID: ISSN 1359-6462
- Publisher:
- Elsevier
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Liu, Yingxia, Tamura, Nobumichi, Kim, Dong Wook, Gu, Sam, and Tu, K. N. A metastable phase of tin in 3D integrated circuit solder microbumps. United States: N. p., 2015.
Web. doi:10.1016/j.scriptamat.2015.02.009.
Liu, Yingxia, Tamura, Nobumichi, Kim, Dong Wook, Gu, Sam, & Tu, K. N. A metastable phase of tin in 3D integrated circuit solder microbumps. United States. https://doi.org/10.1016/j.scriptamat.2015.02.009
Liu, Yingxia, Tamura, Nobumichi, Kim, Dong Wook, Gu, Sam, and Tu, K. N. Mon .
"A metastable phase of tin in 3D integrated circuit solder microbumps". United States. https://doi.org/10.1016/j.scriptamat.2015.02.009.
@article{osti_1251503,
title = {A metastable phase of tin in 3D integrated circuit solder microbumps},
author = {Liu, Yingxia and Tamura, Nobumichi and Kim, Dong Wook and Gu, Sam and Tu, K. N.},
abstractNote = {},
doi = {10.1016/j.scriptamat.2015.02.009},
journal = {Scripta Materialia},
number = C,
volume = 102,
place = {United States},
year = {Mon Jun 01 00:00:00 EDT 2015},
month = {Mon Jun 01 00:00:00 EDT 2015}
}
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1016/j.scriptamat.2015.02.009
https://doi.org/10.1016/j.scriptamat.2015.02.009
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Cited by: 15 works
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