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Title: A metastable phase of tin in 3D integrated circuit solder microbumps

Authors:
; ; ; ;
Publication Date:
OSTI Identifier:
1251503
Grant/Contract Number:
AC02-05CH11231
Type:
Publisher's Accepted Manuscript
Journal Name:
Scripta Materialia
Additional Journal Information:
Journal Volume: 102; Journal Issue: C; Related Information: CHORUS Timestamp: 2016-09-06 06:39:41; Journal ID: ISSN 1359-6462
Publisher:
Elsevier
Sponsoring Org:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
Country of Publication:
United States
Language:
English