Tensile behavior and flow stress anisotropy of accumulative roll bonded Cu-Nb nanolaminates
Abstract
The flow stress, ductility, and in-plane anisotropy are evaluated for bulk accumulative roll bonded copper-niobium nanolaminates with layer thicknesses ranging from 1.8 μm to 15 nm. Uniaxial tensile tests conducted parallel to the rolling direction and transverse direction demonstrate that ductility generally decreases with decreasing layer thickness; however, at 30 nm, both high strengths (1200 MPa) and significant ductility (8%) are achieved. The yield strength increases monotonically with decreasing layer thickness, consistent with the Hall-Petch relationship, and significant in-plane flow stress anisotropy is observed. As a result, Taylor polycrystal modeling is used to demonstrate that crystallographic texture is responsible for the in-plane anisotropy and that the effects of texture dominate even at nanoscale layer thicknesses.
- Authors:
-
- Univ. of California Santa Barbara, Santa Barbara, CA (United States)
- Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
- Publication Date:
- Research Org.:
- Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1247681
- Report Number(s):
- LA-UR-16-20702
Journal ID: ISSN 0003-6951; APPLAB
- Grant/Contract Number:
- 238091; AC52-06NA25396
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Applied Physics Letters
- Additional Journal Information:
- Journal Volume: 108; Journal Issue: 5; Journal ID: ISSN 0003-6951
- Publisher:
- American Institute of Physics (AIP)
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; texture; Hall Petch; visco-plastic self-consistent; nanolaminate; anisotropy; plasticity; polycrystals; stress strain relations; niobium
Citation Formats
Nizolek, Thomas, Beyerlein, Irene J., Mara, Nathan A., Avallone, Jaclyn T., and Pollock, Tresa M. Tensile behavior and flow stress anisotropy of accumulative roll bonded Cu-Nb nanolaminates. United States: N. p., 2016.
Web. doi:10.1063/1.4941043.
Nizolek, Thomas, Beyerlein, Irene J., Mara, Nathan A., Avallone, Jaclyn T., & Pollock, Tresa M. Tensile behavior and flow stress anisotropy of accumulative roll bonded Cu-Nb nanolaminates. United States. https://doi.org/10.1063/1.4941043
Nizolek, Thomas, Beyerlein, Irene J., Mara, Nathan A., Avallone, Jaclyn T., and Pollock, Tresa M. Mon .
"Tensile behavior and flow stress anisotropy of accumulative roll bonded Cu-Nb nanolaminates". United States. https://doi.org/10.1063/1.4941043. https://www.osti.gov/servlets/purl/1247681.
@article{osti_1247681,
title = {Tensile behavior and flow stress anisotropy of accumulative roll bonded Cu-Nb nanolaminates},
author = {Nizolek, Thomas and Beyerlein, Irene J. and Mara, Nathan A. and Avallone, Jaclyn T. and Pollock, Tresa M.},
abstractNote = {The flow stress, ductility, and in-plane anisotropy are evaluated for bulk accumulative roll bonded copper-niobium nanolaminates with layer thicknesses ranging from 1.8 μm to 15 nm. Uniaxial tensile tests conducted parallel to the rolling direction and transverse direction demonstrate that ductility generally decreases with decreasing layer thickness; however, at 30 nm, both high strengths (1200 MPa) and significant ductility (8%) are achieved. The yield strength increases monotonically with decreasing layer thickness, consistent with the Hall-Petch relationship, and significant in-plane flow stress anisotropy is observed. As a result, Taylor polycrystal modeling is used to demonstrate that crystallographic texture is responsible for the in-plane anisotropy and that the effects of texture dominate even at nanoscale layer thicknesses.},
doi = {10.1063/1.4941043},
journal = {Applied Physics Letters},
number = 5,
volume = 108,
place = {United States},
year = {Mon Feb 01 00:00:00 EST 2016},
month = {Mon Feb 01 00:00:00 EST 2016}
}
Web of Science
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