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Title: Sintering Kinetics of Inkjet Printed Conductive Silver Lines on Insulating Plastic Substrate

This paper focuses on sintering kinetics of inkjet printed lines containing silver nanoparticles deposited on a plastic substrate. Upon heat treatment, the change of resistance in the printed lines was measured as a function of time and sintering temperatures from 150 to 200 C. A critical temperature was observed for the sintering process, beyond which there was no further reduction in resistance. Analysis shows the critical temperature correlates to the boiling point of the solvent, which is attributed to a liquid-mediated sintering mechanism. It is demonstrated that the sintering process shuts down after the solvent has completely evaporated.
Authors:
 [1] ;  [1] ;  [1] ;  [1]
  1. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Publication Date:
OSTI Identifier:
1234315
Grant/Contract Number:
AC05-00OR22725
Type:
Accepted Manuscript
Journal Name:
Metallurgical and Materials Transactions. B, Process Metallurgy and Materials Processing Science
Additional Journal Information:
Journal Volume: 46; Journal Issue: 3; Journal ID: ISSN 1073-5615
Publisher:
ASM International
Research Org:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Manufacturing Demonstration Facility (MDF)
Sponsoring Org:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE Inkjet Printing; Silver Nanoparticles; Sintering; Additive Manufacturing; Fused Deposition Modeling; Electrical Properties