Stability and migration of small copper clusters in amorphous dielectrics
- Authors:
-
- School of Materials Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907-2044, USA
- Publication Date:
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1228179
- Resource Type:
- Publisher's Accepted Manuscript
- Journal Name:
- Journal of Applied Physics
- Additional Journal Information:
- Journal Name: Journal of Applied Physics Journal Volume: 117 Journal Issue: 19; Journal ID: ISSN 0021-8979
- Publisher:
- American Institute of Physics
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Guzman, David M., Onofrio, Nicolas, and Strachan, Alejandro. Stability and migration of small copper clusters in amorphous dielectrics. United States: N. p., 2015.
Web. doi:10.1063/1.4921059.
Guzman, David M., Onofrio, Nicolas, & Strachan, Alejandro. Stability and migration of small copper clusters in amorphous dielectrics. United States. https://doi.org/10.1063/1.4921059
Guzman, David M., Onofrio, Nicolas, and Strachan, Alejandro. Mon .
"Stability and migration of small copper clusters in amorphous dielectrics". United States. https://doi.org/10.1063/1.4921059.
@article{osti_1228179,
title = {Stability and migration of small copper clusters in amorphous dielectrics},
author = {Guzman, David M. and Onofrio, Nicolas and Strachan, Alejandro},
abstractNote = {},
doi = {10.1063/1.4921059},
journal = {Journal of Applied Physics},
number = 19,
volume = 117,
place = {United States},
year = {Mon May 18 00:00:00 EDT 2015},
month = {Mon May 18 00:00:00 EDT 2015}
}
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https://doi.org/10.1063/1.4921059
https://doi.org/10.1063/1.4921059
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Cited by: 19 works
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