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Title: Stability and migration of small copper clusters in amorphous dielectrics

Authors:
 [1]; ORCiD logo [1];  [1]
  1. School of Materials Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907-2044, USA
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1228179
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Name: Journal of Applied Physics Journal Volume: 117 Journal Issue: 19; Journal ID: ISSN 0021-8979
Publisher:
American Institute of Physics
Country of Publication:
United States
Language:
English

Citation Formats

Guzman, David M., Onofrio, Nicolas, and Strachan, Alejandro. Stability and migration of small copper clusters in amorphous dielectrics. United States: N. p., 2015. Web. doi:10.1063/1.4921059.
Guzman, David M., Onofrio, Nicolas, & Strachan, Alejandro. Stability and migration of small copper clusters in amorphous dielectrics. United States. https://doi.org/10.1063/1.4921059
Guzman, David M., Onofrio, Nicolas, and Strachan, Alejandro. Mon . "Stability and migration of small copper clusters in amorphous dielectrics". United States. https://doi.org/10.1063/1.4921059.
@article{osti_1228179,
title = {Stability and migration of small copper clusters in amorphous dielectrics},
author = {Guzman, David M. and Onofrio, Nicolas and Strachan, Alejandro},
abstractNote = {},
doi = {10.1063/1.4921059},
journal = {Journal of Applied Physics},
number = 19,
volume = 117,
place = {United States},
year = {Mon May 18 00:00:00 EDT 2015},
month = {Mon May 18 00:00:00 EDT 2015}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1063/1.4921059

Citation Metrics:
Cited by: 19 works
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