Stress balance in nanopatterned N/Cu(001) surfaces
- Authors:
- Publication Date:
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1100926
- Resource Type:
- Publisher's Accepted Manuscript
- Journal Name:
- Physical Review B
- Additional Journal Information:
- Journal Volume: 84; Journal Issue: 16; Journal ID: ISSN 1098-0121
- Publisher:
- American Physical Society
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Hong, S., Rahman, T. S., Ciftlikli, E. Z., and Hinch, B. J. Stress balance in nanopatterned N/Cu(001) surfaces. United States: N. p., 2011.
Web. doi:10.1103/PhysRevB.84.165413.
Hong, S., Rahman, T. S., Ciftlikli, E. Z., & Hinch, B. J. Stress balance in nanopatterned N/Cu(001) surfaces. United States. https://doi.org/10.1103/PhysRevB.84.165413
Hong, S., Rahman, T. S., Ciftlikli, E. Z., and Hinch, B. J. Mon .
"Stress balance in nanopatterned N/Cu(001) surfaces". United States. https://doi.org/10.1103/PhysRevB.84.165413.
@article{osti_1100926,
title = {Stress balance in nanopatterned N/Cu(001) surfaces},
author = {Hong, S. and Rahman, T. S. and Ciftlikli, E. Z. and Hinch, B. J.},
abstractNote = {},
doi = {10.1103/PhysRevB.84.165413},
journal = {Physical Review B},
number = 16,
volume = 84,
place = {United States},
year = {Mon Oct 10 00:00:00 EDT 2011},
month = {Mon Oct 10 00:00:00 EDT 2011}
}
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1103/PhysRevB.84.165413
https://doi.org/10.1103/PhysRevB.84.165413
Other availability
Cited by: 3 works
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