Terminating Surface Electromigration at the Source
- Authors:
- Publication Date:
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1100223
- Resource Type:
- Publisher's Accepted Manuscript
- Journal Name:
- Physical Review Letters
- Additional Journal Information:
- Journal Volume: 106; Journal Issue: 15; Journal ID: ISSN 0031-9007
- Publisher:
- American Physical Society
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Bevan, Kirk H., Zhu, Wenguang, Guo, Hong, and Zhang, Zhenyu. Terminating Surface Electromigration at the Source. United States: N. p., 2011.
Web. doi:10.1103/PhysRevLett.106.156404.
Bevan, Kirk H., Zhu, Wenguang, Guo, Hong, & Zhang, Zhenyu. Terminating Surface Electromigration at the Source. United States. https://doi.org/10.1103/PhysRevLett.106.156404
Bevan, Kirk H., Zhu, Wenguang, Guo, Hong, and Zhang, Zhenyu. Wed .
"Terminating Surface Electromigration at the Source". United States. https://doi.org/10.1103/PhysRevLett.106.156404.
@article{osti_1100223,
title = {Terminating Surface Electromigration at the Source},
author = {Bevan, Kirk H. and Zhu, Wenguang and Guo, Hong and Zhang, Zhenyu},
abstractNote = {},
doi = {10.1103/PhysRevLett.106.156404},
journal = {Physical Review Letters},
number = 15,
volume = 106,
place = {United States},
year = {Wed Apr 13 00:00:00 EDT 2011},
month = {Wed Apr 13 00:00:00 EDT 2011}
}
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1103/PhysRevLett.106.156404
https://doi.org/10.1103/PhysRevLett.106.156404
Other availability
Cited by: 15 works
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