National Library of Energy BETA

Sample records for wafer bonding national

  1. APPLIED PHYSICS REVIEWSFOCUSED REVIEW Adhesive wafer bonding

    E-Print Network [OSTI]

    Lü, James Jian-Qiang

    APPLIED PHYSICS REVIEWS­FOCUSED REVIEW Adhesive wafer bonding F. Niklausa Microsystem Technology 9 February 2006 Wafer bonding with intermediate polymer adhesives is an important fabrication-dimensional integrated circuits, advanced packaging, and microfluidics. In adhesive wafer bonding, the polymer adhesive

  2. Effect of Wafer Bow and Etch Patterns in Direct Wafer Bonding

    E-Print Network [OSTI]

    Spearing, S. Mark

    Direct wafer bonding has been identified as an en-abling technology for microelectromechanical systems (MEMS). As the complexity of devices increase and the bonding of multiple patterned wafers is required, there is a need ...

  3. MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

    DOE Patents [OSTI]

    Chanchani, Rajen; Nordquist, Christopher; Olsson, Roy H; Peterson, Tracy C; Shul, Randy J; Ahlers, Catalina; Plut, Thomas A; Patrizi, Gary A

    2013-12-03

    In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.

  4. Plasma-activated direct bonding of diamond-on-insulator wafers to thermal oxide grown silicon wafers

    E-Print Network [OSTI]

    Akin, Tayfun

    Plasma-activated direct bonding of diamond-on-insulator wafers to thermal oxide grown silicon microscopy, profilometer and wafer bow measurements. Plasma-activated direct bonding of DOI wafers to thermal September 2010 Keywords: Diamond-on-insulator Plasma activation Ultrananocrystalline diamond Direct bonding

  5. Strained Si, SiGe, and Ge on-insulator: review of wafer bonding fabrication techniques

    E-Print Network [OSTI]

    Strained Si, SiGe, and Ge on-insulator: review of wafer bonding fabrication techniques Gianni was arranged by Prof. C.K. Maiti Abstract Techniques for fabricating strained Si, SiGe, and Ge on-insulator include SIMOX, Ge condensation and wafer bonding. In this paper, a brief introduction of each method

  6. Eutectic bonding of a Ti sputter coated, carbon aerogel wafer to a Ni foil

    SciTech Connect (OSTI)

    Jankowski, A.F.; Hayes, J.P.; Kanna, R.L.

    1994-06-01

    The formation of high energy density, storage devices is achievable using composite material systems. Alternate layering of carbon aerogel wafers and Ni foils with rnicroporous separators is a prospective composite for capacitor applications. An inherent problem exists to form a physical bond between Ni and the porous carbon wafer. The bonding process must be limited to temperatures less than 1000{degrees}C, at which point the aerogel begins to degrade. The advantage of a low temperature eutectic in the Ni-Ti alloy system solves this problem. Ti, a carbide former, is readily adherent as a sputter deposited thin film onto the carbon wafer. A vacuum bonding process is then used to join the Ni foil and Ti coating through eutectic phase formation. The parameters required for successfld bonding are described along with a structural characterization of the Ni foil-carbon aerogel wafer interface.

  7. Wafer bonded virtual substrate and method for forming the same

    DOE Patents [OSTI]

    Atwater, Jr., Harry A. (So. Pasadena, CA); Zahler, James M. (Pasadena, CA); Morral, Anna Fontcuberta i (Paris, FR)

    2007-07-03

    A method of forming a virtual substrate comprised of an optoelectronic device substrate and handle substrate comprises the steps of initiating bonding of the device substrate to the handle substrate, improving or increasing the mechanical strength of the device and handle substrates, and thinning the device substrate to leave a single-crystal film on the virtual substrate such as by exfoliation of a device film from the device substrate. The handle substrate is typically Si or other inexpensive common substrate material, while the optoelectronic device substrate is formed of more expensive and specialized electro-optic material. Using the methodology of the invention a wide variety of thin film electro-optic materials of high quality can be bonded to inexpensive substrates which serve as the mechanical support for an optoelectronic device layer fabricated in the thin film electro-optic material.

  8. Aberration-corrected transmission electron microscopy analyses of GaAs/Si interfaces in wafer-bonded multi-junction solar cells

    E-Print Network [OSTI]

    Dunin-Borkowski, Rafal E.

    -bonded multi-junction solar cells Dietrich Häussler a , Lothar Houben b , Stephanie Essig c , Mert Kurttepeli online 20 July 2013 Keywords: Multi-junction solar cell Wafer bonding Interfaces Aberration corrected and composition fluctuations near interfaces in wafer-bonded multi-junction solar cells. Multi-junction solar

  9. Integrated optical MEMS using through-wafer vias and bump-bonding.

    SciTech Connect (OSTI)

    McCormick, Frederick Bossert; Frederick, Scott K.

    2008-01-01

    This LDRD began as a three year program to integrate through-wafer vias, micro-mirrors and control electronics with high-voltage capability to yield a 64 by 64 array of individually controllable micro-mirrors on 125 or 250 micron pitch with piston, tip and tilt movement. The effort was a mix of R&D and application. Care was taken to create SUMMiT{trademark} (Sandia's ultraplanar, multilevel MEMS technology) compatible via and mirror processes, and the ultimate goal was to mate this MEMS fabrication product to a complementary metal-oxide semiconductor (CMOS) electronics substrate. Significant progress was made on the via and mirror fabrication and design, the attach process development as well as the electronics high voltage (30 volt) and control designs. After approximately 22 months, the program was ready to proceed with fabrication and integration of the electronics, final mirror array, and through wafer vias to create a high resolution OMEMS array with individual mirror electronic control. At this point, however, mission alignment and budget constraints reduced the last year program funding and redirected the program to help support the through-silicon via work in the Hyper-Temporal Sensors (HTS) Grand Challenge (GC) LDRD. Several months of investigation and discussion with the HTS team resulted in a revised plan for the remaining 10 months of the program. We planned to build a capability in finer-pitched via fabrication on thinned substrates along with metallization schemes and bonding techniques for very large arrays of high density interconnects (up to 2000 x 2000 vias). Through this program, Sandia was able to build capability in several different conductive through wafer via processes using internal and external resources, MEMS mirror design and fabrication, various bonding techniques for arrayed substrates, and arrayed electronics control design with high voltage capability.

  10. Wafer-level packaging with compression-controlled seal ring bonding

    DOE Patents [OSTI]

    Farino, Anthony J

    2013-11-05

    A device may be provided in a sealed package by aligning a seal ring provided on a first surface of a first semiconductor wafer in opposing relationship with a seal ring that is provided on a second surface of a second semiconductor wafer and surrounds a portion of the second wafer that contains the device. Forcible movement of the first and second wafer surfaces toward one another compresses the first and second seal rings against one another. A physical barrier against the movement, other than the first and second seal rings, is provided between the first and second wafer surfaces.

  11. Towards large size substrates for III-V co-integration made by direct wafer bonding on Si

    SciTech Connect (OSTI)

    Daix, N., E-mail: dai@zurich.ibm.com; Uccelli, E.; Czornomaz, L.; Caimi, D.; Rossel, C.; Sousa, M.; Siegwart, H.; Marchiori, C.; Fompeyrine, J. [IBM Research - Zürich, Säumerstrasse 4, CH-8803 Rüschlikon (Switzerland); Hartmann, J. M. [CEA, LETI 17, rue des Martyrs, F-38054 Grenoble (France); Shiu, K.-T.; Cheng, C.-W.; Krishnan, M.; Lofaro, M.; Kobayashi, M.; Sadana, D. [IBM T. J. Watson Research Center, 1101 Kitchawan Rd., Route 134 Yorktown Heights, New York 10598 (United States)

    2014-08-01

    We report the first demonstration of 200 mm InGaAs-on-insulator (InGaAs-o-I) fabricated by the direct wafer bonding technique with a donor wafer made of III-V heteroepitaxial structure grown on 200 mm silicon wafer. The measured threading dislocation density of the In{sub 0.53}Ga{sub 0.47}As (InGaAs) active layer is equal to 3.5 × 10{sup 9} cm{sup ?2}, and it does not degrade after the bonding and the layer transfer steps. The surface roughness of the InGaAs layer can be improved by chemical-mechanical-polishing step, reaching values as low as 0.4 nm root-mean-square. The electron Hall mobility in 450 nm thick InGaAs-o-I layer reaches values of up to 6000 cm{sup 2}/Vs, and working pseudo-MOS transistors are demonstrated with an extracted electron mobility in the range of 2000–3000 cm{sup 2}/Vs. Finally, the fabrication of an InGaAs-o-I substrate with the active layer as thin as 90 nm is achieved with a Buried Oxide of 50 nm. These results open the way to very large scale production of III-V-o-I advanced substrates for future CMOS technology nodes.

  12. Direct wafer bonding technology for large-scale InGaAs-on-insulator transistors

    SciTech Connect (OSTI)

    Kim, SangHyeon E-mail: sh-kim@kist.re.kr; Ikku, Yuki; Takenaka, Mitsuru; Takagi, Shinichi; Yokoyama, Masafumi; Nakane, Ryosho; Li, Jian; Kao, Yung-Chung

    2014-07-28

    Heterogeneous integration of III-V devices on Si wafers have been explored for realizing high device performance as well as merging electrical and photonic applications on the Si platform. Existing methodologies have unavoidable drawbacks such as inferior device quality or high cost in comparison with the current Si-based technology. In this paper, we present InGaAs-on-insulator (-OI) fabrication from an InGaAs layer grown on a Si donor wafer with a III-V buffer layer instead of growth on a InP donor wafer. This technology allows us to yield large wafer size scalability of III-V-OI layers up to the Si wafer size of 300?mm with a high film quality and low cost. The high film quality has been confirmed by Raman and photoluminescence spectra. In addition, the fabricated InGaAs-OI transistors exhibit the high electron mobility of 1700?cm{sup 2}/V s and uniform distribution of the leakage current, indicating high layer quality with low defect density.

  13. Lattice-Mismatched GaAs/InGaAs Two-Junction Solar Cells by Direct Wafer Bonding

    SciTech Connect (OSTI)

    Tanabe, K.; Aiken, D. J.; Wanlass, M. W.; Morral, A. F.; Atwater, H. A.

    2006-01-01

    Direct bonded interconnect between subcells of a lattice-mismatched III-V compound multijunction cell would enable dislocation-free active regions by confining the defect network needed for lattice mismatch accommodation to tunnel junction interfaces, while metamorphic growth inevitably results in less design flexibility and lower material quality than is desirable. The first direct-bond interconnected multijunction solar cell, a two-terminal monolithic GaAs/InGaAs two-junction solar cell, is reported and demonstrates viability of direct wafer bonding for solar cell applications. The tandem cell open-circuit voltage was approximately the sum of the subcell open-circuit voltages. This achievement shows direct bonding enables us to construct lattice-mismatched III-V multijunction solar cells and is extensible to an ultrahigh efficiency InGaP/GaAs/InGaAsP/InGaAs four-junction cell by bonding a GaAs-based lattice-matched InGaP/GaAs subcell and an InP-based lattice-matched InGaAsP/InGaAs subcell. The interfacial resistance experimentally obtained for bonded GaAs/InP smaller than 0.10 Ohm-cm{sup 2} would result in a negligible decrease in overall cell efficiency of {approx}0.02%, under 1-sun illumination.

  14. Thermal compression wafer bonding of tungsten applied to fabrication of small-period tungsten woodpile structures

    E-Print Network [OSTI]

    Klotzkin, David

    properties Multilayer structure Nanomaterials Optical materials and properties In this paper, we report of a 3D tungsten woodpile structure using this method. The structure is fabricated by holographic region of the electromagnetic spectrum and then to bond these 2D- structures to form a 3D

  15. Structured wafer for device processing

    DOE Patents [OSTI]

    Okandan, Murat; Nielson, Gregory N

    2014-11-25

    A structured wafer that includes through passages is used for device processing. Each of the through passages extends from or along one surface of the structured wafer and forms a pattern on a top surface area of the structured wafer. The top surface of the structured wafer is bonded to a device layer via a release layer. Devices are processed on the device layer, and are released from the structured wafer using etchant. The through passages within the structured wafer allow the etchant to access the release layer to thereby remove the release layer.

  16. Structured wafer for device processing

    DOE Patents [OSTI]

    Okandan, Murat; Nielson, Gregory N

    2014-05-20

    A structured wafer that includes through passages is used for device processing. Each of the through passages extends from or along one surface of the structured wafer and forms a pattern on a top surface area of the structured wafer. The top surface of the structured wafer is bonded to a device layer via a release layer. Devices are processed on the device layer, and are released from the structured wafer using etchant. The through passages within the structured wafer allow the etchant to access the release layer to thereby remove the release layer.

  17. Bond Price Volatility c2012 Prof. Yuh-Dauh Lyuu, National Taiwan University Page 75

    E-Print Network [OSTI]

    Lyuu, Yuh-Dauh

    Bond Price Volatility c2012 Prof. Yuh-Dauh Lyuu, National Taiwan University Page 75 #12;"Well Taiwan University Page 76 #12;Price Volatility · Volatility measures how bond prices respond to interest-coupon bonds here. c2012 Prof. Yuh-Dauh Lyuu, National Taiwan University Page 77 #12;Price Volatility

  18. Bond Price Volatility c 2008 Prof. Yuh-Dauh Lyuu, National Taiwan University Page 71

    E-Print Network [OSTI]

    Lyuu, Yuh-Dauh

    Bond Price Volatility c 2008 Prof. Yuh-Dauh Lyuu, National Taiwan University Page 71 #12;"Well Taiwan University Page 72 #12;Price Volatility · Volatility measures how bond prices respond to interest-coupon bonds throughout. c 2008 Prof. Yuh-Dauh Lyuu, National Taiwan University Page 73 #12;Price Volatility

  19. Bond Price Volatility c 2011 Prof. Yuh-Dauh Lyuu, National Taiwan University Page 74

    E-Print Network [OSTI]

    Lyuu, Yuh-Dauh

    Bond Price Volatility c 2011 Prof. Yuh-Dauh Lyuu, National Taiwan University Page 74 #12;"Well Taiwan University Page 75 #12;Price Volatility · Volatility measures how bond prices respond to interest-coupon bonds throughout. c 2011 Prof. Yuh-Dauh Lyuu, National Taiwan University Page 76 #12;Price Volatility

  20. Four-Junction Solar Cell with 40% Target Efficiency Fabricated by Wafer Bonding and Layer Transfer: Final Technical Report, 1 January 2005 - 31 December 2007

    SciTech Connect (OSTI)

    Atwater, H. A.

    2008-11-01

    We realized high-quality InGaP/GaAs 2-junction top cells on Ge/Si, InGaAs/InP bottom cells, direct-bond series interconnection of tandem cells, and modeling of bonded 3- and 4-junction device performance.

  1. Three wafer stacking for 3D integration.

    SciTech Connect (OSTI)

    Greth, K. Douglas; Ford, Christine L.; Lantz, Jeffrey W.; Shinde, Subhash L.; Timon, Robert P.; Bauer, Todd M.; Hetherington, Dale Laird; Sanchez, Carlos Anthony

    2011-11-01

    Vertical wafer stacking will enable a wide variety of new system architectures by enabling the integration of dissimilar technologies in one small form factor package. With this LDRD, we explored the combination of processes and integration techniques required to achieve stacking of three or more layers. The specific topics that we investigated include design and layout of a reticle set for use as a process development vehicle, through silicon via formation, bonding media, wafer thinning, dielectric deposition for via isolation on the wafer backside, and pad formation.

  2. A LOW COST WAFER-LEVEL MEMS PACKAGING TECHNOLOGY Pejman Monajemi, Paul J. Joseph*

    E-Print Network [OSTI]

    Ayazi, Farrokh

    A LOW COST WAFER-LEVEL MEMS PACKAGING TECHNOLOGY Pejman Monajemi, Paul J. Joseph* , Paul A. Kohl-cost low-temperature packaging technique for wafer-level encapsulation of MEMS devices fabricated on any arbitrary substrate. The packaging process presented here does not involve wafer bonding and can be applied

  3. Particulate contamination removal from wafers using plasmas and mechanical agitation

    DOE Patents [OSTI]

    Selwyn, G.S.

    1998-12-15

    Particulate contamination removal from wafers is disclosed using plasmas and mechanical agitation. The present invention includes the use of plasmas with mechanical agitation for removing particulate matter from the surface of a wafer. The apparatus hereof comprises a mechanical activator, at least one conducting contact pin for transferring the vibration from the activator to the wafer, clamp fingers that maintain the wafer`s position, and means for generating a plasma in the vicinity of the surface of the wafer, all parts of the cleaning apparatus except the mechanical activator and part of the contact pin being contained inside the processing chamber. By exposing a wafer to a plasma and providing motion thereto in a direction perpendicular to its surface, the bonding between the particulate matter and the surface may be overcome. Once free of the wafer surface, the particulates become charged by electrons from the plasma and are drawn into the plasma by attractive forces which keep them from redepositing. The introduction of a flowing gas through the plasma sweeps the particulates away from the wafer and out of the plasma. The entire surface is cleaned during one cleaning step. The use of an rf plasma to accomplish the particulate removal was found to remove more than 90% of the particulates. 4 figs.

  4. Wafer characteristics via reflectometry

    DOE Patents [OSTI]

    Sopori, Bhushan L. (Denver, CO)

    2010-10-19

    Various exemplary methods (800, 900, 1000, 1100) are directed to determining wafer thickness and/or wafer surface characteristics. An exemplary method (900) includes measuring reflectance of a wafer and comparing the measured reflectance to a calculated reflectance or a reflectance stored in a database. Another exemplary method (800) includes positioning a wafer on a reflecting support to extend a reflectance range. An exemplary device (200) has an input (210), analysis modules (222-228) and optionally a database (230). Various exemplary reflectometer chambers (1300, 1400) include radiation sources positioned at a first altitudinal angle (1308, 1408) and at a second altitudinal angle (1312, 1412). An exemplary method includes selecting radiation sources positioned at various altitudinal angles. An exemplary element (1650, 1850) includes a first aperture (1654, 1854) and a second aperture (1658, 1858) that can transmit reflected radiation to a fiber and an imager, respectfully.

  5. Stable wafer-carrier system

    DOE Patents [OSTI]

    Rozenzon, Yan; Trujillo, Robert T; Beese, Steven C

    2013-10-22

    One embodiment of the present invention provides a wafer-carrier system used in a deposition chamber for carrying wafers. The wafer-carrier system includes a base susceptor and a top susceptor nested inside the base susceptor with its wafer-mounting side facing the base susceptor's wafer-mounting side, thereby forming a substantially enclosed narrow channel. The base susceptor provides an upward support to the top susceptor.

  6. Wafer screening device and methods for wafer screening

    DOE Patents [OSTI]

    Sopori, Bhushan; Rupnowski, Przemyslaw

    2014-07-15

    Wafer breakage is a serious problem in the photovoltaic industry because a large fraction of wafers (between 5 and 10%) break during solar cell/module fabrication. The major cause of this excessive wafer breakage is that these wafers have residual microcracks--microcracks that were not completely etched. Additional propensity for breakage is caused by texture etching and incomplete edge grinding. To eliminate the cost of processing the wafers that break, it is best to remove them prior to cell fabrication. Some attempts have been made to develop optical techniques to detect microcracks. Unfortunately, it is very difficult to detect microcracks that are embedded within the roughness/texture of the wafers. Furthermore, even if such detection is successful, it is not straightforward to relate them to wafer breakage. We believe that the best way to isolate the wafers with fatal microcracks is to apply a stress to wafers--a stress that mimics the highest stress during cell/module processing. If a wafer survives this stress, it has a high probability of surviving without breakage during cell/module fabrication. Based on this, we have developed a high throughput, noncontact method for applying a predetermined stress to a wafer. The wafers are carried on a belt through a chamber that illuminates the wafer with an intense light of a predetermined intensity distribution that can be varied by changing the power to the light source. As the wafers move under the light source, each wafer undergoes a dynamic temperature profile that produces a preset elastic stress. If this stress exceeds the wafer strength, the wafer will break. The broken wafers are separated early, eliminating cost of processing into cell/module. We will describe details of the system and show comparison of breakage statistics with the breakage on a production line.

  7. Particulate contamination removal from wafers using plasmas and mechanical agitation

    DOE Patents [OSTI]

    Selwyn, Gary S. (Los Alamos, NM)

    1998-01-01

    Particulate contamination removal from wafers using plasmas and mechanical agitation. The present invention includes the use of plasmas with mechanical agitation for removing particulate matter from the surface of a wafer. The apparatus hereof comprises a mechanical activator, at least one conducting contact pin for transferring the vibration from the activator to the wafer, clamp fingers that maintain the wafer's position, and means for generating a plasma in the vicinity of the surface of the wafer, all parts of the cleaning apparatus except the mechanical activator and part of the contact pin being contained inside the processing chamber. By exposing a wafer to a plasma and providing motion thereto in a direction perpendicular to its surface, the bonding between the particulate matter and the surface may be overcome. Once free of the wafer surface, the particulates become charged by electrons from the plasma and are drawn into the plasma by attractive forces which keep them from redepositing. The introduction of a flowing gas through the plasma sweeps the particulates away from the wafer and out of the plasma. The entire surface is cleaned during one cleaning step. The use of an rf plasma to accomplish the particulate removal was found to remove more than 90% of the particulates.

  8. The Dependence of Electrical Properties on Miscut Orientation in Direct Bonded III-V Solar Cell Layers

    E-Print Network [OSTI]

    Seal, Mark K.

    2015-01-01

    GaInAs concentrator solar cells with 44.7% efficiency",wafer-bonded tandem solar cells”, 38 th IEEE Photovoltaicfor Wafer-Bonded Tandem Solar Cells”, ECS Trans. 50 99 (

  9. Bonded semiconductor substrate

    DOE Patents [OSTI]

    Atwater, Jr.; Harry A. (South Pasadena, CA), Zahler; James M. (Pasadena, CA)

    2010-07-13

    Ge/Si and other nonsilicon film heterostructures are formed by hydrogen-induced exfoliation of the Ge film which is wafer bonded to a cheaper substrate, such as Si. A thin, single-crystal layer of Ge is transferred to Si substrate. The bond at the interface of the Ge/Si heterostructures is covalent to ensure good thermal contact, mechanical strength, and to enable the formation of an ohmic contact between the Si substrate and Ge layers. To accomplish this type of bond, hydrophobic wafer bonding is used, because as the invention demonstrates the hydrogen-surface-terminating species that facilitate van der Waals bonding evolves at temperatures above 600.degree. C. into covalent bonding in hydrophobically bound Ge/Si layer transferred systems.

  10. Glass blowing on a wafer level

    E-Print Network [OSTI]

    Eklund, E. Jesper; Shkel, Andrei M.

    2007-01-01

    Wafer-Level Micro-Glass-Blowing UCI Of?ce of Technology176, 2005. [3] ——, Glass Blowing on a Wafer Scale (Expandedmodels. EKLUND AND SHKEL: GLASS BLOWING ON A WAFER LEVEL [5

  11. Silicon cast wafer recrystallization for photovoltaic applications

    E-Print Network [OSTI]

    Hantsoo, Eerik T. (Eerik Torm)

    2008-01-01

    Current industry-standard methods of manufacturing silicon wafers for photovoltaic (PV) cells define the electrical properties of the wafer in a first step, and then the geometry of the wafer in a subsequent step. The ...

  12. IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 30, NO. 1, FEBRUARY 2007 19 Wafer-Level Packaging of Micromechanical

    E-Print Network [OSTI]

    Ayazi, Farrokh

    of microelectromechanical systems (MEMS), e.g., microresonators, is reported. The process does not require wafer-cost, high-volume packaging technique for microelectromechanical systems (MEMS) is an important challenge-to-wafer bonding and can be applied to a wide range of MEMS devices. A sacrificial polymer-placeholder is first

  13. Mechanics aspects of water thermocompression bonding

    E-Print Network [OSTI]

    Stamoulis, Konstantinos, 1970-

    2005-01-01

    Wafer-level, thermocompression bonding is a promising technique for microelectromechanical systems (MEMS) packaging. The process is a form of solid-state joining and requires the simultaneous application of temperature and ...

  14. Heating device for semiconductor wafers

    DOE Patents [OSTI]

    Vosen, Steven R. (Berkeley, CA)

    1999-01-01

    An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the light energy sources are positioned such that many different radial heating zones are created on a wafer being heated. For instance, in one embodiment, the light energy sources form a spiral configuration. In an alternative embodiment, the light energy sources appear to be randomly dispersed with respect to each other so that no discernable pattern is present. In a third alternative embodiment of the present invention, the light energy sources form concentric rings. Tuning light sources are then placed in between the concentric rings of light.

  15. Heating device for semiconductor wafers

    DOE Patents [OSTI]

    Vosen, S.R.

    1999-07-27

    An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the light energy sources are positioned such that many different radial heating zones are created on a wafer being heated. For instance, in one embodiment, the light energy sources form a spiral configuration. In an alternative embodiment, the light energy sources appear to be randomly dispersed with respect to each other so that no discernible pattern is present. In a third alternative embodiment of the present invention, the light energy sources form concentric rings. Tuning light sources are then placed in between the concentric rings of light. 4 figs.

  16. Testing and Simulation of the SRF Wafer Test Cavity for the Characterization of Superconductors and Heterostructures 

    E-Print Network [OSTI]

    Comeaux, Justin

    2014-08-07

    The wafer test cavity, designed at Texas A&M University, has been constructed and tested at Thomas Jefferson National Accelerator Facility. The mode structure, quality factor and coupling methods have been investigated. ...

  17. Support apparatus for semiconductor wafer processing

    DOE Patents [OSTI]

    Griffiths, Stewart K.; Nilson, Robert H.; Torres, Kenneth J.

    2003-06-10

    A support apparatus for minimizing gravitational stress in semiconductor wafers, and particularly silicon wafers, during thermal processing. The support apparatus comprises two concentric circular support structures disposed on a common support fixture. The two concentric circular support structures, located generally at between 10 and 70% and 70 and 100% and preferably at 35 and 82.3% of the semiconductor wafer radius, can be either solid rings or a plurality of spaced support points spaced apart from each other in a substantially uniform manner. Further, the support structures can have segments removed to facilitate wafer loading and unloading. In order to withstand the elevated temperatures encountered during semiconductor wafer processing, the support apparatus, including the concentric circular support structures and support fixture can be fabricated from refractory materials, such as silicon carbide, quartz and graphite. The claimed wafer support apparatus can be readily adapted for use in either batch or single-wafer processors.

  18. Fabrication and characterization of wafer-level gold thermocompression bonding

    E-Print Network [OSTI]

    Tsau, Christine H. (Christine Hsin-Hwa), 1976-

    2003-01-01

    Packaging is an important aspect of microelectromechanical systems (MEMS) design. As MEMS devices traverse multiple energy domains, sometimes operating in hostile conditions, the need to maintain reliability and functionality ...

  19. Three dimensional integration technology using copper wafer bonding

    E-Print Network [OSTI]

    Fan, Andy, 1976-

    2006-01-01

    With 3-D integration, the added vertical component could theoretically increase the device density per footprint ratio of a given chip by n-fold, provide a means of heterogeneous integration of devices fabricated from ...

  20. Copper wafer bonding in three-dimensional integration

    E-Print Network [OSTI]

    Chen, Kuan-Neng, 1974-

    2005-01-01

    Three-dimensional (3D) integration, in which multiple layers of devices are stacked with high density of interconnects between the layers, offers solutions for problems when the critical dimensions in integrated circuits ...

  1. Wafer scale micromachine assembly method

    DOE Patents [OSTI]

    Christenson, Todd R. (Albuquerque, NM)

    2001-01-01

    A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first and second substrate, respectively. The substrates are positioned so that the upper surfaces of the two micromachine subassemblies face each other and are aligned so that the desired assembly results from their fusion. The upper surfaces are then brought into contact, and the assembly is subjected to conditions suited to the desired diffusion bonding.

  2. Methane production using resin-wafer electrodeionization

    DOE Patents [OSTI]

    Snyder, Seth W; Lin, YuPo; Urgun-Demirtas, Meltem

    2014-03-25

    The present invention provides an efficient method for creating natural gas including the anaerobic digestion of biomass to form biogas, and the electrodeionization of biogas to form natural gas and carbon dioxide using a resin-wafer deionization (RW-EDI) system. The method may be further modified to include a wastewater treatment system and can include a chemical conditioning/dewatering system after the anaerobic digestion system. The RW-EDI system, which includes a cathode and an anode, can either comprise at least one pair of wafers, each a basic and acidic wafer, or at least one wafer comprising of a basic portion and an acidic portion. A final embodiment of the RW-EDI system can include only one basic wafer for creating natural gas.

  3. Cost-Effective Silicon Wafers for Solar Cells: Direct Wafer Enabling Terawatt Photovoltaics

    SciTech Connect (OSTI)

    2010-01-15

    Broad Funding Opportunity Announcement Project: 1366 is developing a process to reduce the cost of solar electricity by up to 50% by 2020—from $0.15 per kilowatt hour to less than $0.07. 1366’s process avoids the costly step of slicing a large block of silicon crystal into wafers, which turns half the silicon to dust. Instead, the company is producing thin wafers directly from molten silicon at industry-standard sizes, and with efficiencies that compare favorably with today’s state-of-the-art technologies. 1366’s wafers could directly replace wafers currently on the market, so there would be no interruptions to the delivery of these products to market. As a result of 1366’s technology, the cost of silicon wafers could be reduced by 80%.

  4. Wafer-fused semiconductor radiation detector

    DOE Patents [OSTI]

    Lee, Edwin Y. (Livermore, CA); James, Ralph B. (Livermore, CA)

    2002-01-01

    Wafer-fused semiconductor radiation detector useful for gamma-ray and x-ray spectrometers and imaging systems. The detector is fabricated using wafer fusion to insert an electrically conductive grid, typically comprising a metal, between two solid semiconductor pieces, one having a cathode (negative electrode) and the other having an anode (positive electrode). The wafer fused semiconductor radiation detector functions like the commonly used Frisch grid radiation detector, in which an electrically conductive grid is inserted in high vacuum between the cathode and the anode. The wafer-fused semiconductor radiation detector can be fabricated using the same or two different semiconductor materials of different sizes and of the same or different thicknesses; and it may utilize a wide range of metals, or other electrically conducting materials, to form the grid, to optimize the detector performance, without being constrained by structural dissimilarity of the individual parts. The wafer-fused detector is basically formed, for example, by etching spaced grooves across one end of one of two pieces of semiconductor materials, partially filling the grooves with a selected electrical conductor which forms a grid electrode, and then fusing the grooved end of the one semiconductor piece to an end of the other semiconductor piece with a cathode and an anode being formed on opposite ends of the semiconductor pieces.

  5. Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits

    E-Print Network [OSTI]

    Nagarajan, Raghavan

    2008-01-01

    Wafer bonding is a key process and enabling technology for realization of three-dimensional integrated circuits (3DIC) with reduced interconnect delay and correspondingly increased circuit speed and decreased power ...

  6. Geometry control of recrystallized silicon wafers for solar applications

    E-Print Network [OSTI]

    Ruggiero, Christopher W

    2009-01-01

    The cost of manufacturing crystalline silicon wafers for use in solar cells can be reduced by eliminating the waste streams caused by sawing ingots into individual wafers. Professor Emanuel Sachs has developed a new method ...

  7. www.suss.com LithographyWaferBondingDeviceBondingTesting

    E-Print Network [OSTI]

    moving parts. All microscope lift options, manual or pneumatic, are easy to use and allow convenient . Tempe . Vaihingen . Waterbury Center . Yokohama www.suss.com Technical Data: PM5 Manual Probe Station

  8. Methanol Steam Reformer on a Silicon Wafer

    SciTech Connect (OSTI)

    Park, H; Malen, J; Piggott, T; Morse, J; Sopchak, D; Greif, R; Grigoropoulos, C; Havstad, M; Upadhye, R

    2004-04-15

    A study of the reforming rates, heat transfer and flow through a methanol reforming catalytic microreactor fabricated on a silicon wafer are presented. Comparison of computed and measured conversion efficiencies are shown to be favorable. Concepts for insulating the reactor while maintaining small overall size and starting operation from ambient temperature are analyzed.

  9. Optical cavity furnace for semiconductor wafer processing

    DOE Patents [OSTI]

    Sopori, Bhushan L.

    2014-08-05

    An optical cavity furnace 10 having multiple optical energy sources 12 associated with an optical cavity 18 of the furnace. The multiple optical energy sources 12 may be lamps or other devices suitable for producing an appropriate level of optical energy. The optical cavity furnace 10 may also include one or more reflectors 14 and one or more walls 16 associated with the optical energy sources 12 such that the reflectors 14 and walls 16 define the optical cavity 18. The walls 16 may have any desired configuration or shape to enhance operation of the furnace as an optical cavity 18. The optical energy sources 12 may be positioned at any location with respect to the reflectors 14 and walls defining the optical cavity. The optical cavity furnace 10 may further include a semiconductor wafer transport system 22 for transporting one or more semiconductor wafers 20 through the optical cavity.

  10. Devices using resin wafers and applications thereof

    DOE Patents [OSTI]

    Lin, YuPo J. (Naperville, IL); Henry, Michael P. (Batavia, IL); Snyder, Seth W. (Lincolnwood, IL); St. Martin, Edward (Libertyville, IL); Arora, Michelle (Woodridge, IL); de la Garza, Linda (Woodridge, IL)

    2009-03-24

    Devices incorporating a thin wafer of electrically and ionically conductive porous material made by the method of introducing a mixture of a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material into a mold. The mixture is subjected to temperatures in the range of from about 60.degree. C. to about 170.degree. C. at pressures in the range of from about 0 to about 500 psig for a time in the range of from about 1 to about 240 minutes to form thin wafers. Devices include electrodeionization and separative bioreactors in the production of organic and amino acids, alcohols or esters for regenerating cofactors in enzymes and microbial cells.

  11. Wafer Works Corporation | Open Energy Information

    Open Energy Info (EERE)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Home Page on Google Bookmark EERE: Alternative Fuels Data Center Home Page on QA:QA J-E-1 SECTION J APPENDIX ECoop IncIowa (Utility Company)Idaho)Vossloh Kiepe Jump to:WKV AG JumpWaareeWabashWafer

  12. 1366 Direct Wafer: Demolishing the Cost Barrier for Silicon Photovoltaics

    SciTech Connect (OSTI)

    Lorenz, Adam

    2013-08-30

    The goal of 1366 Direct Wafer™ is to drastically reduce the cost of silicon-based PV by eliminating the cost barrier imposed by sawn wafers. The key characteristics of Direct Wafer are 1) kerf-free, 156-mm standard silicon wafers 2) high throughput for very low CAPEX and rapid scale up. Together, these characteristics will allow Direct Wafer™ to become the new standard for silicon PV wafers and will enable terawatt-scale PV – a prospect that may not be possible with sawn wafers. Our single, high-throughput step will replace the expensive and rate-limiting process steps of ingot casting and sawing, thereby enabling drastically lower wafer cost. This High-Impact PV Supply Chain project addressed the challenges of scaling Direct Wafer technology for cost-effective, high-throughput production of commercially viable 156 mm wafers. The Direct Wafer process is inherently simple and offers the potential for very low production cost, but to realize this, it is necessary to demonstrate production of wafers at high-throughput that meet customer specifications. At the start of the program, 1366 had demonstrated (with ARPA-E funding) increases in solar cell efficiency from 10% to 15.9% on small area (20cm2), scaling wafer size up to the industry standard 156mm, and demonstrated initial cell efficiency on larger wafers of 13.5%. During this program, the throughput of the Direct Wafer furnace was increased by more than 10X, simultaneous with quality improvements to meet early customer specifications. Dedicated equipment for laser trimming of wafers and measurement methods were developed to feedback key quality metrics to improve the process and equipment. Subsequent operations served both to determine key operating metrics affecting cost, as well as generating sample product that was used for developing downstream processing including texture and interaction with standard cell processing. Dramatic price drops for silicon wafers raised the bar significantly, but the developments made under this program have increased 1366 confidence that Direct Wafers can be produced for ~$0.10/W, still nearly 50% lower than current industry best practice. Wafer quality also steadily improved throughout the program, both in electrical performance and geometry. The improvements to electrical performance were achieved through a combination of optimized heat transfer during growth, reduction of metallic impurities to below 10 ppbw total metals, and lowering oxygen content to below 2e17 atoms/cc. Wafer average thickness has been reduced below 200µm with standard deviation less than 20µm. Measurement of spatially varying thickness shortly after wafer growth is being used to continually improve uniformity by adjusting thermal conditions. At the conclusion of the program, 1366 has developed strong relationships with four leading Tier1 cell manufactures and several have demonstrated 17% cell efficiency on Direct Wafer. Sample volumes were limited, with the largest trial consisting of 300 Direct Wafers, and there remains strong pull for larger quantities necessary for qualification before sales contracts can be signed. This will be the focus of our pilot manufacturing scale up in 2014.

  13. The Effect of Offcut Angle on Electrical Conductivity of Direct Wafer-Bonded n-GaAs/n-GaAs Structures for Wafer-Bonded Tandem Solar Cells

    E-Print Network [OSTI]

    Yeung, King Wah Sunny

    2012-01-01

    photovoltaic applications, as multijunction solar devices currently achieving world record power conversion efficiencies typically consist of a multiple cell

  14. The Effect of Offcut Angle on Electrical Conductivity of Direct Wafer-Bonded n-GaAs/n-GaAs Structures for Wafer-Bonded Tandem Solar Cells

    E-Print Network [OSTI]

    Yeung, King Wah Sunny

    2012-01-01

    electron tunneling model revealed an increase in the potential barrier to conduction, due to the presence of charge trap

  15. The Effect of Offcut Angle on Electrical Conductivity of Direct Wafer-Bonded n-GaAs/n-GaAs Structures for Wafer-Bonded Tandem Solar Cells

    E-Print Network [OSTI]

    Yeung, King Wah Sunny

    2012-01-01

    Efficient Inverted Triple- Junction Solar Cell with TwoCurrent-Matched Triple-Junction Solar Cell Reaching 41.1%

  16. The Effect of Offcut Angle on Electrical Conductivity of Direct Wafer-Bonded n-GaAs/n-GaAs Structures for Wafer-Bonded Tandem Solar Cells

    E-Print Network [OSTI]

    Yeung, King Wah Sunny

    2012-01-01

    manufacturing of multijunction III-V solar cells by directMultijunction semiconductor heterostructures are the basis for the design of high efficiency solar cellscell efficiency is currently held by Solar Junction at 43.5% 1 for their multijunction

  17. Process and apparatus for casting multiple silicon wafer articles

    DOE Patents [OSTI]

    Nanis, Leonard (Palo Alto, CA)

    1992-05-05

    Method and apparatus of casting silicon produced by the reaction between SiF.sub.4 and an alkaline earth metal into thin wafer-shaped articles suitable for solar cell fabrication.

  18. Electrochemical method for defect delineation in silicon-on-insulator wafers

    DOE Patents [OSTI]

    Guilinger, Terry R. (Albuquerque, NM); Jones, Howland D. T. (Albuquerque, NM); Kelly, Michael J. (Albuquerque, NM); Medernach, John W. (Albuquerque, NM); Stevenson, Joel O. (Albuquerque, NM); Tsao, Sylvia S. (Albuquerque, NM)

    1991-01-01

    An electrochemical method for defect delineation in thin-film SOI or SOS wafers in which a surface of a silicon wafer is electrically connected so as to control the voltage of the surface within a specified range, the silicon wafer is then contacted with an electrolyte, and, after removing the electrolyte, defects and metal contamination in the silicon wafer are identified.

  19. Auto Defect Classification (ADC) Value for Patterned Wafer Inspection Systems in PLY Within a High Volume Wafer Manufacturing Fabrication Facility

    E-Print Network [OSTI]

    Durniak, John

    2010-05-14

    The purpose of this investigation is to demonstrate value for Auto Defect Classification (ADC) for patterned wafer inspection systems within a high volume manufacturing fabrication in the Process Limited Yield (PLY) defect area. Process excursions...

  20. Apparatus and method for measuring the thickness of a semiconductor wafer

    DOE Patents [OSTI]

    Ciszek, T.F.

    1995-03-07

    Apparatus for measuring thicknesses of semiconductor wafers is discussed, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light. 4 figs.

  1. Recovery Act: Novel Kerf-Free PV Wafering that provides a low-cost approach to generate wafers from 150um to 50um in thickness

    SciTech Connect (OSTI)

    Fong, Theodore E.

    2013-05-06

    The technical paper summarizes the project work conducted in the development of Kerf-Free silicon wafering equipment for silicon solar wafering. This new PolyMax technology uses a two step process of implantation and cleaving to exfoliate 50um to 120um wafers with thicknesses ranging from 50um to 120um from a 125mm or 156mm pseudo-squared silicon ingot. No kerf is generated using this method of wafering. This method of wafering contrasts with the current method of making silicon solar wafers using the industry standard wire saw equipment. The report summarizes the activity conducted by Silicon Genesis Corporation in working to develop this technology further and to define the roadmap specifications for the first commercial proto-type equipment for high volume solar wafer manufacturing using the PolyMax technology.

  2. PREDICTIVE SIMULATION OF PIEZOELECTRIC WAFER ACTIVE SENSORS FOR STRUCTURAL HEALTH MONITORING

    E-Print Network [OSTI]

    Giurgiutiu, Victor

    1 PREDICTIVE SIMULATION OF PIEZOELECTRIC WAFER ACTIVE SENSORS FOR STRUCTURAL HEALTH MONITORING: structural health monitoring (SHM), piezoelectric wafer active sensors (PWAS), nondestructive evaluation (NDE sensors (PWAS) are lightweight and inexpensive enablers for structural health monitoring (SHM). After

  3. Vibration Analysis of Wiresaw Manufacturing Processes and Wafer Surface Measurements

    E-Print Network [OSTI]

    Kao, Imin

    Vibration Analysis of Wiresaw Manufacturing Processes and Wafer Surface Measurements I. Kao (PI), S. Wei, F-P. Chiang Department of Mechanical Engineering, SUNY Stony Brook, NY 11794-2300 Abstract the yield per crystal and to reduce the cost. In this paper, the vibration model of wiresaw system

  4. Wafer-Level Packaging Technology for RF Applications Based on a Rigid Low-Loss Spacer

    E-Print Network [OSTI]

    Technische Universiteit Delft

    Wafer-Level Packaging Technology for RF Applications Based on a Rigid Low-Loss Spacer Substrate Alexander Polyakov #12;#12;Wafer-Level Packaging Technology for RF Applications Based on a Rigid Low ICs...............................................13 1.4. Wafer-level packaging for RF applications

  5. Investing in Bonds 

    E-Print Network [OSTI]

    Johnson, Jason; Polk, Wade

    2002-08-12

    bonds Corporate bonds are generally the riskiest of all fixed-income securities because companies? even large, stable ones?are much more susceptible than govern- ments to economic problems, mis- management and competition. However, corporate bonds can...

  6. Municipal Bond - Power Purchase Agreement Model Continues to...

    Broader source: Energy.gov (indexed) [DOE]

    power purchase agreement model to provide low-cost solar energy. Author: National Renewable Energy Laboratory Municipal Bond - Power Purchase Agreement Model Continues to Provide...

  7. Qualified Energy Conservation Bond (QECB) Update: New Guidance...

    Office of Environmental Management (EM)

    clarification of what constitutes a qualified project for potential issuers of qualified energy conservation bond capacity. Author: Lawrence Berkeley National Laboratory Qualified...

  8. Chemical method for producing smooth surfaces on silicon wafers

    DOE Patents [OSTI]

    Yu, Conrad (Antioch, CA)

    2003-01-01

    An improved method for producing optically smooth surfaces in silicon wafers during wet chemical etching involves a pre-treatment rinse of the wafers before etching and a post-etching rinse. The pre-treatment with an organic solvent provides a well-wetted surface that ensures uniform mass transfer during etching, which results in optically smooth surfaces. The post-etching treatment with an acetic acid solution stops the etching instantly, preventing any uneven etching that leads to surface roughness. This method can be used to etch silicon surfaces to a depth of 200 .mu.m or more, while the finished surfaces have a surface roughness of only 15-50 .ANG. (RMS).

  9. Propagation of Nd-laser pulses through crystalline silicon wafers

    SciTech Connect (OSTI)

    Kirichenko, N A; Kuzmin, P G; Shcherbina, M E [Wave Research Center, A.M. Prokhorov General Physics Institute, Russian Academy of Sciences, Moscow (Russian Federation)

    2011-07-31

    Propagation of pulses from an Nd:YAG laser (wavelength, 1.064 {mu}m; pulse duration, 270 ns; pulse energy, 225 {mu}J) through crystalline silicon wafers is studied experimentally. Mathematical modelling of the process is performed: the heat conduction equation is solved numerically, the temperature dependences of the absorption and refraction of a substance, as well as generation of nonequilibrium carriers by radiation are taken into account. The constructed model satisfactorily explains the experimentally observed intensity oscillations of transmitted radiation. (interaction of laser radiation with matter)

  10. REC ScanWafer AS | Open Energy Information

    Open Energy Info (EERE)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Home Page on Google Bookmark EERE: Alternative Fuels Data Center Home Page on QA:QA J-E-1 SECTION J APPENDIX ECoop Inc Jump to:Newberg,Energy LLCALLETE IncScienceRoadmap/12-FD-hbScanWafer AS Jump

  11. Trending: Metal Oxo Bonds

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Trending: Metal Oxo Bonds Trending: Metal Oxo Bonds Print Wednesday, 29 May 2013 00:00 Metal oxides are important for scientific and technical applications in a variety of...

  12. Essays on corporate bonds

    E-Print Network [OSTI]

    Bao, Jack (Jack C.)

    2009-01-01

    This thesis consists of three empirical essays on corporate bonds, examining the role of both credit risk and liquidity. In the first chapter, I test the ability of structural models of default to price corporate bonds in ...

  13. Bonding thermoplastic polymers

    DOE Patents [OSTI]

    Wallow, Thomas I. (Fremont, CA); Hunter, Marion C. (Livermore, CA); Krafcik, Karen Lee (Livermore, CA); Morales, Alfredo M. (Livermore, CA); Simmons, Blake A. (San Francisco, CA); Domeier, Linda A. (Danville, CA)

    2008-06-24

    We demonstrate a new method for joining patterned thermoplastic parts into layered structures. The method takes advantage of case-II permeant diffusion to generate dimensionally controlled, activated bonding layers at the surfaces being joined. It is capable of producing bonds characterized by cohesive failure while preserving the fidelity of patterned features in the bonding surfaces. This approach is uniquely suited to production of microfluidic multilayer structures, as it allows the bond-forming interface between plastic parts to be precisely manipulated at micrometer length scales. The bond enhancing procedure is easily integrated in standard process flows and requires no specialized equipment.

  14. Structural health monitoring with piezoelectric wafer active sensors predictive modeling and simulation

    E-Print Network [OSTI]

    Giurgiutiu, Victor

    Structural health monitoring with piezoelectric wafer active sensors ­ predictive modeling of the state of the art in structural health monitoring with piezoelectric wafer active sensors and follows with conclusions and suggestions for further work Key Words: structural health monitoring, SHM, nondestructive

  15. Imaging Study of Multi-Crystalline Silicon Wafers Throughout the Manufacturing Process: Preprint

    SciTech Connect (OSTI)

    Johnston, S.; Yan, F.; Zaunbracher, K.; Al-Jassim, M.; Sidelkheir, O.; Blosse, A.

    2011-07-01

    Imaging techniques are applied to multi-crystalline silicon bricks, wafers at various process steps, and finished solar cells. Photoluminescence (PL) imaging is used to characterize defects and material quality on bricks and wafers. Defect regions within the wafers are influenced by brick position within an ingot and height within the brick. The defect areas in as-cut wafers are compared to imaging results from reverse-bias electroluminescence and dark lock-in thermography and cell parameters of near-neighbor finished cells. Defect areas are also characterized by defect band emissions. The defect areas measured by these techniques on as-cut wafers are shown to correlate to finished cell performance.

  16. Wafer chamber having a gas curtain for extreme-UV lithography

    DOE Patents [OSTI]

    Kanouff, Michael P. (Livermore, CA); Ray-Chaudhuri, Avijit K. (Livermore, CA)

    2001-01-01

    An EUVL device includes a wafer chamber that is separated from the upstream optics by a barrier having an aperture that is permeable to the inert gas. Maintaining an inert gas curtain in the proximity of a wafer positioned in a chamber of an extreme ultraviolet lithography device can effectively prevent contaminants from reaching the optics in an extreme ultraviolet photolithography device even though solid window filters are not employed between the source of reflected radiation, e.g., the camera, and the wafer. The inert gas removes the contaminants by entrainment.

  17. Water's Hydrogen Bond Strength

    E-Print Network [OSTI]

    Chaplin, Martin

    2007-01-01

    Water is necessary both for the evolution of life and its continuance. It possesses particular properties that cannot be found in other materials and that are required for life-giving processes. These properties are brought about by the hydrogen bonded environment particularly evident in liquid water. Each liquid water molecule is involved in about four hydrogen bonds with strengths considerably less than covalent bonds but considerably greater than the natural thermal energy. These hydrogen bonds are roughly tetrahedrally arranged such that when strongly formed the local clustering expands, decreasing the density. Such low density structuring naturally occurs at low and supercooled temperatures and gives rise to many physical and chemical properties that evidence the particular uniqueness of liquid water. If aqueous hydrogen bonds were actually somewhat stronger then water would behave similar to a glass, whereas if they were weaker then water would be a gas and only exist as a liquid at sub-zero temperature...

  18. Space Application of Piezoelectric Wafer Active Sensors for Structural Health Monitoring**

    E-Print Network [OSTI]

    Giurgiutiu, Victor

    Space Application of Piezoelectric Wafer Active Sensors for Structural Health Monitoring** V class of structural health monitoring (SHM) applications. This paper presents and discusses with conclusions and suggestions for further work. Key Words: structural health monitoring, piezoelectric, sensors

  19. Finite Element Simulation of Piezoelectric Wafer Active Sensors for Structural Health Monitoring with Coupled-Filed

    E-Print Network [OSTI]

    Giurgiutiu, Victor

    Finite Element Simulation of Piezoelectric Wafer Active Sensors for Structural Health Monitoring) is emerging as an effective and powerful technique in structural health monitoring (SHM). Modeling to analytical calculation and experimental data. Key words: Structural Health Monitoring, PWAS, finite element

  20. Structural Health Monitoring with Piezoelectric Wafer Active Sensors for Space Applications

    E-Print Network [OSTI]

    Giurgiutiu, Victor

    Structural Health Monitoring with Piezoelectric Wafer Active Sensors for Space Applications Adrian detection and structural health monitoring. Where appropriate, comparison between different methods-coupling coefficient I. Introduction STRUCTURAL health monitoring (SHM) is an emerging research area with multiple

  1. In-situ temperature and thickness characterization for silicon wafers undergoing thermal annealing 

    E-Print Network [OSTI]

    Vedantham, Vikram

    2004-11-15

    characteristics of the wafer. The Gabor wavelet transform allows the wave dispersion to be unraveled and the group velocity of individual frequency components to be extracted from the experimentally acquired time waveform. The thesis illustrates the formulation...

  2. Reflectance reduction of InP wafers after high-temperature annealing

    E-Print Network [OSTI]

    Luryi, Serge

    is beneficial for many devices, such as solar cells, LEDs, and sen- sors. Various methods of reflection unprocessed as the reference sample. Three quarters of one wafer were annealed in an oven at 350, 500, and 600

  3. Standardizing and improving test wafer processes : inventory optimization and a days of inventory pull system

    E-Print Network [OSTI]

    Johnson, David W. (David William), S.M. Massachusetts Institute of Technology

    2009-01-01

    Over the past few years, the Intel Fab-17 facility has aggressively pursued lean methodology to reduce the manufacturing costs associated with its aging 200mm diameter wafer process. One area ripe with improvement opportunities ...

  4. Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom

    DOE Patents [OSTI]

    Lin, YuPo J. (Naperville, IL); Henry, Michael P. (Batavia, IL); Snyder, Seth W. (Lincolnwood, IL)

    2008-11-18

    An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.

  5. Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom

    DOE Patents [OSTI]

    Lin, YuPo J. (Naperville, IL); Henry, Michael P. (Batavia, IL); Snyder, Seth W. (Lincolnwood, IL)

    2011-07-12

    An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.

  6. Low Temperature Material Bonding Technique

    DOE Patents [OSTI]

    Ramsey, J. Michael (Knoxville, TN); Foote, Robert S. (Oak Ridge, TN)

    2000-10-10

    A method of performing a lower temperature bonding technique to bond together two mating pieces of glass includes applying a sodium silicate aqueous solution between the two pieces.

  7. Low temperature material bonding technique

    DOE Patents [OSTI]

    Ramsey, J. Michael (Knoxville, TN); Foote, Robert S. (Oak Ridge, TN)

    2002-02-12

    A method of performing a lower temperature bonding technique to bond together two mating pieces of glass includes applying a sodium silicate aqueous solution between the two pieces.

  8. Qualified Energy Conservation Bonds

    Broader source: Energy.gov [DOE]

    Provides an in-depth description of qualified energy conservation bonds, including process and mechanics, case studies, utilization trends, barriers, and regulatory and legal issues. Author: Energy Programs Consortium

  9. Characterization of anodic bonding

    E-Print Network [OSTI]

    Tudryn, Carissa Debra, 1978-

    2004-01-01

    Anodic bonding is a common process used in MicroElectroMechanical Systems (MEMS) device fabrication and packaging. Polycrystalline chemical vapor deposited (CVD) silicon carbide (SiC) is emerging as a new MEMS device and ...

  10. Bonding aerogels with polyurethanes

    SciTech Connect (OSTI)

    Matthews, F.M.; Hoffman, D.M.

    1989-11-01

    Aerogels, porous silica glasses with ultra-fine cell size (30nm), are made by a solution gelation (sol-gel) process. The resulting gel is critical point dried to densities from 0.15--0.60 g/cc. This material is machinable, homogeneous, transparent, coatable and bondable. To bond aerogel an adhesive should have long cure time, no attack on the aerogel structure, and high strength. Several epoxies and urethanes were examined to determine if they satisfied these conditions. Bond strengths above 13 psi were found with double bubble and DP-110 epoxies and XI-208/ODA-1000 and Castall U-2630 urethanes. Hardman Kalex Tough Stuff'' A-85 hardness urethane gave 18 psi bond strength. Hardman A-85, Tuff-Stuff'' was selected for further evaluation because it produced bond strengths comparable to the adherend cohesive strength. 5 refs., 2 figs.

  11. Water's Hydrogen Bond Strength

    E-Print Network [OSTI]

    Martin Chaplin

    2007-06-10

    Water is necessary both for the evolution of life and its continuance. It possesses particular properties that cannot be found in other materials and that are required for life-giving processes. These properties are brought about by the hydrogen bonded environment particularly evident in liquid water. Each liquid water molecule is involved in about four hydrogen bonds with strengths considerably less than covalent bonds but considerably greater than the natural thermal energy. These hydrogen bonds are roughly tetrahedrally arranged such that when strongly formed the local clustering expands, decreasing the density. Such low density structuring naturally occurs at low and supercooled temperatures and gives rise to many physical and chemical properties that evidence the particular uniqueness of liquid water. If aqueous hydrogen bonds were actually somewhat stronger then water would behave similar to a glass, whereas if they were weaker then water would be a gas and only exist as a liquid at sub-zero temperatures. The overall conclusion of this investigation is that water's hydrogen bond strength is poised centrally within a narrow window of its suitability for life.

  12. Phase transformations during the Ag-In plating and bonding of vertical diode elements of multijunction solar cells

    SciTech Connect (OSTI)

    Klochko, N. P. Khrypunov, G. S.; Volkova, N. D.; Kopach, V. R.; Lyubov, V. N.; Kirichenko, M. V.; Momotenko, A. V.; Kharchenko, N. M.; Nikitin, V. A.

    2013-06-15

    The conditions of the bonding of silicon multijunction solar cells with vertical p-n junctions using Ag-In solder are studied. The compositions of electrodeposited indium films on silicon wafers silver plated by screen printing and silver and indium films fabricated by layer-by-layer electrochemical deposition onto the surface of silicon vertical diode cells silver plated in vacuum are studied. Studying the electrochemical-deposition conditions, structure, and surface morphology of the grown layers showed that guaranteed bonding is provided by 8-min heat treatment at 400 Degree-Sign C under the pressure of a stack of metallized silicon wafers; however, the ratio of the indium and silver layer thicknesses should not exceed 1: 3. As this condition is satisfied, the solder after wafer bonding has the InAg{sub 3} structure (or InAg{sub 3} with an Ag phase admixture), due to which the junction melting point exceeds 700 Degree-Sign C, which guarantees the functioning of such solar cells under concentrated illumination.

  13. Thin, High Lifetime Silicon Wafers with No Sawing; Re-crystallization in a Thin Film Capsule

    SciTech Connect (OSTI)

    Emanuel Sachs Tonio Buonassisi

    2013-01-16

    The project fits within the area of renewable energy called photovoltaics (PV), or the generation of electricity directly from sunlight using semiconductor devices. PV has the greatest potential of any renewable energy technology. The vast majority of photovoltaic modules are made on crystalline silicon wafers and these wafers accounts for the largest fraction of the cost of a photovoltaic module. Thus, a method of making high quality, low cost wafers would be extremely beneficial to the PV industry The industry standard technology creates wafers by casting an ingot and then sawing wafers from the ingot. Sawing rendered half of the highly refined silicon feedstock as un-reclaimable dust. Being a brittle material, the sawing is actually a type of grinding operation which is costly both in terms of capital equipment and in terms of consumables costs. The consumables costs associated with the wire sawing technology are particularly burdensome and include the cost of the wire itself (continuously fed, one time use), the abrasive particles, and, waste disposal. The goal of this project was to make wafers directly from molten silicon with no sawing required. The fundamental concept was to create a very low cost (but low quality) wafer of the desired shape and size and then to improve the quality of the wafer by a specialized thermal treatment (called re-crystallization). Others have attempted to create silicon sheet by recrystallization with varying degrees of success. Key among the difficulties encountered by others were: a) difficulty in maintaining the physical shape of the sheet during the recrystallization process and b) difficulty in maintaining the cleanliness of the sheet during recrystallization. Our method solved both of these challenges by encapsulating the preform wafer in a protective capsule prior to recrystallization (see below). The recrystallization method developed in this work was extremely effective at maintaining the shape and the cleanliness of the wafer. In addition, it was found to be suitable for growing very large crystals. The equipment used was simple and inexpensive to operate. Reasonable solar cells were fabricated on re-crystallized material.

  14. SiGe-free strained Si on insulator by wafer bonding and layer transfer T. A. Langdo,a)

    E-Print Network [OSTI]

    ­8 or Ge condensation during SiGe oxidation.9 In these approaches, the relaxed SGOI layer serves as a ten chemical mechanical polishing step to elimi- nate the surface crosshatch roughness induced by the com

  15. Microwave ECR plasma electron flood for low pressure wafer charge neutralization

    SciTech Connect (OSTI)

    Vanderberg, Bo; Nakatsugawa, Tomoya; Divergilio, William

    2012-11-06

    Modern ion implanters typically use dc arc discharge Plasma Electron Floods (PEFs) to neutralize wafer charge. The arc discharge requires using at least some refractory metal hardware, e.g. a thermionically emitting filament, which can be undesirable in applications where no metallic contamination is critical. rf discharge PEFs have been proposed to mitigate contamination risks but the gas flows required can result in high process chamber pressures. Axcelis has developed a microwave electron cyclotron resonance (ECR) PEF to provide refractory metals contamination-free wafer neutralization with low gas flow requirement. Our PEF uses a custom, reentrant cusp magnet field providing ECR and superior electron confinement. Stable PEF operation with extraction slits sized for 300 mm wafers can be attained at Xe gas flows lower than 0.2 sccm. Electron extraction currents can be as high as 20 mA at absorbed microwave powers < 70 W. On Axcelis' new medium current implanter, plasma generation has proven robust against pressure transients caused by, for example, photoresist outgassing by high power ion beams. Charge monitor and floating potential measurements along the wafer surface corroborate adequate wafer charge neutralization for low energy, high current ion beams.

  16. Qualifying Energy Conservation Bonds 

    E-Print Network [OSTI]

    Briggs, J.

    2013-01-01

    Bonds (QECB’s) CATEE Conference December 18, 2013 ESL-KT-13-12-39 CATEE 2013: Clean Air Through Energy Efficiency Conference, San Antonio, Texas Dec. 16-18 • Originally authorized by the Energy Improvement & Extension Act of 2008 • American Recovery... ) of the interest cost associated with the transaction • Typical effective interest rates anywhere from 0%-2% depending on credit strength • Bond issuance or private placement is acceptable 2 What are QECB’s ESL-KT-13-12-39 CATEE 2013: Clean Air Through Energy...

  17. Initiation time of near-infrared laser-induced slip on the surface of silicon wafers

    SciTech Connect (OSTI)

    Choi, Sungho [Graduate School of Mechanical Engineering, Hanyang University, Seoul 133–791 (Korea, Republic of); Jhang, Kyung-Young, E-mail: kyjhang@hanyang.ac.kr [School of Mechanical Engineering, Hanyang University, Seoul 133–791 (Korea, Republic of)

    2014-06-23

    We have determined the initiation time of laser-induced slip on a silicon wafer surface subjected to a near-infrared continuous-wave laser by numerical simulations and experiments. First, numerical analysis was performed based on the heat transfer and thermoelasticity model to calculate the resolved shear stress and the temperature-dependent yield stress. Slip initiation time was predicted by finding the time at which the resolved shear stress reached the yield stress. Experimentally, the slip initiation time was measured by using a laser scattering technique that collects scattered light from the silicon wafer surface and detects strong scattering when the surface slip is initiated. The surface morphology of the silicon wafer surface after laser irradiation was also observed using an optical microscope to confirm the occurrence of slip. The measured slip initiation times agreed well with the numerical predictions.

  18. Photochemical tissue bonding

    DOE Patents [OSTI]

    Redmond, Robert W. (Brookline, MA); Kochevar, Irene E. (Charlestown, MA)

    2012-01-10

    Photochemical tissue bonding methods include the application of a photosensitizer to a tissue and/or tissue graft, followed by irradiation with electromagnetic energy to produce a tissue seal. The methods are useful for tissue adhesion, such as in wound closure, tissue grafting, skin grafting, musculoskeletal tissue repair, ligament or tendon repair and corneal repair.

  19. Influence of gas composition on wafer temperature in a tungsten chemical vapor deposition reactor: Experimental measurements, model

    E-Print Network [OSTI]

    Rubloff, Gary W.

    tool in the de- velopment of semiconductor manufacturing equipment. The value of process modeling studies have focused on modeling trans- port mechanisms in single wafer rapid thermal processing RTP the gas phase and wafer itself. In addition to the dominant radiative energy exchange modes inside

  20. Generation of SWNTs on Si Wafer by Alcohol Catalytic CVD Shigeo Maruyama, Shohei Chiashi and Yuhei Miyauchi

    E-Print Network [OSTI]

    Maruyama, Shigeo

    Generation of SWNTs on Si Wafer by Alcohol Catalytic CVD Shigeo Maruyama, Shohei Chiashi and Yuhei ACCVD technique, lower temperature generation of SWNTs on Al patterned Si surface should be principally possible. We tried to generate SWNTs on Si wafer by ACCVD technique. Zeolite particles supporting Fe

  1. Generation and Recombination Carrier Lifetimes in 4H SiC Epitaxial Wafers , M. J. Loboda1)

    E-Print Network [OSTI]

    Schroder, Dieter K.

    Generation and Recombination Carrier Lifetimes in 4H SiC Epitaxial Wafers G. Chung1) , M. J. Loboda comparative studies of recombination and carrier lifetimes in SiC. For the first time, both generation-wafer structures. The ratio of the generation to recombination lifetime is much different in SiC compared to Si

  2. 232 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 16, NO. 2, APRIL 2007 Glass Blowing on a Wafer Level

    E-Print Network [OSTI]

    Chen, Zhongping

    232 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 16, NO. 2, APRIL 2007 Glass Blowing on a Wafer. The ability to blow glass on a wafer level may enable novel capabilities including mass-pro- duction-0092] Index Terms--Fabrication, glass, glass blowing, glass bubble, glass shell, microglass sphere

  3. Material requirements for the adoption of unconventional silicon crystal and wafer growth techniques for high-efficiency solar cells

    DOE Public Access Gateway for Energy & Science Beta (PAGES Beta)

    Hofstetter, Jasmin; del Cańizo, Carlos; Wagner, Hannes; Castellanos, Sergio; Buonassisi, Tonio

    2015-10-15

    Silicon wafers comprise approximately 40% of crystalline silicon module cost and represent an area of great technological innovation potential. Paradoxically, unconventional wafer-growth techniques have thus far failed to displace multicrystalline and Czochralski silicon, despite four decades of innovation. One of the shortcomings of most unconventional materials has been a persistent carrier lifetime deficit in comparison to established wafer technologies, which limits the device efficiency potential. In this perspective article, we review a defect-management framework that has proven successful in enabling millisecond lifetimes in kerfless and cast materials. Control of dislocations and slowly diffusing metal point defects during growth, coupled tomore »effective control of fast-diffusing species during cell processing, is critical to enable high cell efficiencies. As a result, to accelerate the pace of novel wafer development, we discuss approaches to rapidly evaluate the device efficiency potential of unconventional wafers from injection-dependent lifetime measurements.« less

  4. An Optical Method for Monitoring Metal Contamination during Aqueous Processing of Silicon Wafers

    E-Print Network [OSTI]

    Suni, Ian Ivar

    An Optical Method for Monitoring Metal Contamination during Aqueous Processing of Silicon Wafers during microelectronics fabrication. Cu deposition from 0.15 and 0.25% HF solutions contaminated with 3 etch is to remove the native oxide (5i03), which often has significant contamination arising from

  5. Damage Identification in Aging Aircraft Structures with Piezoelectric Wafer Active Sensors

    E-Print Network [OSTI]

    Giurgiutiu, Victor

    Damage Identification in Aging Aircraft Structures with Piezoelectric Wafer Active Sensors VICTOR of structural damage such as fatigue cracks and corrosion. Two main detection strategies are considered: (a) the wave propagation method for far-field damage detection; and (b) the electro-mechanical (E/M) impedance

  6. Damage Identification in Aging Aircraft Structures with Piezoelectric Wafer Active Sensors

    E-Print Network [OSTI]

    Giurgiutiu, Victor

    Damage Identification in Aging Aircraft Structures with Piezoelectric Wafer Active Sensors VICTOR the onset and progress of structural damage such as fatigue cracks and corrosion. Two main detection strategies are considered: (a) the wave propagation method for far-field damage detection; and (b

  7. Tuned Lamb Wave Excitation and Detection with Piezoelectric Wafer Active Sensors for Structural Health Monitoring

    E-Print Network [OSTI]

    Giurgiutiu, Victor

    and detect tuned Lamb waves for structural health monitoring is explored. First, a brief review of Lamb waves mode Lamb waves is demonstrated as an effective structural health monitoring method. Key Words: structural health monitoring, Lamb waves, piezoelectric wafer active sensors, aging aircraft, cracks, damage

  8. Signal Acquisition/Conditioning for Automated Data Collection during Structural Health Monitoring with Piezoelectric Wafer

    E-Print Network [OSTI]

    Giurgiutiu, Victor

    1 Signal Acquisition/Conditioning for Automated Data Collection during Structural Health Monitoring sensors (PWAS) is emerging as an effective and powerful technique for structural health monitoring (SHM words: Structural health monitoring, piezoelectric wafer active sensors, pitch-catch, pulse-echo, phased

  9. Piezoelectric Wafer Embedded Active Sensors for Aging Aircraft Structural Health Monitoring

    E-Print Network [OSTI]

    Giurgiutiu, Victor

    41 Piezoelectric Wafer Embedded Active Sensors for Aging Aircraft Structural Health Monitoring ends with a conceptual design of a structural health monitoring system and suggestions for aging damage detection Á structural health monitoring Á failure prevention Á ultrasonics Á pulse-echo Á emitter

  10. MULTIFUNCTIONAL VEHICLE STRUCTURAL HEALTH MONITORING OPPORTUNITIES WITH PIEZOELECTRIC WAFER ACTIVE SENSORS

    E-Print Network [OSTI]

    Giurgiutiu, Victor

    MULTIFUNCTIONAL VEHICLE STRUCTURAL HEALTH MONITORING OPPORTUNITIES WITH PIEZOELECTRIC WAFER ACTIVE and the research needs are also discussed. INTRODUCTION Structural Health Monitoring is a major component of the remaining structural life. For the health monitoring of an actual structure, networks of embedded active

  11. Noncontact semiconductor wafer characterization with the terahertz Hall D. M. Mittleman,a)

    E-Print Network [OSTI]

    Natelson, Douglas

    of Physics. S0003-6951 97 01427-7 Doped semiconductors are frequently characterized by two material properties and quality. They also determine many of the electrical and optical properties of the material. NNoncontact semiconductor wafer characterization with the terahertz Hall effect D. M. Mittleman,a) J

  12. ISOTROPIC ETCHING OF 111 SCS FOR WAFER-SCALE MANUFACTURING OF PERFECTLY HEMISPHERICAL SILICON MOLDS

    E-Print Network [OSTI]

    Afshari, Ehsan

    ISOTROPIC ETCHING OF 111 SCS FOR WAFER-SCALE MANUFACTURING OF PERFECTLY HEMISPHERICAL SILICON MOLDS as sacrificial molds for micro-scale hemispherical resonator gyroscopes (HRGs) made using hemispherical shell resonators. Geometric uniformity of the mold is critical for HRG applications in order to achieve degenerate

  13. Through-Wafer Interconnects for High Degree of Freedom MEMS Deformable Mirrors

    E-Print Network [OSTI]

    Bifano, Thomas

    Through-Wafer Interconnects for High Degree of Freedom MEMS Deformable Mirrors Alioune Diouf 1 Spinelli Place, Cambridge, MA 02138 Abstract The development of an assembly and packaging process for MEMS University MEMS DMs are surface-micromachined polysilicon double-cantilever actuator architecture

  14. Wafer-scale metasurface for total power absorption, local field enhancement and

    E-Print Network [OSTI]

    with near-complete absorption and record areas (4 inch wafers, i.e. ,80 cm2 ) using standard sputtering the silver nanoparticle island morphology. We discuss the physical interpretation of the perfect absorption phenomenon in terms of equivalent electric and magnetic surface currents. These are enabled by the SIOM

  15. Wafer-Level Patterned and Aligned Polymer Nanowire/ Micro-and Nanotube Arrays on any Substrate

    E-Print Network [OSTI]

    Wang, Zhong L.

    with silicon technology. Fabrication of PNW arrays of functional polymers has important applications rangingWafer-Level Patterned and Aligned Polymer Nanowire/ Micro- and Nanotube Arrays on any Substrate, and energy science.[1­7] A key requirement for these applications is the cost-effective growth of high

  16. Pauling bond strength, bond length and electron density distribution

    SciTech Connect (OSTI)

    Gibbs, Gerald V.; Ross, Nancy L.; Cox, David F.; Rosso, Kevin M.; Iversen, Bo B.; Spackman, M. A.

    2014-01-18

    A power law regression equation, = 1.46(/r)-0.19, connecting the average experimental bond lengths, , with the average accumulation of the electron density at the bond critical point, , between bonded metal M and oxygen atoms, determined at ambient conditions for oxide crystals, where r is the row number of the M atom, is similar to the regression equation R(M-O) = 1.39(?(rc)/r)-0.21 determined for three perovskite crystals for pressures as high as 80 GPa. The two equations are also comparable with those, = 1.43(/r)-0.21, determined for a large number of oxide crystals at ambient conditions and = 1.39(/r)-0.22, determined for geometry optimized hydroxyacid molecules, that connect the bond lengths to the average Pauling electrostatic bond strength, , for the M-O bonded interactions. On the basis of the correspondence between the two sets of equations connecting ?(rc) and the Pauling bond strength s with bond length, it appears that Pauling’s simple definition of bond strength closely mimics the accumulation of the electron density between bonded pairs of atoms. The similarity of the expressions for the crystals and molecules is compelling evidence that the M-O bonded interactions for the crystals and molecules 2 containing the same bonded interactions are comparable. Similar expressions, connecting bond lengths and bond strength, have also been found to hold for fluoride, nitride and sulfide molecules and crystals. The Brown-Shannon bond valence, ?, power law expression ? = [R1/(R(M-O)]N that has found wide use in crystal chemistry, is shown to be connected to a more universal expression determined for oxides and the perovskites, = r[(1.41)/]4.76, demonstrating that the bond valence for a bonded interaction is likewise closely connected to the accumulation of the electron density between the bonded atoms. Unlike the Brown-Shannon expression, it is universal in that it holds for the M-O bonded interactions for a relatively wide range of M atoms of the periodic table. The power law equation determined for the oxide crystals at ambient conditions is similar to the power law expression = r[1.46/]5.26 determined for the perovskites at pressures as high as 80 GPa, indicating that the intrinsic connection between R(M-O) and ?(rc) that holds at ambient conditions also holds, to a first approximation, at high pressures.

  17. Sandia starts silicon wafer production for three nuclear weapon programs |

    National Nuclear Security Administration (NNSA)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantity of NaturalDukeWakefield Municipal GasAdministration Medal ofNational Nuclear Security Administration signs MOU with

  18. Low temperature reactive bonding

    DOE Patents [OSTI]

    Makowiecki, D.M.; Bionta, R.M.

    1995-01-17

    The joining technique is disclosed that requires no external heat source and generates very little heat during joining. It involves the reaction of thin multilayered films deposited on faying surfaces to create a stable compound that functions as an intermediate or braze material in order to create a high strength bond. While high temperatures are reached in the reaction of the multilayer film, very little heat is generated because the films are very thin. It is essentially a room temperature joining process. 5 figures.

  19. Trending: Metal Oxo Bonds

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantityBonneville Power AdministrationRobust,Field-effectWorking With U.S.WeekProducts >TransportationEHSSTrending: Metal Oxo Bonds

  20. Better Bonded Ethernet Load Balancing

    SciTech Connect (OSTI)

    Gabler, Jason

    2006-09-29

    When a High Performance Storage System's mover shuttles large amounts of data to storage over a single Ethernet device that single channel can rapidly become saturated. Using Linux Ethernet channel bonding to address this and similar situations was not, until now, a viable solution. The various modes in which channel bonding could be configured always offered some benefit but only under strict conditions or at a system resource cost that was greater than the benefit gained by using channel bonding. Newer bonding modes designed by various networking hardware companies, helpful in such networking scenarios, were already present in their own switches. However, Linux-based systems were unable to take advantage of those new modes as they had not yet been implemented in the Linux kernel bonding driver. So, except for basic fault tolerance, Linux channel bonding could not positively combine separate Ethernet devices to provide the necessary bandwidth.

  1. Features of the electric-field distribution in anisotropic semiconductor wafers in a transverse magnetic field

    SciTech Connect (OSTI)

    Filippov, V. V., E-mail: wwfilippow@mail.ru [Lipetsk State Pedagogical University (Russian Federation); Bormontov, E. N. [Voronezh State University (Russian Federation)

    2013-07-15

    A macroscopic model of the Hall effects and magnetoresistance in anisotropic semiconductor wafers is developed. The results obtained by solving the electrodynamic boundary problem allow the potential and eddy currents in anisotropic semiconductors to be calculated at different current-contact locations, depending on the parameters of the sample material's anisotropy. The results of this study are of great practical importance for investigating the physical properties of anisotropic semiconductors and simulating the electron-transport phenomena in devices based on anisotropic semiconductors.

  2. Geek-Up[09.03.10]-- Innovative Silicon Wafers, Real-Time Power Traders and Petascale & Exascale Supercomputers

    Broader source: Energy.gov [DOE]

    A trillion holes in a silicon wafer the size of a compact disk? Buying when the Columbia River Basin is low, and selling when it's high. And how supercomputers can revolutionize climate science and modeling.

  3. Method for protecting chip corners in wet chemical etching of wafers

    DOE Patents [OSTI]

    Hui, Wing C. (Campbell, CA)

    1994-01-01

    The present invention is a corner protection mask design that protects chip corners from undercutting during anisotropic etching of wafers. The corner protection masks abut the chip corner point and extend laterally from segments along one or both corner sides of the corner point, forming lateral extensions. The protection mask then extends from the lateral extensions, parallel to the direction of the corner side of the chip and parallel to scribe lines, thus conserving wafer space. Unmasked bomb regions strategically formed in the protection mask facilitate the break-up of the protection mask during etching. Corner protection masks are useful for chip patterns with deep grooves and either large or small chip mask areas. Auxiliary protection masks form nested concentric frames that etch from the center outward are useful for small chip mask patterns. The protection masks also form self-aligning chip mask areas. The present invention is advantageous for etching wafers with thin film windows, microfine and micromechanical structures, and for forming chip structures more elaborate than presently possible.

  4. Method for protecting chip corners in wet chemical etching of wafers

    DOE Patents [OSTI]

    Hui, W.C.

    1994-02-15

    The present invention is a corner protection mask design that protects chip corners from undercutting during anisotropic etching of wafers. The corner protection masks abut the chip corner point and extend laterally from segments along one or both corner sides of the corner point, forming lateral extensions. The protection mask then extends from the lateral extensions, parallel to the direction of the corner side of the chip and parallel to scribe lines, thus conserving wafer space. Unmasked bomb regions strategically formed in the protection mask facilitate the break-up of the protection mask during etching. Corner protection masks are useful for chip patterns with deep grooves and either large or small chip mask areas. Auxiliary protection masks form nested concentric frames that etch from the center outward are useful for small chip mask patterns. The protection masks also form self-aligning chip mask areas. The present invention is advantageous for etching wafers with thin film windows, microfine and micromechanical structures, and for forming chip structures more elaborate than presently possible. 63 figures.

  5. Method for photolithographic definition of recessed features on a semiconductor wafer utilizing auto-focusing alignment

    DOE Patents [OSTI]

    Farino, Anthony J. (Albuquerque, NM); Montague, Stephen (Albuquerque, NM); Sniegowski, Jeffry J. (Albuquerque, NM); Smith, James H. (Albuquerque, NM); McWhorter, Paul J. (Albuquerque, NM)

    1998-01-01

    A method is disclosed for photolithographically defining device features up to the resolution limit of an auto-focusing projection stepper when the device features are to be formed in a wafer cavity at a depth exceeding the depth of focus of the stepper. The method uses a focusing cavity located in a die field at the position of a focusing light beam from the auto-focusing projection stepper, with the focusing cavity being of the same depth as one or more adjacent cavities wherein a semiconductor device is to be formed. The focusing cavity provides a bottom surface for referencing the focusing light beam and focusing the stepper at a predetermined depth below the surface of the wafer, whereat the device features are to be defined. As material layers are deposited in each device cavity to build up a semiconductor structure such as a microelectromechanical system (MEMS) device, the same material layers are deposited in the focusing cavity, raising the bottom surface and re-focusing the stepper for accurately defining additional device features in each succeeding material layer. The method is especially applicable for forming MEMS devices within a cavity or trench and integrating the MEMS devices with electronic circuitry fabricated on the wafer surface.

  6. Method for photolithographic definition of recessed features on a semiconductor wafer utilizing auto-focusing alignment

    DOE Patents [OSTI]

    Farino, A.J.; Montague, S.; Sniegowski, J.J.; Smith, J.H.; McWhorter, P.J.

    1998-07-21

    A method is disclosed for photolithographically defining device features up to the resolution limit of an auto-focusing projection stepper when the device features are to be formed in a wafer cavity at a depth exceeding the depth of focus of the stepper. The method uses a focusing cavity located in a die field at the position of a focusing light beam from the auto-focusing projection stepper, with the focusing cavity being of the same depth as one or more adjacent cavities wherein a semiconductor device is to be formed. The focusing cavity provides a bottom surface for referencing the focusing light beam and focusing the stepper at a predetermined depth below the surface of the wafer, whereat the device features are to be defined. As material layers are deposited in each device cavity to build up a semiconductor structure such as a microelectromechanical system (MEMS) device, the same material layers are deposited in the focusing cavity, raising the bottom surface and re-focusing the stepper for accurately defining additional device features in each succeeding material layer. The method is especially applicable for forming MEMS devices within a cavity or trench and integrating the MEMS devices with electronic circuitry fabricated on the wafer surface. 15 figs.

  7. Quantum Confinement in Hydrogen Bond

    E-Print Network [OSTI]

    Carlos da Silva dos Santos; Elso Drigo Filho; Regina Maria Ricotta

    2015-02-09

    In this work, the quantum confinement effect is proposed as the cause of the displacement of the vibrational spectrum of molecular groups that involve hydrogen bonds. In this approach the hydrogen bond imposes a space barrier to hydrogen and constrains its oscillatory motion. We studied the vibrational transitions through the Morse potential, for the NH and OH molecular groups inside macromolecules in situation of confinement (when hydrogen bonding is formed) and non-confinement (when there is no hydrogen bonding). The energies were obtained through the variational method with the trial wave functions obtained from Supersymmetric Quantum Mechanics (SQM) formalism. The results indicate that it is possible to distinguish the emission peaks related to the existence of the hydrogen bonds. These analytical results were satisfactorily compared with experimental results obtained from infrared spectroscopy.

  8. Physical Nature of Hydrogen Bond

    E-Print Network [OSTI]

    Zhyganiuk, I V

    2015-01-01

    The physical nature and the correct definition of hydrogen bond (H-bond) are considered.\\,\\,The influence of H-bonds on the thermodynamic, kinetic, and spectroscopic properties of water is analyzed.\\,\\,The conventional model of H-bonds as sharply directed and saturated bridges between water molecules is incompatible with the behavior of the specific volume, evaporation heat, and self-diffusion and kinematic shear viscosity coefficients of water. On the other hand, it is shown that the variation of the dipole moment of a water molecule and the frequency shift of valence vibrations of a hydroxyl group can be totally explained in the framework of the electrostatic model of H-bond.\\,\\,At the same time, the temperature dependences of the heat capacity of water in the liquid and vapor states clearly testify to the existence of weak H-bonds.\\,\\,The analysis of a water dimer shows that the contribution of weak H-bonds to its ground state energy is approximately 4--5 times lower in comparison with the energy of electr...

  9. Determining Pad-Wafer Contact using Dual Emission Laser Induced Fluorescence Caprice Gray1

    E-Print Network [OSTI]

    White, Robert D.

    energy required to break and re-order the chemical bonds on the glass substrate surface so thickness, asperity layer compressibility, surface roughness measurements and polishing pad rebound

  10. Fusion bonding and alignment fixture

    DOE Patents [OSTI]

    Ackler, Harold D. (Sunnyvale, CA); Swierkowski, Stefan P. (Livermore, CA); Tarte, Lisa A. (Livermore, CA); Hicks, Randall K. (Stockton, CA)

    2000-01-01

    An improved vacuum fusion bonding structure and process for aligned bonding of large area glass plates, patterned with microchannels and access holes and slots, for elevated glass fusion temperatures. Vacuum pumpout of all the components is through the bottom platform which yields an untouched, defect free top surface which greatly improves optical access through this smooth surface. Also, a completely non-adherent interlayer, such as graphite, with alignment and location features is located between the main steel platform and the glass plate pair, which makes large improvements in quality, yield, and ease of use, and enables aligned bonding of very large glass structures.

  11. Method for vacuum fusion bonding

    DOE Patents [OSTI]

    Ackler, Harold D. (Sunnyvale, CA); Swierkowski, Stefan P. (Livermore, CA); Tarte, Lisa A. (Livermore, CA); Hicks, Randall K. (Stockton, CA)

    2001-01-01

    An improved vacuum fusion bonding structure and process for aligned bonding of large area glass plates, patterned with microchannels and access holes and slots, for elevated glass fusion temperatures. Vacuum pumpout of all components is through the bottom platform which yields an untouched, defect free top surface which greatly improves optical access through this smooth surface. Also, a completely non-adherent interlayer, such as graphite, with alignment and location features is located between the main steel platform and the glass plate pair, which makes large improvements in quality, yield, and ease of use, and enables aligned bonding of very large glass structures.

  12. Method of bonding

    DOE Patents [OSTI]

    Saller, deceased, Henry A. (late of Columbus, OH); Hodge, Edwin S. (Columbus, OH); Paprocki, Stanley J. (Columbus, OH); Dayton, Russell W. (Columbus, OH)

    1987-12-01

    1. A method of making a fuel-containing structure for nuclear reactors, comprising providing an assembly comprising a plurality of fuel units; each fuel unit consisting of a core plate containing thermal-neutron-fissionable material, sheets of cladding metal on its bottom and top surfaces, said cladding sheets being of greater width and length than said core plates whereby recesses are formed at the ends and sides of said core plate, and end pieces and first side pieces of cladding metal of the same thickness as the core plate positioned in said recesses, the assembly further comprising a plurality of second side pieces of cladding metal engaging the cladding sheets so as to space the fuel units from one another, and a plurality of filler plates of an acid-dissolvable nonresilient material whose melting point is above 2000.degree. F., each filler plate being arranged between a pair of said second side pieces and the cladding plates of two adjacent fuel units, the filler plates having the same thickness as the second side pieces; the method further comprising enclosing the entire assembly in an envelope; evacuating the interior of the entire assembly through said envelope; applying inert gas under a pressure of about 10,000 psi to the outside of said envelope while at the same time heating the assembly to a temperature above the flow point of the cladding metal but below the melting point of any material of the assembly, whereby the envelope is pressed against the assembly and integral bonds are formed between plates, sheets, first side pieces, and end pieces and between the sheets and the second side pieces; slowly cooling the assembly to room temperature; removing the envelope; and dissolving the filler plates without attacking the cladding metal.

  13. Low Temperature Material Bonding Techniq Ue

    DOE Patents [OSTI]

    Ramsey, J. Michael (Knoxville, TN); Foote, Robert S. (Oak Ridge, TN)

    2002-08-06

    A method of performing a lower temperature bonding technique to bond together two mating pieces of glass includes applying a sodium silicate aqueous solution between the two pieces.

  14. Hydrogen Bond Shaping of Membrane Protein Structure

    E-Print Network [OSTI]

    Cao, Zheng

    2013-01-01

    2 1.3. HYDROGEN BOND STRENGTHAND EQUILIBRIUM HYDROGEN / DEUTERIUM FRACTIONATION4 1.4. MEASUING HYDROGEN BOND STRENGTH IN A MEMBRANE PROTEIN

  15. Sandia Energy - Diffusion Bonding Characterization

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    bond surface is poor or only the region near this corner. Diffusion 7-8-9 "Diffusion Welding and Brazing," in Welding Handbook, 7th ed., American Welding Society, 1980, p 311-335...

  16. Transient liquid phase ceramic bonding

    DOE Patents [OSTI]

    Glaeser, Andreas M. (Berkeley, CA)

    1994-01-01

    Ceramics are joined to themselves or to metals using a transient liquid phase method employing three layers, one of which is a refractory metal, ceramic or alloy. The refractory layer is placed between two metal layers, each of which has a lower melting point than the refractory layer. The three layers are pressed between the two articles to be bonded to form an assembly. The assembly is heated to a bonding temperature at which the refractory layer remains solid, but the two metal layers melt to form a liquid. The refractory layer reacts with the surrounding liquid and a single solid bonding layer is eventually formed. The layers may be designed to react completely with each other and form refractory intermetallic bonding layers. Impurities incorporated into the refractory metal may react with the metal layers to form refractory compounds. Another method for joining ceramic articles employs a ceramic interlayer sandwiched between two metal layers. In alternative embodiments, the metal layers may include sublayers. A method is also provided for joining two ceramic articles using a single interlayer. An alternate bonding method provides a refractory-metal oxide interlayer placed adjacent to a strong oxide former. Aluminum or aluminum alloys are joined together using metal interlayers.

  17. Bond percolation on multiplex networks

    E-Print Network [OSTI]

    Hackett, A; Gómez, S; Arenas, A; Gleeson, J P

    2015-01-01

    We present an analytical approach for bond percolation on multiplex networks and use it to determine the expected size of the giant connected component and the value of the critical bond occupation probability in these networks. We advocate the relevance of these tools to the modeling of multilayer robustness and contribute to the debate on whether any benefit is to be yielded from studying a full multiplex structure as opposed to its monoplex projection, especially in the seemingly irrelevant case of a bond occupation probability that does not depend on the layer. Although we find that in many cases the predictions of our theory for multiplex networks coincide with previously derived results for monoplex networks, we also uncover the remarkable result that for a certain class of multiplex networks, well described by our theory, new critical phenomena occur as multiple percolation phase transitions are present. We provide an instance of this phenomenon in a multipex network constructed from London rail and Eu...

  18. Bond Underwriter Costs: Texas School Districts and the Hidden Cost of Issuing Bonds 

    E-Print Network [OSTI]

    Stasny, Mary Knetsar

    2011-02-22

    The purpose of this study was to investigate possible relationships between school district characteristics and bond underwriter costs for Texas independent school districts. Bond data for all school districts issuing bonds in the five-year period...

  19. Non-bonded ultrasonic transducer

    DOE Patents [OSTI]

    Eoff, J.M.

    1984-07-06

    A mechanically assembled non-bonded ultrasonic transducer includes a substrate, a piezoelectric film, a wetting agent, a thin metal electrode, and a lens held in intimate contact by a mechanical clamp. No epoxy or glue is used in the assembly of this device.

  20. Enhanced rigid-bond restraints

    SciTech Connect (OSTI)

    Thorn, Andrea; Dittrich, Birger; Sheldrick, George M., E-mail: gsheldr@shelx.uni-ac.gwdg.de [Department of Structural Chemistry, University of Göttingen, Tammannstrasse 4, D-37077 Göttingen (Germany)

    2012-07-01

    An extension is proposed to the rigid-bond description of atomic thermal motion in crystals. The rigid-bond model [Hirshfeld (1976 ?). Acta Cryst. A32, 239–244] states that the mean-square displacements of two atoms are equal in the direction of the bond joining them. This criterion is widely used for verification (as intended by Hirshfeld) and also as a restraint in structure refinement as suggested by Rollett [Crystallographic Computing (1970 ?), edited by F. R. Ahmed et al., pp. 167–181. Copenhagen: Munksgaard]. By reformulating this condition, so that the relative motion of the two atoms is required to be perpendicular to the bond, the number of restraints that can be applied per anisotropic atom is increased from about one to about three. Application of this condition to 1,3-distances in addition to the 1,2-distances means that on average just over six restraints can be applied to the six anisotropic displacement parameters of each atom. This concept is tested against very high resolution data of a small peptide and employed as a restraint for protein refinement at more modest resolution (e.g. 1.7 Ĺ)

  1. Bonded polyimide fuel cell package

    DOE Patents [OSTI]

    Morse, Jeffrey D.; Jankowski, Alan; Graff, Robert T.; Bettencourt, Kerry

    2010-06-08

    Described herein are processes for fabricating microfluidic fuel cell systems with embedded components in which micron-scale features are formed by bonding layers of DuPont Kapton.TM. polyimide laminate. A microfluidic fuel cell system fabricated using this process is also described.

  2. Hydrogen Bond Shaping of Membrane Protein Structure

    E-Print Network [OSTI]

    Cao, Zheng

    2013-01-01

    Energy of Amide Hydrogen Bond Formation in Vacuum, in Water, andEnergy of Amide Hydrogen Bond Formation in Vacuum, in Water, andto water is dependent on the zero-point energies, i.e. the

  3. The Market for Borrowing Corporate Bonds

    E-Print Network [OSTI]

    Asquith, Paul

    This paper describes the market for borrowing corporate bonds using a comprehensive data set from a major lender. The cost of borrowing corporate bonds is comparable to the cost of borrowing stock, between 10 and 20 basis ...

  4. Clean Energy and Bond Finance Initiative

    Broader source: Energy.gov [DOE]

    Provides information on Clean Energy and Bond Finance Initiative (CE+BFI). CE+BFI brings together public infrastructure finance agencies, clean energy public fund managers and institutional investors across the country to explore how to raise capital at scale for clean energy development through bond financing. Author: Clean Energy and Bond Finance Initiative

  5. Bonding, antibonding and tunable optical forces in asymmetric membranes

    E-Print Network [OSTI]

    Hui, Pui-Chuen

    We demonstrate that tunable attractive (bonding) and repulsive (anti-bonding) forces can arise in highly asymmetric structures coupled to external radiation, a consequence of the bonding/anti-bonding level repulsion of ...

  6. Interface Evolution of Au-Au Thermocompression Bonding and Nanotwins

    E-Print Network [OSTI]

    Beekley, Brett

    2015-01-01

    bonds. Journal of Microelectromechanical Systems, 2004. 13(bonds. Journal of Microelectromechanical Systems, 2002. 11(packaging. Journal of Microelectromechanical Systems, 2000.

  7. Design And Fabrication of Condenser Microphone Using Wafer Transfer And Micro-electroplating Technique

    E-Print Network [OSTI]

    Shu, Zhen-Zhun; Chen, Guan-Wei; Horng, Ray Hua; Chang, Chao-Chih; Tsai, Jean-Yih; Lai, Chung-Ching; Chen, Ji-Liang

    2008-01-01

    A novel fabrication process, which uses wafer transfer and micro-electroplating technique, has been proposed and tested. In this paper, the effects of the diaphragm thickness and stress, the air-gap thickness, and the area ratio of acoustic holes to backplate on the sensitivity of the condenser microphone have been demonstrated since the performance of the microphone depends on these parameters. The microphone diaphragm has been designed with a diameter and thickness of 1.9 mm and 0.6 $\\mu$m, respectively, an air-gap thickness of 10 $\\mu$m, and a 24% area ratio of acoustic holes to backplate. To obtain a lower initial stress, the material used for the diaphragm is polyimide. The measured sensitivities of the microphone at the bias voltages of 24 V and 12 V are -45.3 and -50.2 dB/Pa (at 1 kHz), respectively. The fabricated microphone shows a flat frequency response extending to 20 kHz.

  8. Bond Programs | Open Energy Information

    Open Energy Info (EERE)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Home Page on Google Bookmark EERE: Alternative Fuels Data Center Home Page on QA:QA J-E-1 SECTION JEnvironmental JumpInformationBio-GasIllinois:Energy Authority JumpBond Programs Jump to:

  9. Bonding Tools | Department of Energy

    Broader source: Energy.gov (indexed) [DOE]

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantity of Natural GasAdjustmentsShirley Ann JacksonDepartment|Marketing, LLC |Energycurrently provides technicalBonds are one of

  10. WAFER TEST CAVITY -Linking Surface Microstructure to RF Performance: a ‘Short-­?Sample Test Facility’ for characterizing superconducting materials for SRF cavities.

    SciTech Connect (OSTI)

    Pogue, Nathaniel; Comeaux, Justin; McIntyre, Peter

    2014-05-30

    The Wafer Test cavity was designed to create a short sample test system to determine the properties of the superconducting materials and S?I?S hetero?structures. The project, funded by ARRA, was successful in accomplishing several goals to achieving a high gradient test system for SRF research and development. The project led to the design and construction of the two unique cavities that each severed unique purposes: the Wafer test Cavity and the Sapphire Test cavity. The Sapphire Cavity was constructed first to determine the properties of large single crystal sapphires in an SRF environment. The data obtained from the cavity greatly altered the design of the Wafer Cavity and provided the necessary information to ascertain the Wafer Test cavity’s performance.

  11. A spatially resolved retarding field energy analyzer design suitable for uniformity analysis across the surface of a semiconductor wafer

    SciTech Connect (OSTI)

    Sharma, S.; Gahan, D. Hopkins, M. B.; Kechkar, S.; Daniels, S.

    2014-04-15

    A novel retarding field energy analyzer design capable of measuring the spatial uniformity of the ion energy and ion flux across the surface of a semiconductor wafer is presented. The design consists of 13 individual, compact-sized, analyzers, all of which are multiplexed and controlled by a single acquisition unit. The analyzers were tested to have less than 2% variability from unit to unit due to tight manufacturing tolerances. The main sensor assembly consists of a 300 mm disk to mimic a semiconductor wafer and the plasma sampling orifices of each sensor are flush with disk surface. This device is placed directly on top of the rf biased electrode, at the wafer location, in an industrial capacitively coupled plasma reactor without the need for any modification to the electrode structure. The ion energy distribution, average ion energy, and average ion flux were measured at the 13 locations over the surface of the powered electrode to determine the degree of spatial nonuniformity. The ion energy and ion flux are shown to vary by approximately 20% and 5%, respectively, across the surface of the electrode for the range of conditions investigated in this study.

  12. Hydrogen Adsorption Induces Interlayer Carbon Bond Formation...

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Hydrogen Adsorption Induces Interlayer Carbon Bond Formation in Supported Few-Layer Graphene Friday, February 28, 2014 Among the allotropes of carbon, diamond has some of the most...

  13. Nuclear reactor multiphysics via bond graph formalism

    E-Print Network [OSTI]

    Sosnovsky, Eugeny

    2014-01-01

    This work proposes a simple and effective approach to modeling nuclear reactor multiphysics problems using bond graphs. Conventional multiphysics simulation paradigms normally use operator splitting, which treats the ...

  14. Bond Strength Measurements from an Australian Standard Bond Wrench in Comparison to the Unbalanced ASTM C 1072 Bond Wrench to the Balanced and Unbalanced Wrenches 

    E-Print Network [OSTI]

    Suresh, Sri Vishnu Chaitanya Guptha

    2014-08-14

    in 1980s in the Australian laboratories. Former TAMU students had built a lightweight Indian unbalanced and balanced bond wrench. An Australian bond wrench was manufactured in 2011 and subsequently in 2012 an ASTM C 1072 Bond Wrench was developed...

  15. High Efficiency, Low Cost Solar Cells Manufactured Using 'Silicon Ink' on Thin Crystalline Silicon Wafers

    SciTech Connect (OSTI)

    Antoniadis, H.

    2011-03-01

    Reported are the development and demonstration of a 17% efficient 25mm x 25mm crystalline Silicon solar cell and a 16% efficient 125mm x 125mm crystalline Silicon solar cell, both produced by Ink-jet printing Silicon Ink on a thin crystalline Silicon wafer. To achieve these objectives, processing approaches were developed to print the Silicon Ink in a predetermined pattern to form a high efficiency selective emitter, remove the solvents in the Silicon Ink and fuse the deposited particle Silicon films. Additionally, standard solar cell manufacturing equipment with slightly modified processes were used to complete the fabrication of the Silicon Ink high efficiency solar cells. Also reported are the development and demonstration of a 18.5% efficient 125mm x 125mm monocrystalline Silicon cell, and a 17% efficient 125mm x 125mm multicrystalline Silicon cell, by utilizing high throughput Ink-jet and screen printing technologies. To achieve these objectives, Innovalight developed new high throughput processing tools to print and fuse both p and n type particle Silicon Inks in a predetermined pat-tern applied either on the front or the back of the cell. Additionally, a customized Ink-jet and screen printing systems, coupled with customized substrate handling solution, customized printing algorithms, and a customized ink drying process, in combination with a purchased turn-key line, were used to complete the high efficiency solar cells. This development work delivered a process capable of high volume producing 18.5% efficient crystalline Silicon solar cells and enabled the Innovalight to commercialize its technology by the summer of 2010.

  16. Valence Bond States: Link models

    E-Print Network [OSTI]

    E. Rico; R. Hübener; S. Montangero; N. Moran; B. Pirvu; J. Vala; H. J. Briegel

    2009-08-07

    An isotropic anti-ferromagnetic quantum state on a square lattice is characterized by symmetry arguments only. By construction, this quantum state is the result of an underlying valence bond structure without breaking any symmetry in the lattice or spin spaces. A detailed analysis of the correlations of the quantum state is given (using a mapping to a 2D classical statistical model and methods in field theory like mapping to the non-linear sigma model or bosonization techniques) as well as the results of numerical treatments (regarding exact diagonalization and variational methods). Finally, the physical relevance of the model is motivated. A comparison of the model to known anti-ferromagnetic Mott-Hubbard insulators is given by means of the two-point equal-time correlation function obtained i) numerically from the suggested state and ii) experimentally from neutron scattering on cuprates in the anti-ferromagnetic insulator phase.

  17. Experimental Observation of Bonding Electrons in Proteins*

    E-Print Network [OSTI]

    Experimental Observation of Bonding Electrons in Proteins* (Received for publication, April 15 enables bonding details of electron distributions in proteins to be revealed experimentally for the first time. We move one step closer to imaging directly the fine details of the electronic structure on which

  18. Identification of products containing {single_bond}COOH, {single_bond}OH, and {single_bond}C{double_bond}O in atmospheric oxidation of hydrocarbons

    SciTech Connect (OSTI)

    Yu, J.; Flagan, R.C.; Seinfeld, J.H.

    1998-08-15

    Atmospheric oxidation of hydrocarbons by hydroxyl radicals and ozone leads to products containing {single_bond}COOH, {single_bond}OH, and {single_bond}C{double_bond}O functional groups. The high polarity of such compounds precludes direct GC-MS analysis. In addition, many such compounds often exist in a single sample at trace levels. An analytical method has been developed to identify compounds containing one or more functional groups of carbonyl, carboxy, and hydroxy in atmospheric samples. In the method, {single_bond}C{double_bond}O groups are derivatized using O-(2,3,4,5,6-pentafluorobenzyl) hydroxy amine(PFBHA), and {single_bond}COOH and {single_bond}OH groups are derivatized using a silylation reagent N,O-bis(trimethylsilyl)-trifluoroacetamide (BSTFA). The derivatives are easily resolved by a GC column. The chemical ionization mass spectra of these derivatives exhibit several pseudomolecular ions, allowing unambiguous determination of molecular weights. Functional group identification is accomplished by monitoring the ions in the electron ionization mass spectra that are characteristic of each functional group derivative: m/z 181 for carbonyl and m/z 73 and 75 for carboxyl and hydroxy groups. The method is used to identify products in laboratory studies of ozone oxidation of {alpha}-pinene and {Delta}{sup 3}-carene.

  19. 1 mil gold bond wire study.

    SciTech Connect (OSTI)

    Huff, Johnathon; McLean, Michael B.; Jenkins, Mark W.; Rutherford, Brian Milne

    2013-05-01

    In microcircuit fabrication, the diameter and length of a bond wire have been shown to both affect the current versus fusing time ratio of a bond wire as well as the gap length of the fused wire. This study investigated the impact of current level on the time-to-open and gap length of 1 mil by 60 mil gold bond wires. During the experiments, constant current was provided for a control set of bond wires for 250ms, 410ms and until the wire fused; non-destructively pull-tested wires for 250ms; and notched wires. The key findings were that as the current increases, the gap length increases and 73% of the bond wires will fuse at 1.8A, and 100% of the wires fuse at 1.9A within 60ms. Due to the limited scope of experiments and limited data analyzed, further investigation is encouraged to confirm these observations.

  20. Low Barrier Hydrogen Bonds in Acyclic Tertiary Diamines

    E-Print Network [OSTI]

    Khodagholian, Sevana

    2010-01-01

    9. S. Yaghmaei, In Search of a Low Barrier Hydrogen Bond inP.A. Frey, and J.A. Gerlt, “The Low Barrier Hydrogen Bond inConsiderations Show That Low-Barrier Hydrogen Bonds do not

  1. A Surprising Path for Proton Transfer Without Hydrogen Bonds

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    A Surprising Path for Proton Transfer Without Hydrogen Bonds Print Hydrogen bonds are found everywhere in chemistry and biology and are critical in DNA and RNA. A hydrogen bond...

  2. A Surprising Path for Proton Transfer Without Hydrogen Bonds

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    A Surprising Path for Proton Transfer Without Hydrogen Bonds A Surprising Path for Proton Transfer Without Hydrogen Bonds Print Wednesday, 25 July 2012 00:00 Hydrogen bonds are...

  3. Process Of Bonding Copper And Tungsten

    DOE Patents [OSTI]

    Slattery, Kevin T. (St. Charles, MO); Driemeyer, Daniel E. (Manchester, MO); Davis, John W. (Ballwin, MO)

    2000-07-18

    Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by sintering a stack of individual copper and tungsten powder blend layers having progressively higher copper content/tungsten content, by volume, ratio values in successive powder blend layers in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

  4. Atomically Bonded Transparent Superhydrophobic Coatings

    SciTech Connect (OSTI)

    Aytug, Tolga

    2015-08-01

    Maintaining clarity and avoiding the accumulation of water and dirt on optically transparent surfaces such as US military vehicle windshields, viewports, periscope optical head windows, and electronic equipment cover glasses are critical to providing a high level of visibility, improved survivability, and much-needed safety for warfighters in the field. Through a combination of physical vapor deposition techniques and the exploitation of metastable phase separation in low-alkali borosilicate, a novel technology was developed for the fabrication of optically transparent, porous nanostructured silica thin film coatings that are strongly bonded to glass platforms. The nanotextured films, initially structurally superhydrophilic, exhibit superior superhydrophobicity, hence antisoiling ability, following a simple but robust modification in surface chemistry. The surfaces yield water droplet contact angles as high as 172°. Moreover, the nanostructured nature of these coatings provides increased light scattering in the UV regime and reduced reflectivity (i.e., enhanced transmission) over a broad range of the visible spectrum. In addition to these functionalities, the coatings exhibit superior mechanical resistance to abrasion and are thermally stable to temperatures approaching 500°C. The overall process technology relies on industry standard equipment and inherently scalable manufacturing processes and demands only nontoxic, naturally abundant, and inexpensive base materials. Such coatings, applied to the optical components of current and future combat equipment and military vehicles will provide a significant strategic advantage for warfighters. The inherent self-cleaning properties of such superhydrophobic coatings will also mitigate biofouling of optical windows exposed to high-humidity conditions and can help decrease repair/replacement costs, reduce maintenance, and increase readiness by limiting equipment downtime.

  5. New Bond Helps Toledo, Ohio, Expand Financing Pool | Department...

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    New Bond Helps Toledo, Ohio, Expand Financing Pool New Bond Helps Toledo, Ohio, Expand Financing Pool The logo for Better Buildings Northwest Ohio, Toleco Lucas County Port...

  6. Surface Modification by Atmospheric Pressure Plasma for Improved Bonding

    E-Print Network [OSTI]

    Williams, Thomas Scott

    2013-01-01

    of hydrogen- bonded hydroxyl groups. Acknowledgements Thisonto the exposed surface hydroxyl groups. The rate offraction of hydrogen-bonded hydroxyl groups increased from

  7. Qualified Energy Conservation Bonds (QECBs) & New Clean Renewable...

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    conservation bond and new clean renewable energy bonds, including characteristics, mechanics, allocated volume, and other information. Author: U.S. Department of Energy...

  8. Using Qualified Energy Conservation Bonds for Public Building...

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    Bonds for Public Building Upgrades: Reducing Energy Bills in the City of Philadelphia Using Qualified Energy Conservation Bonds for Public Building Upgrades: Reducing...

  9. Review of Direct Metal Bonding for Microelectronic Interconnections

    E-Print Network [OSTI]

    Zhang, G.G.

    Microelectronic interconnections require advanced joining techniques. Direct metal bonding methods, which include thercomsonic and thermocompression bonding, offer remarkable advantages over soldering and adhesives joining. ...

  10. REITs: Stocks, Bonds, or Real Estate?

    E-Print Network [OSTI]

    Rosen, Kenneth T.

    1995-01-01

    Berkeley FISHER CENTER FOR REAL ESTATE AND URBAN ECONOMICS244 RElTs: Stocks, Bonds or Real Estate? By KENNETH T. ROSENBUSINESS FISHER CENTER FOR REAL ESTATE AND URBAN ECONOMICS

  11. Ultrafast Infrared Studies of Bond Activation in

    E-Print Network [OSTI]

    Harris, Charles B.

    a few. Predominate in the field are UV-pump visible-probe techniques, a fact which derives largely from industry. Si-H bond activation by certain transition-metal-containing com- pounds was discovered by Jetz

  12. Corporate bond repurchases and earnings management

    E-Print Network [OSTI]

    Lemayian, Zawadi Rehema

    2013-01-01

    This paper investigates whether earnings management incentives are associated with gains/losses recognized when firms repurchase bonds. The research question is motivated by the inclusion of these gains/losses in firms' ...

  13. Method of bonding metals to ceramics

    DOE Patents [OSTI]

    Maroni, V.A.

    1991-04-23

    A ceramic or glass having a thin layer of silver, gold or alloys thereof at the surface thereof is disclosed. A first metal is bonded to the thin layer and a second metal is bonded to the first metal. The first metal is selected from the class consisting of In, Ga, Sn, Bi, Zn, Cd, Pb, Tl and alloys thereof, and the second metal is selected from the class consisting of Cu, Al, Pb, Au and alloys thereof. 3 figures.

  14. Method of bonding metals to ceramics

    DOE Patents [OSTI]

    Maroni, Victor A. (Naperville, IL)

    1991-01-01

    A ceramic or glass having a thin layer of silver, gold or alloys thereof at the surface thereof. A first metal is bonded to the thin layer and a second metal is bonded to the first metal. The first metal is selected from the class consisting of In, Ga, Sn, Bi, Zn, Cd, Pb, Tl and alloys thereof, and the second metal is selected from the class consisting of Cu, Al, Pb, An and alloys thereof.

  15. Qualified Energy Conservation Bond State-by-State Summary Tables

    Broader source: Energy.gov [DOE]

    Provides a list of qualified energy conservation bond state summary tables. Author: Energy Programs Consortium

  16. Hydrogen Bonding DOI: 10.1002/anie.200501349

    E-Print Network [OSTI]

    Simons, Jack

    Hydrogen Bonding DOI: 10.1002/anie.200501349 Observation of Weak C�H···O Hydrogen Bonding to Unactivated Alkanes** Xue-Bin Wang, Hin-Koon Woo, Boggavarapu Kiran, and Lai-Sheng Wang* The hydrogen bond carbon can also behave as a proton donor to form C�H···O-type hydrogen bonds has been the subject

  17. Managing Value-at-Risk for a bond using bond put options

    E-Print Network [OSTI]

    Vanmaele, Michčle

    Managing Value-at-Risk for a bond using bond put options Griselda Deelstra1 , Ahmed Ezzine1 , Dries. Furthermore, at a suffi- ciently low confidence level the VaR measure explicitly focuses risk managersR-based risk management. The starting point of our analysis is the classical hedging example, where

  18. A High Aspect-Ratio Silicon Substrate-ViaTechnology and Applications: Through-Wafer Interconnects for Power and Ground and Faraday Cages for SOC Isolation

    E-Print Network [OSTI]

    del Alamo, Jesús A.

    technology in silicon that incorporates a silicon nitride barrier liner and is filled with electroplated Cu],but their vias have only a thin coating of metal inside the via instead of being filled. Our via of the wafer by PECVD, and (3) via filling with electroplated cu. For cross-section imaging of the technology

  19. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 18, NO. 3, AUGUST 2005 371 On the Wafer/Pad Friction of ChemicalMechanical

    E-Print Network [OSTI]

    Yi, Jingang

    and polishing downforce. A prototype of a rotary CMP polisher and blanket oxide wafers were used in Sikder et al and the proposed methods can be extended and applied to rotary CMP polishers. A quantitative relationship between of Mechanical Engineering, Texas A&M Uni- versity, College Station, TX 77843 USA (e-mail: jgyi

  20. Identification and Characterization of Performance Limiting Regions in Poly-Si Wafers Used for PV Cells: Preprint

    SciTech Connect (OSTI)

    Guthrey, H.; Gorman, B.; Al-Jassim, M.

    2011-07-01

    As demand for silicon photovoltaic (PV) material increases, so does the need for cost-effective feedstock and production methods that will allow enhanced penetration of silicon PV into the total energy market. The focus on cost minimization for production of polycrystalline silicon (poly-Si) PV has led to relaxed feedstock purity requirements, which has also introduced undesirable characteristics into cast poly-Si PV wafers. To produce cells with the highest possible conversion efficiencies, it is crucial to understand how reduced purity requirements and defects that are introduced through the casting process can impair minority carrier properties in poly-Si PV cells. This is only possible by using multiple characterization techniques that give macro-scale information (such as the spatial distribution of performance-limiting regions), as well as micro and nano-scale information about the structural and chemical nature of such performance-limiting regions. This study demonstrates the usefulness of combining multiple techniques to analyze performance-limiting regions in the poly-Si wafers that are used for PV cells. This is done by first identifying performance-limiting regions using macro-scale techniques including photoluminescence (PL) imaging, microwave photoconductive decay (uPCD), and reflectometry), then using smaller-scale techniques such as scanning electron microscopy (SEM), electron backscattered diffraction (EBSD), laser ablation inductively coupled mass spectrometry (LA-ICP-MS), cathodoluminescence (CL), and transmission electron microscopy (TEM) to understand the nature of such regions. This analysis shows that structural defects as well as metallic impurities are present in performance-limiting regions, which together act to decrease conversion efficiencies in poly-Si PV cells.

  1. Hydrogen Bond Networks: Structure and Evolution after Hydrogen Bond Breaking John B. Asbury, Tobias Steinel, and M. D. Fayer*

    E-Print Network [OSTI]

    Fayer, Michael D.

    Hydrogen Bond Networks: Structure and Evolution after Hydrogen Bond Breaking John B. Asbury, TobiasVed: September 1, 2003; In Final Form: December 18, 2003 The nature of hydrogen bonding networks following hydrogen bond breaking is investigated using vibrational echo correlation spectroscopy of the hydroxyl

  2. Epoxy bond and stop etch fabrication method

    DOE Patents [OSTI]

    Simmons, Jerry A. (Sandia Park, NM); Weckwerth, Mark V. (Pleasanton, CA); Baca, Wes E. (Albuquerque, NM)

    2000-01-01

    A class of epoxy bond and stop etch (EBASE) microelectronic fabrication techniques is disclosed. The essence of such techniques is to grow circuit components on top of a stop etch layer grown on a first substrate. The first substrate and a host substrate are then bonded together so that the circuit components are attached to the host substrate by the bonding agent. The first substrate is then removed, e.g., by a chemical or physical etching process to which the stop etch layer is resistant. EBASE fabrication methods allow access to regions of a device structure which are usually blocked by the presence of a substrate, and are of particular utility in the fabrication of ultrafast electronic and optoelectronic devices and circuits.

  3. Bonded ultrasonic transducer and method for making

    DOE Patents [OSTI]

    Dixon, R.D.; Roe, L.H.; Migliori, A.

    1995-11-14

    An ultrasonic transducer is formed as a diffusion bonded assembly of piezoelectric crystal, backing material, and, optionally, a ceramic wear surface. The mating surfaces of each component are silver films that are diffusion bonded together under the application of pressure and heat. Each mating surface may also be coated with a reactive metal, such as hafnium, to increase the adhesion of the silver films to the component surfaces. Only thin silver films are deposited, e.g., a thickness of about 0.00635 mm, to form a substantially non-compliant bond between surfaces. The resulting transducer assembly is substantially free of self-resonances over normal operating ranges for taking resonant ultrasound measurements. 12 figs.

  4. Process Of Bonding Copper And Tungsten

    DOE Patents [OSTI]

    Slattery, Kevin T. (St. Charles, MO); Driemeyer, Daniel E. (Manchester, MO)

    1999-11-23

    Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by thermal plasma spraying mixtures of copper powder and tungsten powder in a varied blending ratio such that the blending ratio of the copper powder and the tungsten powder that is fed to a plasma torch is intermittently adjusted to provide progressively higher copper content/tungsten content, by volume, ratio values in the interlayer in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

  5. Bonded ultrasonic transducer and method for making

    DOE Patents [OSTI]

    Dixon, Raymond D. (Los Alamos, NM); Roe, Lawrence H. (Los Alamos, NM); Migliori, Albert (Santa Fe, NM)

    1995-01-01

    An ultrasonic transducer is formed as a diffusion bonded assembly of piezoelectric crystal, backing material, and, optionally, a ceramic wear surface. The mating surfaces of each component are silver films that are diffusion bonded together under the application of pressure and heat. Each mating surface may also be coated with a reactive metal, such as hafnium, to increase the adhesion of the silver films to the component surfaces. Only thin silver films are deposited, e.g., a thickness of about 0.00635 mm, to form a substantially non-compliant bond between surfaces. The resulting transducer assembly is substantially free of self-resonances over normal operating ranges for taking resonant ultrasound measurements.

  6. Phosphate-bonded calcium aluminate cements

    DOE Patents [OSTI]

    Sugama, Toshifumi (Mastic Beach, NY)

    1993-01-01

    A method is described for making a rapid-setting phosphate-bonded cementitious material. A powdered aluminous cement is mixed with an aqueous solution of ammonium phosphate. The mixture is allowed to set to form an amorphous cementitious material which also may be hydrothermally treated at a temperature of from about 120.degree. C. to about 300.degree. C. to form a crystal-containing phosphate-bonded material. Also described are the cementitious products of this method and the cement composition which includes aluminous cement and ammonium polyphosphate.

  7. Phosphate-bonded calcium aluminate cements

    DOE Patents [OSTI]

    Sugama, T.

    1993-09-21

    A method is described for making a rapid-setting phosphate-bonded cementitious material. A powdered aluminous cement is mixed with an aqueous solution of ammonium phosphate. The mixture is allowed to set to form an amorphous cementitious material which also may be hydrothermally treated at a temperature of from about 120 C to about 300 C to form a crystal-containing phosphate-bonded material. Also described are the cementitious products of this method and the cement composition which includes aluminous cement and ammonium polyphosphate. 10 figures.

  8. Adhesive bonding using variable frequency microwave energy

    DOE Patents [OSTI]

    Lauf, R.J.; McMillan, A.D.; Paulauskas, F.L.; Fathi, Z.; Wei, J.

    1998-08-25

    Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy. 26 figs.

  9. Adhesive bonding using variable frequency microwave energy

    DOE Patents [OSTI]

    Lauf, R.J.; McMillan, A.D.; Paulauskas, F.L.; Fathi, Z.; Wei, J.

    1998-09-08

    Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy. 26 figs.

  10. Adhesive bonding using variable frequency microwave energy

    DOE Patents [OSTI]

    Lauf, Robert J. (Oak Ridge, TN); McMillan, April D. (Knoxville, TN); Paulauskas, Felix L. (Oak Ridge, TN); Fathi, Zakaryae (Cary, NC); Wei, Jianghua (Raleigh, NC)

    1998-01-01

    Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy.

  11. Fluorinated diamond bonded in fluorocarbon resin

    DOE Patents [OSTI]

    Taylor, Gene W. (Los Alamos, NM)

    1982-01-01

    By fluorinating diamond grit, the grit may be readily bonded into a fluorocarbon resin matrix. The matrix is formed by simple hot pressing techniques. Diamond grinding wheels may advantageously be manufactured using such a matrix. Teflon fluorocarbon resins are particularly well suited for using in forming the matrix.

  12. Covalent Bonding in Actinide Sandwich Molecules

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    by: S.G. Minasian (Los Alamos National Laboratory and Berkeley Lab); J.M. Keith, E.R. Batista, K.S. Boland, D.L. Clark, S.A. Kozimor, and R.L. Martin (Los Alamos National...

  13. Various Carbon to Carbon Bond Lengths Inter-related via the Golden Ratio, and their Linear Dependence on Bond Energies

    E-Print Network [OSTI]

    Raji Heyrovska

    2008-09-11

    This work presents the relations between the carbon to carbon bond lengths in the single, double and triple bonds and in graphite, butadiene and benzene. The Golden ratio, which was shown to divide the Bohr radius into two parts pertaining to the charged particles, the electron and proton, and to divide inter-atomic distances into their cationic and anionic radii, also plays a role in the carbon-carbon bonds and in the ionic/polar character of those in graphite, butadiene and benzene. Further, the bond energies of the various CC bonds are shown to vary linearly with the bond lengths.

  14. Time-Resolved Study of Bonding in Liquid Carbon

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Time-Resolved Study of Bonding in Liquid Carbon Time-Resolved Study of Bonding in Liquid Carbon Print Wednesday, 28 September 2005 00:00 We are accustomed to observing carbon in...

  15. FUNDAMENTALS OF WETTING AND BONDING BETWEEN CERAMICS AND METALS

    E-Print Network [OSTI]

    Pask, J.A.

    2010-01-01

    WETTING AND BONDING BETWEEN CERAMICS AND METALS Jo s eph A.OF WETTING AND BONDING BETWEEN CERAMICS AND METALS Joseph A.and glass-to-metal or ceramic-to-metal seals. Both physical

  16. FITCH RATES ENERGY NORTHWEST, WA'S ELECTRIC REV RFDG BONDS 'AA...

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    FITCH RATES ENERGY NORTHWEST, WA'S ELECTRIC REV RFDG BONDS 'AA'; OUTLOOK STABLE Fitch Ratings-Austin-22 September 2015: Fitch Ratings assigns its 'AA' rating to the following bonds...

  17. Nanoscale metals and semiconductors for the storage of solar energy in chemical bonds

    E-Print Network [OSTI]

    Manthiram, Karthish

    2015-01-01

    for the storage of solar energy in chemical bonds Byfor the storage of solar energy in chemical bonds Copyrightfor the storage of solar energy in chemical bonds By

  18. A Corpuscular Picture of Electrons in Chemical Bond

    E-Print Network [OSTI]

    Ando, Koji

    2015-01-01

    We introduce a theory of chemical bond with a corpuscular picture of electrons. It employs a minimal set of localized electron wave packets with 'floating and breathing' degrees of freedom and the spin-coupling of non-orthogonal valence-bond theory. It accurately describes chemical bonds in ground and excited states of spin singlet and triplet, in a distinct manner from conventional theories, indicating potential for establishing a dynamical theory of electrons in chemical bonds.

  19. Anion Coordination in Metal-Organic Frameworks Functionalized with Urea Hydrogen-Bonding Groups

    SciTech Connect (OSTI)

    Custelcean, Radu; Moyer, Bruce A.; Bryantsev, Vyacheslav; Hay, Benjamin P.

    2005-12-15

    A series of metal-organic frameworks (MOFs) functionalized with urea hydrogen-bonding groups have been designed, synthesized, and structurally analyzed by single crystal X-ray diffraction to evaluate the efficacy of anion binding within the structural constraints of the MOFs. We found that urea-based functionalities may be used for anion binding within metal-organic frameworks when the tendency for urea???urea self-association is decreased by strengthening the intramolelcular CH???O hydrogen bonding of N-phenyl substituents to the carbonyl oxygen atom. Theoretical calculations indicate that N,N?-bis(m-pyridyl)urea (BPU) and N,N?-bis(m-cyanophenyl)urea (BCPU) should have enhanced hydrogen-bonding donor abilities toward anions and decreased tendencies to self-associate into hydrogen-bonded chains compared to other disubstituted ureas. Accordingly, BPU and BCPU were incorporated in MOFs as linkers through coordination of various Zn, Cu, and Ag transition metal salts, including Zn(ClO4)2, ZnSO4, Cu(NO3)2, Cu(CF3SO3)2, AgNO3 and AgSO3CH3. Structural analysis by single-crystal X-ray diffraction showed that these linkers are versatile anion binders, capable of chelate hydrogen bonding to all of the oxoanions explored. Anion binding by the urea functionalities was found to successfully compete with urea self-association in all cases except for that of charge-diffuse perchlorate. This research was sponsored by the Division of Chemical Sciences, Geosciences, and Biosciences, Office of Basic Energy Sciences of the U.S. Department of Energy, under contract number DE-AC05-00OR22725 with Oak Ridge National Laboratory (managed by UT-Battelle, LLC), and performed at Oak Ridge National laboratory and Pacific Northwest National Laboratory (managed by Battelle for the U.S. Department of Energy under contract DE-AC05-76RL01830). This research was performed in part using the Molecular Science Computing Facility (MSCF) in the William R. Wiley Environmental Molecular Sciences laboratory, a national scientific user facility sponsored by the U.S. Department of Energy's Office of Biological and Environmental Research located at the Pacific Northwest National Laboratory.

  20. Real-time, noninvasive monitoring of ion energy and ion current at a wafer surface during plasma etching

    SciTech Connect (OSTI)

    Sobolewski, Mark A. [National Institute of Standards and Technology, Gaithersburg, Maryland 20899 (United States)

    2006-09-15

    A noninvasive, nonperturbing technique for real-time monitoring of ion energy distributions and total ion current at a wafer surface during plasma processing has been used to monitor rapid changes in CF{sub 4}/Ar etching plasmas in an inductively coupled, rf-biased plasma reactor. To mimic the effects of process recipe steps or reactor malfunctions, perturbations were made in the inductive source power, gas flow, and pressure, and the resulting effects on total ion current, sheath voltage, and ion energy were monitored. During etching of a thermal silicon dioxide film, smaller changes, which are caused by the etch process itself, were also observed. Sheath voltages determined by the noninvasive technique were in good agreement with simultaneous measurements made using a capacitive probe. In addition to providing a demonstration of the speed and accuracy of the technique, the results also provide useful information about the relative importance of different types of equipment malfunctions and suggest methods for minimizing their effects. In particular, operating at constant bias voltage, instead of constant bias power, gave more stable ion energies. The physical mechanisms that cause the observed changes in ion energy are discussed, and a comparison to other process monitoring methods is presented. No other noninvasive, nonperturbing method yields ion current or ion energies as accurately as the technique presented here.

  1. Hydrogen Bonding Penalty upon Ligand Binding Hongtao Zhao, Danzhi Huang*

    E-Print Network [OSTI]

    Caflisch, Amedeo

    Hydrogen Bonding Penalty upon Ligand Binding Hongtao Zhao, Danzhi Huang* Department of Biochemistry, University of Zurich, Zurich, Switzerland Abstract Ligand binding involves breakage of hydrogen bonds with water molecules and formation of new hydrogen bonds between protein and ligand. In this work, the change

  2. Hydrogen Bond Networks in Graphene Oxide Composite Paper: Structure and

    E-Print Network [OSTI]

    Hydrogen Bond Networks in Graphene Oxide Composite Paper: Structure and Mechanical Properties of hydrogen bonds mediated by oxygen-containing functional groups and water molecules. A quantitative analysis of the formation of hydrogen bond networks further shows that they play a central role in *Address correspondence

  3. Hydrogen bonds in liquid water are broken only fleetingly

    E-Print Network [OSTI]

    Geissler, Phillip

    Hydrogen bonds in liquid water are broken only fleetingly J. D. Eaves* , J. J. Loparo* , C. J that the local structure of liquid water has tetrahedral arrangements of molecules ordered by hydrogen bonds, the mechanism by which water molecules switch hydrogen-bonded partners remains unclear. In this mechanism

  4. Hydrogen bonding in benzonitrilewater complexes Eugene S. Kryachkoa)

    E-Print Network [OSTI]

    Nguyen, Minh Tho

    Hydrogen bonding in benzonitrile­water complexes Eugene S. Kryachkoa) and Minh Tho Nguyenb January 2001; accepted 23 March 2001 The hydrogen bonding between benzonitrile and one and two water,p and aug-cc-pVDZ basis sets. The strength of such hydrogen bonding is analyzed in terms of a magnitude

  5. Analysis of C H...O hydrogen bonds

    E-Print Network [OSTI]

    Babu, M. Madan

    1 Analysis of C H...O hydrogen bonds in high resolution protein crystal structures from the PDB 1.4 Identification of C-H...O hydrogen bonds............................................. 1.4.1 The definition of a C-H...O hydrogen bond.................................... 1.4.2 Fixing the hydrogen and measuring the parameters

  6. Oil prices and government bond risk premiums Herv Alexandre*

    E-Print Network [OSTI]

    Boyer, Edmond

    Oil prices and government bond risk premiums By Hervé Alexandre*º Antonin de Benoist * Abstract : This article analyses the impact of oil price on bond risk premiums issued by emerging economies. No empirical study has yet focussed on the effects of the oil price on government bond risk premiums. We develop

  7. Article coated with flash bonded superhydrophobic particles

    DOE Patents [OSTI]

    Simpson, John T (Clinton, TN) [Clinton, TN; Blue, Craig A (Knoxville, TN) [Knoxville, TN; Kiggans, Jr., James O [Oak Ridge, TN

    2010-07-13

    A method of making article having a superhydrophobic surface includes: providing a solid body defining at least one surface; applying to the surface a plurality of diatomaceous earth particles and/or particles characterized by particle sizes ranging from at least 100 nm to about 10 .mu.m, the particles being further characterized by a plurality of nanopores, wherein at least some of the nanopores provide flow through porosity, the particles being further characterized by a plurality of spaced apart nanostructured features that include a contiguous, protrusive material; flash bonding the particles to the surface so that the particles are adherently bonded to the surface; and applying a hydrophobic coating layer to the surface and the particles so that the hydrophobic coating layer conforms to the nanostructured features.

  8. On the reliability of nanoindentation hardness of Al{sub 2}O{sub 3} films grown on Si-wafer by atomic layer deposition

    SciTech Connect (OSTI)

    Liu, Xuwen, E-mail: xuwen.liu@aalto.fi; Haimi, Eero; Hannula, Simo-Pekka [Department of Materials Science and Engineering, Aalto University School of Chemical Technology, Vuorimiehentie 2A, FI-00076 Espoo (Finland); Ylivaara, Oili M. E.; Puurunen, Riikka L. [VTT Technical Research Centre of Finland, Tietotie 3, FI-02044 Espoo (Finland)

    2014-01-15

    The interest in applying thin films on Si-wafer substrate for microelectromechanical systems devices by using atomic layer deposition (ALD) has raised the demand on reliable mechanical property data of the films. This study aims to find a quick method for obtaining nanoindentation hardness of thin films on silicon with improved reliability. This is achieved by ensuring that the film hardness is determined under the condition that no plastic deformation occurs in the substrate. In the study, ALD Al{sub 2}O{sub 3} films having thickness varying from 10 to 600?nm were deposited on a single-side polished silicon wafer at 300?°C. A sharp cube-corner indenter was used for the nanoindentation measurements. A thorough study on the Si-wafer reference revealed that at a specific contact depth of about 8?nm the wafer deformation in loading transferred from elastic to elastic–plastic state. Furthermore, the occurrence of this transition was associated with a sharp increase of the power-law exponent, m, when the unloading data were fitted to a power-law relation. Since m is only slightly material dependent and should fall between 1.2 and 1.6 for different indenter geometry having elastic contact to common materials, it is proposed that the high m values are the results from the inelastic events during unloading. This inelasticity is linked to phase transformations during pressure releasing, a unique phenomenon widely observed in single crystal silicon. Therefore, it is concluded that m could be used to monitor the mechanical state of the Si substrate when the whole coating system is loaded. A suggested indentation depth range can then be assigned to each film thickness to provide guidelines for obtaining reliable property data. The results show good consistence for films thicker than 20?nm and the nanoindentation hardness is about 11?GPa independent of film thickness.

  9. Public Bonding Options | Department of Energy

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Home Page on Google Bookmark EERE: Alternative Fuels Data Center Home Page on Delicious RankADVANCED MANUFACTURINGEnergy BillsNo. 195 - Oct. 7, 2011 | DepartmentFunds for Renewables andBonding

  10. Microchannel cooling of face down bonded chips

    DOE Patents [OSTI]

    Bernhardt, A.F.

    1993-06-08

    Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multi chip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.

  11. Vacuum fusion bonding of glass plates

    DOE Patents [OSTI]

    Swierkowski, Steve P. (Livermore, CA); Davidson, James C. (Livermore, CA); Balch, Joseph W. (Livermore, CA)

    2001-01-01

    An improved apparatus and method for vacuum fusion bonding of large, patterned glass plates. One or both glass plates are patterned with etched features such as microstructure capillaries and a vacuum pumpout moat, with one plate having at least one hole therethrough for communication with a vacuum pumpout fixture. High accuracy alignment of the plates is accomplished by a temporary clamping fixture until the start of the fusion bonding heat cycle. A complete, void-free fusion bond of seamless, full-strength quality is obtained through the plates; because the glass is heated well into its softening point and because of a large, distributed force that is developed that presses the two plates together from the difference in pressure between the furnace ambient (high pressure) and the channeling and microstructures in the plates (low pressure) due to the vacuum drawn. The apparatus and method may be used to fabricate microcapillary arrays for chemical electrophoresis; for example, any apparatus using a network of microfluidic channels embedded between plates of glass or similar moderate melting point substrates with a gradual softening point curve, or for assembly of glass-based substrates onto larger substrates, such as in flat panel display systems.

  12. Vacuum fusion bonding of glass plates

    DOE Patents [OSTI]

    Swierkowski, Steve P. (Livermore, CA); Davidson, James C. (Livermore, CA); Balch, Joseph W. (Livermore, CA)

    2000-01-01

    An improved apparatus and method for vacuum fusion bonding of large, patterned glass plates. One or both glass plates are patterned with etched features such as microstructure capillaries and a vacuum pumpout moat, with one plate having at least one hole therethrough for communication with a vacuum pumpout fixture. High accuracy alignment of the plates is accomplished by a temporary clamping fixture until the start of the fusion bonding heat cycle. A complete, void-free fusion bond of seamless, full-strength quality is obtained through the plates; because the glass is heated well into its softening point and because of a large, distributed force that is developed that presses the two plates together from the difference in pressure between the furnace ambient (high pressure) and the channeling and microstructures in the plates (low pressure) due to the vacuum drawn. The apparatus and method may be used to fabricate microcapillary arrays for chemical electrophoresis; for example, any apparatus using a network of microfluidic channels embedded between plates of glass or similar moderate melting point substrates with a gradual softening point curve, or for assembly of glass-based substrates onto larger substrates, such as in flat panel display systems.

  13. Hydrogen Bond Breaking and Reformation in Alcohol Oligomers Following Vibrational Relaxation of a Non-Hydrogen-Bond Donating Hydroxyl Stretch

    E-Print Network [OSTI]

    Fayer, Michael D.

    Hydrogen Bond Breaking and Reformation in Alcohol Oligomers Following Vibrational Relaxation of a Non-Hydrogen-Bond Donating Hydroxyl Stretch K. J. Gaffney, I. R. Piletic, and M. D. Fayer* Department measured with ultrafast infrared pump-probe experiments. Non-hydrogen-bond donating OD stretches (2690 cm-1

  14. Method for bonding a transmission line to a downhole tool

    DOE Patents [OSTI]

    Hall, David R. (Provo, UT); Fox, Joe (Spanish Fork, UT)

    2007-11-06

    An apparatus for bonding a transmission line to the central bore of a downhole tool includes a pre-formed interface for bonding a transmission line to the inside diameter of a downhole tool. The pre-formed interface includes a first surface that substantially conforms to the outside contour of a transmission line and a second surface that substantially conforms to the inside diameter of a downhole tool. In another aspect of the invention, a method for bonding a transmission line to the inside diameter of a downhole tool includes positioning a transmission line near the inside wall of a downhole tool and placing a mold near the transmission line and the inside wall. The method further includes injecting a bonding material into the mold and curing the bonding material such that the bonding material bonds the transmission line to the inside wall.

  15. Bond selective chemistry beyond the adiabatic approximation

    SciTech Connect (OSTI)

    Butler, L.J. [Univ. of Chicago, IL (United States)

    1993-12-01

    One of the most important challenges in chemistry is to develop predictive ability for the branching between energetically allowed chemical reaction pathways. Such predictive capability, coupled with a fundamental understanding of the important molecular interactions, is essential to the development and utilization of new fuels and the design of efficient combustion processes. Existing transition state and exact quantum theories successfully predict the branching between available product channels for systems in which each reaction coordinate can be adequately described by different paths along a single adiabatic potential energy surface. In particular, unimolecular dissociation following thermal, infrared multiphoton, or overtone excitation in the ground state yields a branching between energetically allowed product channels which can be successfully predicted by the application of statistical theories, i.e. the weakest bond breaks. (The predictions are particularly good for competing reactions in which when there is no saddle point along the reaction coordinates, as in simple bond fission reactions.) The predicted lack of bond selectivity results from the assumption of rapid internal vibrational energy redistribution and the implicit use of a single adiabatic Born-Oppenheimer potential energy surface for the reaction. However, the adiabatic approximation is not valid for the reaction of a wide variety of energetic materials and organic fuels; coupling between the electronic states of the reacting species play a a key role in determining the selectivity of the chemical reactions induced. The work described below investigated the central role played by coupling between electronic states in polyatomic molecules in determining the selective branching between energetically allowed fragmentation pathways in two key systems.

  16. Repairable chip bonding/interconnect process

    DOE Patents [OSTI]

    Bernhardt, Anthony F. (Berkeley, CA); Contolini, Robert J. (Livermore, CA); Malba, Vincent (Livermore, CA); Riddle, Robert A. (Tracy, CA)

    1997-01-01

    A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder.

  17. Repairable chip bonding/interconnect process

    DOE Patents [OSTI]

    Bernhardt, A.F.; Contolini, R.J.; Malba, V.; Riddle, R.A.

    1997-08-05

    A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules is disclosed. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder. 10 figs.

  18. Covalent Bonding in Actinide Sandwich Molecules

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantityBonneville Power Administration would like submit theCovalent Bonding in Actinide Sandwich Molecules Print Glenn Seaborg was one

  19. Covalent Bonding in Actinide Sandwich Molecules

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantityBonneville Power Administration would like submit theCovalent Bonding in Actinide Sandwich Molecules Print Glenn Seaborg was

  20. Bonded Compliant Seal (BCS) - Energy Innovation Portal

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantity ofkandz-cm11 OutreachProductswsicloudwsiclouddenDVA N C E D B L O OLaura|BilayerBiomimetic DyeBlue Gene/Q Download52015 |Bonded

  1. State Bond Program | Open Energy Information

    Open Energy Info (EERE)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Home Page on Google Bookmark EERE: Alternative Fuels Data Center Home Page on QA:QA J-E-1 SECTION JEnvironmental Jump to:EA EIS ReportEurope GmbHSoloPage EditStamford,Energy CenterStateState Bond

  2. Cement Bond Log | Open Energy Information

    Open Energy Info (EERE)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Home Page on Google Bookmark EERE: Alternative Fuels Data Center Home Page on QA:QA J-E-1 SECTION JEnvironmentalBowerbank,CammackFLIR Jump to:RAPIDCavallo Energy JumpCeiling Fan JumpCement Bond Log

  3. Chemically bonded phospho-silicate ceramics

    DOE Patents [OSTI]

    Wagh, Arun S. (Orland Park, IL); Jeong, Seung Y. (Westmont, IL); Lohan, Dirk (Chicago, IL); Elizabeth, Anne (Chicago, IL)

    2003-01-01

    A chemically bonded phospho-silicate ceramic formed by chemically reacting a monovalent alkali metal phosphate (or ammonium hydrogen phosphate) and a sparsely soluble oxide, with a sparsely soluble silicate in an aqueous solution. The monovalent alkali metal phosphate (or ammonium hydrogen phosphate) and sparsely soluble oxide are both in powder form and combined in a stochiometric molar ratio range of (0.5-1.5):1 to form a binder powder. Similarly, the sparsely soluble silicate is also in powder form and mixed with the binder powder to form a mixture. Water is added to the mixture to form a slurry. The water comprises 50% by weight of the powder mixture in said slurry. The slurry is allowed to harden. The resulting chemically bonded phospho-silicate ceramic exhibits high flexural strength, high compression strength, low porosity and permeability to water, has a definable and bio-compatible chemical composition, and is readily and easily colored to almost any desired shade or hue.

  4. Consent Order, Lawrence Livermore National National Security...

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    Lawrence Livermore National National Security, LLC - WCO-2010-01 Consent Order, Lawrence Livermore National National Security, LLC - WCO-2010-01 October 29, 2010 Issued to Lawrence...

  5. Microstructural Characteristics of HIP-bonded Monolithic Nuclear Fuels with a Diffusion Barrier

    SciTech Connect (OSTI)

    Jan-Fong Jue; Dennis D. Keiser, Jr.; Cynthia R. Breckenridge; Glenn A. Moore; Mitchell K. Meyer

    2014-05-01

    Due to the limitation of maximum uranium load achievable by dispersion fuel type, the Global Threat Reduction Initiative (GTRI) is developing an advanced monolithic fuel to convert US high performance research reactors to low-enriched uranium. Hot-isostatic-press bonding was the single process down-selected to bond monolithic U-Mo fuel meat to aluminum alloy cladding. A diffusion barrier was applied to the U–Mo fuel meat by roll-bonding process to prevent extensive interaction between fuel meat and aluminum-alloy cladding. Microstructural characterization was performed on fresh fuel plates fabricated at Idaho National Laboratory. Interfaces between fuel meat, cladding, and diffusion barrier, as well as U–10Mo fuel meat and Al–6061 cladding were characterized by scanning electron microscopy. Preliminary results indicate that the interfaces contain many different phases while decomposition, second phases, and chemical banding were also observed in the fuel meat. The important attributes of the HIP-bonded monolithic fuel are • A typical Zr diffusion barrier of thickness 25 µm • Transverse cross section that exhibits relatively equiaxed grains with an average grain diameter of 10 µm • Chemical banding, in some areas more than 100 µm in length, that is very pronounced in longitudinal (i.e., rolling) direction with Mo concentration varying from 7–13 wt% • Decomposed areas containing plate-shaped low-Mo phase • A typical Zr/cladding interaction layer of thickness 1-2 µm • A visible UZr2 bearing layer of thickness 1-2 µm • Mo-rich precipitates (mainly Mo2Zr, forming a layer in some areas) followed by a Mo-depleted sub-layer between the visible UZr2-bearing layer and the U–Mo matrix • No excessive interaction between cladding and the uncoated fuel edge • Cladding-to-cladding bonding that exhibits no cracks or porosity with second phases high in Mg, Si, and O decorating the bond line. • Some of these attributes might be critical to the irradiation performance of monolithic U-10Mo nuclear fuel. There are several issues or concerns that warrant more detailed study, such as precipitation along cladding-to-cladding bond line, chemical banding, uncovered fuel-zone edge, and interaction layer between U–Mo fuel meat and zirconium. Future post-irradiation examination results will focus, among other things, on identifying in-reactor failure mechanisms and, eventually, directing further fresh fuel characterization efforts.

  6. Developing A Laser Shockwave Model For Characterizing Diffusion Bonded Interfaces

    SciTech Connect (OSTI)

    James A. Smith; Jeffrey M. Lacy; Barry H. Rabin

    2014-07-01

    12. Other advances in QNDE and related topics: Preferred Session Laser-ultrasonics Developing A Laser Shockwave Model For Characterizing Diffusion Bonded Interfaces 41st Annual Review of Progress in Quantitative Nondestructive Evaluation Conference QNDE Conference July 20-25, 2014 Boise Centre 850 West Front Street Boise, Idaho 83702 James A. Smith, Jeffrey M. Lacy, Barry H. Rabin, Idaho National Laboratory, Idaho Falls, ID ABSTRACT: The US National Nuclear Security Agency has a Global Threat Reduction Initiative (GTRI) which is assigned with reducing the worldwide use of high-enriched uranium (HEU). A salient component of that initiative is the conversion of research reactors from HEU to low enriched uranium (LEU) fuels. An innovative fuel is being developed to replace HEU. The new LEU fuel is based on a monolithic fuel made from a U-Mo alloy foil encapsulated in Al-6061 cladding. In order to complete the fuel qualification process, the laser shock technique is being developed to characterize the clad-clad and fuel-clad interface strengths in fresh and irradiated fuel plates. The Laser Shockwave Technique (LST) is being investigated to characterize interface strength in fuel plates. LST is a non-contact method that uses lasers for the generation and detection of large amplitude acoustic waves to characterize interfaces in nuclear fuel plates. However the deposition of laser energy into the containment layer on specimen’s surface is intractably complex. The shock wave energy is inferred from the velocity on the backside and the depth of the impression left on the surface from the high pressure plasma pulse created by the shock laser. To help quantify the stresses and strengths at the interface, a finite element model is being developed and validated by comparing numerical and experimental results for back face velocities and front face depressions with experimental results. This paper will report on initial efforts to develop a finite element model for laser shock.

  7. Energetics of Hydrogen Bond Network Rearrangements in Liquid...

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Energetics of Hydrogen Bond Network Rearrangements in Liquid Water Print The unique chemical and physical properties of liquid water are thought to result from the highly...

  8. Qualified Energy Conservation Bonds (ŤQECBs?) & New Clean Renewable...

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    Conservation Bonds (QECBs) may be issued by state, local and tribal governments to finance qualified energy conservation projects. A minimum of 70% of a state's allocation must...

  9. Douglas County School District (Nevada) Bonds Case Study | Department...

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    Bonds Case Study Douglas County School District faced a challenging combination of aging equipment and buildings (most over 37 years old), rising energy costs, and limited...

  10. National Laboratory

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    on the Pajarito Plateau topic of inaugural lecture at Los Alamos National Laboratory January 4, 2013 Lecture series begins yearlong commemoration of 70th anniversary LOS...

  11. 3-D INTEGRATION USING WAFER BONDING J.-Q. L *, A. KUMAR *, Y. KWON *, E.T. EISENBRAUN **, R.P. KRAFT *, J.F. McDONALD *, R.J.

    E-Print Network [OSTI]

    Lü, James Jian-Qiang

    . McDonald et al. studied via holes formed by laser drilling, etching, Cu sputtering, and Au plating unattractive. Conventional scaling of planar ICs has advanced significantly in the last decade, partially generations of conventional scaling of planar ICs [5]. However, this scaling process has begun to encounter

  12. Method of bonding single crystal quartz by field-assisted bonding

    DOE Patents [OSTI]

    Curlee, R.M.; Tuthill, C.D.; Watkins, R.D.

    1991-04-23

    The method of producing a hermetic stable structural bond between quartz crystals includes providing first and second quartz crystals and depositing thin films of borosilicate glass and silicon on portions of the first and second crystals, respectively. The portions of the first and second crystals are then juxtaposed in a surface contact relationship and heated to a temperature for a period sufficient to cause the glass and silicon films to become electrically conductive. An electrical potential is then applied across the first and second crystals for creating an electrostatic field between the adjoining surfaces and causing the juxtaposed portions to be attracted into an intimate contact and form a bond for joining the adjoining surfaces of the crystals. 2 figures.

  13. Flip chip electrical interconnection by selective electroplating and bonding

    E-Print Network [OSTI]

    Lin, Liwei

    Flip chip electrical interconnection by selective electroplating and bonding L.-W. Pan, P. Yuen, L resistance of the electroplating bond is 12 W. This process has potential applications in replacing-step approach for high-density electrical in- terconnection by using flip chip selective electroplating

  14. Proton Transfer and Hydrogen Bonding in Chemical and Biological

    E-Print Network [OSTI]

    Amrhein, Valentin

    Proton Transfer and Hydrogen Bonding in Chemical and Biological Systems: A Force Field Approach and support. i #12;ii #12;Abstract Proton transfer and hydrogen bonds are fundamental for the function be regarded as incipient proton transfer reactions, so theoretically they can be de- scribed in unitary way

  15. Quantum Finance Hamiltonian for Coupon Bond European and Barrier Options

    E-Print Network [OSTI]

    Chaudhuri, Sanjay

    Quantum Finance Hamiltonian for Coupon Bond European and Barrier Options Belal E. Baaquie RMI are financial derivatives that can be analyzed in the Hamiltonian formulation of quantum finance. Forward-2963 Fax: (65) 6777-6126 Email: phybeb@nus.edu.sg #12;Quantum Finance Hamiltonian for Coupon Bond European

  16. Material Properties of Chemically Bonded Phosphate Ceramic/Wood Interfaces

    E-Print Network [OSTI]

    Collins, Gary S.

    Material Properties of Chemically Bonded Phosphate Ceramic/Wood Interfaces M.J. Benjamin, K Chemically bonded phosphate ceramics (CBPCs) are man made inorganic solids that lie in between hydraulic cements and ceramics . Normally, ceramics are sintered at temperatures ranging from 700-2000C

  17. Electrically conductive resinous bond and method of manufacture

    DOE Patents [OSTI]

    Snowden, Jr., Thomas M. (P.O. Box 4231, Clearwater, FL 33518); Wells, Barbara J. (865 N. Village Dr., Apt. 101B, St. Petersburg, FL 33702)

    1987-01-01

    A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40.degree. to 365.degree. C. to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.

  18. Electrically conductive resinous bond and method of manufacture

    DOE Patents [OSTI]

    Snowden, T.M. Jr.; Wells, B.J.

    1985-01-01

    A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40 to 365/sup 0/C to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.

  19. Theoretical Electron Density Distributions for Fe-and Cu-Sulfide Earth Materials: A Connection between Bond Length, Bond Critical Point Properties, Local Energy Densities,

    E-Print Network [OSTI]

    Downs, Robert T.

    between Bond Length, Bond Critical Point Properties, Local Energy Densities, and Bonded Interactions G. V; In Final Form: December 6, 2006 Bond critical point and local energy density properties together with netTheoretical Electron Density Distributions for Fe- and Cu-Sulfide Earth Materials: A Connection

  20. NATIONAL LABORATORY

    Office of Environmental Management (EM)

    a modified United Nations Test for Oxidizing Solids protocol. * 2010 burn-rate tests at New Mexico Tech performed on two types of surrogates of the buried Rocky Flats salt...

  1. Globalization Nationalized

    E-Print Network [OSTI]

    Mazlish, Bruce

    Globalism and globalization have been seen as competitors to other allegiances, namely regionalism and nationalism. A look at recent efforts at reconceptualizing global history in China, Korea and the U.S., however, suggests ...

  2. Vacuum pull down method for an enhanced bonding process

    DOE Patents [OSTI]

    Davidson, James C. (Livermore, CA); Balch, Joseph W. (Livermore, CA)

    1999-01-01

    A process for effectively bonding arbitrary size or shape substrates. The process incorporates vacuum pull down techniques to ensure uniform surface contact during the bonding process. The essence of the process for bonding substrates, such as glass, plastic, or alloys, etc., which have a moderate melting point with a gradual softening point curve, involves the application of an active vacuum source to evacuate interstices between the substrates while at the same time providing a positive force to hold the parts to be bonded in contact. This enables increasing the temperature of the bonding process to ensure that the softening point has been reached and small void areas are filled and come in contact with the opposing substrate. The process is most effective where at least one of the two plates or substrates contain channels or grooves that can be used to apply vacuum between the plates or substrates during the thermal bonding cycle. Also, it is beneficial to provide a vacuum groove or channel near the perimeter of the plates or substrates to ensure bonding of the perimeter of the plates or substrates and reduce the unbonded regions inside the interior region of the plates or substrates.

  3. Hydrogen Bond Dynamics Probed with Ultrafast Infrared Heterodyne-Detected Multidimensional Vibrational Stimulated Echoes

    E-Print Network [OSTI]

    Fayer, Michael D.

    Hydrogen Bond Dynamics Probed with Ultrafast Infrared Heterodyne-Detected Multidimensional, USA (Received 24 February 2003; published 3 December 2003) Hydrogen bond dynamics are explicated hydrogen bonded network are measured with ultrashort (

  4. Wire bond vibration of forward pixel tracking detector of CMS

    SciTech Connect (OSTI)

    Atac, M.; /Fermilab; Gobbi, B.; /Northwestern U.; Kwan, S.; Pischalnikov, Y.; /Fermilab; Spencer, E.; /Northwestern U.; Sellberg, G.; Pavlicek, V.; /Fermilab

    2006-10-01

    Wire bonds of the Forward Pixel (FPix) tracking detectors are oriented in the direction that maximizes Lorentz Forces relative to the 4 Tesla field of the Compact Muon Solenoid (CMS) Detector's magnet. The CMS Experiment is under construction at the Large Hadron Collider at CERN, Geneva, Switzerland. We were concerned about Lorentz Force oscillating the wires at their fundamental frequencies and possibly fracturing or breaking them at their heels, as happened with the CDF wire bonds. This paper reports a study to understand what conditions break such bonds.

  5. Hydrogen-Bond Networks: Strengths of Different Types of Hydrogen Bonds and An Alternative to the Low Barrier Hydrogen-Bond Proposal

    SciTech Connect (OSTI)

    Shokri, Alireza; Wang, Yanping; O'Doherty, George A.; Wang, Xue B.; Kass, Steven R.

    2013-11-27

    We report quantifying the strengths of different types of hydrogen bonds in hydrogen bond networks (HBNs) via measurement of the adiabatic electron detachment energy of the conjugate base of a small covalent polyol model compound (i.e., (HOCH2CH2CH(OH)CH2)2CHOH) in the gas phase and the pKa of the corresponding acid in DMSO. The latter result reveals that the hydrogen bonds to the charged center and those that are one solvation shell further away (i.e., primary and secondary) provide 5.3 and 2.5 pKa units of stabilization per hydrogen bond in DMSO. Computations indicate that these energies increase to 8.4 and 3.9 pKa units in benzene and that the total stabilizations are 16 (DMSO) and 25 (benzene) pKa units. Calculations on a larger linear heptaol (i.e., (HOCH2CH2CH(OH)CH2CH(OH)CH2)2CHOH) reveal that the terminal hydroxyl groups each contribute 0.6 pKa units of stabilization in DMSO and 1.1 pKa units in benzene. All of these results taken together indicate that the presence of a charged center can provide a powerful energetic driving force for enzyme catalysis and conformational changes such as in protein folding due to multiple hydrogen bonds in a HBN.

  6. National Nuclear Security Administration | National Nuclear Security...

    National Nuclear Security Administration (NNSA)

    National Nuclear Security Administration | National Nuclear Security Administration Facebook Twitter Youtube Flickr RSS People Mission Managing the Stockpile Preventing...

  7. Low temperature transient liquid phase bonding of copper

    E-Print Network [OSTI]

    Williams, Joel C. (Joel Carlton)

    2005-01-01

    This thesis describes a Pb-free solder alternative that is capable of fluxless bonding. The main advantage of this process is that it offers the benefits of low fabrication temperature (125?C) while producing a joint capable ...

  8. Multilayer roll bonded aluminium foil: processing, microstructure and flow stress

    SciTech Connect (OSTI)

    Barlow, C.Y.; Nielsen, P.; Hansen, N

    2004-08-02

    Bulk aluminium has been produced by warm-rolling followed by cold-rolling of commercial purity (99% purity) aluminium foil. The bonding appeared perfect from observation with the naked eye, light and transmission electron microscopy. By comparison with bulk aluminium of similar purity (AA1200) rolled to a similar strain (90%RA), the roll-bonded metal showed a much higher density of high-angle grain boundaries, similar strength and improved thermal stability. This study has implications for a number of applications in relation to the processing of aluminium. Roll bonding is of interest as a method for grain size refinement; oxide-containing materials have increased strength, enhanced work-hardening behaviour, and exhibit alterations in recrystallisation behaviour. The behaviour of the hard oxide film is of interest in aluminium processing, and has been investigated by characterising the size and distribution of oxide particles in the roll-bonded samples.

  9. MODE II FRACTURE BEHAVIOR OF BONDED VISCOELASTIC THERMAL COMPRESSED WOOD

    E-Print Network [OSTI]

    Nairn, John A.

    MODE II FRACTURE BEHAVIOR OF BONDED VISCOELASTIC THERMAL COMPRESSED WOOD Andreja Kutnar* Graduate Student Department of Wood Science and Technology Biotechnical Faculty University of Ljubljana 1000 Ljubljana, Slovenia Frederick A. Kamke Professor John A. Nairn Professor Department of Wood Science

  10. Mpemba paradox: Hydrogen bond memory and water-skin supersolidity

    E-Print Network [OSTI]

    Chang Q Sun

    2015-01-05

    Numerical reproduction of measurements, experimental evidence for skin super-solidity and hydrogen-bond memory clarified that Mpemba paradox integrates the heat emission-conduction-dissipation dynamics in the source-path-drain cycle system.

  11. Spectroscopic investigations of hydrogen bond dynamics in liquid water

    E-Print Network [OSTI]

    Fecko, Christopher J., 1975-

    2004-01-01

    Many of the remarkable physical and chemical properties of liquid water are due to the strong influence hydrogen bonds have on its microscopic dynamics. However, because of the fast timescales involved, there are relatively ...

  12. Application of Social Impact Bonds in Built Infrastructure Sustainability Projects 

    E-Print Network [OSTI]

    White, Robert Joseph

    2014-05-01

    This study examines a first look at the implementation of Social Impact Bonds (SIB) for sustainability projects by comparing two cases. The cases are described using System Dynamic (SD) modeling to portray the feedback structures and characteristics...

  13. Bond graph models of electromechanical systems. The AC generator case

    E-Print Network [OSTI]

    Batlle, Carles

    Bond graph models of electromechanical systems. The AC generator case Carles Batlle Department. After reviewing electromechanical energy conversion and torque gener- ation, the core element present in any electromechanical system is introduced, and the corresponding electrical and mechanical ports

  14. Reply to comment on "Quantum Confinement in Hydrogen Bond"

    E-Print Network [OSTI]

    Santos, Carlos da Silva dos; Ricotta, Regina Maria

    2015-01-01

    We reply to the comments on our paper "Quantum Confinement in Hydrogen Bond" (Int. J. Quantum Chem. 115 (2015) 765 DOI: 10.1002/qua.24894) made by Matthias Heger and Martin A. Suhm.

  15. Influence of receptor flexibility on intramolecular H-bonding interactions

    E-Print Network [OSTI]

    Sun, Hongmei; Guo, Kai; Gan, Haifeng; Li, Xin; Hunter, Christopher A.

    2015-01-01

    Atropisomers of a series of zinc tetraphenyl porphyrins were synthesized and used as supramolecular receptors. Rotation around the porphyrin-meso phenyl bonds is restricted by installing ortho-chlorine substituents on the phenyl groups. The chlorine...

  16. IRS Announces New Tribal Economic Development Bond Allocation Guidance

    Broader source: Energy.gov [DOE]

    Treasury and the IRS published new guidance today allocating Tribal Economic Development Bonds (TEDBs) for Tribes that have projects that are in the final stages of going to the market to receive financing.

  17. Low-Cost Financing with Clean Renewable Energy Bonds

    Broader source: Energy.gov [DOE]

    Contains information from the TAP Webcast on June 24, 2009 on clean renewable energy bonds from Claire Kreycik on feed-in tariffs, an economic resource for developing renewable energy.

  18. Time-Resolved Study of Bonding in Liquid Carbon

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Time-Resolved Study of Bonding in Liquid Carbon Print We are accustomed to observing carbon in its elemental form as a solid, ranging from the soft "lead" in pencils to the...

  19. The Geography of European Convertible Bonds: Why Firms Issue Convertibles?

    E-Print Network [OSTI]

    Saskatchewan, University of

    1 The Geography of European Convertible Bonds: Why Firms Issue Convertibles? Franck Bancel Usha R at the geography of CB issuance. The size and development of the CB market varies widely across countries and over

  20. Understanding mechanisms for C-H bond activation 

    E-Print Network [OSTI]

    Vastine, Benjamin Alan

    2009-05-15

    The results from density functional theory (DFT) studies into C–H bond activation, hydrogen transfer, and alkyne–to–vinylidene isomerization are presented in this work. The reaction mechanism for the reductive elimination ...

  1. Ultra-HighDensity Board Technologyfor suh-100pn Pitch nano-WaferLevel Packaging Venky Sundaram, Fuhan Liu, Ankur 0.Aggarwal, Seyed M. Hosseini, Sharath Mekala, George E. White, Rao R. Tummala,

    E-Print Network [OSTI]

    Swaminathan, Madhavan

    Ultra-HighDensity Board Technologyfor suh-100pn Pitch nano-WaferLevel Packaging Venky Sundaram, Packaging Research Center, Georgia Institute of Technology, 813 Ferst Dr, Atlanta, GA 30332-0560, USA and the package increases tremendously. With the shift towards nano ICs by 2004 with cl00 nm feature sizes

  2. Method of making sintered ductile intermetallic-bonded ceramic composites

    DOE Patents [OSTI]

    Plucknett, K.; Tiegs, T.N.; Becher, P.F.

    1999-05-18

    A method of making an intermetallic-bonded ceramic composite involves combining a particulate brittle intermetallic precursor with a particulate reactant metal and a particulate ceramic to form a mixture and heating the mixture in a non-oxidizing atmosphere at a sufficient temperature and for a sufficient time to react the brittle intermetallic precursor and the reactant metal to form a ductile intermetallic and sinter the mixture to form a ductile intermetallic-bonded ceramic composite. 2 figs.

  3. Bonded Bracket Assmebly for Frameless Solar Panels

    SciTech Connect (OSTI)

    Murray, Todd

    2013-01-30

    In February 2011 the US Department of Energy announced their new Sunshot Initiative. The Sunshot goal is to reduce the total cost of solar energy systems by about 75 percent before the end of the decade. The DOE estimated that a total installed cost of $1 per watt for photovoltaic systems would be equivalent to 6���¢/kilowatt hour (kWh) for energy available from the grid. The DOE also estimated that to meet the $1 per watt goal, PV module costs would need to be reduced to $.50 per watt, balance of systems costs would need to be reduced to $.40 per watt, and power electronic costs would need to reach $.10 per watt. To address the BOS balance of systems cost component of the $1 per watt goal, the DOE announced a funding opportunity called (BOS-X) Extreme Balance of System Hardware Cost Reductions. The DOE identified eight areas within the total BOS costs: 1) installation labor, 2) installation materials, 3) installation overhead and profit, 4) tracker, 5) permitting and commissioning, 6) site preparation, 7) land acquisition, 8) sales tax. The BOS-X funding announcement requested applications in four specific topics: Topic 1: Transformational Building Integrated Photovoltaic (BIPV) Modules Topic 2: Roof and Ground Mount Innovations Topic 3: Transformational Photovoltaic System Designs Topic 4: Development of New Wind Load Codes for PV Systems The application submitted by ARaymond Tinnerman reflected the requirements listed in Topic #2, Roof and Ground Mount Innovations. The goal of topic #2 was to develop technologies that would result in the extreme reduction of material and labor costs associated with applications that require physical connections and attachments to roof and ground mount structures. The topics researched in this project included component cost reduction, labor reduction, weight reduction, wiring innovations, and alternative material utilization. The project objectives included: 1) The development of an innovative quick snap bracket assembly that would be bonded to frameless PV modules for commercial rooftop installations. 2) The development of a composite pultruded rail to replace traditional racking materials. 3) In partnership with a roofing company, pilot the certification of a commercial roof to be solar panel compliant, eliminating the need for structural analysis and government oversight resulting in significantly decreased permitting costs. 4) Reduce the sum of all cost impacts in topic #2 from a baseline total of $2.05/watt to $.34/watt.

  4. The Breathing Orbital Valence Bond Method in Diffusion Monte Carlo: C-H Bond Dissociation of Acetylene

    E-Print Network [OSTI]

    Braida, Benoit

    2009-01-01

    Quantum Chem. 2005, (19) Barnett, R. N. ; Sun, Z. ; Lester,In a systematic DMC study, Barnett et al. 19 explored thefor the C-H bond distance. Barnett et al. reported 1-CSF DMC

  5. Bond-valence methods for pKa prediction. II. Bond-valence, electrostatic, molecular geometry, and solvation effects

    SciTech Connect (OSTI)

    Bickmore, Barry R.; Rosso, Kevin M.; Tadanier, Christopher J.; Bylaska, Eric J.; Doud, Darrin

    2006-08-15

    In a previous contribution, we outlined a method for predicting (hydr)oxy-acid and oxide surface acidity constants based on three main factors: bond valence, Me?O bond ionicity, and molecular shape. Here electrostatics calculations and ab initio molecular dynamics simulations are used to qualitatively show that Me?O bond ionicity controls the extent to which the electrostatic work of proton removal departs from ideality, bond valence controls the extent of solvation of individual functional groups, and bond valence and molecular shape controls local dielectric response. These results are consistent with our model of acidity, but completely at odds with other methods of predicting acidity constants for use in multisite complexation models. In particular, our ab initio molecular dynamics simulations of solvated monomers clearly indicate that hydrogen bonding between (hydr)oxo-groups and water molecules adjusts to obey the valence sum rule, rather than maintaining a fixed valence based on the coordination of the oxygen atom as predicted by the standard MUSIC model.

  6. The C OH O hydrogen bond: A determinant of stability and specificity

    E-Print Network [OSTI]

    Senes, Alessandro

    recovered by hydro- gen bond formation, so hydrogen bonds provide a small or even unfavorable net energy hydro- gen bond has been unclear and its interaction energy has been believed to be small. Recently that apparent carbon hydro- gen bonds cluster frequently at glycine-, serine-, and threonine-rich packing

  7. Hydrogen Bond Migration between Molecular Sites Observed with Ultrafast 2D IR Chemical Exchange Spectroscopy

    E-Print Network [OSTI]

    Fayer, Michael D.

    Hydrogen Bond Migration between Molecular Sites Observed with Ultrafast 2D IR Chemical ExchangeVed: January 12, 2010 Hydrogen-bonded complexes between phenol and phenylacetylene are studied using ultrafast hydrogen bonding acceptor sites (phenyl or acetylene) that compete for hydrogen bond donors in solution

  8. Hydrogen bonding between neon and hydrogen fluoride M. Losonczy and J. W. Moskowitz*

    E-Print Network [OSTI]

    Stillinger, Frank

    Hydrogen bonding between neon and hydrogen fluoride M. Losonczy and J. W. Moskowitz* Chemistry of hydrogen fluoride. The results exhibit formation of a linear hydrogen bond. Although this bond is weak (0.234 kcal!mole), its strength exceeds that found earlier for the neon-water hydrogen bond. I. INTRODUCTION

  9. A new hydrogen-bonding potential for the design of proteinRNA interactions predicts specific

    E-Print Network [OSTI]

    Baker, David

    A new hydrogen-bonding potential for the design of protein­RNA interactions predicts specific-dependent hydrogen-bonding potential based on the statistical analysis of hydrogen-bonding geometries of hydrogen-bonding atom pairs at protein­ nucleic acid interfaces. A scoring function based on the hydrogen

  10. Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications (Presentation)

    SciTech Connect (OSTI)

    Devoto, D.

    2013-07-01

    This presentation discusses the thermal performance and reliability of bonded interfaces for power electronics packaging applications.

  11. Comparison of bond character in hydrocarbons and fullerenes D. W. Snoke

    E-Print Network [OSTI]

    Snoke, David

    Comparison of bond character in hydrocarbons and fullerenes D. W. Snoke Department of Physics a comparison of the bond polarizabilities for carbon-carbon bonds in hydrocarbons and fullerenes, using two and ethylene. We find that the polarizabilities for single bonds in fullerenes and hydrocarbons compare well

  12. Effect of hydrogen bond on coal extraction by in-situ vacuum FTIR

    SciTech Connect (OSTI)

    Li, J.; Feng, J.; Li, W.Y.; Chang, H.Z.; Xie, K.C. [Taiyuan University of Technol, Taiyuan (China)

    2009-07-01

    Coal chemical formation environment might result in different properties of hydrogen bonds in coal structure. The thermo stability, amount and types of hydrogen bond in six typical Chinese coal macerals were investigated by in situ vacuum Fourier transform infrared spectroscopy (FTIR). It was found that three types of hydrogen bond were involved in coal structure, which were OH-N, OH self associated, and OH tetrapolymer hydrogen bond. There was no correlation between the amount of three types of hydrogen bonds and extraction yield. The thermo stability of hydrogen bond in inertinite was stronger than that of vitrinite, especially the thermo stability of hydrogen bond in Pingshuo inertinite.

  13. National Institutes of Health Current National Institute

    E-Print Network [OSTI]

    Rau, Don C.

    Library of Medicine John E. Fogarty International Center for Advanced Study in National Center National Institute of Nursing Research National Library of Medicine John E. Fogarty International CenterNational Institutes of Health Current National Institute of Arthritis and Musculoskeletal and Skin

  14. Intramolecular Hydrogen Bonding in Disubstituted Ethanes. A Comparison of NH,,,O-and OH,,,O-Hydrogen Bonding through Conformational Analysis of 4-Amino-4-oxobutanoate

    E-Print Network [OSTI]

    Goddard III, William A.

    Intramolecular Hydrogen Bonding in Disubstituted Ethanes. A Comparison of NH,,,O- and OH,,,O- Hydrogen Bonding through Conformational Analysis of 4-Amino-4-oxobutanoate (succinamate) and Monohydrogen 1 of amide NH,,,O- and carboxyl OH,,,O- hydrogen bonds were investigated via conformational analysis

  15. CCD DEVELOPMENT PROGRESS AT LAWRENCE BERKELEY NATIONAL

    E-Print Network [OSTI]

    defined and is determined by the transit time of the photo-generated holes in an electric field wafer (right). The processing steps critical to the fabrication of LBNL CCDs and the challenges

  16. Rhodium-Catalyzed C-C Bond Formation via Heteroatom-Directed C-H Bond Activation

    SciTech Connect (OSTI)

    Colby, Denise; Bergman, Robert; Ellman, Jonathan

    2010-05-13

    Once considered the 'holy grail' of organometallic chemistry, synthetically useful reactions employing C-H bond activation have increasingly been developed and applied to natural product and drug synthesis over the past decade. The ubiquity and relative low cost of hydrocarbons makes C-H bond functionalization an attractive alternative to classical C-C bond forming reactions such as cross-coupling, which require organohalides and organometallic reagents. In addition to providing an atom economical alternative to standard cross - coupling strategies, C-H bond functionalization also reduces the production of toxic by-products, thereby contributing to the growing field of reactions with decreased environmental impact. In the area of C-C bond forming reactions that proceed via a C-H activation mechanism, rhodium catalysts stand out for their functional group tolerance and wide range of synthetic utility. Over the course of the last decade, many Rh-catalyzed methods for heteroatom-directed C-H bond functionalization have been reported and will be the focus of this review. Material appearing in the literature prior to 2001 has been reviewed previously and will only be introduced as background when necessary. The synthesis of complex molecules from relatively simple precursors has long been a goal for many organic chemists. The ability to selectively functionalize a molecule with minimal pre-activation can streamline syntheses and expand the opportunities to explore the utility of complex molecules in areas ranging from the pharmaceutical industry to materials science. Indeed, the issue of selectivity is paramount in the development of all C-H bond functionalization methods. Several groups have developed elegant approaches towards achieving selectivity in molecules that possess many sterically and electronically similar C-H bonds. Many of these approaches are discussed in detail in the accompanying articles in this special issue of Chemical Reviews. One approach that has seen widespread success involves the use of a proximal heteroatom that serves as a directing group for the selective functionalization of a specific C-H bond. In a survey of examples of heteroatom-directed Rh catalysis, two mechanistically distinct reaction pathways are revealed. In one case, the heteroatom acts as a chelator to bind the Rh catalyst, facilitating reactivity at a proximal site. In this case, the formation of a five-membered metallacycle provides a favorable driving force in inducing reactivity at the desired location. In the other case, the heteroatom initially coordinates the Rh catalyst and then acts to stabilize the formation of a metal-carbon bond at a proximal site. A true test of the utility of a synthetic method is in its application to the synthesis of natural products or complex molecules. Several groups have demonstrated the applicability of C-H bond functionalization reactions towards complex molecule synthesis. Target-oriented synthesis provides a platform to test the effectiveness of a method in unique chemical and steric environments. In this respect, Rh-catalyzed methods for C-H bond functionalization stand out, with several syntheses being described in the literature that utilize C-H bond functionalization in a key step. These syntheses are highlighted following the discussion of the method they employ.

  17. National Laboratory

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantityBonneville Power Administration wouldMass map shinesSolar Photovoltaic Solar PhotovoltaicBWXT Y-12 is preserving Y-12'sNational

  18. National Laboratory

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantityBonneville Power Administration wouldMass map shinesSolar Photovoltaic Solar PhotovoltaicBWXT Y-12 is preserving Y-12'sNational

  19. National Laboratory

    Office of Scientific and Technical Information (OSTI)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantity of NaturalDukeWakefield MunicipalTechnical Report: AchievementsTemperatures Year 6 -FINALEnergy,Pacific Mort hwest National

  20. Novel Chemically-Bonded Phosphate Ceramic Borehole Sealants (Ceramicretes) for Arctic Environments

    SciTech Connect (OSTI)

    Shirish Patil; Godwin A. Chukwu; Gang Chen; Santanu Khataniar

    2008-12-31

    Novel chemically bonded phosphate ceramic borehole sealant, i.e. Ceramicrete, has many advantages over conventionally used permafrost cement at Alaska North Slope (ANS). However, in normal field practices when Ceramicrete is mixed with water in blenders, it has a chance of being contaminated with leftover Portland cement. In order to identify the effect of Portland cement contamination, recent tests have been conducted at BJ services in Tomball, TX as well as at the University of Alaska Fairbanks with Ceramicrete formulations proposed by the Argonne National Laboratory. The tests conducted at BJ Services with proposed Ceramicrete formulations and Portland cement contamination have shown significant drawbacks which has caused these formulations to be rejected. However, the newly developed Ceramicrete formulation at the University of Alaska Fairbanks has shown positive results with Portland cement contamination as well as without Portland cement contamination for its effective use in oil well cementing operations at ANS.

  1. National System Templates: Building Sustainable National Inventory...

    Open Energy Info (EERE)

    to: navigation, search Tool Summary LAUNCH TOOL Name: National System Templates: Building Sustainable National Inventory Management Systems AgencyCompany Organization: United...

  2. Sandia National Laboratories | National Nuclear Security Administratio...

    National Nuclear Security Administration (NNSA)

    nuclear weapons Bay Area national labs team to tackle long-standing automotive hydrogen storage challenge Sandia National Laboratories chemist Mark Allendorf, shown here at...

  3. COMPARISON OF AIR AND DEUTERIUM ON PINCH WELD BOND APPEARANCE

    SciTech Connect (OSTI)

    Korinko, P

    2005-10-11

    The effect that air and deuterium internal atmospheres have on the pinch weld bond quality was evaluated by conducting a scoping study using type 304L stainless steel LF-7 test stems that were fabricated for an associated study. Welds were made under cool, yet nominal conditions to exacerbate the influence of the atmosphere. The bond quality of the welds was directly related to the internal atmosphere with the air atmosphere welds being of lower quality than the deuterium atmosphere welds for nominally identical welding conditions.

  4. Conceptual Design of a MEDE Treatment System for Sodium Bonded Fuel

    SciTech Connect (OSTI)

    Carl E. Baily; Karen A. Moore; Collin J. Knight; Peter B. Wells; Paul J. Petersen; Ali S. Siahpush; Matthew T. Weseman

    2008-05-01

    Unirradiated sodium bonded metal fuel and casting scrap material containing highly enriched uranium (HEU) is stored at the Materials and Fuels Complex (MFC) on the Idaho National Laboratory (INL). This material, which includes intact fuel assemblies and elements from the Fast Flux Test Facility (FFTF) and Experimental Breeder Reactor-II (EBR-II) reactors as well as scrap material from the casting of these fuels, has no current use under the terminated reactor programs for both facilities. The Department of Energy (DOE), under the Sodium-Bonded Spent Nuclear Fuel Treatment Record of Decision (ROD), has determined that this material could be prepared and transferred to an off-site facility for processing and eventual fabrication of fuel for commercial nuclear reactors. A plan is being developed to prepare, package and transfer this material to the DOE High Enriched Uranium Disposition Program Office (HDPO), located at the Y-12 National Security Complex in Oak Ridge, Tennessee. Disposition of the sodium bonded material will require separating the elemental sodium from the metallic uranium fuel. A sodium distillation process known as MEDE (Melt-Drain-Evaporate), will be used for the separation process. The casting scrap material needs to be sorted to remove any foreign material or fines that are not acceptable to the HDPO program. Once all elements have been cut and loaded into baskets, they are then loaded into an evaporation chamber as the first step in the MEDE process. The chamber will be sealed and the pressure reduced to approximately 200 mtorr. The chamber will then be heated as high as 650 şC, causing the sodium to melt and then vaporize. The vapor phase sodium will be driven into an outlet line where it is condensed and drained into a receiver vessel. Once the evaporation operation is complete, the system is de-energized and returned to atmospheric pressure. This paper describes the MEDE process as well as a general overview of the furnace systems, as necessary, to complete the MEDE process.

  5. Enantioselective nickel catalysis : exploiting activated C-H bonds

    E-Print Network [OSTI]

    Bencivenga, Nicholas Ernest

    2012-01-01

    A method for the nickel-catalyzed cross-coupling between benzoxazole and secondary halides was explored. This method was to make use of the activated C-H bond found in benzoxazole at the 2-position to generate the nucleophilic ...

  6. Water inertial reorientation: Hydrogen bond strength and the angular potential

    E-Print Network [OSTI]

    Fayer, Michael D.

    Water inertial reorientation: Hydrogen bond strength and the angular potential David E. Moilanen) The short-time orientational relaxation of water is studied by ultrafast infrared pump-probe spectroscopy with recent molecular dynamics simulations employing the simple point charge-extended water model at room

  7. FULL ARTICLE Bond-selective imaging of deep tissue

    E-Print Network [OSTI]

    Cheng, Ji-Xin

    FULL ARTICLE Bond-selective imaging of deep tissue through the optical window between 1600 and 1850 of Biomedical Engineering, Purdue University, West Lafayette, IN 47907, USA 2 Department of Cellular 2011, accepted 12 November 2011 Published online 29 November 2011 Key words: optical window, deep

  8. Actuated Transitory Metal-Ligand Bond As Tunable Electromechanical Switch

    E-Print Network [OSTI]

    Ortega, Enrique

    a copper atom and coordinating organic molecules adsorbed on a metal surface acts as variable frequency of STM is the on-demand forma- tion and breaking of chemical bonds with atomic precision. Furthermore-vinyl)] benzoic acid (hereafter referred to as PVBA) with copper adatoms on the Cu (111) surface.26

  9. WHAT'S GRAPHENE? Mono or few layers of sp2 bonded

    E-Print Network [OSTI]

    Mellor-Crummey, John

    WHAT'S GRAPHENE? · Mono or few layers of sp2 bonded carbon atoms in a honeycomb lattice 105cm2/Vs at RT. 1 Due to its unique transport properties, graphene is suitable for implementation sampling (EOS) timeresolved spectroscopy to optically pump and THz probe exfoliated graphene ribbons (GR

  10. Process for protecting bonded components from plating shorts

    DOE Patents [OSTI]

    Tarte, Lisa A. (Livermore, CA); Bonde, Wayne L. (Pleasanton, CA); Carey, Paul G. (Mountain View, CA); Contolini, Robert J. (Pleasanton, CA); McCarthy, Anthony M. (Menlo Park, CA)

    2000-01-01

    A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.

  11. July 18, 2012 Using Qualified Energy Conservation Bonds for Public

    E-Print Network [OSTI]

    energy use by 4.9 percent and saved approximately $4 million, primarily through reduced vehicle fuel use) as a tool that had potential to reduce the barriers to further energy savings in city- owned facilities.4July 18, 2012 Using Qualified Energy Conservation Bonds for Public Building Upgrades: Reducing

  12. A Pact with the Devil Mike Bond and George Danezis

    E-Print Network [OSTI]

    Danezis, George

    be damned." The Tragicall History of D. Faustus -- Christopher Marlowe Computer viruses and their payloads computer), through user education, to sophisticated anti-virus software, which today include full virtualA Pact with the Devil Mike Bond and George Danezis Computer Laboratory, University of Cambridge, 15

  13. Hydrogen Bonding Increases Packing Density in the Protein Interior

    E-Print Network [OSTI]

    Hydrogen Bonding Increases Packing Density in the Protein Interior David Schell,1,2 Jerry Tsai,1 J System Health Science Center, College Station, Texas 77843-1114 ABSTRACT The contribution of hydrogen to the stability, but experimental studies show that bury- ing polar groups, especially those that are hydrogen

  14. Method of preparation of bonded polyimide fuel cell package

    DOE Patents [OSTI]

    Morse, Jeffrey D. (Martinez, CA); Jankowski, Alan (Livermore, CA); Graff, Robert T. (Modesto, CA); Bettencourt, Kerry (Dublin, CA)

    2011-04-26

    Described herein are processes for fabricating microfluidic fuel cell systems with embedded components in which micron-scale features are formed by bonding layers of DuPont Kapton.TM. polyimide laminate. A microfluidic fuel cell system fabricated using this process is also described.

  15. Chemical Shielding Tensors for a Silicon-Carbon Double Bond

    E-Print Network [OSTI]

    Apeloig, Yitzhak

    Chemical Shielding Tensors for a Silicon-Carbon Double Bond Jarrod J. Buffy, Robert West,*, Michael of NMR chemical shielding tensors (CST) have been important in aiding the understanding of the nature shielding tensors have been reported and interpreted for compounds containing SidSi,1 PdP,2 SndSn,3 Cd

  16. Bonded polyimide fuel cell package and method thereof

    SciTech Connect (OSTI)

    Morse, Jeffrey D.; Jankowski, Alan; Graff, Robert T.; Bettencourt, Kerry

    2005-11-01

    Described herein are processes for fabricating microfluidic fuel cell systems with embedded components in which micron-scale features are formed by bonding layers of DuPont Kapton.TM. polyimide laminate. A microfluidic fuel cell system fabricated using this process is also described.

  17. Polyurethane spray coating of aluminum wire bonds to prevent corrosion and suppress resonant oscillations

    E-Print Network [OSTI]

    Izen, Joseph; The ATLAS collaboration; Kurth, Matthew Glenn

    2015-01-01

    Unencapsulated aluminum wedge wire bonds are common in particle-physics pixel and strip detectors. Industry-favored bulk encapsulation is eschewed due to the range of operating temperatures and radiation. Wire bond failures are a persistent, source of tracking detector failure Unencapsulated bonds are vulnerable to condensation-induced corrosion, particularly when halides are present. Oscillations from periodic Lorenz forces are documented as another source of wire bond failure. Spray application of polyurethane coatings, performance of polyurethane-coated wire bonds after climate chamber exposure, and resonant properties of PU-coated wire bonds and their resistance to periodic Lorenz forces will be described.

  18. CX-000268: Categorical Exclusion Determination

    Office of Energy Efficiency and Renewable Energy (EERE)

    High Efficiency, Low-Cost, Multijunction Solar Cells Based on Epitaxial Liftoff and Wafer Bonding; National Renewable Energy Laboratory Tracking Number 09-041CX(s) Applied: B3.6Date: 12/28/2009Location(s): IllinoisOffice(s): Energy Efficiency and Renewable Energy, Golden Field Office

  19. Cu-Cu direct bonding achieved by surface method at room temperature

    SciTech Connect (OSTI)

    Utsumi, Jun [Advanced Technology Research Center, Mitsubishi Heavy Industries, Ltd., 1-8-1 Sachiura, Kanazawa-ku, Yokohama 236-8515 (Japan); Ichiyanagi, Yuko, E-mail: yuko@ynu.ac.jp [Department of Physics, Graduate School of Engineering, Yokohama National University, Tokiwadai, Hodogaya, Yokohama 240-8501 (Japan)

    2014-02-20

    The metal bonding is a key technology in the processes for the microelectromechanical systems (MEMS) devices and the semiconductor devices to improve functionality and higher density integration. Strong adhesion between surfaces at the atomic level is crucial; however, it is difficult to achieve close bonding in such a system. Cu films were deposited on Si substrates by vacuum deposition, and then, two Cu films were bonded directly by means of surface activated bonding (SAB) at room temperature. The two Cu films, with the surface roughness Ra about 1.3nm, were bonded by using SAB at room temperature, however, the bonding strength was very weak in this method. In order to improve the bonding strength between the Cu films, samples were annealed at low temperatures, between 323 and 473 K, in air. As the result, the Cu-Cu bonding strength was 10 times higher than that of the original samples without annealing.

  20. Non-Destructive Inspection of Adhesive Bonds in Metal-Metal Joints...

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    Inspection of Adhesive Bonds in Metal-Metal Joints Non-Destructive Inspection of Adhesive Bonds in Metal-Metal Joints 2009 DOE Hydrogen Program and Vehicle Technologies Program...

  1. Plasticity of hydrogen bond networks regulates mechanochemistry of cell adhesion complexes

    E-Print Network [OSTI]

    Chakrabarti, Shaon; Thirumalai, D

    2014-01-01

    Mechanical forces acting on cell adhesion receptor proteins regulate a range of cellular functions by formation and rupture of non-covalent interactions with ligands. Typically, force decreases the lifetimes of intact complexes (slip-bonds), making the discovery that these lifetimes can also be prolonged ("catch-bonds"), a surprise. We created a microscopic analytic theory by incorporating the structures of selectin and integrin receptors into a conceptual framework based on the theory of stochastic equations, which quantitatively explains a wide range of experimental data (including catch-bonds at low forces and slip-bonds at high forces). Catch-bonds arise due to force-induced remodeling of hydrogen bond networks, a finding that also accounts for unbinding in structurally unrelated integrin-fibronectin and actomyosin complexes. For the selectin family, remodeling of hydrogen bond networks drives an allosteric transition resulting in the formation of maximum number of hydrogen bonds determined only by the st...

  2. Chemical Bonding In Amorphous Si Coated-carbon Nanotube As Anodes...

    Office of Scientific and Technical Information (OSTI)

    Chemical Bonding In Amorphous Si Coated-carbon Nanotube As Anodes For Li ion Batteries: A XANES Study Citation Details In-Document Search Title: Chemical Bonding In Amorphous Si...

  3. Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation)

    SciTech Connect (OSTI)

    Devoto, D.

    2014-06-01

    This presentation reviews the status of the performance and reliability of bonded interfaces for high-temperature packaging.

  4. United Nations Programme on

    E-Print Network [OSTI]

    Schrijver, Karel

    United Nations Programme on Space Applications UNITED NATIONS UNITED NATIONS OFFICE FOR OUTER SPACE, Sputnik 1. Soon after that event, the Member States of the United Nations declared that space should and natural resources management. At the first United Nations Conference on the Exploration and Peaceful Uses

  5. Development and validation of bonded composite doubler repairs for commercial aircraft.

    SciTech Connect (OSTI)

    Roach, Dennis Patrick; Rackow, Kirk A.

    2007-07-01

    A typical aircraft can experience over 2,000 fatigue cycles (cabin pressurizations) and even greater flight hours in a single year. An unavoidable by-product of aircraft use is that crack, impact, and corrosion flaws develop throughout the aircraft's skin and substructure elements. Economic barriers to the purchase of new aircraft have placed even greater demands on efficient and safe repair methods. The use of bonded composite doublers offers the airframe manufacturers and aircraft maintenance facilities a cost effective method to safely extend the lives of their aircraft. Instead of riveting multiple steel or aluminum plates to facilitate an aircraft repair, it is now possible to bond a single Boron-Epoxy composite doubler to the damaged structure. The FAA's Airworthiness Assurance Center at Sandia National Labs (AANC), Boeing, and Federal Express completed a pilot program to validate and introduce composite doubler repair technology to the U.S. commercial aircraft industry. This project focused on repair of DC-10 fuselage structure and its primary goal was to demonstrate routine use of this repair technology using niche applications that streamline the design-to-installation process. As composite doubler repairs gradually appear in the commercial aircraft arena, successful flight operation data is being accumulated. These commercial aircraft repairs are not only demonstrating the engineering and economic advantages of composite doubler technology but they are also establishing the ability of commercial maintenance depots to safely adopt this repair technique. This report presents the array of engineering activities that were completed in order to make this technology available for widespread commercial aircraft use. Focused laboratory testing was conducted to compliment the field data and to address specific issues regarding damage tolerance and flaw growth in composite doubler repairs. Fatigue and strength tests were performed on a simulated wing repair using a substandard design and a flawed installation. In addition, the new Sol-Gel surface preparation technique was evaluated. Fatigue coupon tests produced Sol-Gel results that could be compared with a large performance database from conventional, riveted repairs. It was demonstrated that not only can composite doublers perform well in severe off-design conditions (low doubler stiffness and presence of defects in doubler installation) but that the Sol-Gel surface preparation technique is easier and quicker to carry out while still producing optimum bonding properties. Nondestructive inspection (NDI) methods were developed so that the potential for disbond and delamination growth could be monitored and crack growth mitigation could be quantified. The NDI methods were validated using full-scale test articles and the FedEx aircraft installations. It was demonstrated that specialized NDI techniques can detect flaws in composite doubler installations before they reach critical size. Probability of Detection studies were integrated into the FedEx training in order to quantify the ability of aircraft maintenance depots to properly monitor these repairs. In addition, Boeing Structural Repair and Nondestructive Testing Manuals were modified to include composite doubler repair and inspection procedures. This report presents the results from the FedEx Pilot Program that involved installation and surveillance of numerous repairs on operating aircraft. Results from critical NDI evaluations are reported in light of damage tolerance assessments for bonded composite doublers. This work has produced significant interest from airlines and aircraft manufacturers. The successful Pilot Program produced flight performance history to establish the durability of bonded composite patches as a permanent repair on commercial aircraft structures. This report discusses both the laboratory data and Pilot Program results from repair installations on operating aircraft to introduce composite doubler repairs into mainstream commercial aircraft use.

  6. The Optimal Payment Reduction Ratios for a Catastrophe Bond Xiaoli Zhang

    E-Print Network [OSTI]

    Brennand, Tracy

    and the future bond payments are reduced. This projects first presents a general pricing formula for a CAT bond losses. Last, it shows how strike price, maturity, parameters of the catastrophe loss process List of Tables ix List of Figures x 1 Introduction 1 1.1 Introduction to catastrophe bond

  7. Bonding is carried out by building up Quartz Wax on the sample holder to

    E-Print Network [OSTI]

    Smith, Tanya M.

    Bonding is carried out by building up Quartz Wax on the sample holder to support and bond the tooth that the Quartz Wax should cover as much of the sample face as possible to ensure a strong bond. Application Note Tooth Wax layer Figure 1 Sample holder Tooth Thin Section #12;B. Cutting - SIngle Selection Figure 2

  8. PlasticPDMS bonding for high pressure hydrolytically stable active microfluidics

    E-Print Network [OSTI]

    Ram, Rajeev J.

    to plastics. Plastics can be manufactured using mass fabrication technologies such as injection molding with established plastic mass fabri- cation technologies. Bonding technologies Bonding between PDMS and plasticsPlastic­PDMS bonding for high pressure hydrolytically stable active microfluidics Kevin S. Lee

  9. The Hydrogen Bonding of Cytosinewith Guanine:Calorimetric and`H-NMR Analysis

    E-Print Network [OSTI]

    Williams, Loren

    The Hydrogen Bonding of Cytosinewith Guanine:Calorimetric and`H-NMR Analysis of the Molecular of hydrogen-bondformation between guanine (G) and cytusine (C) in o-dichloro- benzene and in chloroformat 25°C forming hydrogen bonds. Consequently, hydrogen-bond formation in our system is primarily between the bases

  10. Hydrogen Bond Dissociation and Reformation in Methanol Oligomers Following Hydroxyl Stretch Relaxation

    E-Print Network [OSTI]

    Fayer, Michael D.

    Hydrogen Bond Dissociation and Reformation in Methanol Oligomers Following Hydroxyl Stretch, 2002 Vibrational relaxation and hydrogen bond dynamics in methanol-d dissolved in CCl4 have been-d molecules both accepting and donating hydrogen bonds at 2500 cm-1 . Following vibrational relaxation

  11. Hydrogen bond breaking probed with multidimensional stimulated vibrational echo correlation spectroscopy

    E-Print Network [OSTI]

    Fayer, Michael D.

    Hydrogen bond breaking probed with multidimensional stimulated vibrational echo correlation September 2003 Hydrogen bond population dynamics are extricated with exceptional detail using ultrafast ( 50 of methanol­OD oligomers in CCl4 . Hydrogen bond breaking makes it possible to acquire data for times much

  12. Hydrogen bond dynamics in membrane protein function Ana-Nicoleta Bondar a,

    E-Print Network [OSTI]

    White, Stephen

    Review Hydrogen bond dynamics in membrane protein function Ana-Nicoleta Bondar a, , Stephen H 30 November 2011 Available online 8 December 2011 Keywords: Membrane protein structure Hydrogen bond Membrane protein dynamics Lipid­protein interactions Changes in inter-helical hydrogen bonding

  13. Hydrogen bond dynamics in the active site of photoactive yellow protein

    E-Print Network [OSTI]

    Herschlag, Dan

    Hydrogen bond dynamics in the active site of photoactive yellow protein Paul A. Sigala, Mark A for review February 5, 2009) Hydrogen bonds play major roles in biological structure and function. Nonetheless, hydrogen-bonded protons are not typically observed by X-ray crystallography, and most structural

  14. Hydrogen bonding in solid ammonia from ab initio calculations A. D. Fortes,a)

    E-Print Network [OSTI]

    Vocadlo, Lidunka

    Hydrogen bonding in solid ammonia from ab initio calculations A. D. Fortes,a) J. P. Brodholt, I. G the tendency toward symmetrization of the hydrogen bonds at high pressures and find that, unlike pure ice that ammonia IV does not contain a bifurcated hydrogen bond, as has previously been suggested. © 2003 American

  15. Hydrogen bond dynamics in aqueous NaBr solutions Sungnam Park

    E-Print Network [OSTI]

    Fayer, Michael D.

    Hydrogen bond dynamics in aqueous NaBr solutions Sungnam Park and M. D. Fayer§ Department. D. Fayer, August 19, 2007 (sent for review July 27, 2007) Hydrogen bond dynamics of water in Na pump­probe experiments. The hydrogen bond structural dynamics are observed by measuring spectral

  16. A CH O Hydrogen Bond Stabilized Polypeptide Chain Reversal Motif at the C Terminus of Helices

    E-Print Network [OSTI]

    Babu, M. Madan

    A C­H· · ·O Hydrogen Bond Stabilized Polypeptide Chain Reversal Motif at the C Terminus of Helices of Science Bangalore 560012, India The serendipitous observation of a C­H· · ·O hydrogen bond mediated­N hydrogen bond involving the side- chain of residue T 2 4 and the N­H group of residue T ţ 3. In as many

  17. Native Hydrogen Bonds in a Molten Globule: The Apoflavodoxin Thermal Intermediate

    E-Print Network [OSTI]

    Sancho, Javier

    Native Hydrogen Bonds in a Molten Globule: The Apoflavodoxin Thermal Intermediate MarőÂa P. IruÂn1 in surface- exposed hydrogen bonds connecting secondary-structure elements in the native protein. All hydrogen bonds analysed are formed in the molten globule intermediate, either with native strength

  18. Stoichiometric Valence and Structural Valence--Two Different Sides of the Same Coin: "Bonding Power"

    E-Print Network [OSTI]

    Wang, Xiqu

    concept is one of the cornerstones of chemistry. Valence,[1] that is, the bonding power of atoms,[2 affects the structure and stability of compounds. Therefore, knowledge of atomic bonding power is not only is equivalent to three moles of hydrogen. The property of an atom to compensate the bonding power of an equiva

  19. Can the Bond Price Reaction to Earnings Announcements Predict Future Stock Returns?

    E-Print Network [OSTI]

    Tipple, Brett

    Can the Bond Price Reaction to Earnings Announcements Predict Future Stock Returns? Omri Even. #12;Abstract In this paper I show that the bond price reaction to earnings announcements has. By demonstrating that a firm's bond price reaction to an earnings announcement can predict future stock returns

  20. From ab initio quantum chemistry to molecular dynamics: The delicate case of hydrogen bonding in ammonia

    E-Print Network [OSTI]

    Martin, Jan M.L.

    energies of this nonlinear hydrogen bond. We present a novel density functional, HCTH/407 , which leads to two equivalent ``hydrogen bonding contacts,'' is extremely close in energy on an overall flatFrom ab initio quantum chemistry to molecular dynamics: The delicate case of hydrogen bonding

  1. Characterization of Fuel-Cladding Bond Strength Using Laser Shock

    SciTech Connect (OSTI)

    James A. Smith; David L. Cottle; Barry H. Rabin

    2014-04-01

    This paper describes new laser-based capabilities for characterization of fuel-cladding bond strength in nuclear fuels, and presents preliminary results obtained from studies on as-fabricated monolithic fuel consisting of uranium-10 wt.% molybdenum alloys clad in 6061 aluminum by hot isostatic pressing. Two complementary experimental methods are employed, laser-shock testing and laser-ultrasonic imaging. Measurements are spatially localized, non-contacting and require minimum specimen preparation, and are therefore ideally suited for applications involving radioactive materials, including irradiated materials. The theoretical principles and experimental approaches employed in characterization of nuclear fuel plates are described. The ability to measure layer thicknesses, elastic properties of the constituents, and the location and nature of laser-shock induced debonds is demonstrated, and preliminary bond strength measurement results are discussed.

  2. Membrane adhesion via competing receptor/ligand bonds

    E-Print Network [OSTI]

    Mesfin Asfaw; Bartosz Rozycki; Reinhard Lipowsky; Thomas R. Weikl

    2006-10-01

    The adhesion of biological membranes is controlled by various types of receptor and ligand molecules. In this letter, we present a statistical-mechanical model for membranes that interact via receptor/ligand bonds of two different lengths. We show that the equilibrium phase behavior of the membranes is governed by an effective double-well potential. The depths of the two potential wells depend on the concentrations and binding energies of the receptors and ligands. The membranes are unbound for small, and bound for larger potential depths. In the bound state, the length mismatch of the receptor/ligand bonds can lead to lateral phase separation. We derive explicit scaling laws for the critical points of unbinding and phase separation, and determine the prefactors by comparison with Monte Carlo results.

  3. Effect of nuclear ownership on utility bond ratings and yields

    SciTech Connect (OSTI)

    Nesse, R.J.

    1982-02-01

    The major objective of this study was to test the hypothesis that investors have required an additional interest rate premium before purchasing bonds of utilities with large investments in nuclear facilities. The study required several tasks. First, the literature relating to firm bankruptcy and default was reviewed. Second, the failing financial health of the electric utility industry was assessed in terms of construction problems, the impact of federal and state regulations, and the impact of Three Mile Island. Finally, data were collected on 63 electric utilities. This allowed statistical estimation of the magnitude of the risk premium associated with utility involvement in nuclear power. The effect of this involvement on a utility's bond ratings was also examined. Multiple regression was the statistical tool used for the statistical testing and estimation.

  4. Cold bond agglomeration of waste oxides for recycling

    SciTech Connect (OSTI)

    D`Alessio, G.; Lu, W.K. [McMaster Univ., Hamilton, Ontario (Canada). Dept. of Materials Science and Engineering

    1996-12-31

    Recycling of waste oxides has been an on-going challenge for integrated steel plants. The majority of these waste oxides are collected from the cleaning systems of ironmaking and steelmaking processes, and are usually in the form of fine particulates and slurries. In most cases, these waste materials are contaminated by oils and heavy metals and often require treatment at a considerable expense prior to landfill disposal. This contamination also limits the re-use or recycling potential of these oxides as secondary resources of reliable quality. However, recycling of some selected wastes in blast furnaces or steelmaking vessels is possible, but first requires agglomeration of the fine particulate by such methods as cold bond briquetting. Cold bond briquetting technology provides both mechanical compacting and bonding (with appropriate binders) of the particulates. This method of recycling has the potential to be economically viable and environmentally sustainable. The nature of the present study is cold bond briquetting of iron ore pellet fines with a molasses-cement-H{sub 2}O binder for recycling in a blast furnace. The inclusion of molasses is for its contribution to the green strength of briquettes. During the curing stage, significant gains in strength may be credited to molasses in the presence of cement. The interactions of cement (and its substitutes), water and molasses and their effects on the properties of the agglomerates during and after various curing conditions were investigated. Tensile strengths of briquettes made in the laboratory and subjected to experimental conditions which simulated the top part of a blast furnace shaft were also examined.

  5. Deconfinement of electric charges in hydrogen-bonded ferroelectrics

    E-Print Network [OSTI]

    Bo-Jie Huang; Chyh-Hong Chern

    2015-04-15

    In addition to the gauge charges, a new charge degree of freedom is found in the deconfined phase in the lattice Ising gauge theory. While applying to the hydrogen-bonded ferroelectrics, the new charge is essentially the electric charge, leading to the divergent dielectric susceptibility. The new degree of freedom paves an experimentally accessible way to identify the deconfined phase in the lattice Ising gauge theory.

  6. Fluorinated diamond particles bonded in a filled fluorocarbon resin matrix

    DOE Patents [OSTI]

    Taylor, Gene W. (Los Alamos, NM); Roybal, Herman E. (Santa Fe, NM)

    1985-01-01

    A method of producing fluorinated diamond particles bonded in a filled fluorocarbon resin matrix. Simple hot pressing techniques permit the formation of such matrices from which diamond impregnated grinding tools and other articles of manufacture can be produced. Teflon fluorocarbon resins filled with Al.sub.2 O.sub.3 yield grinding tools with substantially improved work-to-wear ratios over grinding wheels known in the art.

  7. Oxford Area Community School District (Michigan) Bonds Case Study

    Broader source: Energy.gov [DOE]

    Michigan’s Oxford Area Community School District entered into an energy savings performance contract and issued limited tax general obligation bonds to fund the up-front costs of almost $3 million of energy-related improvements. Case study is excerpted from Financing Energy Upgrades for K-12 School Districts: A Guide to Tapping into Funding for Energy Efficiency and Renewable Energy Improvements. Author: Merrian Borgeson and Mark Zimring

  8. Fluorinated diamond particles bonded in a filled fluorocarbon resin matrix

    DOE Patents [OSTI]

    Taylor, G.W.; Roybal, H.E.

    1983-11-14

    A method of producing fluorinated diamond particles bonded in a filled fluorocarbon resin matrix. Simple hot pressing techniques permit the formation of such matrices from which diamond impregnated grinding tools and other articles of manufacture can be produced. Teflon fluorocarbon resins filled with Al/sub 2/O/sub 3/ yield grinding tools with substantially improved work-to-wear ratios over grinding wheels known in the art.

  9. Quantum Confinement in Hydrogen Bond of DNA and RNA

    E-Print Network [OSTI]

    da Silva dos Santos; Elso Drigo Filho; Regina Maria Ricotta

    2015-02-09

    The hydrogen bond is a fundamental ingredient to stabilize the DNA and RNA macromolecules. The main contribution of this work is to describe quantitatively this interaction as a consequence of the quantum confinement of the hydrogen. The results for the free and confined system are compared with experimental data. The formalism to compute the energy gap of the vibration motion used to identify the spectrum lines is the Variational Method allied to Supersymmetric Quantum Mechanics.

  10. Quantum Confinement in Hydrogen Bond of DNA and RNA

    E-Print Network [OSTI]

    Santos, da Silva dos; Ricotta, Regina Maria

    2015-01-01

    The hydrogen bond is a fundamental ingredient to stabilize the DNA and RNA macromolecules. The main contribution of this work is to describe quantitatively this interaction as a consequence of the quantum confinement of the hydrogen. The results for the free and confined system are compared with experimental data. The formalism to compute the energy gap of the vibration motion used to identify the spectrum lines is the Variational Method allied to Supersymmetric Quantum Mechanics.

  11. Compacting Plastic-Bonded Explosive Molding Powders to Dense Solids

    SciTech Connect (OSTI)

    B. Olinger

    2005-04-15

    Dense solid high explosives are made by compacting plastic-bonded explosive molding powders with high pressures and temperatures for extended periods of time. The density is influenced by manufacturing processes of the powders, compaction temperature, the magnitude of compaction pressure, pressure duration, and number of repeated applications of pressure. The internal density variation of compacted explosives depends on method of compaction and the material being compacted.

  12. National Laboratory]; Chertkov, Michael [Los Alamos National...

    Office of Scientific and Technical Information (OSTI)

    Chertkov, Michael Los Alamos National Laboratory Construction and Facility Engineering; Energy Conservation, Consumption, & Utilization(32); Energy Planning, Policy, &...

  13. Fragmentation and depolymerization of non-covalently bonded filaments

    E-Print Network [OSTI]

    A. Zaccone; I. Terentjev; L. DiMichele; E. M. Terentjev

    2015-03-22

    Protein molecules often self-assemble by means of non-covalent physical bonds to form extended filaments, such as amyloids, F-actin, intermediate filaments, and many others. The kinetics of filament growth is limited by the disassembly rate, at which inter-protein bonds break due to the thermal motion. Existing models often assume that the thermal dissociation of subunits occurs uniformly along the filament, or even preferentially in the middle, while the well-known propensity of F-actin to depolymerize from one end is mediated by biochemical factors. Here, we show for a very general (and generic) model, using Brownian dynamics simulations and theory, that the breakup location along the filament is strongly controlled by the asymmetry of the binding force about the minimum, as well as by the bending stiffness of the filament. We provide the basic connection between the features of the interaction potential between subunits and the breakup topology. With central-force (that is, fully flexible) bonds, the breakup rate is always maximum in the middle of the chain, whereas for semiflexible or stiff filaments this rate is either a minimum in the middle or flat. The emerging framework provides a unifying understanding of biopolymer fragmentation and depolymerization and recovers earlier results in its different limits.

  14. Effect of hydrogen bond cooperativity on the behavior of water

    E-Print Network [OSTI]

    Kevin Stokely; Marco G. Mazza; H. Eugene Stanley; Giancarlo Franzese

    2009-08-27

    Four scenarios have been proposed for the low--temperature phase behavior of liquid water, each predicting different thermodynamics. The physical mechanism which leads to each is debated. Moreover, it is still unclear which of the scenarios best describes water, as there is no definitive experimental test. Here we address both open issues within the framework of a microscopic cell model by performing a study combining mean field calculations and Monte Carlo simulations. We show that a common physical mechanism underlies each of the four scenarios, and that two key physical quantities determine which of the four scenarios describes water: (i) the strength of the directional component of the hydrogen bond and (ii) the strength of the cooperative component of the hydrogen bond. The four scenarios may be mapped in the space of these two quantities. We argue that our conclusions are model-independent. Using estimates from experimental data for H bond properties the model predicts that the low-temperature phase diagram of water exhibits a liquid--liquid critical point at positive pressure.

  15. Bonding energies and long-range order in the trialuminides

    SciTech Connect (OSTI)

    Sparks, C.J.; Specht, E.D.; Ice, G.E.; Zschack, P.; Schneibel, J.

    1990-01-01

    The degree of long-range order in the trialuminides is determined by X-ray powder diffraction techniques. Long-range order exists to their melting points. For the binary trialuminides Al{sub 3}Ti, Al{sub 73}Ti{sub 27}, and Al{sub 3}Sc, the degree of long-range order is nearly perfect and is a measure of the lack of mixing of the aluminum atoms onto the sublattice occupied by either Ti or Sc. A calculation of the bond energy between neighboring pairs of atoms from the ordering (melting) temperature is made following the Bragg-Williams mean field theory approach. These bond energies compare favorably with more sophisticated calculations. Bond energies are found to be larger than the energy difference between the crystal structure forms DO{sub 22}, Ll{sub 2}, and DO{sub 23}, and therefore, more relevant to understanding the mechanical and chemical behavior of the trialuminides. Ordering or melting temperatures of these intermetallics reflect the strong Al-metal near-neighbor pair potentials and may provide insights to their brittle properties. 11 refs., 2 figs., 2 tabs.

  16. Vacuum fusion bonded glass plates having microstructures thereon

    DOE Patents [OSTI]

    Swierkowski, Steve P. (Livermore, CA); Davidson, James C. (Livermore, CA); Balch, Joseph W. (Livermore, CA)

    2001-01-01

    An improved apparatus and method for vacuum fusion bonding of large, patterned glass plates. One or both glass plates are patterned with etched features such as microstructure capillaries and a vacuum pumpout moat, with one plate having at least one hole therethrough for communication with a vacuum pumpout fixture. High accuracy alignment of the plates is accomplished by a temporary clamping fixture until the start of the fusion bonding heat cycle. A complete, void-free fusion bond of seamless, full-strength quality is obtained through the plates; because the glass is heated well into its softening point and because of a large, distributed force that is developed that presses the two plates together from the difference in pressure between the furnace ambient (high pressure) and the channeling and microstructures in the plates (low pressure) due to the vacuum drawn. The apparatus and method may be used to fabricate microcapillary arrays for chemical electrophoresis; for example, any apparatus using a network of microfluidic channels embedded between plates of glass or similar moderate melting point substrates with a gradual softening point curve, or for assembly of glass-based substrates onto larger substrates, such as in flat panel display systems.

  17. Mojave National Preserve Joshua Tree National Park

    E-Print Network [OSTI]

    Laughlin, Robert B.

    Forest (SBNF) Angeles National Forest (ANF) Cleveland National Forest (CNF) CNF CNF SBNF ANF CACA 049111°0'0"N 34°0'0"N 34°0'0"N 33°0'0"N 33°0'0"N California Desert Conservation Area BLM Solar Energy Project Contingent Corridor Deleted Corridor Land Status BLM National Park Service Forest Service Military USFWS

  18. Oak Ridge National Laboratory National Security Programs

    E-Print Network [OSTI]

    Security Challenges #12;3 OAK RIDGE NATIONAL LABORATORY U. S. DEPARTMENT OF ENERGY How Will Our Enemies and Homeland Security #12;OAK RIDGE NATIONAL LABORATORY U. S. DEPARTMENT OF ENERGY Nuclear Nonproliferation $27,050 Cleanup $7,481 Science $359M National Security $278M Energy $170M Cleanup $0.8M Total $1.08B

  19. National Environmental Information Infrastructure

    E-Print Network [OSTI]

    Greenslade, Diana

    National Environmental Information Infrastructure: Reference Architecture Contributing to the Australian Government National Plan for Environmental Information initiative #12;National Environmental Information Infrastructure: Reference Architecture v1.1 Environmental Information Programme Publication Series

  20. National Science Bowl Finals

    ScienceCinema (OSTI)

    None

    2010-09-01

    National Science Bowl finals and awards at the National Building Museum in Washington D.C. Monday 5/3/2010

  1. CEMI 2015 National Summit

    Office of Energy Efficiency and Renewable Energy (EERE)

    At the Clean Energy Manufacturing Initiative's (CEMI) 2015 National Summit, stakeholders are invited to share input on national priorities for clean energy manufacturing and explore models for...

  2. 2012 National Electricity Forum

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    U.S. Department of Energy U.S. Department of Energy National Electric Transmission Congestion Study Workshop - December 6, 2011 National Electric Transmission Congestion Study...

  3. Concept of chemical bond and aromaticity based on quantum information theory

    E-Print Network [OSTI]

    Szilvási, T; Legeza, Ö

    2015-01-01

    Quantum information theory (QIT) emerged in physics as standard technique to extract relevant information from quantum systems. It has already contributed to the development of novel fields like quantum computing, quantum cryptography, and quantum complexity. This arises the question what information is stored according to QIT in molecules which are inherently quantum systems as well. Rigorous analysis of the central quantities of QIT on systematic series of molecules offered the introduction of the concept of chemical bond and aromaticity directly from physical principles and notions. We identify covalent bond, donor-acceptor dative bond, multiple bond, charge-shift bond, and aromaticity indicating unified picture of fundamental chemical models from ab initio.

  4. Coexistence of dilute and densely packed domains of ligand-receptor bonds in membrane adhesion

    E-Print Network [OSTI]

    Daniel Schmidt; Timo Bihr; Udo Seifert; Ana-Sun?ana Smith

    2012-07-11

    We analyze the stability of micro-domains of ligand-receptor bonds that mediate the adhesion of biological model membranes. After evaluating the effects of membrane fluctuations on the binding affinity of a single bond, we characterize the organization of bonds within the domains by theoretical means. In a large range of parameters, we find the commonly suggested dense packing to be separated by a free energy barrier from a regime in which bonds are sparsely distributed. If bonds are mobile, a coexistence of the two regimes should emerge, which agrees with recent experimental observations.

  5. Implementation of Section 1072 of the National Defense Authorization Act for Fiscal Year 2008

    Broader source: Directives, Delegations, and Requirements [Office of Management (MA)]

    2009-08-12

    This Notice provides guidance for implementing the mandates of Section 1072 of the National Defense Authorization Act for Fiscal Year 2008, commonly referred to as the Bond Amendment. Extended until 9-28-11 by DOE N 251.90 dated 9-28-10. Canceled by DOE O 472.2. Does not cancel other directives.

  6. DC Wafers | Open Energy Information

    Open Energy Info (EERE)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Home Page on Google Bookmark EERE: Alternative Fuels Data Center Home Page on QA:QA J-E-1 SECTION J APPENDIX E LISTStar EnergyLawler,CoalConcordiaConsumerLEDSEnergy Information akaDATAGROWafers

  7. National Renewable Energy Laboratory

    E-Print Network [OSTI]

    National Renewable Energy Laboratory Innovation for Our Energy Future ponsorship Format Reversed Color:White rtical Format Reversed-A ertical Format Reversed-B National Renewable Energy Laboratory National Renewable Energy Laboratory Innovation for Our Energy Future National Renewable Energy Laboratory

  8. Title 43 CFR 3104 Bonds | Open Energy Information

    Open Energy Info (EERE)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Home Page on Google Bookmark EERE: Alternative Fuels Data Center Home Page| Open Energy Information Serbia-EnhancingEt Al., 2013)Open EnergyTinoxOpen Energy Information 155104 Bonds Jump

  9. Chemical bond and entanglement of electrons in the hydrogen molecule

    E-Print Network [OSTI]

    Nikos Iliopoulos; Andreas F. Terzis

    2014-08-01

    We theoretically investigate the quantum correlations (in terms of concurrence of indistinguishable electrons) in a prototype molecular system (hydrogen molecule). With the assistance of the standard approximations of the linear combination of atomic orbitals and the con?guration interaction methods we describe the electronic wavefunction of the ground state of the H2 molecule. Moreover, we managed to ?find a rather simple analytic expression for the concurrence (the most used measure of quantum entanglement) of the two electrons when the molecule is in its lowest energy. We have found that concurrence does not really show any relation to the construction of the chemical bond.

  10. Fuel cell system with separating structure bonded to electrolyte

    DOE Patents [OSTI]

    Bourgeois, Richard Scott (Albany, NY); Gudlavalleti, Sauri (Albany, NY); Quek, Shu Ching (Clifton Park, NY); Hasz, Wayne Charles (Pownal, VT); Powers, James Daniel (Santa Monica, CA)

    2010-09-28

    A fuel cell assembly comprises a separating structure configured for separating a first reactant and a second reactant wherein the separating structure has an opening therein. The fuel cell assembly further comprises a fuel cell comprising a first electrode, a second electrode, and an electrolyte interposed between the first and second electrodes, and a passage configured to introduce the second reactant to the second electrode. The electrolyte is bonded to the separating structure with the first electrode being situated within the opening, and the second electrode being situated within the passage.

  11. Carbon-Fluorine Bond Cleavage by Zirconium Metal Hydride Complexes

    E-Print Network [OSTI]

    Jones, William D.

    Carbon-Fluorine Bond Cleavage by Zirconium Metal Hydride Complexes Brian L. Edelbach, A. K. Fazlur, Rochester, New York 14627 Received April 8, 1999 The zirconium hydride dimer [Cp2ZrH2]2 reacts with C6F6. [Cp2ZrH2]2 reacts with C6F5H to give Cp2Zr(p-C6F4H)F, Cp2ZrF2, C6F4H2, and H2. The zirconium hydride

  12. Qualified Energy Conservation Bonds (QECBs) & New Clean Renewable Energy

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Home Page on Google Bookmark EERE: Alternative Fuels Data Center Home Page on Delicious RankADVANCED MANUFACTURINGEnergy BillsNo. 195 - Oct. 7, 2011 |1 DOE HydrogenDepartmentU.S. Department ofBonds

  13. Bond County, Illinois: Energy Resources | Open Energy Information

    Open Energy Info (EERE)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Home Page on Google Bookmark EERE: Alternative Fuels Data Center Home Page on QA:QA J-E-1 SECTION JEnvironmental JumpInformationBio-GasIllinois:Energy Authority Jump to:Bolivia:Vermont:BonBond

  14. Time-Resolved Study of Bonding in Liquid Carbon

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantityBonneville Power AdministrationRobust,Field-effectWorking With U.S.Week DayDr.Theories (JournalTime-Resolved Study of Bonding in

  15. Sandia National Laboratories: National Security Missions: Internationa...

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Defense Advanced Research Projects Agency, Unified Combatant Commands, National Nuclear Security Administration, and U.S. industry. Related Links Robotics Weapons-Force Center...

  16. Lawrence Livermore National Laboratory | National Nuclear Security...

    National Nuclear Security Administration (NNSA)

    Life Extension Program Bay Area national labs team to tackle long-standing automotive hydrogen storage challenge SOLAR POWER PURCHASE FOR DOE LABORATORIES More about LLNL...

  17. Nitrogen-tuned bonding mechanism of Li and Ti adatom embedded graphene

    SciTech Connect (OSTI)

    Lee, Sangho; Chung, Yong-Chae, E-mail: yongchae@hanyang.ac.kr

    2013-09-15

    The effects of nitrogen defects on the bonding mechanism and resultant binding energy between the metal and graphene layer were investigated using density functional theory (DFT) calculations. For the graphitic N-doped graphene, Li adatom exhibited ionic bonding character, while Ti adatom showed features of covalent bonding similar to that of pristine graphene. However, in the cases of pyridinic and pyrrolic structures, partially covalent bonding characteristic occurred around N atoms in the process of binding with metals, and this particular bond formation enhanced the bond strength of metal on the graphene layer as much as it exceeded the cohesive energy of the metal bulk. Thus, Li and Ti metals are expected to be dispersed with atomic accuracy on the pyridinic and pyrrolic N-doped graphene layers. These results demonstrate that the bonding mechanism of metal–graphene complex can change according to the type of N defect, and this also affects the binding results. - Graphical abstract: Display Omitted - Highlights: • Nitrogen defects changed the bonding mechanism between metal and graphene. • Bonding character and binding results were investigated using DFT calculations. • Covalent bonding character occurred around pyridinic and pyrrolic N-doped graphene. • Pyridinic and pyrrolic N atoms are effective for metal dispersion on the graphene.

  18. Experimental and Theoretical Investigations of Energy Transfer and Hydrogen-Bond Breaking in Small Water and HCl Clusters

    E-Print Network [OSTI]

    Reisler, Hanna

    Experimental and Theoretical Investigations of Energy Transfer and Hydrogen-Bond Breaking in Small illustrating ubiquitous hydrogen bonding (H-bonding) in the gas phase, liquids, crystals, and amorphous solids and experiment are enlisted to determine bond dissociation energies (D0) of small dimers and cyclic trimers

  19. IMPACT OF CAPILLARY AND BOND NUMBERS ON RELATIVE PERMEABILITY

    SciTech Connect (OSTI)

    Kishore K. Mohanty

    2002-09-30

    Recovery and recovery rate of oil, gas and condensates depend crucially on their relative permeability. Relative permeability in turn depends on the pore structure, wettability and flooding conditions, which can be represented by a set of dimensionless groups including capillary and bond numbers. The effect of flooding conditions on drainage relative permeabilities is not well understood and is the overall goal of this project. This project has three specific objectives: to improve the centrifuge relative permeability method, to measure capillary and bond number effects experimentally, and to develop a pore network model for multiphase flows. A centrifuge has been built that can accommodate high pressure core holders and x-ray saturation monitoring. The centrifuge core holders can operate at a pore pressure of 6.9 MPa (1000 psi) and an overburden pressure of 17 MPa (2500 psi). The effect of capillary number on residual saturation and relative permeability in drainage flow has been measured. A pore network model has been developed to study the effect of capillary numbers and viscosity ratio on drainage relative permeability. Capillary and Reynolds number dependence of gas-condensate flow has been studied during well testing. A method has been developed to estimate relative permeability parameters from gas-condensate well test data.

  20. Fuel Fabrication Capability WBS 01.02.01.05 - HIP Bonding Experiments Final Report

    SciTech Connect (OSTI)

    Dickerson, Patricia O'Donnell; Summa, Deborah Ann; Liu, Cheng; Tucker, Laura Arias; Chen, Ching-Fong; Aikin, Beverly; Aragon, Daniel Adrian; Beard, Timothy Vance; Montalvo, Joel Dwayne; Pena, Maria Isela; Dombrowski, David E.

    2015-06-10

    The goals of this project were to demonstrate reliable, reproducible solid state bonding of aluminum 6061 alloy plates together to encapsulate DU-10 wt% Mo surrogate fuel foils. This was done as part of the CONVERT Fuel Fabrication Capability effort in Process Baseline Development . Bonding was done using Hot Isotatic Pressing (HIP) of evacuated stainless steel cans (a.k.a HIP cans) containing fuel plate components and strongbacks. Gross macroscopic measurements of HIP cans prior to HIP and after HIP were used as part of this demonstration, and were used to determine the accuracy of a finitie element model of the HIP bonding process. The quality of the bonding was measured by controlled miniature bulge testing for Al-Al, Al-Zr, and Zr-DU bonds. A special objective was to determine if the HIP process consistently produces good quality bonding and to determine the best characterization techniques for technology transfer.

  1. Polyurethane spray coating of aluminum wire bonds to prevent corrosion and suppress resonant oscillations

    E-Print Network [OSTI]

    Joseph M. Izen; Matthew Kurth; Rusty Boyd

    2016-01-04

    Unencapsulated aluminum wedge wire bonds are common in particle physics pixel and strip detectors. Industry-favored bulk encapsulation is eschewed due to the range of operating temperatures and radiation. Wire bond failures are a persistent source of tracking-detector failure. Unencapsulated bonds are vulnerable to condensation-induced corrosion, particularly when halides are present. Oscillations from periodic Lorentz forces are documented as another source of wire bond failure. Spray application of polyurethane coatings, performance of polyurethane-coated wire bonds after climate chamber exposure, and resonant properties of polyurethane-coated wire bonds and their resistance to periodic Lorentz forces are under study for use in a future High Luminosity Large Hadron Collider detector such as the ATLAS Inner Tracker upgrade.

  2. Polyurethane spray coating of aluminum wire bonds to prevent corrosion and suppress resonant oscillations

    E-Print Network [OSTI]

    Izen, Joseph M; Boyd, Rusty

    2015-01-01

    Unencapsulated aluminum wedge wire bonds are common in particle physics pixel and strip detectors. Industry-favored bulk encapsulation is eschewed due to the range of operating temperatures and radiation. Wire bond failures are a persistent source of tracking-detector failure. Unencapsulated bonds are vulnerable to condensation-induced corrosion, particularly when halides are present. Oscillations from periodic Lorentz forces are documented as another source of wire bond failure. Spray application of polyurethane coatings, performance of polyurethane-coated wire bonds after climate chamber exposure, and resonant properties of polyurethane-coated wire bonds and their resistance to periodic Lorentz forces are under study for use in a future High Luminosity Large Hadron Collider detector such as the ATLAS Inner Tracker upgrade.

  3. Atomic Structures of Graphene, Benzene and Methane with Bond Lengths as Sums of the Single, Double and Resonance Bond Radii of Carbon

    E-Print Network [OSTI]

    Raji Heyrovska

    2008-04-25

    Two dimensional layers of graphene are currently drawing a great attention in fundamental and applied nanoscience. Graphene consists of interconnected hexagons of carbon atoms as in graphite. This article presents for the first time the structures of graphene at the atomic level and shows how it differs from that of benzene, due to the difference in the double bond and resonance bond based radii of carbon. The carbon atom of an aliphatic compound such as methane has a longer covalent single bond radius as in diamond. All the atomic structures presented here have been drawn to scale.

  4. Partial-Transient-Liquid-Phase Bonding of Advanced Ceramics Using Surface-Modified Interlayers

    E-Print Network [OSTI]

    Reynolds, Thomas Bither

    2012-01-01

    Brazing." Zeitschrift Für Metallkunde 85, 828–832 (1994).Bonding." Zeitschrift Für Metallkunde 85, 775– Shalz, M. ,Molybdän." Zeitschrift Für Metallkunde 46, 187–194 (1955).

  5. Making it Easier to Complete Clean Energy Projects with Qualified Energy Conservation Bonds (QECBs)

    Broader source: Energy.gov [DOE]

    This presentation, given through the DOE's Technical Assitance Program (TAP), provides information on How to to Complete Clean Energy Projects with Qualified Energy Conservation Bonds (QECBs)

  6. Thermal barrier and overlay coating systems comprising composite metal/metal oxide bond coating layers

    DOE Patents [OSTI]

    Goedjen, John G. (Oviedo, FL); Sabol, Stephen M. (Orlando, FL); Sloan, Kelly M. (Longwood, FL); Vance, Steven J. (Orlando, FL)

    2001-01-01

    The present invention generally describes multilayer coating systems comprising a composite metal/metal oxide bond coat layer. The coating systems may be used in gas turbines.

  7. First Steps toward Automated Design of Mechatronic Systems Using Bond Graphs and Genetic Programming

    E-Print Network [OSTI]

    Fernandez, Thomas

    First Steps toward Automated Design of Mechatronic Systems Using Bond Graphs and Genetic for mechatronic systems. The domain of mechatronic systems includes mixtures of, for example, electrical

  8. EIS-0306: Treatment and Management of Sodium-Bonded Spent Nuclear Fuel

    Broader source: Energy.gov [DOE]

    DOE prepared a EIS that evaluated the potential environmental impacts of treatment and management of DOE-owned sodium bonded spent nuclear fuel.

  9. Liquid Metal Bond for Improved Heat Transfer in LWR Fuel Rods

    SciTech Connect (OSTI)

    Donald Olander

    2005-08-24

    A liquid metal (LM) consisting of 1/3 weight fraction each of Pb, Sn, and Bi has been proposed as the bonding substance in the pellet-cladding gap in place of He. The LM bond eliminates the large AT over the pre-closure gap which is characteristic of helium-bonded fuel elements. Because the LM does not wet either UO2 or Zircaloy, simply loading fuel pellets into a cladding tube containing LM at atmospheric pressure leaves unfilled regions (voids) in the bond. The HEATING 7.3 heat transfer code indicates that these void spaces lead to local fuel hot spots.

  10. Microsoft Word - News Release -- EN Bond Sale goes well 8-19...

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    borrowing authority and saved approximately 500 million in interest under BPA's Debt Optimization Program. The bond proceeds will be used to pay off Energy Northwest debt that...

  11. Carbon Disclosure Project Webinar: Climate Change: A Challenge for Bond Analysts

    Broader source: Energy.gov [DOE]

    Hosted by the Carbon Disclosure Project, this webinar will cover climate change and how its impacts can present significant risks for municipalities and municipal bond investors.

  12. Metal-and hydrogen-bonding competition during water absorption on Pd(111) and Ru(0001)

    E-Print Network [OSTI]

    Tatarkhanov, Mouslim

    2010-01-01

    Metal- and hydrogen-bonding competition during waterthe molecules bind to the metal substrate through the O-loneplane perpendicular to the metal surface with reduced water-

  13. Bimetallic cleavage of aromatic C-H bonds by rare-earth-metal complexes

    E-Print Network [OSTI]

    Huang, W; Huang, W; Dulong, F; Khan, SI; Cantat, T; Diaconescu, PL

    2014-01-01

    of Aromatic C-H Bonds by Rare Earth Metal Complexes Wenliangone week prior to use. Rare earth metal oxides (scandium,

  14. Covalent features in the hydrogen bond of a water dimer: molecular orbital analysis

    E-Print Network [OSTI]

    Wang, Bo; Dai, Xing; Gao, Yang; Wang, Zhigang; Zhang, Rui-Qin

    2015-01-01

    The covalent-like characteristics of hydrogen bonds offer a new perspective on intermolecular interactions. Here, using density functional theory and post-Hartree-Fock methods, we reveal that there are two bonding molecular orbitals (MOs) crossing the O and H atoms of the hydrogen-bond in water dimer. Energy decomposition analysis also shows a non-negligible contribution of the induction term. These results illustrate the covalent-like character of the hydrogen bond between water molecules, which contributes to the essential understanding of ice, liquid water, related materials, and life sciences.

  15. Tuning the Metal-Adsorbate Chemical Bond through the Ligand Effect...

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Tuning the Metal-Adsorbate Chemical Bond through the Ligand Effect on Platinum Subsurface Alloys Tuesday, July 31, 2012 The ability to design and control the activities of...

  16. National Energy Education Summit

    Broader source: Energy.gov [DOE]

    The National Energy Education Summit is organized by the Council of Energy Research and Education Leaders (CEREL) and will serve as a first-of-its-kind national forum for energy educators, subject...

  17. National Geothermal Summit

    Office of Energy Efficiency and Renewable Energy (EERE)

    The Geothermal Energy Association (GEA) will be holding it’s fifth annual National Geothermal Summit on June 3-4 at the Grand Sierra Resort and Casino in Reno, NV. The National Geothermal Summit is...

  18. Sandia National Laboratories

    National Nuclear Security Administration (NNSA)

    feet underground.

    Bay Area national labs team to tackle long-standing automotive hydrogen storage challenge http:www.nnsa.energy.govblogbay-area-national-labs-team-tackle-...

  19. National Transportation Stakeholders Forum

    Office of Environmental Management (EM)

    next webinar is scheduled to occur in June 2013 TRIBAL NATIONS CAUCUS UPDATE WIKI AND NTSF WEB SITES ntsf.wikidot.com www.em.doe.govPagesNationalTransportationForum.aspx...

  20. National Environmental Research Parks

    SciTech Connect (OSTI)

    Not Available

    1994-07-01

    The National Environmental Research Parks are outdoor laboratories that provide opportunities for environmental studies on protected lands that act as buffers around Department of Energy (DOE) facilities. The research parks are used to evaluate the environmental consequences of energy use and development as well as the strategies to mitigate these effects. They are also used to demonstrate possible environmental and land-use options. The seven parks are: Fermilab National Environmental Research Park; Hanford National Environmental Research Park; Idaho National Environmental Research Park; Los Alamos National Environmental Research Park; Nevada National Environmental Research Park; Oak Ridge National Environmental Research Park; and Savannah River National Environmental Research Park. This document gives an overview of the events that led to the creation of the research parks. Its main purpose is to summarize key points about each park, including ecological research, geological characteristics, facilities, and available databases.

  1. nevada national security site

    National Nuclear Security Administration (NNSA)

    7%2A en Nevada National Security Site operator recognized for green fleet http:www.nnsa.energy.govblognevada-national-security-site-operator-recognized-green-fleet

    The...

  2. Los Alamos National Security, LLC Los Alamos National Laboratory...

    Office of Environmental Management (EM)

    Security, LLC Los Alamos National Laboratory (LANL) Voluntary Protection Program (VPP) Assessment Los Alamos National Security, LLC Los Alamos National Laboratory (LANL) Voluntary...

  3. National Geothermal Summit

    Broader source: Energy.gov [DOE]

    The Geothermal Energy Association hosts its annual National Geothermal Summit in Reno, Nevada, June 3-4, 2015.

  4. National Hydropower Map

    Broader source: Energy.gov [DOE]

    High-resolution map produced by Oak Ridge National Laboratory showing hydropower resources throughout the United States.

  5. Sensors and Actuators A 114 (2004) 521527 Fabrication of nanofluidic devices using glass-to-glass anodic bonding

    E-Print Network [OSTI]

    van Vliet, Lucas J.

    2004-01-01

    process, an intermediate layer (thin insulating film) is deposited on one of the two glass wafers. The channel is then defined, with one or two photo-patterning steps, in the intermediate layer. In our) was used as an intermediate layer. The depth of the channel is defined during the etching of this layer

  6. NATIONAL HYDROGEN ENERGY ROADMAP

    E-Print Network [OSTI]

    NATIONAL HYDROGEN ENERGY ROADMAP NATIONAL HYDROGEN ENERGY ROADMAP . . Toward a More Secure and Cleaner Energy Future for America Based on the results of the National Hydrogen Energy Roadmap Workshop to make it a reality. This Roadmap provides a framework that can make a hydrogen economy a reality

  7. National Center Standardsfor

    E-Print Network [OSTI]

    texts of standards Indexes to millions of industry, national, regional, and international standards U for Standards and Certification Information (NCSCI) National Institute of Standards and Technology (NIST) 100.975.4040 for an appointment, Monday-Friday, 8:30 a.m.­5:00 p.m. (except Federal holidays). National Institute of Standards

  8. Hybrid valence-bond states for universal quantum computation

    E-Print Network [OSTI]

    Tzu-Chieh Wei; Poya Haghnegahdar; Robert Raussendorf

    2015-01-29

    The spin-3/2 Affleck-Kennedy-Lieb-Tasaki (AKLT) valence-bond state on the hexagonal lattice was shown to be a universal resource state for measurement-based quantum computation (MBQC). Can AKLT states of higher spin magnitude support universal MBQC? We demonstrate that several hybrid 2D AKLT states involving mixture of spin-2 and other lower-spin entities, such as spin-3/2 and spin-1, are also universal for MBQC. This significantly expands universal resource states in the AKLT family. Even though frustration may be a hinderance to quantum computational universality, lattices can be modified to yield AKLT states that are universal. The family of AKLT states thus provides a versatile playground for quantum computation.

  9. Kinetics of bond formation in crosslinked gelatin gels

    E-Print Network [OSTI]

    T. Abete; E. Del Gado; D. Hellio Serughetti; L. de Arcangelis; M. Djabourov; A. Coniglio

    2006-11-07

    In chemical crosslinking of gelatin solutions, two different time scales affect the kinetics of the gel formation in the experiments. We complement the experimental study with Monte Carlo numerical simulations of a lattice model. This approach shows that the two characteristic time scales are related to the formation of single bonds crosslinker-chain and of bridges between chains. In particular their ratio turns out to control the kinetics of the gel formation. We discuss the effect of the concentration of chains. Finally our results suggest that, by varying the probability of forming bridges as an independent parameter, one can finely tune the kinetics of the gelation via the ratio of the two characteristic times.

  10. Method of making bonded or sintered permanent magnets

    DOE Patents [OSTI]

    McCallum, R.W.; Dennis, K.W.; Lograsso, B.K.; Anderson, I.E.

    1995-11-28

    An isotropic permanent magnet is made by mixing a thermally responsive, low viscosity binder and atomized rare earth-transition metal (e.g., iron) alloy powder having a carbon-bearing (e.g., graphite) layer thereon that facilitates wetting and bonding of the powder particles by the binder. Prior to mixing with the binder, the atomized alloy powder may be sized or classified to provide a particular particle size fraction having a grain size within a given relatively narrow range. A selected particle size fraction is mixed with the binder and the mixture is molded to a desired complex magnet shape. A molded isotropic permanent magnet is thereby formed. A sintered isotropic permanent magnet can be formed by removing the binder from the molded mixture and thereafter sintering to full density. 14 figs.

  11. Method of making bonded or sintered permanent magnets

    DOE Patents [OSTI]

    McCallum, R.W.; Dennis, K.W.; Lograsso, B.K.; Anderson, I.E.

    1993-08-31

    An isotropic permanent magnet is made by mixing a thermally responsive, low viscosity binder and atomized rare earth-transition metal (e.g., iron) alloy powder having a carbon-bearing (e.g., graphite) layer thereon that facilitates wetting and bonding of the powder particles by the binder. Prior to mixing with the binder, the atomized alloy powder may be sized or classified to provide a particular particle size fraction having a grain size within a given relatively narrow range. A selected particle size fraction is mixed with the binder and the mixture is molded to a desired complex magnet shape. A molded isotropic permanent magnet is thereby formed. A sintered isotropic permanent magnet can be formed by removing the binder from the molded mixture and thereafter sintering to full density.

  12. Double site-bond percolation model for biomaterial implants

    E-Print Network [OSTI]

    Mely, H

    2011-01-01

    We present a double site-bond percolation model to account, on the one hand, for the vascularization and/or resorption of biomaterial implant in bones and, on the other hand, for its mechanical continuity. The transformation of the implant into osseous material, and the dynamical formation/destruction of this osseous material is accounted for by creation and destruction of links and sites in two, entangled, networks. We identify the relevant parameters to describe the implant and its evolution, and separate their biological or chemical origin from their physical one. We classify the various phenomena in the two regimes, percolating or non-percolating, of the networks. We present first numerical results in two dimensions.

  13. Interstellar Isomers: The Importance of Bonding Energy Differences

    E-Print Network [OSTI]

    Anthony J. Remijan; J. M. Hollis; F. J. Lovas; D. F. Plusquellic; P. R. Jewell

    2005-06-21

    We present strong detections of methyl cyanide, vinyl cyanide, ethyl cyanide and cyanodiacetylene molecules with the Green Bank Telescope (GBT) toward the Sgr B2(N) molecular cloud. Attempts to detect the corresponding isocyanide isomers were only successful in the case of methyl isocyanide for its J(K)=1(0)-0(0) transition, which is the first interstellar report of this line. To determine the spatial distribution of methyl isocyanide, we used archival Berkeley-Illinois-Maryland Association (BIMA) array data for the J(K)=4(K)-3(K) (K=0-3) transitions but no emission was detected. From ab initio calculations, the bonding energy difference between the cyanide and isocyanide molecules is >8500 cm^-1 (>12,000 K). That we detect methyl isocyanide emission with a single antenna (Gaussian beamsize(Omega_B)=1723 arcsec^2) but not with an interferometer (Omega_B=192 arcsec^2), strongly suggests that methyl isocyanide has a widespread spatial distribution toward the Sgr B2(N) region. Thus, large-scale, non-thermal processes in the surrounding medium may account for the conversion of methyl cyanide to methyl isocyanide while the LMH hot core, which is dominated by thermal processes, does not produce a significant amount of methyl isocyanide. Ice analog experiments by other investigators have shown that radiation bombardment of methyl cyanide can produce methyl isocyanide, thus supporting our observations. We conclude that isomers separated by such large bonding energy differences are distributed in different interstellar environments, making the evaluation of column density ratios between such isomers irrelevant unless it can be independently shown that these species are co-spatial.

  14. Effect of Superalloy Substrate and Bond Coating on TBC Lifetime

    SciTech Connect (OSTI)

    Pint, Bruce A; Haynes, James A; Zhang, Ying

    2010-01-01

    Several different single-crystal superalloys were coated with different bond coatings to study the effect of composition on the cyclic oxidation lifetime of an yttria-stabilized zirconia (YSZ) top coating deposited by electron beam physical vapor deposition from a commercial source. Three different superalloys were coated with a 7 {micro}m Pt layer that was diffused into the surface prior to YSZ deposition. One of the superalloys, N5, was coated with a low activity, Pt-modified aluminide coating and Pt-diffusion coatings with 3 and 7 {micro}m of Pt. Three coatings of each type were furnace cycled to failure in 1 h cycles at 1150 C to assess average coating lifetime. The 7 {micro}m Pt diffusion coating on N5 had an average YSZ coating lifetime >50% higher than a Pt-modified aluminide coating on N5. Without a YSZ coating, the Pt-modified aluminide coating on N5 showed the typical surface deformation during cycling, however, the deformation was greatly reduced when constrained by the YSZ coating. The 3 {micro}m Pt diffusion coating had a similar average lifetime as the Pt-modified aluminide coating but a much wider scatter. The Pt diffusion bond coating on superalloy X4 containing Ti exhibited the shortest YSZ coating lifetime, this alloy-coating combination also showed the worst alumina scale adhesion without a YSZ coating. The third generation superalloy N6 exhibited the longest coating lifetime with a 7 {micro}m Pt diffusion coating.

  15. Oneida Nation | Department of Energy

    Office of Environmental Management (EM)

    Oneida Nation Oneida Nation Oneida Nation More Documents & Publications Confederated Tribes of the Umatilla Indian Reservation Shoshone-Bannock Tribes Pueblo de San Ildefonso...

  16. Program Areas | National Security | ORNL

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Organizations National Security Home | Science & Discovery | National Security | Program Areas SHARE Program Areas image Oak Ridge National Laboratory (ORNL) has a robust...

  17. Climate Change and National Security

    E-Print Network [OSTI]

    Alyson, Fleming; Summer, Kelly; Summer, Martin; Lauren, Franck; Jonathan, Mark

    2015-01-01

    for Environment and National Security Scripps Institution ofMultiplying Threats to National Security Higher temperaturesefforts to protect national security. Page 2 The U.S. Armed

  18. Review: Manufacturing National Park Nature

    E-Print Network [OSTI]

    Mason, Fred

    2012-01-01

    Review: Manufacturing National Park Nature: Photography,Canada Cronin, J. Keri. Manufacturing National Park Nature:J. Keri Cronin’s book Manufacturing National Park Nature

  19. Transition Metal Catalyzed Hydroarylation of Multiple Bonds: Exploration of Second Generation Ruthenium Catalysts and Extension to Copper Systems

    SciTech Connect (OSTI)

    T. Brent Gunnoe

    2011-02-17

    Catalysts provide foundational technology for the development of new materials and can enhance the efficiency of routes to known materials. New catalyst technologies offer the possibility of reducing energy and raw material consumption as well as enabling chemical processes with a lower environmental impact. The rising demand and expense of fossil resources has strained national and global economies and has increased the importance of accessing more efficient catalytic processes for the conversion of hydrocarbons to useful products. The goals of the research are to develop and understand single-site homogeneous catalysts for the conversion of readily available hydrocarbons into useful materials. A detailed understanding of these catalytic reactions could lead to the development of catalysts with improved activity, longevity and selectivity. Such transformations could reduce the environmental impact of hydrocarbon functionalization, conserve energy and valuable fossil resources and provide new technologies for the production of liquid fuels. This project is a collaborative effort that incorporates both experimental and computational studies to understand the details of transition metal catalyzed C-H activation and C-C bond forming reactions with olefins. Accomplishments of the current funding period include: (1) We have completed and published studies of C-H activation and catalytic olefin hydroarylation by TpRu{l_brace}P(pyr){sub 3}{r_brace}(NCMe)R (pyr = N-pyrrolyl) complexes. While these systems efficiently initiate stoichiometric benzene C-H activation, catalytic olefin hydroarylation is hindered by inhibition of olefin coordination, which is a result of the steric bulk of the P(pyr){sub 3} ligand. (2) We have extended our studies of catalytic olefin hydroarylation by TpRu(L)(NCMe)Ph systems to L = P(OCH{sub 2}){sub 3}CEt. Thus, we have now completed detailed mechanistic studies of four systems with L = CO, PMe{sub 3}, P(pyr){sub 3} and P(OCH{sub 2}){sub 3}CEt, which has provided a comprehensive understanding of the impact of steric and electronic parameters of 'L' on the catalytic hydroarylation of olefins. (3) We have completed and published a detailed mechanistic study of stoichiometric aromatic C-H activation by TpRu(L)(NCMe)Ph (L = CO or PMe{sub 3}). These efforts have probed the impact of functionality para to the site of C-H activation for benzene substrates and have allowed us to develop a detailed model of the transition state for the C-H activation process. These results have led us to conclude that the C-H bond cleavage occurs by a {sigma}-bond metathesis process in which the C-H transfer is best viewed as an intramolecular proton transfer. (4) We have completed studies of Ru complexes possessing the N-heterocyclic carbene IMes (IMes = 1,3-bis-(2,4,6-trimethylphenyl)imidazol-2-ylidene). One of these systems is a unique four-coordinate Ru(II) complex that catalyzes the oxidative hydrophenylation of ethylene (in low yields) to produce styrene and ethane (utilizing ethylene as the hydrogen acceptor) as well as the hydrogenation of olefins, aldehydes and ketones. These results provide a map for the preparation of catalysts that are selective for oxidative olefin hydroarylation. (5) The ability of TpRu(PMe{sub 3})(NCMe)R systems to activate sp{sup 3} C-H bonds has been demonstrated including extension to subsequent C-C bond forming steps. These results open the door to the development of catalysts for the functionalization of more inert C-H bonds. (6) We have discovered that Pt(II) complexes supported by simple nitrogen-based ligands serve as catalysts for the hydroarylation of olefins. Given the extensive studies of Pt-based catalytic C-H activation, we believe these results will provide an entry point into an array of possible catalysts for hydrocarbon functionalization.

  20. Design | Argonne National Laboratory

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantityBonneville Power Administration would like submit theCovalent BondingMeeting |Design Competitions Design

  1. Materials Science and Engineering A 458 (2007) 101107 Fluxless silicon-to-alumina bonding using electroplated

    E-Print Network [OSTI]

    Chen, Zhongping

    2007-01-01

    electroplated Au­Sn­Au structure at eutectic composition Jong S. Kima, Won S. Choia,1, Dongwook Kima,2, Andrei successfully bonded to alumina substrates with electroplated Au/Sn/Au structure at the eutectic composition. Keywords: Fluxless bonding; Fluxless soldering; Soldering; Eutectic Au­Sn alloys; Electroplating 1

  2. Alkane Contamination Effects on PFPE Lubricant Bonding to a-CHx Overcoats

    E-Print Network [OSTI]

    Gellman, Andrew J.

    Alkane Contamination Effects on PFPE Lubricant Bonding to a-CHx Overcoats Ryan Z. Lei and Andrew J contamination on the bonding of perfluoropolyalkyl ether (PFPE) lubricants to amorphous hydrogenated carbon (a, respectively, of the common disk lubricant Fomblin Zdol. Temperature-programmed desorption experiments were

  3. Effect of freezethaw cycles on the bond durability between fibre reinforced polymer plate

    E-Print Network [OSTI]

    Labossičre, Pierre

    Effect of freeze­thaw cycles on the bond durability between fibre reinforced polymer plate polymer (FRP) plates and sheets, are being developed. To apply these rehabilitation methods in Canada using both single lap pull-off and bond beam specimens. Only uniaxial carbon FRP strips were considered

  4. Ultrafast conversions between hydrogen bonded structures in liquid water observed by femtosecond x-ray spectroscopy

    E-Print Network [OSTI]

    Ultrafast conversions between hydrogen bonded structures in liquid water observed by femtosecond x the first femtosecond soft x-ray spectroscopy in liquids, enabling the observation of changes in hydrogen, characteristic x-ray absorption changes monitor the conversion of strongly hydrogen-bonded water structures

  5. Bonded carbon or ceramic fiber composite filter vent for radioactive waste

    DOE Patents [OSTI]

    Brassell, Gilbert W. (13237 W. 8th Ave., Golden, CO 80401); Brugger, Ronald P. (Lafayette, CO)

    1985-02-19

    Carbon bonded carbon fiber composites as well as ceramic or carbon bonded ceramic fiber composites are very useful as filters which can separate particulate matter from gas streams entraining the same. These filters have particular application to the filtering of radioactive particles, e.g., they can act as vents for containers of radioactive waste material.

  6. Accepted Manuscript Superconductivity in Entirely End-bonded Multi-Walled Carbon Nanotubes

    E-Print Network [OSTI]

    Maruyama, Shigeo

    Accepted Manuscript Superconductivity in Entirely End-bonded Multi-Walled Carbon Nanotubes I, Superconductivity in Entirely End-bonded Multi-Walled Carbon Nanotubes, Physica C (2007), doi: 10.1016/ j.physc.2007 disclaimers that apply to the journal pertain. #12;ACCEPTED MANUSCRIPT Physica C 1 Superconductivity

  7. Bond Computing Systems: a Biologically Inspired and High-level Dynamics Model for Pervasive Computing

    E-Print Network [OSTI]

    Dang, Zhe

    Bond Computing Systems: a Biologically Inspired and High-level Dynamics Model for Pervasive. Targeting at modeling the high-level dynamics of pervasive comput- ing systems, we introduce Bond Computing are regular, and study their computation power and verification problems. Among other results, we show

  8. Combining Bond-Graphs with Genetic Programming for Unified/Automated Design of Mechatronic or

    E-Print Network [OSTI]

    Fernandez, Thomas

    Combining Bond-Graphs with Genetic Programming for Unified/Automated Design of Mechatronic or Multi of a mechatronic system makes it difficult to model using a single modeling technique over the whole system and polymorphic modeling and simulation technique. Bond-Graph model of the mechatronic system can be directly

  9. Solvent Control of the Soft Angular Potential in Hydroxyl-Hydrogen Bonds: Inertial Orientational Dynamics

    E-Print Network [OSTI]

    Fayer, Michael D.

    Solvent Control of the Soft Angular Potential in Hydroxyl- Hydrogen Bonds: Inertial Orientational with the hydrogen bond. The complexes studied are composed of phenol-OD (hydroxyl hydrogen replaced by deuterium orientational motions of phenol-OD (phenyl hydroxyl hydrogen replaced by deuterium) in phenol/-base complexes

  10. Hydrogen incorporation in stishovite at high pressure and symmetric hydrogen bonding in N-AlOOH

    E-Print Network [OSTI]

    Stixrude, Lars

    Hydrogen incorporation in stishovite at high pressure and symmetric hydrogen bonding in N significant amounts of hydrogen in stishovite under lower-mantle conditions. The enthalpy of solution pressure and temperature. We predict asymmetric hydrogen bonding in the stishovite^N-AlOOH solid solution

  11. The Brownian Bridge Asymptotics in the Subcritical Phase of Bernoulli Bond Percolation Model.

    E-Print Network [OSTI]

    Kovchegov, Yevgeniy

    The Brownian Bridge Asymptotics in the Subcritical Phase of Bernoulli Bond Percolation Model)-dimensional Brownian bridge. 1 1 Introduction. In this paper we describe the limiting structure of a bond presented in [9] and [11]. We will also recall the definition of Brownian bridge. The result

  12. STANDARD OPERATING PROCEDURE FOR TUBE "A2-WetOxBond" furnace in TRL.

    E-Print Network [OSTI]

    Reif, Rafael

    STANDARD OPERATING PROCEDURE FOR TUBE "A2-WetOxBond" furnace in TRL. INTRODUCTION Tube "A2-Wet. Three Eurotherm temperature controllers provide a 20 inch long, flat profile in the Center Zone resistant gloves to handle those parts PROCEDURE. 1) "ENGAGE" the machine in CORAL for TRL tube "A2-WetOxBond"machine

  13. ForPeerReview Bond graph model of a switched reluctance machine

    E-Print Network [OSTI]

    Batlle, Carles

    Keywords: Electric machines, Reluctance machines, Modeling Are any of authors IEEE Member?: No Are any the electromechanical energy transformation in electrical machines, is used for a SRM. The bond graph modelForPeerReview Bond graph model of a switched reluctance machine Journal: Transactions on Industrial

  14. Mechanical switching and coupling between two dissociation pathways in a P-selectin adhesion bond

    E-Print Network [OSTI]

    Heinrich, Volkmar

    Mechanical switching and coupling between two dissociation pathways in a P-selectin adhesion bond energy barrier. Using a sensitive force probe to test the leukocyte adhesion bond P-selectin glycoprotein interactions among large multidomain proteins underlie most adhesive functions in biology. Well known

  15. Adhesively bonded lap joints with extreme interface geometry Babak Haghpanah, Shihung Chiu, Ashkan Vaziri n

    E-Print Network [OSTI]

    Vaziri, Ashkan

    Adhesively bonded lap joints with extreme interface geometry Babak Haghpanah, Shihung Chiu, Ashkan 2013 Keywords: Adhesively bonded joint Interface profile Failure Finite element a b s t r a c t The role of adhesive­adherend interface morphology (through intentional deviation from a flat joint plane

  16. Technical note Degradation of the bond between old and new mortar under cyclic shear

    E-Print Network [OSTI]

    Chung, Deborah D.L.

    shrinkage of the new concrete, the quality of the bond is limited. Destructive measurement of the shear bond was used for mixing, which was conducted for 5 min. After that, the mix was poured into oiled molds. A vibrator was used to facilitate compaction and decrease the amount of air bubbles. A cylindrical piece

  17. System-Level Synthesis of MEMS via Genetic Programming and Bond Graphs

    E-Print Network [OSTI]

    Hu, Jianjun

    System-Level Synthesis of MEMS via Genetic Programming and Bond Graphs Zhun Fan+ , Kisung Seo for automatic synthesis of MEMS system-level lumped parameter models using genetic programming and bond graphs. This paper first dis- cusses the necessity of narrowing the problem of MEMS synthesis into a certain specific

  18. Modeling the metal-semiconductor interaction: Analytical bond-order potential for platinum-carbon

    E-Print Network [OSTI]

    Nordlund, Kai

    Modeling the metal-semiconductor interaction: Analytical bond-order potential for platinum for this potential makes use of the fact that chemical bonding in both covalent systems and d-transition metals can for describing the C-C/Pt-Pt/Pt-C interactions. It resembles, in the case of the pure metal interaction

  19. Bonding of thermoplastic polymer microfluidics Chia-Wen Tsao Don L. DeVoe

    E-Print Network [OSTI]

    Rubloff, Gary W.

    REVIEW Bonding of thermoplastic polymer microfluidics Chia-Wen Tsao Ć Don L. DeVoe Received: 20 Abstract Thermoplastics are highly attractive substrate materials for microfluidic systems, with important microchannels and other microfluidic elements, and thus bonding remains a critical step in any thermo- plastic

  20. Estimation of Bond Dissociation Energies and Radical Stabilization Energies by ESR Spectroscopy

    E-Print Network [OSTI]

    Brocks, Jochen J.

    stabilization enthalpies (RSE) and with BDE(C-H), the C-H bond dissociation energies for the corresponding stabilization energies and bond dissociation enthalpies (BDE) are useful for the prediction or inter- pretation be measured directly but must be deduced indirectly from the results of thermochemical, kinetic

  1. MOLECULAR PHYSICS, 1999, VOL. 97, NO. 7, 897 905 Dynamics and hydrogen bonding in liquid ethanol

    E-Print Network [OSTI]

    Saiz, Leonor

    MOLECULAR PHYSICS, 1999, VOL. 97, NO. 7, 897± 905 Dynamics and hydrogen bonding in liquid ethanol L of liquid ethanol at three temperatures have been carried out. The hydrogen bonding states of ethanol measurements of the frequency-dependent dielectric permittivity of liquid ethanol. 1. Introduction A detailed

  2. Coherent low-frequency motions of hydrogen bonded acetic acid dimers in the liquid phase

    E-Print Network [OSTI]

    Mukamel, Shaul

    of 1­2 ps. Calculations of the vibrational potential energy surface based on density functional theoryCoherent low-frequency motions of hydrogen bonded acetic acid dimers in the liquid phase Karsten; accepted 22 April 2004 Ultrafast vibrational dynamics of cyclic hydrogen bonded dimers and the underlying

  3. The Development of Werner-type Cobalt Complexes in Enantioselective Hydrogen Bond Mediated Catalysis 

    E-Print Network [OSTI]

    Lewis, Kyle

    2013-12-03

    nitrogen-hydrogen bonds of the diamine ligands could activate Lewis basic substrates towards nucleophilic addition via hydrogen bonding. Towards this end, the diastereomeric trications ?-[Co((S,S)-dpen)_(3)]^(3+) and ?-[Co((S,S)-dpen)_(3)]^(3+) (dpen...

  4. FRONTIERS ARTICLE Imaging bond breaking and vibrational energy transfer in small water

    E-Print Network [OSTI]

    Reisler, Hanna

    FRONTIERS ARTICLE Imaging bond breaking and vibrational energy transfer in small water containing it is possible to generate accurate potential energy surfaces (PESs) for small clusters, such as those of water (REMPI) are used to determine accurate bond dissociation energies (D0) of (H2O)2, (H2O)3, HCl­H2O and NH3

  5. Introduction to Mortgage-Backed Securities c 2008 Prof. Yuh-Dauh Lyuu, National Taiwan University Page 969

    E-Print Network [OSTI]

    Lyuu, Yuh-Dauh

    Introduction to Mortgage-Backed Securities c 2008 Prof. Yuh-Dauh Lyuu, National Taiwan University Taiwan University Page 971 #12;Mortgage-Backed Securities · A mortgage-backed security (MBS) is a bond backed by an undivided interest in a pool of mortgages. · MBSs traditionally enjoy high returns, wide

  6. Structural Aspects of Hydrogen Bonding with Nitrate and Sulfate: Design Criteria for Polyalcohol Hosts

    SciTech Connect (OSTI)

    Hay, Benjamin P.; Dixon, David A.; Lumetta, Gregg J.; Vargas, Rubicelia; Garza, Jorge

    2004-01-01

    Organic hosts for oxyanion complexation can be constructed by combining two or more hydrogen bonding sites. The deliberate design of architectures for such hosts requires knowledge of the optimal geometry for the hydrogen bonds formed between the host and the guest. Important structural parameters include the O--H distance, the O--H-D angle, the X-O--H angle, and the X-O--H-D dihedral angle (H-D=hydrogen bond donor, X=any atom). This information can be obtained through the analysis of hydrogen bonding observed in crystal structures and electronic structure calculations on simple gas-phase complexes. In this chapter, we present an analysis of hydrogen bonding structural parameters for alcohol hydrogen donors and the oxygen atom acceptors in nitrate and sulfate.

  7. Optical characterization of gaps in directly bonded Si compound optics using infrared spectroscopy

    E-Print Network [OSTI]

    Gully-Santiago, Michael; White, Victor

    2015-01-01

    Silicon direct bonding offers flexibility in the design and development of Si optics by allowing manufacturers to combine subcomponents with a potentially lossless and mechanically stable interface. The bonding process presents challenges in meeting the requirements for optical performance because air gaps at the Si interface cause large Fresnel reflections. Even small (35 nm) gaps reduce transmission through a direct bonded Si compound optic by 4% at $\\lambda = 1.25 \\; \\mu$m at normal incidence. We describe a bond inspection method that makes use of precision slit spectroscopy to detect and measure gaps as small as 14 nm. Our method compares low finesse Fabry-P\\'{e}rot models to high precision measurements of transmission as a function of wavelength. We demonstrate the validity of the approach by measuring bond gaps of known depths produced by microlithography.

  8. States and Terrorist Groups that Collaborate: Strong Bonds, Sensitive Transfers and the Issue of Control

    E-Print Network [OSTI]

    Klein, Robyn W.

    2011-01-01

    Threats to U.S. National Security,” Testimony before theenormous practical value for national security analysts anda significant concern for national security practitioners,

  9. Sandia Energy - National SCADA Testbed

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    National SCADA Testbed Home Stationary Power Safety, Security & Resilience of Energy Infrastructure Grid Modernization Cyber Security for Electric Infrastructure National...

  10. Please cite this article in press as: W. Wu, et al., Wafer-scale synthesis of graphene by chemical vapor deposition and its application in hydrogen sensing, Sens. Actuators B: Chem. (2010), doi:10.1016/j.snb.2010.06.070

    E-Print Network [OSTI]

    Bao, Jiming

    2010-01-01

    with a 1 nm palladium film deposited for hydrogen detection. Hydrogen in air with concentrations in 0 vapor deposition and its application in hydrogen sensing, Sens. Actuators B: Chem. (2010), doi:10.1016/j.elsevier.com/locate/snb Wafer-scale synthesis of graphene by chemical vapor deposition and its application in hydrogen sensing

  11. Manganese Porphyrins Catalyze Selective C-H Bond Halogenations

    SciTech Connect (OSTI)

    Liu, Wei; Groves, John T

    2010-01-01

    We report a manganese porphyrin mediated aliphatic C?H bond chlorination using sodium hypochlorite as the chlorine source. In the presence of catalytic amounts of phase transfer catalyst and manganese porphyrin Mn(TPP)Cl 1, reaction of sodium hypochlorite with different unactivated alkanes afforded alkyl chlorides as the major products with only trace amounts of oxygenation products. Substrates with strong C?H bonds, such as neopentane (BDE =?100 kcal/mol) can be also chlorinated with moderate yield. Chlorination of a diagnostic substrate, norcarane, afforded rearranged products indicating a long-lived carbon radical intermediate. Moreover, regioselective chlorination was achieved by using a hindered catalyst, Mn(TMP)Cl, 2. Chlorination of trans-decalin with 2 provided 95% selectivity for methylene-chlorinated products as well as a preference for the C2 position. This novel chlorination system was also applied to complex substrates. With 5?-cholestane as the substrate, we observed chlorination only at the C2 and C3 positions in a net 55% yield, corresponding to the least sterically hindered methylene positions in the A-ring. Similarly, chlorination of sclareolide afforded the equatorial C2 chloride in a 42% isolated yield. Regarding the mechanism, reaction of sodium hypochlorite with the Mn{sup III} porphyrin is expected to afford a reactive Mn{sup V}?O complex that abstracts a hydrogen atom from the substrate, resulting in a free alkyl radical and a Mn{sup IV}—OH complex. We suggest that this carbon radical then reacts with a Mn{sup IV}—OCl species, providing the alkyl chloride and regenerating the reactive Mn{sup V}?O complex. The regioselectivity and the preference for CH{sub 2} groups can be attributed to nonbonded interactions between the alkyl groups on the substrates and the aryl groups of the manganese porphyrin. The results are indicative of a bent [Mn{sup v}?O---H---C] geometry due to the C—H approach to the Mn{sup v}?O (d??p?)* frontier orbital.

  12. Semi-emprical Molecular Orbital Calculation on XeF2 The bonding in XeF2 can be interpreted in terms the three-center four-electron bond. In linear XeF2 the molecular

    E-Print Network [OSTI]

    Rioux, Frank

    the three-center four-electron bond. In linear XeF2 the molecular orbital can be considered to be a linear electrons each in the bonding and non-bonding orbitals for a total energy of -72.14 eV. The energy. The fluorine atoms have a kernel charge of +7. They get credit for 6 non-bonding atomic electrons, 42

  13. National Ignition Facility | National Nuclear Security Administration

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantity ofkandz-cm11 Outreach Home Room NewsInformationJessework usesofPublications TheScience (SC) National2015 | National Nuclear

  14. Los Alamos National Laboratory ...

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    guy" and "a very hard worker." Fanelli began his college education in his native Argentina. By 2005, he was stationed at the National High Magnetic Field Laboratory...

  15. National Laboratory Geothermal Publications

    Broader source: Energy.gov [DOE]

    You can find publications, including technical papers and reports, about geothermal technologies, research, and development at the following U.S. Department of Energy national laboratories.

  16. National Women's History Month

    Office of Energy Efficiency and Renewable Energy (EERE)

    NATIONAL WOMEN’S HISTORY MONTH is an annual declared month that highlights the contributions of women to events in history and contemporary society.

  17. National Transportation Stakeholders Forum

    Office of Environmental Management (EM)

    Nuclear Fuel Grand BC and High-Level Radioactive Waste - Jeff Williams, Director, Nuclear Fuel Storage and Transportation Planning Project, DOEOffice of Nuclear Energy National...

  18. Seneca Nation- 2014 Project

    Broader source: Energy.gov [DOE]

    The Seneca Nation of Indians (SNI) will install one 1.8-megawatt (MW) wind turbine on tribal common lands near Lake Erie in New York.

  19. National Day of Remembrance

    SciTech Connect (OSTI)

    None

    2010-01-01

    Ames Laboratory observed the National Day of Remembrance for weapons workers from the Cold War era with a ceremony held Oct. 27, 2009 at the Ames Public Library.

  20. Los Alamos National Laboratory

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Lawrence Livermore National Laboratory's weapon-physicist Greg Spriggs, leader of the Film Scanning and Reanalysis Project, the work has become a search-and-rescue mission. He...

  1. National VPPPA Conference

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    VPPPA Conference August 19, 2012 Subcontractor Selection & Alignment Mark Manderbach, Steve Maki, J. Manuel Aguirre National VPPPA Conference August 19, 2012 Mark Manderbach, Steve...

  2. Los Alamos National Laboratory

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    3, 2015 Projects save taxpayer dollars, promote environmental stewardship, sustainability LOS ALAMOS, N.M., April 22, 2015-Nearly 400 Los Alamos National Laboratory employees on 32...

  3. National RES Las Vegas

    Office of Energy Efficiency and Renewable Energy (EERE)

    RES Las Vegas is another multifaceted event from The National Center which will feature unparalleled access to respected tribal leaders, members of congress, federal agency representatives, state...

  4. 2015 APPA National Conference

    Broader source: Energy.gov [DOE]

    The American Public Power Association (APPA) is hosting their national conference that covers the political, economic, and technological trends shaping the electric utility industry.

  5. National Nuclear Security Administration

    National Nuclear Security Administration (NNSA)

    the Earth's Surface. The second virtual classroom to the student was presented by Tommy Smith from Lawrence Livermore National Laboratory on various sources of energy, its use and...

  6. National Day of Remembrance

    ScienceCinema (OSTI)

    None

    2013-03-01

    Ames Laboratory observed the National Day of Remembrance for weapons workers from the Cold War era with a ceremony held Oct. 27, 2009 at the Ames Public Library.

  7. National Nuclear Security Administration

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Washington, DC 20585 MEMORANDUM FOR THE ADMINISTRATOR FROM: THEODORE D. SHERRY II 4 flA. * -. SUBJECT: REFERENCE: NATIONAL SECURITY ENTI's'E FIELD COUNCIL CHAIR ACTION:...

  8. National Transportation Stakeholders Forum

    Office of Environmental Management (EM)

    and page number - 2 - Mission is to remove excess, unwanted, abandoned, or orphan radioactive sealed sources that pose a potential risk to health, safety, and national security...

  9. National Transportation Stakeholders Forum

    Office of Environmental Management (EM)

    rate. Reserve a room at Embassy Suites Albuquerque About the NTSF The NTSF is the mechanism through which the DOE communicates with states and tribal nations about DOE's...

  10. Alamos National Security, LLC

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    30 nonprofit organizations to receive monetary donations from Los Alamos National Security, LLC June 25, 2012 Recognizing employee and retiree volunteer efforts LOS ALAMOS, NEW...

  11. National Laboratory Photovoltaics Research

    Broader source: Energy.gov [DOE]

    DOE supports photovoltaic (PV) research and development and facilities at its national laboratories to accelerate progress toward achieving the SunShot Initiative's technological and economic...

  12. 2012 National Electricity Forum

    Energy Savers [EERE]

    U.S. Department of Energy 2012 National Electric Transmission Congestion Study Eastern Regional Workshops December 6, 2011 - Philadelphia, Pennsylvania Hilton Philadelphia Airport...

  13. Submitting Organization Sandia National ...

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    POC Technologies Center, funded by a National Institutes of Biomedical Imaging and Bioengineering (NIBIB) U54 award, focuses on advancing critical-emergency-disaster care by...

  14. Method of waste stabilization with dewatered chemically bonded phosphate ceramics

    DOE Patents [OSTI]

    Wagh, Arun; Maloney, Martin D.

    2010-06-29

    A method of stabilizing a waste in a chemically bonded phosphate ceramic (CBPC). The method consists of preparing a slurry including the waste, water, an oxide binder, and a phosphate binder. The slurry is then allowed to cure to a solid, hydrated CBPC matrix. Next, bound water within the solid, hydrated CBPC matrix is removed. Typically, the bound water is removed by applying heat to the cured CBPC matrix. Preferably, the quantity of heat applied to the cured CBPC matrix is sufficient to drive off water bound within the hydrated CBPC matrix, but not to volatalize other non-water components of the matrix, such as metals and radioactive components. Typically, a temperature range of between 100.degree. C.-200.degree. C. will be sufficient. In another embodiment of the invention wherein the waste and water have been mixed prior to the preparation of the slurry, a select amount of water may be evaporated from the waste and water mixture prior to preparation of the slurry. Another aspect of the invention is a direct anyhydrous CBPC fabrication method wherein water is removed from the slurry by heating and mixing the slurry while allowing the slurry to cure. Additional aspects of the invention are ceramic matrix waste forms prepared by the methods disclosed above.

  15. Method for bonding thin film thermocouples to ceramics

    DOE Patents [OSTI]

    Kreider, Kenneth G. (Potomac, MD)

    1993-01-01

    A method is provided for adhering a thin film metal thermocouple to a ceramic substrate used in an environment up to 700 degrees Centigrade, such as at a cylinder of an internal combustion engine. The method includes the steps of: depositing a thin layer of a reactive metal on a clean ceramic substrate; and depositing thin layers of platinum and a platinum-10% rhodium alloy forming the respective legs of the thermocouple on the reactive metal layer. The reactive metal layer serves as a bond coat between the thin noble metal thermocouple layers and the ceramic substrate. The thin layers of noble metal are in the range of 1-4 micrometers thick. Preferably, the ceramic substrate is selected from the group consisting of alumina and partially stabilized zirconia. Preferably, the thin layer of reactive metal is in the range of 0.015-0.030 micrometers (15-30 nanometers) thick. The preferred reactive metal is chromium. Other reactive metals may be titanium or zirconium. The thin layer of reactive metal may be deposited by sputtering in ultra high purity argon in a vacuum of approximately 2 milliTorr (0.3 Pascals).

  16. Specificity, flexibility and valence of DNA bonds guide emulsion architecture

    E-Print Network [OSTI]

    Lang Feng; Lea-Laetitia Pontani; Remi Dreyfus; Paul Chaikin; Jasna Brujic

    2013-03-25

    The specificity and thermal reversibility of DNA interactions have enabled the self-assembly of crystal structures, self-replicating materials and colloidal molecules. Grafting DNA onto liquid interfaces of emulsions leads to exciting new architectural possibilities due to the mobility of the DNA ligands and the patches they form between bound droplets. Here we show that the size and number of these adhesion patches (valency) can be controlled. Valence 2 leads to flexible polymers of emulsion droplets, while valence above 4 leads to rigid droplet networks. A simple thermodynamic model quantitatively describes the increase in the patch size with droplet radii, DNA concentration and the stiffness of the tether to the sticky-end. The patches are formed between droplets with complementary DNA strands or alternatively with complementary colloidal nanoparticles to mediate DNA binding between droplets. This emulsion system opens the route to directed self-assembly of more complex structures through distinct DNA bonds with varying strengths and controlled valence and flexibility.

  17. A Single Phosphine Ligand Allows Palladium-Catalyzed Intermolecular C-O Bond Formation with Secondary and Primary Alcohols

    E-Print Network [OSTI]

    Wu, Xiaoxing

    Forging a bond: An efficient, general palladium catalyst for C-O bond-forming reactions of secondary and primary alcohols with a range of aryl halides has been developed using the ligand 1. Heteroaryl halides, and for the ...

  18. ADSORPTION AND BONDING OF BUTANE AND PENTANE ON THE Pt(111) CRYSTAL SURFACES. EFFECTS OF OXYGEN TREATMENTS AND DEUTERIUM PREADSORPTION

    E-Print Network [OSTI]

    Salmeron, M.

    2012-01-01

    ADSORPTION AND BONDING OF BUTANE AND PENTANE ON THE .Pt(111)ADSORPTION AND BONDING OF BUTANE AND PENTANE ON THE Pt(lll)adsorption characteristics of butane and pentane on the (

  19. An On-Target Performic Acid Oxidation Method Suitable for Disulfide Bond Elucidation Using Capillary Electrophoresis - Mass Spectrometry 

    E-Print Network [OSTI]

    Williams, Brad J.

    2011-08-08

    advancements, the detection and proper assignment of disulfide bonds have remained experimentally difficult. Therefore, we have developed an alternative method for disulfide bond elucidation using capillary electrophoresis-mass spectrometry (CE-MS) combined...

  20. Transient-Liquid-Phase (TLP) Bonding of Al2O3 Using Nb-based Multilayer Interlayers

    E-Print Network [OSTI]

    Hong, Sung Moo

    2009-01-01

    Brazing. Zeitschrift Fur Metallkunde, vol. 85, no. 12 (1994)Bonding. Zeitschrift Für Metallkunde, vol. 85, no. 11 (1994)

  1. C-H..O Hydrogen Bonds in Minor Groove of A-tracts in DNA Double Helices

    E-Print Network [OSTI]

    Bansal, Manju

    C-H..O Hydrogen Bonds in Minor Groove of A-tracts in DNA Double Helices Anirban Ghosh and Manju-pair as well as cross-strand C-H..O hydrogen bonds in the minor groove. The C2-H2..O2 hydrogen bonds within leads to a narrow minor groove in these regions. # 1999 Academic Press Keywords: C-H..O hydrogen bonds

  2. On the accuracy of density-functional theory exchange-correlation functionals for H bonds in small water clusters. II. The water hexamer

    E-Print Network [OSTI]

    Alavi, Ali

    On the accuracy of density-functional theory exchange-correlation functionals for H bonds in small for hydro- gen H bonds? What is the best exchange-correlation xc functional for treating H bonds? Questions

  3. A Naked Diatomic Molecule of Bismuth, [Bi2]2-, with a Short Bi-Bi Bond: Synthesis and Structure

    E-Print Network [OSTI]

    A Naked Diatomic Molecule of Bismuth, [Bi2]2-, with a Short Bi-Bi Bond: Synthesis and Structure Li UniVersity of Notre Dame, Notre Dame, Indiana 46556 ReceiVed July 12, 1999 We have made a naked of substituted diatomic species with single bonds.1,6,7 Singly bonded naked molecules are also known but all

  4. Volume 136, number 6 CHEMICAL PHYSICS LETTERS 22 May 1987 MECHANISM FOR BOND-SELECTIVE PROCESSES IN LASER DESORPTION

    E-Print Network [OSTI]

    for short pulse excitation. Deviations from such statistical behavior require the existence of "bottlenecks pumped. A bottleneck may occur however in the energy flow from the sur- face-adsorbate van der Waals bond to be pumped via excitation of the physisorption bond. The energy flow out of this bond and into the mol- 0 009

  5. Hydrogen Bond Switching among Flavin and Amino Acids Determines the Nature of Proton-Coupled Electron Transfer in BLUF

    E-Print Network [OSTI]

    van Stokkum, Ivo

    Hydrogen Bond Switching among Flavin and Amino Acids Determines the Nature of Proton results from a hydrogen bond switch between the flavin and its surrounding amino acids that preconfigures a rearrangement of the hydrogen bond network around the flavin takes place leading to a 10-15 nm red shift

  6. Hydrogen Bond Switching among Flavin and Amino Acid Side Chains in the BLUF Photoreceptor Observed by Ultrafast Infrared Spectroscopy

    E-Print Network [OSTI]

    van Stokkum, Ivo

    Hydrogen Bond Switching among Flavin and Amino Acid Side Chains in the BLUF Photoreceptor Observed hydrogen-bond network with nearby amino acid side chains, including a highly conserved tyrosine and glutamine. The participation of particular amino acid side chains in the ultrafast hydrogen-bond switching

  7. Subangstrom Crystallography Reveals that Short Ionic Hydrogen Bonds, and Not a His-Asp Low-Barrier Hydrogen

    E-Print Network [OSTI]

    Agard, David

    Subangstrom Crystallography Reveals that Short Ionic Hydrogen Bonds, and Not a His-Asp Low-Barrier Hydrogen Bond, Stabilize the Transition State in Serine Protease Catalysis Cynthia N. Fuhrmann, Matthew D that destabilizes the His57-Ser195 hydrogen bond, preventing the back-reaction. In both structures the His57-Asp102

  8. Hydrogen Bonds Involved in Binding the Qi-site Semiquinone in the bc1 Complex, Identified through Deuterium Exchange

    E-Print Network [OSTI]

    Crofts, Antony R.

    Hydrogen Bonds Involved in Binding the Qi-site Semiquinone in the bc1 Complex, Identified through them. The strength of interactions indicates that the protons are involved in hydrogen bonds with SQ. The hyperfine cou- plings differ from values typical for in-plane hydrogen bonds previously observed in model

  9. Hydrogen-Bonding Interaction in Molecular Complexes and Clusters of Aerosol Nucleation Alexei Khalizov, and Renyi Zhang*

    E-Print Network [OSTI]

    Hydrogen-Bonding Interaction in Molecular Complexes and Clusters of Aerosol Nucleation Precursors, water, and ammonia. A central feature of the complexes is the presence of two hydrogen bonds. Organic acid-sulfuric acid complexes show one strong and one medium-strength hydrogen bond whereas

  10. Hydrogen Bond Lifetimes and Energetics for Solute/Solvent Complexes Studied with 2D-IR Vibrational Echo Spectroscopy

    E-Print Network [OSTI]

    Fayer, Michael D.

    Hydrogen Bond Lifetimes and Energetics for Solute/Solvent Complexes Studied with 2D-IR Vibrational@stanford.edu Abstract: Weak hydrogen-bonded solute/solvent complexes are studied with ultrafast two the dissociation and formation rates of the hydrogen-bonded complexes. The dissociation rates of the weak hydrogen

  11. Hydrogen bonding preference of equatorial versus axial hydroxyl groups in pyran and cyclohexane rings in organic crystals

    E-Print Network [OSTI]

    de Gispert, Adriŕ

    Paper Hydrogen bonding preference of equatorial versus axial hydroxyl groups in pyran of the hydrogen bonding counts in crystalline pyranose monosaccharides, we noticed that equatorial hydroxyls formed more hydrogen bonds, on average, than axial groups. A survey of the Cambridge Structural Database

  12. Chemistry of Materials 1989, 1,83-101 How C-C Bonds Are Formed and How They Influence

    E-Print Network [OSTI]

    Li, Jing

    Chemistry of Materials 1989, 1,83-101 How C-C Bonds Are Formed and How They Influence Structural Choices in Some Binary and Ternary Metal Carbides 83 Jing Li and Roald Hoffmann* Department of Chemistry properties. In the UC2structure, both uranium-carbon bonding and carbon-carbon bonding are enhanced upon

  13. Classification of metal-oxide bonded interactions based on local potential-and kinetic-energy densities

    E-Print Network [OSTI]

    Downs, Robert T.

    of the local potential-energy density and G rc is the local kinetic-energy density, each evaluated at a bond rc and the local electronic energy density, H rc =G rc +V rc , in the H­F study, yielded practically the bond critical point and local energy density properties with the bond lengths displayed by the H

  14. Inhibition of Hotspot Formation in Polymer Bonded Explosives Using an Interface Matching Low Density Polymer Coating at the Polymer-

    E-Print Network [OSTI]

    Goddard III, William A.

    Inhibition of Hotspot Formation in Polymer Bonded Explosives Using an Interface Matching Low Density Polymer Coating at the Polymer- Explosive Interface Qi An, William A. Goddard, III,*, Sergey V/s) on a prototype polymer bonded explosive (PBX) consisting of cyclotrimethylene trinitramine (RDX) bonded

  15. National Tribal Energy Summit

    Broader source: Energy.gov [DOE]

    The U.S. Department of Energy (DOE) is participating in a National Tribal Energy Summit September 23–25, 2015, in Washington, D.C. The National Summit supports the Obama Administration’s ongoing commitment to assist tribal efforts to enhance energy security, increase community resiliency, and cultivate a sustainable energy future.

  16. The National Cancer Institute,

    E-Print Network [OSTI]

    The National Cancer Institute, International Cancer Information Center Bldg. 82, Rm 123 Bethesda, MD 20892 The National Cancer Institute (NCI) is part of the Federal Government. NCI coordinates the government's cancer research program. It is the largest of the 17 biomedical research institutes and centers

  17. Bond Energy Sums in Benzene, Cyclohexatriene and Cyclohexane Prove Resonance Unnecessary

    E-Print Network [OSTI]

    Raji Heyrovska

    2008-07-27

    The recent new structure of benzene shows that it consists of three C atoms of radii as in graphite alternating with three C atoms with double bond radii. This is different from the hypothetical cyclohexatriene (Kekule structure) involving alternate double and single bonds. It was shown that the difference in the bond energy sum of the atomic structure of benzene from that of the Kekule structure is the energy (erroneously) assumed to be due to resonance. Here it is shown that the present structure of benzene also explains the energy of hydrogenation into cyclohexane and its difference from that of cyclohexatriene.

  18. Hydrogen-bond equilibria and life times in a supercooled monohydroxy alcohol

    E-Print Network [OSTI]

    C. Gainaru; S. Kastner; F. Mayr; P. Lunkenheimer; S. Schildmann; H. J. Weber; W. Hiller; A. Loidl; R. Böhmer

    2011-06-29

    Dielectric loss spectra covering 13 decades in frequency were collected for 2-ethyl-1-hexanol, a monohydroxy alcohol that exhibits a prominent Debye-like relaxation, typical for several classes of hydrogen-bonded liquids. The thermal variation of the dielectric absorption amplitude agrees well with that of the hydrogen-bond equilibrium population, experimentally mapped out using near infrared (NIR) and nuclear magnetic resonance (NMR) measurements. Despite this agreement, temperature-jump NIR spectroscopy reveals that the hydrogen-bond switching rate does not define the frequency position of the prominent absorption peak. This contrasts with widespread notions and models based thereon, but is consistent with a recent approach.

  19. A Strong Bond Model for Stress Relaxation of Soft Solid Interfaces

    E-Print Network [OSTI]

    Arun K. Singh; Vinay A. Juvekar

    2014-11-29

    In this article, we propose a mathematical model which explains the formation of strong bonds during the relaxation process of a soft solid on a hard surface. As a result, the soft solid relaxes to a non zero residual stress level. The model assumes that formation of strong bonds occurs owing to transition from weak to strong bonds at a critical time. Parametric studies are carried out to understand the effect of different friction parameters related with the model on the relaxation process. The relaxation model is, in turn, validated with experiments and corresponding numerical values are justified.

  20. Hydrogen bond studies. 85. A very short, asymmetrical, intramolecular hydrogen bond: A neutron diffraction study of pyridine?2,3?dicarboxylic acid (C7H5NO4)

    E-Print Network [OSTI]

    Kvick, Å ke; Koetzle, Thomas F.; Thomas, Robert; Takusagawa, Fusao

    1974-01-01

    ) 1" '09 204 50) " . 305 ,9, '" 201 lb9 '" '" 281 1" 324 'I' ll,209 '!b '" 49' 240 '" '" 234 261 "4 219 m Rw"[6W IFg-IFcI212/6WF6r/2,,0.082 The corresponding conventional R(F) was 0.040 if the 453 reflexions with F ~ < 3uc(F~) were... crystal forces distort the symmetry of the short hydrogen bond. Asymmetry in the molecule does not always give asymmetry in com­ parable bonds, however. This is illustrated in potassi­ um hydrogen chloromaleate, 15 where the hydrogen atom is effectively...

  1. Feasibility study on bonding quality inspection of microfluidic devices by optical coherence tomography

    E-Print Network [OSTI]

    Li, Shiguang

    This paper reports the feasibility of optical coherence tomography (OCT) technology for inspection of bonding quality of microfluidic devices in manufacturing environments. A compact optical-fiber–based OCT is developed ...

  2. Metal Catalyzed sp2 Bonded Carbon - Large-scale Graphene Synthesis...

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Metal Catalyzed sp2 Bonded Carbon - Large-scale Graphene Synthesis and Beyond December 1, 2009 at 3pm36-428 Peter Sutter Center for Functional Nanomaterials sutter abstract:...

  3. Palladium(0)-Catalyzed Intermolecular Amination of Unactivated C[3 over sp]-H Bonds

    E-Print Network [OSTI]

    Pan, Jun

    Filling out the space: The title reaction of unactivated C[3 over sp]-H bonds using aryl amines as the nitrogen source is disclosed (see scheme; dba=dibenzylideneacetone, Tf=trifluoromethanesulfonyl). Either the C-N ...

  4. A Hidden Markov Chain Model for the Term Structure of Bond Credit Risk Spreads 

    E-Print Network [OSTI]

    Thomas, L; Allen, David E; Morkel-Kingsbury, N

    1998-01-01

    This paper provides a Markov chain model for the term structure and credit risk spreads of bond processes. It allows dependency between the stochastic process modeling the interest rate and the Markov chain process describing ...

  5. Mutant microorganisms useful for cleavage of organic C-S bonds

    DOE Patents [OSTI]

    Kilbane, II, John J. (Woodstock, IL)

    1991-01-01

    A mutant Bacillus sphaericus strain ATC No. 53969 which has the property of sulfur removal and sulfur metabolism by selective cleavage of C-S bonds in organic carbonaceous materials.

  6. Scaling of the dynamics of flexible Lennard-Jones chains. II. Effects of harmomic bonds

    E-Print Network [OSTI]

    Veldhorst, Arno A; Schrřder, Thomas B

    2015-01-01

    The previous paper [Veldhorst et al., J. Chem. Phys. 141, 054904 (2014)] demonstrated that the isomorph theory explains the scaling properties of a liquid of flexible chains consisting of ten Lennard-Jones particles connected by rigid bonds. We here investigate the same model with harmonic bonds. The introduction of harmonic bonds almost completely destroys the correlations in the equilibrium fluctuations of the potential energy and the virial. According to the isomorph theory, only if these correlations are strong does a system have isomorphs, which are curves in the phase diagram along which structure, dynamics and the excess entropy are invariant. The liquid with harmonic bonds does have curves in the phase diagram along which the structure and dynamics are invariant. The excess entropy is not invariant on these curves, which we therefore refer to as "pseudoisomorphs". In particular this means that Rosenfeld's excess-entropy scaling (the dynamics being a function of excess entropy only) does not apply for ...

  7. EFFECT OF EXCIMER LASER IRRADIATION OF BIODEGRADABLE POLYMER ON ITS CHEMICAL BONDING

    E-Print Network [OSTI]

    Yao, Y. Lawrence

    EFFECT OF EXCIMER LASER IRRADIATION OF BIODEGRADABLE POLYMER ON ITS CHEMICAL BONDING Paper M1306 profile is favorable for surface treatment. The effects of excimer laser irradiation on the surface irradiation as a hea

  8. Distal hydrogen-bonding effects and cofacial bimetallic salen architectures for oxygen activation chemistry

    E-Print Network [OSTI]

    Yang, Jenny Yue-fon

    2007-01-01

    Two distinct structural scaffolds elaborated from Schiff-base macrocycles were designed to study the proton-coupled electron transfer chemistry of 0-0 bond forming and activation chemistry. The "Hangman" architecture is ...

  9. Hydrogen Bond Rearrangements in Water Probed with Temperature-Dependent 2D IR

    E-Print Network [OSTI]

    Nicodemus, Rebecca A.

    We use temperature-dependent two-dimensional infrared spectroscopy (2D IR) of dilute HOD in H2O to investigate hydrogen bond rearrangements in water. The OD stretching frequency is sensitive to its environment, and loss ...

  10. An Investigation of Bonding Mechanism in Metal Cladding by Warm Rolling 

    E-Print Network [OSTI]

    Yang, Wei

    2012-02-14

    Clad metals are extensively used for their multi-functionality and their optimal combination of quality and cost. Roll bonding is an effective and economic processing approach to making clad metals. This dissertation ...

  11. Tubulin Bond Energies and Microtubule Biomechanics Determined from Nanoindentation in Silico

    E-Print Network [OSTI]

    Barsegov, Valeri

    Tubulin Bond Energies and Microtubule Biomechanics Determined from Nanoindentation in Silico Olga explore the biomechanics of microtubule polymers using multi- scale computational modeling and experimental force-deformation spectra enabled us to correlate the microtubule biomechanics with dynamic

  12. Environmental durability of FRP bond to concrete subjected to freeze-thaw action

    E-Print Network [OSTI]

    Dohnálek, Pavel

    2006-01-01

    An experimental study was performed to determine the environmental durability of the adhesive bond between fiber-reinforced plastic (FRP) and concrete. The study specifically focused on freeze-thaw cycling exposure of such ...

  13. Hybrid Two-Dimensional Electronic Systems and Other Applications of sp-2 Bonded Light Elements

    E-Print Network [OSTI]

    Kessler, Brian Maxwell

    2010-01-01

    A.4 A.5 vii List of Tables DOE Hydrogen Storage Targets forsp-2 Bonded Materials 5 Hydrogen Storage 5.1 Motivation andJeffrey R. Long. Hydrogen storage in a microporous metal-

  14. From molecular chemistry to supramolecular chemistry to superdupermolecular chemistry. Controlling covalent bond formation

    E-Print Network [OSTI]

    Turro, Nicholas J.

    From molecular chemistry to supramolecular chemistry to superdupermolecular chemistry. Controlling covalent bond formation through non-covalent and magnetic interactions Nicholas J. Turro Chemistry. Introduction Carbon centered radicals are among the most reactive species encountered in organic chemistry

  15. Stress and Fracture Analysis of a Class of Bonded Joints in Wind Turbine Blades 

    E-Print Network [OSTI]

    Chen, Chang

    2013-05-08

    A simplified model is proposed to investigate the stress fields and the strain energy release rate (SERR) associated with cracks in bonded joints in wind turbine blades. The proposed two-dimensional model consists of nonparallel upper and lower...

  16. Mourning 2.0: Continuing Bonds between the Living and the Dead on Facebook

    E-Print Network [OSTI]

    Irwin, Melissa D.

    2012-05-31

    This study examines the burgeoning phenomenon of Facebook memorial pages and how this research about dynamic, online social networking environments can contribute to the existing literature related to Klass et al's (1996) continuing bonds thesis...

  17. The contribution of tyrosine water=hydrogen bonds to protein stability 

    E-Print Network [OSTI]

    Bechert, Charles John

    2013-02-22

    The goal of this research was to determine how protein stability is affected when tyrosines form specific inter and/or intramolecular hydrogen bonds in the folded state. Our model protein, the enzyme RNase Sa, contains four Tyr residues believed...

  18. Fluorescein and Rosamine Derivatives as Donors/Acceptors for "Through-bond" Energy Transfer Cassettes 

    E-Print Network [OSTI]

    Castro, Juan C.

    2010-07-14

    A series of fluorescein and rosamine derivatives have been prepared and their spectroscopical properties analyzed to determine their usefulness as donor and/or acceptors in "through-bond" energy transfer systems. Such new ...

  19. Catalytic C-N and C-F bond formation by organometallic group 11 complexes

    E-Print Network [OSTI]

    Akana, Jennifer Anne

    2007-01-01

    This thesis presents a study of the reaction between an (NHC)gold(I) fluoride complex (NHC = N-heterocyclic carbene) and alkynes (Chapter 1). Gold(I) and fluoride add trans across the triple bond of 3-hexyne and ...

  20. Mechanistic studies on metal-catalyzed carbon-nitrogen bond forming reactions

    E-Print Network [OSTI]

    Strieter, Eric R

    2005-01-01

    Mechanistic studies on copper and palladium-catalyzed C-N bond forming reactions are described. To understand the mechanistic details of these processes, several principles of physical organic chemistry have been employed. ...