National Library of Energy BETA

Sample records for lead-free solder misbehaves

  1. Lead-free solder

    DOE Patents [OSTI]

    Anderson, Iver E.; Terpstra, Robert L.

    2001-05-15

    A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

  2. Breakthrough: Lead-free Solder

    ScienceCinema (OSTI)

    Anderson, Iver

    2013-03-01

    Ames Laboratory senior metallurgist Iver Anderson explains the importance of lead-free solder in taking hazardous lead out of the environment by eliminating it from discarded computers and electronics that wind up in landfills. Anderson led a team that developed a tin-silver-copper replacement for traditional lead-tin solder that has been adopted by more than 50 companies worldwide.

  3. Lead-Free Solder Paste | The Ames Laboratory

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    hazard, that's not its only advantage," says Ames Lab's Iver Anderson, co-inventor of a new solder from tin, silver and copper. "We worked with different alloy...

  4. Suppression of Tin Whiskers in Lead-Free Solder - Energy Innovation Portal

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Suppression of Tin Whiskers in Lead-Free Solder Improved electronics reliability by surpressing whiskers that can cause short circuits and arcing in electrical circuits Savannah River National Laboratory Contact SRNL About This Technology Technology Marketing Summary Scientists at the Savannah River National Laboratory have identified a treatment method that slows or prevents the formation of whiskers in lead-free solder. The current stage of research has shown initial time studies in comparison

  5. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    SciTech Connect (OSTI)

    Sujan, G.K. Haseeb, A.S.M.A. Afifi, A.B.M.

    2014-11-15

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu{sub 6}Sn{sub 5} from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping of flux with appropriate metallic nanoparticles can be successfully used to control the morphology and growth of intermetallic compound layers at the solder/substrate interface which is expected to lead to better reliability of electronic devices. - Highlights: • A novel nanodoped flux method has been developed to control the growth of IMCs. • Ni doped flux improves the wettability, but Co, Mo and Ti deteriorate it. • Ni and Co doped flux gives planer IMC morphology through in-situ alloying effect. • 0.1 wt.% Ni and Co addition into flux gives the lowest interfacial IMC thickness. • Mo and Ti doped flux does not have any influence at the interfacial reaction.

  6. Suppressing tin whisker growth in lead-free solders and platings

    DOE Patents [OSTI]

    Hoffman, Elizabeth N; Lam, Poh-Sang

    2014-04-29

    A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.

  7. Wave soldering with Pb-free solders

    SciTech Connect (OSTI)

    Artaki, I.; Finley, D.W.; Jackson, A.M.; Ray, U.; Vianco, P.T.

    1995-07-01

    The manufacturing feasibility and attachment reliability of a series of newly developed lead-free solders were investigated for wave soldering applications. Some of the key assembly aspects addressed included: wettability as a function of board surface finish, flux activation and surface tension of the molten solder, solder joint fillet quality and optimization of soldering thermal profiles. Generally, all new solder formulations exhibited adequate wave soldering performance and can be considered as possible alternatives to eutectic SnPb for wave soldering applications. Further process optimization and flux development is necessary to achieve the defect levels associated with the conventional SnPb process.

  8. Lab Breakthrough: Lead-free Solder | Department of Energy

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    View the entire Lab Breakthrough playlist. Michael Hess Michael Hess Former Digital ... This Q&A and video are part of the Lab Breakthrough series, which highlights innovations ...

  9. Lead-free primary explosives

    DOE Patents [OSTI]

    Huynh, My Hang V.

    2010-06-22

    Lead-free primary explosives of the formula (cat).sub.Y[M.sup.II(T).sub.X(H.sub.2O).sub.6-X].sub.Z, where T is 5-nitrotetrazolate, and syntheses thereof are described. Substantially stoichiometric equivalents of the reactants lead to high yields of pure compositions thereby avoiding dangerous purification steps.

  10. Lead-free Thin Film Piezoelectric Devices

    Energy Innovation Portal (Marketing Summaries) [EERE]

    2011-01-21

    In a breakthrough discovery, Ramamoorthy Ramesh, Robert Zeches, and their research team at Berkeley Lab have developed a technology for lead-free piezoelectric materials using thin-film bismuth ferrite. In addition to being less hazardous to human health and the environment, the Berkeley Lab invention offers an order of magnitude more efficient performance, for all applications, than conventional lead-based piezoelectric materials. The invention can be used to fabricate rewritable data storage...

  11. Soldering instrument safety improvements

    DOE Patents [OSTI]

    Kosslow, William J.; Giron, Ronald W.

    1996-01-01

    A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.

  12. Solderability test system

    DOE Patents [OSTI]

    Yost, F.; Hosking, F.M.; Jellison, J.L.; Short, B.; Giversen, T.; Reed, J.R.

    1998-10-27

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.

  13. Solderability test system

    DOE Patents [OSTI]

    Yost, Fred; Hosking, Floyd M.; Jellison, James L.; Short, Bruce; Giversen, Terri; Reed, Jimmy R.

    1998-01-01

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

  14. Lead-free Thin Film Piezoelectric Devices - Energy Innovation Portal

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Vehicles and Fuels Vehicles and Fuels Find More Like This Return to Search Lead-free Thin Film Piezoelectric Devices Lawrence Berkeley National Laboratory Contact LBL About This Technology Technology Marketing SummaryIn a breakthrough discovery, Ramamoorthy Ramesh, Robert Zeches, and their research team at Berkeley Lab have developed a technology for lead-free piezoelectric materials using thin-film bismuth ferrite. In addition to being less hazardous to human health and the environment, the

  15. SOLDERING OF ALUMINUM BASE METALS

    DOE Patents [OSTI]

    Erickson, G.F.

    1958-02-25

    This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.

  16. METHOD FOR SOLDERING NORMALLY NON-SOLDERABLE ARTICLES

    DOE Patents [OSTI]

    McGuire, J.C.

    1959-11-24

    Methods are presented for coating and joining materials which are considered difficult to solder by utilizing an abrasive wheel and applying a bar of a suitable coating material, such as Wood's metal, to the rotating wheel to fill the cavities of the abrasive wheel and load the wheel with the coating material. The surface of the base material is then rubbed against the loaded rotating wheel, thereby coating the surface with the soft coating metal. The coating is a cohesive bonded layer and holds the base metal as tenaciously as a solder holds to easily solderable metals.

  17. KNN–NTK composite lead-free piezoelectric ceramic

    SciTech Connect (OSTI)

    Matsuoka, T. Kozuka, H.; Kitamura, K.; Yamada, H.; Kurahashi, T.; Yamazaki, M.; Ohbayashi, K.

    2014-10-21

    A (K,Na)NbO₃-based lead-free piezoelectric ceramic was successfully densified. It exhibited an enhanced electromechanical coupling factor of kₚ=0.52, a piezoelectric constant d₃₃=252 pC/N, and a frequency constant Nₚ=3170 Hz m because of the incorporation of an elaborate secondary phase composed primarily of KTiNbO₅. The ceramic's nominal composition was 0.92K₀.₄₂Na₀.₄₄Ca₀.₀₄Li₀.₀₂Nb₀.₈₅O₃–0.047K₀.₈₅Ti₀.₈₅Nb₁.₁₅O₅–0.023BaZrO₃ –0.0017Co₃O₄–0.002Fe₂O₃–0.005ZnO, abbreviated herein as KNN–NTK composite. The KNN–NTK ceramic exhibited a dense microstructure with few microvoids which significantly degraded its piezoelectric properties. Elemental maps recorded using transmission electron microscopy with energy-dispersive X-ray spectroscopy (TEM–EDS) revealed regions of high concentrations of Co and Zn inside the NTK phase. In addition, X-ray diffraction patterns confirmed that a small portion of the NTK phase was converted into K₂(Ti,Nb,Co,Zn)₆O₁₃ or CoZnTiO₄ by a possible reaction between Co and Zn solutes and the NTK phase during a programmed sintering schedule. TEM studies also clarified a distortion around the KNN/NTK interfaces. Such an NTK phase filled voids between KNN particles, resulting in an improved chemical stability of the KNN ceramic. The manufacturing process was subsequently scaled to 100 kg per batch for granulated ceramic powder using a spray-drying technique. The properties of the KNN–NTK composite ceramic produced using the scaled-up method were confirmed to be identical to those of the ceramic prepared by conventional solid-state reaction sintering. Consequently, slight changes in the NTK phase composition and the distortion around the KNN/NTK interfaces affected the KNN–NTK composite ceramic's piezoelectric characteristics.

  18. Tin-silver-bismuth solders for electronics assembly

    DOE Patents [OSTI]

    Vianco, Paul T.; Rejent, Jerome A.

    1995-01-01

    A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0

  19. Tin-silver-bismuth solders for electronics assembly

    DOE Patents [OSTI]

    Vianco, P.T.; Rejent, J.A.

    1995-08-08

    A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0

  20. Intermetallic Layers in Soldered Joints

    Energy Science and Technology Software Center (OSTI)

    1998-12-10

    ILAG solves the one-dimensional partial differential equations describing the multiphase, multicomponent, solid-state diffusion-controlled growth of intermetallic layers in soldered joints. This software provides an analysis capability for materials researchers to examine intermetallic growth mechanisms in a wide variety of defense and commercial applications involving both traditional and advanced materials. ILAG calculates the interface positions of the layers, as well as the spatial distribution of constituent mass fractions, and outputs the results at user-prescribed simulation times.

  1. Lead-free precussion primer mixes based on metastable interstitial composite (MIC) technology

    DOE Patents [OSTI]

    Dixon, George P.; Martin, Joe A.; Thompson, Don

    1998-01-01

    A lead-free percussion primer composition and a percussion cup containing e composition. The lead-free percussion primer composition is comprised of a mixture of about 45 wt % aluminum powder having an outer coating of aluminum oxide and molybdenum trioxide powder or a mixture of about 50 wt % aluminum powder having an outer coating of aluminum oxide and polytetrafluoroethylene powder. The aluminum powder, molybdenum trioxide powder and polytetrafluoroethylene powder has a particle size of 0.1 .mu.m or less, more preferably a particle size of from about 200-500 angstroms.

  2. Nano-soldering to single atomic layer

    DOE Patents [OSTI]

    Girit, Caglar O.; Zettl, Alexander K.

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  3. Induction soldering of photovoltaic system components

    DOE Patents [OSTI]

    Kumaria, Shashwat; de Leon, Briccio

    2015-11-17

    A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.

  4. Efforts to Develop a 300°C Solder

    SciTech Connect (OSTI)

    Norann, Randy A

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  5. An Accelerated Method for Testing Soldering Tendency of Core Pins

    SciTech Connect (OSTI)

    Han, Qingyou [ORNL; Xu, Hanbing [ORNL; Ried, Paul [Ried, Engineering; Olson, Paul [Balzers, Inc.

    2010-01-01

    An accelerated method for testing die soldering has been developed. High intensity ultrasonic vibrations has been used to simulate the die casting conditions such as high pressure and high impingement speed of molten metal on the pin. Soldering tendency of steels and coated pins has been examined. The results indicate that in the low carbon steel/Al system, the onset of soldering is 60 times faster with ultrasonic vibration than that without ultrasonic vibration. In the H13/A380 system, the onset of soldering reaction is accelerated to 30-60 times. Coating significantly reduces the soldering tendency of the core pins.

  6. Solder for oxide layer-building metals and alloys

    DOE Patents [OSTI]

    Kronberg, J.W.

    1992-09-15

    A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel is disclosed. The composition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than approximately 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300 C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

  7. Solder for oxide layer-building metals and alloys

    DOE Patents [OSTI]

    Kronberg, James W.

    1992-01-01

    A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The comosition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than aproximatley 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300.degree. C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

  8. ISU professor developing heat-free solder | The Ames Laboratory

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    ISU professor developing heat-free solder Ames Tribune writer Julie Erickson wrote a story about a new heat-free solder being developed by Martin Thuo, an assistant professor of materials science and engineering and an associate of the U.S. Department of Energy's Ames Laboratory. Thuo and his team have found a way to "undercool" solder so that it can be applied at room temperature, thanks to a nano-scale oxide coating.

  9. SU-E-P-09: Radiation Transmission Measurements and Evaluation of Diagnostic Lead-Based and Lead-Free Aprons

    SciTech Connect (OSTI)

    Syh, J

    2014-06-01

    Purpose: This study was conducted to ensure that various lead shield apron manufacturers provided accurate attenuation factors regardless of whether the apron was made of lead-based or lead-free equivalent material. Methods: A calibrated ionization survey meter was placed at chest height and 36 cm horizontally away from a solid water phantom on a simulator couch. Measurements were done with or without apron. Radiation field was set to 24cmx24cm with the phantom at 100cm source-to-surface distance. Irradiation time was set for 1 minute at voltages of 60, 80, 100 and 120 kVp. Current was set at 6mA. Results: Between 60 kVp and 120 kVp, the transmission through 0.50 mm of lead-based apron was between 1.0% and 6.5% with a mean value of 3.2% and a standard deviation (s.d.) of 1.4%. The transmissions through the 0.50 mm lead-free aprons were 1.0 % to 12.0% with a mean value of 6.1% and s.d. of 2.6%. At 120 kVp, the transmission value was 6.5% for 0.50 mm lead-based apron and 11.1% to 12.0% for 0.50 mm lead-free aprons. The radiation transmissions at 80 kVp, measured in two different 0.5 mm lead-free aprons, were 4.3% each. However, only 1.4% transmission was found through the lead-based apron. Overall, the radiation transmitted through the lead-based apron was 1/3 transmission of lead-free at 80kVp, and half value of lead-free aprons at 100 and 120 kVp. Conclusion: Even though lead-based and lead-free aprons all claimed to have the same lead equivalent thickness, the transmission might not be the same. The precaution was needed to exercise diligence in quality assurance program to assure adequate protection to staff who wear it during diagnostic procedures. The requirement for aprons not only should be in certain thickness to meet state regulation but also to keep reasonably achievable low exposure with the accurate labeling from manufacturers.

  10. Reflow of AuSnSolder Creates Strong Joints [Local Reflow of AuSn Solder: Relating Strength to Microstructure

    SciTech Connect (OSTI)

    Golosker, Ilya V.; Florando, Jeff N.

    2013-02-01

    Local heating of AuSn solder creates reliable bonds. However, small changes in the heat schedule result in significant changes to bond strength and microstructure.

  11. Cost comparison modeling between current solder sphere attachment technology and solder jetting technology

    SciTech Connect (OSTI)

    Davidson, R.N.

    1996-10-01

    By predicting the total life-cycle cost of owning and operating production equipment, it becomes possible for processors to make accurate and intelligent decisions regarding major capitol equipment investments as well as determining the most cost effective manufacturing processes and environments. Cost of Ownership (COO) is a decision making technique based on inputting the total costs of acquiring, operating and maintaining production equipment. All quantitative economic and production data can be modeled and processed using COO software programs such as the Cost of Ownership Luminator program TWO COOL{trademark}. This report investigated the Cost of Ownership differences between the current state-of-the-art solder ball attachment process and a prototype solder jetting process developed by Sandia National Laboratories. The prototype jetting process is a novel and unique approach to address the anticipated high rate ball grid array (BGA) production requirements currently forecasted for the next decade. The jetting process, which is both economically and environmentally attractive eliminates the solder sphere fabrication step, the solder flux application step as well as the furnace reflow and post cleaning operations.

  12. Dry soldering with hot filament produced atomic hydrogen

    DOE Patents [OSTI]

    Panitz, Janda K. G.; Jellison, James L.; Staley, David J.

    1995-01-01

    A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.

  13. Dry soldering with hot filament produced atomic hydrogen

    DOE Patents [OSTI]

    Panitz, J.K.G.; Jellison, J.L.; Staley, D.J.

    1995-04-25

    A system is disclosed for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs. 1 fig.

  14. Printability Optimization For Fine Pitch Solder Bonding

    SciTech Connect (OSTI)

    Kwon, Sang-Hyun; Lee, Chang-Woo; Yoo, Sehoon

    2011-01-17

    Effect of metal mask and pad design on solder printability was evaluated by DOE in this study. The process parameters were stencil thickness, squeegee angle, squeegee speed, mask separating speed, and pad angle of PCB. The main process parameters for printability were stencil thickness and squeegee angle. The response surface showed that maximum printability of 1005 chip was achieved at the stencil thickness of 0.12 mm while the maximum printability of 0603 and 0402 chip was obtained at the stencil thickness of 0.05 mm. The bonding strength of the MLCC chips was also directly related with the printability.

  15. Solder extrusion pressure bonding process and bonded products produced thereby

    DOE Patents [OSTI]

    Beavis, L.C.; Karnowsky, M.M.; Yost, F.G.

    1992-06-16

    Disclosed is a process for production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about [minus]40 C and 110 C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  16. Solder extrusion pressure bonding process and bonded products produced thereby

    DOE Patents [OSTI]

    Beavis, Leonard C.; Karnowsky, Maurice M.; Yost, Frederick G.

    1992-01-01

    Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  17. Investigation of electrochemical migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy in HNO{sub 3} solution

    SciTech Connect (OSTI)

    Sarveswaran, C.; Othman, N. K.; Ali, M. Yusuf Tura; Ani, F. Che; Samsudin, Z.

    2015-09-25

    Current issue in lead-free solder in term of its reliability is still under investigation. This high impact research attempts to investigate the electrochemical migration (ECM) on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy by Water Drop Test (WDT) in different concentration of HNO{sub 3} solution. The concentration of HNO{sub 3} solution used in this research was 0.05, 0.10, 0.50 and 1M. Optical Microscope (OM), Field Emission Scanning Electron Microscope (FESEM) and Energy Dispersive X-Ray Analysis (EDX) were carried out in order to analysis the ECM behavior based on the growth of dendrite formation after WDT. In general, the results demonstrated that dendrite growth is faster in higher concentration compared with low concentration of HNO{sub 3}. The concentration of HNO{sub 3} solution used has a strong correlation with Mean-Time-To-Failure (MTTF). As the concentration of HNO{sub 3} increases, the MTTF value decreases. Based on the MTTF results the solder alloy in 1M HNO{sub 3} solution is most susceptible to ECM. SnO{sub 2} forms as a corrosion by-product in the samples proved by EDX analysis. The solder alloy poses a high reliability risk in microelectronic devices during operation in 1M HNO{sub 3} solution.

  18. Substrate solder barriers for semiconductor epilayer growth

    DOE Patents [OSTI]

    Drummond, T.J.; Ginley, D.S.; Zipperian, T.E.

    1989-05-09

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.

  19. Substrate solder barriers for semiconductor epilayer growth

    DOE Patents [OSTI]

    Drummond, T.J.; Ginley, D.S.; Zipperian, T.E.

    1987-10-23

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In molecular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating. 1 tab.

  20. Substrate solder barriers for semiconductor epilayer growth

    DOE Patents [OSTI]

    Drummond, Timothy J.; Ginley, David S.; Zipperian, Thomas E.

    1989-01-01

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.

  1. Room temperature nonlinear magnetoelectric effect in lead-free and Nb-doped AlFeO{sub 3} compositions

    SciTech Connect (OSTI)

    Ctica, Luiz F.; Santos, Guilherme M.; Santos, Ivair A.; Freitas, Valdirlei F.; Coelho, Adelino A.; Pal, Madhuparna; Guo, Ruyan; Bhalla, Amar S.; Garcia, Ducinei; Eiras, Jos A.

    2015-02-14

    It is still a challenging problem to obtain technologically useful materials displaying strong magnetoelectric coupling at room temperature. In the search for new effects and materials to achieve this kind of coupling, a nonlinear magnetoelectric effect was proposed in the magnetically disordered relaxor ferroelectric materials. In this context, the aluminum iron oxide (AlFeO{sub 3}), a room temperature ferroelectric relaxor and magnetic spin glass compound, emerges as an attractive lead-free magnetoelectric material along with nonlinear magnetoelectric effects. In this work, static, dynamic, and temperature dependent ferroic and magnetoelectric properties in lead-free AlFeO{sub 3} and 2 at.?% Nb-doped AlFeO{sub 3} multiferroic magnetoelectric compositions are studied. Pyroelectric and magnetic measurements show changes in ferroelectric and magnetic states close to each other (?200?K). The magnetoelectric coefficient behavior as a function of H{sub bias} suggests a room temperature nonlinear magnetoelectric coupling in both single-phase and Nb-doped AlFeO{sub 3}-based ceramic compositions.

  2. A Revolutionary Advance in Solders - the "Glue" for Electronic...

    Office of Science (SC) Website

    ... a licensee of the technology. Publications CM Miller, IE Anderson, and JF Smith. "A viable tin-lead solder substitute: Sn-Ag-Cu," External link J. Electronic Mater. 23 595 (1994). ...

  3. Soldering of Thin Film-Metallized Glass Substrates

    SciTech Connect (OSTI)

    Hosking, F.M.; Hernandez, C.L.; Glass, S.J.

    1999-03-31

    The ability to produce reliable electrical and structural interconnections between glass and metals by soldering was investigated. Soldering generally requires premetallization of the glass. As a solderable surface finish over soda-lime-silicate glass, two thin films coatings, Cr-Pd-Au and NiCr-Sn, were evaluated. Solder nettability and joint strengths were determined. Test samples were processed with Sn60-Pb40 solder alloy at a reflow temperature of 210 C. Glass-to-cold rolled steel single lap samples yielded an average shear strength of 12 MPa. Solder fill was good. Control of the Au thickness was critical in minimizing the formation of AuSn{sub 4} intermetallic in the joint, with a resulting joint shear strength of 15 MPa. Similar glass-to-glass specimens with the Cr-Pd-Au finish failed at 16.5 MPa. The NiCr-Sn thin film gave even higher shear strengths of 20-22.5 MPa, with failures primarily in the glass.

  4. Hot-stage transmission electron microscopy study of (Na, K)NbO{sub 3} based lead-free piezoceramics

    SciTech Connect (OSTI)

    Lu, Shengbo; Xu, Zhengkui; Kwok, K. W.; Chan, Helen L. W.

    2014-07-28

    Hierarchical nanodomains assembled into micron-sized stripe domains, which is believed to be associated with outstanding piezoelectric properties, were observed at room temperature in a typical lead free piezoceramics, (Na{sub 0.52}K{sub 0.48−x})(Nb{sub 0.95−x}Ta{sub 0.05})-xLiSbO{sub 3}, with finely tuned polymorphic phase boundaries (x = 0.0465) by transmission electron microscopy. The evolution of domain morphology and crystal structure under heating and cooling cycles in the ceramic was investigated by in-situ hot stage study. It is found that the nanodomains are irreversibly transformed into micron-sized rectangular domains during heating and cooling cycles, which lead to the thermal instability of piezoelectric properties of the materials.

  5. Mechanical confinement for improved energy storage density in BNT-BT-KNN lead-free ceramic capacitors

    SciTech Connect (OSTI)

    Chauhan, Aditya; Patel, Satyanarayan; Vaish, Rahul

    2014-08-15

    With the advent of modern power electronics, embedded circuits and non-conventional energy harvesting, the need for high performance capacitors is bound to become indispensible. The current state-of-art employs ferroelectric ceramics and linear dielectrics for solid state capacitance. However, lead-free ferroelectric ceramics propose to offer significant improvement in the field of electrical energy storage owing to their high discharge efficiency and energy storage density. In this regards, the authors have investigated the effects of compressive stress as a means of improving the energy storage density of lead-free ferroelectric ceramics. The energy storage density of 0.91(Bi{sub 0.5}Na{sub 0.5})TiO{sub 3}-0.07BaTiO{sub 3}-0.02(K{sub 0.5}Na{sub 0.5})NbO{sub 3} ferroelectric bulk ceramic was analyzed as a function of varying levels of compressive stress and operational temperature .It was observed that a peak energy density of 387 mJ.cm{sup -3} was obtained at 100 MPa applied stress (25{sup o}C). While a maximum energy density of 568 mJ.cm{sup -3} was obtained for the same stress at 80{sup o}C. These values are indicative of a significant, 25% and 84%, improvement in the value of stored energy compared to an unloaded material. Additionally, material's discharge efficiency has also been discussed as a function of operational parameters. The observed phenomenon has been explained on the basis of field induced structural transition and competitive domain switching theory.

  6. Structural, microstructural and thermal properties of lead-free bismuthsodiumbariumtitanate piezoceramics synthesized by mechanical alloying

    SciTech Connect (OSTI)

    Amini, Rasool; Ghazanfari, Mohammad Reza; Alizadeh, Morteza; Ardakani, Hamed Ahmadi; Ghaffari, Mohammad

    2013-02-15

    Graphical abstract: Mechano-synthesis of lead-free (Bi{sub 0.5}Na{sub 0.5}){sub 0.94}Ba{sub 0.06}TiO{sub 3} piezoceramics with nanocrystalline/amorphous structure and homogeneous composition: partial transformation of constituents to BNBT, BNT and pyrochlore, amorphous phase formation, mechano-crystallization of the amorphous, pyrochlore-to-perovskite BNBT phase transformation during the process. Display Omitted Highlights: ? Perovskite BNBT powders with homogeneous composition were synthesized by MA. ? Partial transformation of constituents to BNBT, BNT and pyrochlore occurred by MA. ? Formation of an amorphous phase and afterwards its crystallization occurred by MA. ? Pyrochlore-to-perovskite BNBT phase transformation occurred after prolong milling. ? Polymorphic transformations of TiO{sub 2} act as the main alloying impediment during MA. -- Abstract: Bismuthsodiumbariumtitanate piezoceramics with a composition of (Bi{sub 0.5}Na{sub 0.5}){sub 0.94}Ba{sub 0.06}TiO{sub 3} (BNBT) were prepared by mechanical alloying (MA). Structural analysis and phase identification were performed by X-ray diffraction (XRD). Microstructural studies and chemical composition homogeneity were performed by scanning electron microscope (SEM) coupled with energy dispersive X-ray analysis (EDX). Furthermore, thermal properties of the as-milled powders were evaluated by thermogravimetry/differential thermal analysis (TG/DTA). During the initial milling, the constituents were transformed to the perovskite, pyrochlore, and BNT phases; in addition, partial amorphization of the structure appeared during the milling cycle. As MA progressed, transformation of pyrochlore-to-perovskite and crystallization of the amorphous phase occurred and also, the BNBT phase was significantly developed. It was found that the MA process has the ability to synthesize the BNBT powders with a submicron particle size, regular morphology, and uniform elemental distribution.

  7. Porosity in collapsible Ball Grid Array solder joints

    SciTech Connect (OSTI)

    Gonzalez, C.A. |

    1998-05-01

    Ball Grid Array (BGA) technology has taken off in recent years due to the increased need for high interconnect density. Opposite to all the advantages BGA packages offer, porosity in collapsible BGA solder joints is often a major concern in the reliability of such packages. The effect of pores on the strength of collapsible BGA solder-joints was studied by manufacturing samples with different degrees of porosity and testing them under a shear load. It was found that the shear strength of the solder joints decreased in a linear fashion with increasing porosity. Failure occurred by internal necking of the interpore matrix. It was confirmed that entrapment of flux residues leads to porosity by manufacturing fluxless samples in a specially made furnace, and comparing them with samples assembled using flux. Also, contamination of Au electrodeposits (in substrate metallization) was determined to cause significant porosity. It was found that hard-Au (Co hardened Au) electrodeposits produce high degrees of porosity even in the absence of flux. Finally, increasing the time the solder spends in the molten state was proven to successfully decrease porosity.

  8. Solder Interconnect Predictor (SIP) Software v. 0.5

    Energy Science and Technology Software Center (OSTI)

    2008-11-19

    This software tool was developed for predicting the fatigue damage in a wide variety of 63Sn-37Pb solder joints used in electronics applications. This tool is based upon the unified creep plasticity damage model CompSIR developed at Sandia National Laboratories. The software can be used as a design tool for predicting the long term reliability of consumer, military and space electronics. Both service as well as accelerated testing environments can be addressed by the user. Themore » mesh generating function provides the user with the greater versatility to explore different package and I/O configurations. For example, different solder joint geometries can be investigated to determine the effects of workmanship quality on reliability. Graphical user interfaces provide the user with easy data input screens as well as results profiles.« less

  9. Method and apparatus for jetting, manufacturing and attaching uniform solder balls

    DOE Patents [OSTI]

    Yost, F.G.; Frear, D.R.; Schmale, D.T.

    1999-01-05

    An apparatus and process are disclosed for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users. 7 figs.

  10. Method and apparatus for jetting, manufacturing and attaching uniform solder balls

    DOE Patents [OSTI]

    Yost, Frederick G.; Frear, Darrel R.; Schmale, David T.

    1999-01-01

    An apparatus and process for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users.

  11. Pb-free Sn-Ag-Cu ternary eutectic solder

    DOE Patents [OSTI]

    Anderson, I.E.; Yost, F.G.; Smith, J.F.; Miller, C.M.; Terpstra, R.L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

  12. Pb-free Sn-Ag-Cu ternary eutectic solder

    DOE Patents [OSTI]

    Anderson, Iver E.; Yost, Frederick G.; Smith, John F.; Miller, Chad M.; Terpstra, Robert L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).

  13. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    SciTech Connect (OSTI)

    Iman, R.L.; Anderson, D.J.; Burress, R.V.

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  14. Description of a solder pulse generator for the single step formation of ball grid arrays

    SciTech Connect (OSTI)

    Schmale, D.T.; Frear, D.R.; Yost, F.G.; Essien, M.

    1997-02-01

    The traditional geometry for surface mount devices is the peripheral array where the leads are on the edges of the device. As the technology drives towards high input/output (I/O) count (increasing number of leads) and smaller packages with finer pitch (less distance between peripheral leads), limitations on peripheral surface mount devices arise. The leads on these fine pitch devices are fragile and can be easily bent. It becomes increasingly difficult to deliver solder past to leads spaced as little as 0.012 inch apart. Too much solder mass can result in bridging between leads while too little solder can contribute to the loss of mechanical and electrical continuity. A solution is to shift the leads from the periphery of the device to the area under the device. This scheme is called areal array packaging and is exemplified by the ball grid array (BGA) package. A system has been designed and constructed to deposit an entire array of several hundred uniform solder droplets onto a printed circuit board in a fraction of a second. The solder droplets wet to the interconnect lands on a pc board and forms a basis for later application of a BGA device. The system consists of a piezoelectric solder pulse unit, heater controls, an inert gas chamber and an analog power supply/pulse unit.

  15. Bonding Low-density Nanoporous Metal Foams Using Sputtered Solder

    SciTech Connect (OSTI)

    Bono, M; Cervantes, O; Akaba, C; Hamza, A; Foreman, R; Teslich, N

    2007-08-21

    A method has been developed for bonding low-density nanoporous metal foam components to a substrate using solder that is sputtered onto the surfaces. Metal foams have unusual properties that make them excellent choices for many applications, and as technologies for processing these materials are evolving, their use in industry is increasing dramatically. Metal foams are lightweight and have advantageous dynamic properties, which make them excellent choices for many structural applications. They also provide good acoustic damping, low thermal conductivity, and excellent energy absorption characteristics. Therefore, these materials are commonly used in the automotive, aerospace, construction, and biomedical industries. The synthesis of nanoporous metal foams with a cell size of less then 1 {micro}m is an emerging technology that is expected to lead to widespread application of metal foams in microdevices, such as sensors and actuators. One of the challenges to manufacturing components from metal foams is that they can be difficult to attach to other structures without degrading their properties. For example, traditional liquid adhesives cannot be used because they are absorbed into foams. The problem of bonding or joining can be particularly difficult for small-scale devices made from nanoporous foam, due to the requirement for a thin bond layer. The current study addresses this problem and develops a method of soldering a nanoporous metal foam to a substrate with a bond thickness of less than 2 {micro}m. There are many applications that require micro-scale metal foams precisely bonded to substrates. This study was motivated by a physics experiment that used a laser to drive a shock wave through an aluminum foil and into a copper foam, in order to determine the speed of the shock in the copper foam. To avoid disturbing the shock, the interface between the copper foam and the aluminum substrate had to be as thin as possible. There are many other applications that could benefit from the bonding technology developed in this study, such as small-scale lightweight structural members, high-strength thermal insulating layers for electronics, and micro-scale mechanical dampers, to name but a few. Each of these applications requires one or more small metal foam components precisely bonded to a substrate. Several methods for bonding metal foam components have been developed by previous researchers. Macroscopic metal foam parts have been successfully bonded by laser welding to create T-sections and butt joints. Ultrasonic welding has been used to join aluminum sheet metal to aluminum foam for structural applications. These methods work well for bonding large foam components, but reducing these methods to a smaller length scale would be challenging. One method that has shown great potential for bonding layers of metal foams to substrates is a brazing process that uses a sputter-deposited interface material. Shirzadi et al.[9] have demonstrated bonds between stainless steel foam and a stainless steel substrate using a layer of copper-titanium filler metal that is sputtered onto the interface surfaces. The foam pieces that they bonded were approximately 10 mm in diameter and 10 mm thick with a cell size of approximately 200 {micro}m. After depositing the filler material, pressing the materials together, and heating them with an induction heater, bonds were achieved without causing significant damage to the foam. The current study also uses a sputter-deposited interface material to bond foam to a substrate. However, in contrast to previous work, the current study examines bonding microscale pieces of fragile nanoporous metal foam. In this study, a method is developed to bond a thin sheet of fragile, low-density nanoporous copper foam to an aluminum foil substrate of thickness 40 {micro}m. By sputter depositing an indium-silver alloy onto the foam and the substrate, a solder joint with a thickness of less than 2 {micro}m was achieved.

  16. Relaxor nature in lead-free Sr{sub 5}LaTi{sub 3}Nb{sub 7}O{sub 30} tetragonal tungsten bronze ceramics

    SciTech Connect (OSTI)

    Li Zhu, Xiao; Department of Materials and Ceramic Engineering, Centre for Research in Ceramics and Composite Materials, CICECO, University of Aveiro, 3810-193 Aveiro ; Li, Kun; Qiang Liu, Xiao; Ming Chen, Xiang; Asif Rafiq, Muhammad

    2013-09-28

    Lead-free tetragonal tungsten bronze Sr{sub 5}LaTi{sub 3}Nb{sub 7}O{sub 30} ceramics were prepared and the correlation of the relaxor nature and crystal structure was studied using dielectric spectroscopy and powder X-ray diffraction. Three dielectric relaxations were observed below the deviation temperature T{sub D}? 330 K. Relaxation I and II followed the Vogel-Fulcher law with the freezing temperatures of 189 K and ?90 K. Low temperature relaxation III, which was first observed in filled tungsten bronze, followed well the Arrhenius law. Dielectric response becomes static below 50 K. Polarization-field (P-E) hysteresis loops were evaluated from 183 K to 298 K. P{sub r} value of 0.41?C/cm{sup 2} was observed at 183 K. Deviation of lattice parameter c from the linear contraction and increasing of tetragonality (c/a ratio) were observed below T{sub D}, reflecting the structure change during the formation of polar nanoregions and the following freezing process. Opposite tendency was observed below 100 K for all the lattice parameters, corresponding to relaxation III. Generally, the main dielectric relaxation I and II were attributed to flipping and breathing of polar nanoregions along c axis, while the concerted rotations of the oxygen octahedra in the ab plane were suggested as the origin of relaxation III.

  17. Improvement of the piezoelectric properties in (K,Na)NbO{sub 3}-based lead-free piezoelectric ceramic with two-phase co-existing state

    SciTech Connect (OSTI)

    Yamada, H. Matsuoka, T.; Kozuka, H.; Yamazaki, M.; Ohbayashi, K.; Ida, T.

    2015-06-07

    Two phases of (K,Na)NbO{sub 3} (KNN) co-exist in a KNN-based composite lead-free piezoelectric ceramic 0.910(K{sub 1−x}Na{sub x}){sub 0.86}Ca{sub 0.04}Li{sub 0.02}Nb{sub 0.85}O{sub 3−δ}–0.042K{sub 0.85}Ti{sub 0.85}Nb{sub 1.15}O{sub 5} –0.036BaZrO{sub 3}–0.0016Co{sub 3}O{sub 4}– 0.0025Fe{sub 2}O{sub 3}–0.0069ZnO system, over a wide range of Na fractions, where 0.56 ≤ x ≤ 0.75. The crystal systems of the two KNN phases are identified to tetragonal and orthorhombic by analyzing the synchrotron powder X-ray diffraction (XRD) data, high-resolution transmission electron microscopy (HR-TEM), and selected-area electron diffraction (SAD). In the range 0.33 ≤ x ≤ 0.50, the main component of the composite system is found to be single-phase KNN with a tetragonal structure. Granular nanodomains of the orthorhombic phase dispersed in the tetragonal matrix have been identified by HR-TEM and SAD for 0.56 ≤ x ≤ 0.75. Only a trace amount of the orthorhombic phase has been found in the SAD patterns at the composition x = 0.56. However, the number of orthorhombic nanodomains gradually increases with increasing Na content up to x < 0.75, as observed from the HR-TEM images. An abrupt increase and agglomeration of the nanodomains are observed at x = 0.75, where weak diffraction peaks of the orthorhombic phase have also become detectable from the XRD data. The maximum value of the electromechanical coupling coefficient, k{sub p} = 0.56, has been observed at the composition x = 0.56.

  18. Characterizing performances of solder paste printing process at flexible manufacturing lines

    SciTech Connect (OSTI)

    Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

    2015-02-03

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

  19. Giant strain with ultra-low hysteresis and high temperature stability in grain oriented lead-free K₀̣₅Bi₀̣₅TiO₃-BaTiO₃-Na₀̣₅Bi₀̣₅TiO₃ piezoelectric materials

    DOE Public Access Gateway for Energy & Science Beta (PAGES Beta)

    Maurya, Deepam; Zhou, Yuan; Wang, Yaojin; Yan, Yongke; Li, Jiefang; Viehland, Dwight; Priya, Shashank

    2015-02-26

    We synthesized grain-oriented lead-free piezoelectric materials in (K₀̣₅Bi₀̣₅TiO₃-BaTiO₃-xNa₀̣₅Bi₀̣₅TiO₃ (KBT-BT-NBT) system with high degree of texturing along the [001]c (c-cubic) crystallographic orientation. We demonstrate giant field induced strain (~0.48%) with an ultra-low hysteresis along with enhanced piezoelectric response (d₃₃ ~ 190pC/N) and high temperature stability (~160°C). Transmission electron microscopy (TEM) and piezoresponse force microscopy (PFM) results demonstrate smaller size highly ordered domain structure in grain-oriented specimen relative to the conventional polycrystalline ceramics. The grain oriented specimens exhibited a high degree of non-180° domain switching, in comparison to the randomly axed ones. These results indicate the effective solution to the lead-free piezoelectricmore » materials.« less

  20. Giant strain with ultra-low hysteresis and high temperature stability in grain oriented lead-free K???Bi???TiO?-BaTiO?-Na???Bi???TiO? piezoelectric materials

    SciTech Connect (OSTI)

    Maurya, Deepam; Zhou, Yuan; Wang, Yaojin; Yan, Yongke; Li, Jiefang; Viehland, Dwight; Priya, Shashank

    2015-02-26

    We synthesized grain-oriented lead-free piezoelectric materials in (K???Bi???TiO?-BaTiO?-xNa???Bi???TiO? (KBT-BT-NBT) system with high degree of texturing along the [001]c (c-cubic) crystallographic orientation. We demonstrate giant field induced strain (~0.48%) with an ultra-low hysteresis along with enhanced piezoelectric response (d?? ~ 190pC/N) and high temperature stability (~160C). Transmission electron microscopy (TEM) and piezoresponse force microscopy (PFM) results demonstrate smaller size highly ordered domain structure in grain-oriented specimen relative to the conventional polycrystalline ceramics. The grain oriented specimens exhibited a high degree of non-180 domain switching, in comparison to the randomly axed ones. These results indicate the effective solution to the lead-free piezoelectric materials.

  1. Process for reducing series resistance of solar cell metal contact systems with a soldering flux etchant

    DOE Patents [OSTI]

    Coyle, R. T.; Barrett, Joy M.

    1984-01-01

    Disclosed is a process for substantially reducing the series resistance of a solar cell having a thick film metal contact assembly thereon while simultaneously removing oxide coatings from the surface of the assembly prior to applying solder therewith. The process includes applying a flux to the contact assembly and heating the cell for a period of time sufficient to substantially remove the series resistance associated with the assembly by etching the assembly with the flux while simultaneously removing metal oxides from said surface of said assembly.

  2. Determination of crystallographic orientation of lead-free piezoelectric (K,Na)NbO{sub 3} epitaxial thin films grown on SrTiO{sub 3} (100) surfaces

    SciTech Connect (OSTI)

    Yu, Qi; Zhu, Fang-Yuan; Cheng, Li-Qian; Wang, Ke; Li, Jing-Feng

    2014-03-10

    Crystallographic structure of sol-gel-processed lead-free (K,Na)NbO{sub 3} (KNN) epitaxial films on [100]-cut SrTiO{sub 3} single-crystalline substrates was investigated for a deeper understanding of its piezoelectric response. Lattice parameter measurement by high-resolution X-ray diffraction and transmission electron microscopy revealed that the orthorhombic KNN films on SrTiO{sub 3} (100) surfaces are [010] oriented (b-axis-oriented) rather than commonly identified c-axis orientation. Based on the crystallographic orientation and corresponding ferroelectric domain structure investigated by piezoresponse force microscopy, the superior piezoelectric property along b-axis of epitaxial KNN films than other orientations can be explained.

  3. Dual-enhancement of ferro-/piezoelectric and photoluminescent performance in Pr{sup 3+} doped (K{sub 0.5}Na{sub 0.5})NbO{sub 3} lead-free ceramics

    SciTech Connect (OSTI)

    Wei, Yongbin; Jia, Yanmin E-mail: ymjia@zjnu.edu.cn; Wu, Jiang; Shen, Yichao; Wu, Zheng E-mail: ymjia@zjnu.edu.cn; Luo, Haosu

    2014-07-28

    A mutual enhancement action between the ferro-/piezoelectric polarization and the photoluminescent performance of rare earth Pr{sup 3+} doped (K{sub 0.5}Na{sub 0.5})NbO{sub 3} (KNN) lead-free ceramics is reported. After Pr{sup 3+} doping, the KNN ceramics exhibit the maximum enhancement of ?1.2 times in the ferroelectric remanent polarization strength and ?1.25 times in the piezoelectric coefficient d{sub 33}, respectively. Furthermore, after undergoing a ferro-/piezoelectric polarization treatment, the maximum enhancement of ?1.3 times in photoluminescence (PL) was observed in the poled 0.3% Pr{sup 3+} doped sample. After the trivalent Pr{sup 3+} unequivalently substituting the univalent (K{sub 0.5}Na{sub 0.5}){sup +}, A-sites ionic vacancies will occur to maintain charge neutrality, which may reduce the inner stress and ease the domain wall motions, yielding to the enhancement in ferro-/piezoelectric performance. The polarization-induced enhancement in PL is attributed to the decrease of crystal symmetry abound the Pr{sup 3+} ions after polarization. The dual-enhancement of the ferro-/piezoelectric and photoluminescent performance makes the Pr{sup 3+} doped KNN ceramic hopeful for piezoelectric/luminescent multifunctional devices.

  4. Electrical properties of (1?x)(Bi{sub 0.5}Na{sub 0.5})TiO{sub 3}xKNbO{sub 3} lead-free ceramics

    SciTech Connect (OSTI)

    Jiang, Xijie; Wang, Baoyin; Luo, Laihui; Li, Weiping; Zhou, Jun; Chen, Hongbing

    2014-05-01

    In this investigation, a simple compound (1?x)(Bi{sub 0.5}Na{sub 0.5})TiO{sub 3}xKNbO{sub 3} (BNTxKN, x=00.08) lead-free ceramics were synthesized successfully by conventional solid state reaction method. The piezoelectric, dielectric and ferroelectric characteristics of the ceramics were investigated and discussed. The results shows that moderate KN addition can enhance the piezoelectric response without an obvious decline of ferroelectric properties. The largest piezoelectric response is obtained in BNT0.05KN, whereas largest electric-field-induced strain is obtained in BNT0.06KN. An effective d{sub 33}{sup eff} of ?400 pC/N calculated from electric-field-induced strain is obtained in BNT0.06KN. The present investigation demonstrates that addition KN effectively reduces the depolarization temperature of the BNTxKN ceramics. The electrical properties of the ceramics are tightly related to their depolarization temperature. - Graphical abstract: Unipolar electric-field-induced strain for the BNTxKN ceramics. A maximum strain of 0.28% is achieved with a low field in BNT0.06KN. - Highlights: Moderate KNbO{sub 3} addition enhances the piezoelectric properties of the ceramics. A maximum strain of 0.28% is achieved with a low field. A large piezoelectric response is achieved in 0.95(Bi{sub 0.5}Na{sub 0.5})TiO{sub 3}0.05KNbO{sub 3}. The electrical properties are tightly related to the depolarization temperature T{sub d}.

  5. Contributions of stress and oxidation on the formation of whiskers in Pb-free solders

    SciTech Connect (OSTI)

    Duncan, A. J.; Hoffman, E. N.

    2016-01-01

    Understanding the environmental factors influencing formation of tin whiskers on electrodeposited lead free, tin coatings over copper (or copper containing) substrates is the topic of this study . An interim report* summarized initial observations as to the role of stress and oxide formation on whisker growth. From the initial results, two main areas were chosen to be the focus of additional research: the demonstration of effects of elastic stress state in the nucleation of whiskers and the confirmation of the effect of oxygen content in the formation of whiskers. Different levels of elastic stress were induced with the incorporation of a custom designed fixture that loaded the sample in a four-point bending configuration and were maintained in an environmental chamber under conditions deemed favorable for whisker growth. The effects of oxygen content were studied by aging substrates in gas vials of varying absolute pressure and different oxygen partial pressure.

  6. Strategy for stabilization of the antiferroelectric phase (Pbma) over the metastable ferroelectric phase (P2{sub 1}ma) to establish double loop hysteresis in lead-free (1−x)NaNbO{sub 3}-xSrZrO{sub 3} solid solution

    SciTech Connect (OSTI)

    Guo, Hanzheng Randall, Clive A.; Shimizu, Hiroyuki; Mizuno, Youichi

    2015-06-07

    A new lead-free antiferroelectric solid solution system, (1−x)NaNbO{sub 3}-xSrZrO{sub 3}, was rationalized through noting the crystal chemistry trend, of decreasing the tolerance factor and an increase in the average electronegativity of the system. The SrZrO{sub 3} doping was found to effectively stabilize the antiferroelectric (P) phase in NaNbO{sub 3} without changing its crystal symmetry. Preliminary electron diffraction and polarization measurements were presented which verified the enhanced antiferroelectricity. In view of our recent report of another lead-free antiferroelectric system (1−x)NaNbO{sub 3}-xCaZrO{sub 3} [H. Shimizu et al. “Lead-free antiferroelectric: xCaZrO{sub 3} - (1−x)NaNbO{sub 3} system (0 ≤ x ≤ 0.10),” Dalton Trans. (published online)], the present results point to a general strategy of utilizing tolerance factor to develop a broad family of new lead-free antiferroelectrics with double polarization hysteresis loops. We also speculate on a broad family of possible solid solutions that could be identified and tested for this important type of dielectric.

  7. Gelatin based on Power-gel.TM. as solders for Cr.sup.4+laser tissue welding and sealing of lung air leak and fistulas in organs

    DOE Patents [OSTI]

    Alfano, Robert R.; Tang, Jing; Evans, Jonathan M.; Ho, Peng Pei

    2006-04-25

    Laser tissue welding can be achieved using tunable Cr.sup.4+ lasers, semiconductor lasers and fiber lasers, where the weld strength follows the absorption spectrum of water. The use of gelatin and esterified gelatin as solders in conjunction with laser inducted tissue welding impart much stronger tensile and torque strengths than albumin solders. Selected NIR wavelength from the above lasers can improve welding and avoid thermal injury to tissue when used alone or with gelatin and esterified gelatin solders. These discoveries can be used to enhance laser tissue welding of tissues such as skin, mucous, bone, blood vessel, nerve, brain, liver, pancreas, spleen, kidney, lung, bronchus, respiratory track, urinary tract, gastrointestinal tract, or gynecologic tract and as a sealant for pulmonary air leaks and fistulas such as intestinal, rectal and urinary fistulas.

  8. Process for reducing series resistance of solar-cell metal-contact systems with a soldering-flux etchant

    DOE Patents [OSTI]

    Coyle, R.T.; Barrett, J.M.

    1982-05-04

    Disclosed is a process for substantially reducing the series resistance of a solar cell having a thick film metal contact assembly thereon while simultaneously removing oxide coatings from the surface of the assembly prior to applying solder therewith. The process includes applying a flux to the contact assembly and heating the cell for a period of time sufficient to substantially remove the series resistance associated with the assembly by etching the assembly with the flux while simultaneously removing metal oxides from said surface of said assembly.

  9. A new Bi{sub 0.5}Na{sub 0.5}TiO{sub 3} based lead-free piezoelectric system with calculated end-member Bi(Zn{sub 0.5}Hf{sub 0.5})O{sub 3}

    SciTech Connect (OSTI)

    Liu, Feng; Wahyudi, Olivia; Li, Yongxiang

    2014-03-21

    The phase structure, dielectric and piezoelectric properties of a new lead-free piezoelectric system (1???x)Bi{sub 0.5}Na{sub 0.5}TiO{sub 3}xBi(Zn{sub 0.5}Hf{sub 0.5})O{sub 3} [(1???x)BNTxBZH, x?=?0, 0.01, 0.02, 0.03, and 0.04] were investigated. The structure of Bi(Zn{sub 0.5}Hf{sub 0.5})O{sub 3} was calculated using first-principles method and (1???x)BNTxBZH ceramics were fabricated by conventional solid-state process. At room temperature, a morphotropic phase boundary (MPB) from rhombohedral to pseudocubic is identified near x?=?0.02 by the analysis of X-ray diffraction patterns. The ceramics with MPB near room temperature exhibit excellent electrical properties: the Curie temperature, maximum polarization, remnant polarization, and coercive field are 340?C, 56.3??C/cm{sup 2}, 43.5??C/cm{sup 2}, and 5.4?kV/mm, respectively, while the maximum positive bipolar strain and piezoelectric coefficient are 0.09% and 92 pC/N, respectively. In addition, a linear relationship between the MPB phase boundary composition and the calculated tetragonality of non-BNT end-member was demonstrated. Thus, this study not only shows a new BNT-based lead-free piezoelectric system but also suggest a new way to predict the composition at MPB a priori when designing new lead-free piezoelectric system.

  10. Ames Lab 101: Technology Transfer

    ScienceCinema (OSTI)

    Covey, Debra

    2012-08-29

    Ames Laboratory Associate Laboratory Director, Sponsored Research Administration, Debra Covey discusses technology transfer. Covey also discusses Ames Laboratory's most successful transfer, lead-free solder.

  11. Mechanical Behavior of Indium Nanostructures

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Mechanical Behavior of Indium Nanostructures Print Indium is a key material in lead-free solder applications for microelectronics due to its excellent wetting properties, extended...

  12. ALSNews Vol. 309

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Nanostructures Indium is a key material in lead-free solder applications for microelectronics due to its excellent wetting properties, extended ductility, and high electrical...

  13. Mechanical Behavior of Indium Nanostructures

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Print Indium is a key material in lead-free solder applications for microelectronics due to its excellent wetting properties, extended ductility, and high electrical...

  14. Structural, ferroelectric and magnetic study of lead free (Na{sub 0.5}Bi{sub 0.5}){sub 1-x}La{sub x}Ti{sub 0.988}Fe{sub 0.012}O{sub 3} (x=0,0.01,0.03,0.05) ceramic

    SciTech Connect (OSTI)

    Parmar, Kusum Sharma, Anshu; Sharma, Hakikat; Negi, N. S.

    2015-05-15

    Lead free (Na{sub 0.5}Bi{sub 0.5}){sub 1-x}La{sub x}Ti{sub 0.988}Fe{sub 0.012}O{sub 3} ceramic having compositions (x=0, 0.01, 0.03, 0.05) has been prepared by sol gel method using citric acid. Structural analysis has been done by X-ray diffraction and FTIR measurements. XRD patterns have been confirmed perovskite structure for all samples. FTIR absorption band at around ?630?cm{sup ?1} is observed for all samples which confirm perovskite phase formation in samples. With increasing La concentration, shifting in XRD peaks and FTIR absorption bands is observed which suggests incorporation of La on A-site in prepared (Na{sub 0.5}Bi{sub 0.5}){sub 1-x}La{sub x}Ti{sub 0.988}Fe{sub 0.012}O{sub 3} samples. Effect of La substitution on Ferroelectric (Polarization vs. Electric field) and Magnetic (Magnetization vs. Magnetic field) properties have been studied at room temperature. All samples exhibit weak ferromagnetic order and also possess ferroelectric behavior which provides new insight to lead free single phase multiferroic materials.

  15. Effect of composition on electrical properties of lead-free Bi{sub 0.5}(Na{sub 0.80}K{sub 0.20}){sub 0.5}TiO{sub 3}-(Ba{sub 0.98}Nd{sub 0.02})TiO{sub 3} piezoelectric ceramics

    SciTech Connect (OSTI)

    Jaita, Pharatree; Watcharapasorn, Anucha; Jiansirisomboon, Sukanda

    2013-07-14

    Lead-free piezoelectric ceramics with the composition of (1-x)Bi{sub 0.5}(Na{sub 0.80}K{sub 0.20}){sub 0.5}TiO{sub 3}-x(Ba{sub 0.98}Nd{sub 0.02})TiO{sub 3} or (1-x) BNKT-xBNdT (with x = 0-0.20 mol fraction) have been synthesized by a conventional mixed-oxide method. The compositional dependence of phase structure and electrical properties of the ceramics were systemically studied. The optimum sintering temperature of all BNKT-BNdT ceramics was found to be 1125 Degree-Sign C. X-ray diffraction pattern suggested that BNdT effectively diffused into BNKT lattice during sintering to form a solid solution with a perovskite structure. Scanning electron micrographs showed a slight reduction of grain size when BNdT was added. It was found that BNKT-0.10BNdT ceramic exhibited optimum electrical properties ({epsilon}{sub r} = 1716, tan{delta} = 0.0701, T{sub c} = 327 Degree-Sign C, and d{sub 33} = 211 pC/N), suggesting that this composition has a potential to be one of a promising lead-free piezoelectric candidate for dielectric and piezoelectric applications.

  16. An analysis of lead-free (Bi{sub 0.5}Na{sub 0.5}){sub 0.915}-(Bi{sub 0.5}K{sub 0.5}){sub 0.05}Ba{sub 0.02}Sr{sub 0.015}TiO{sub 3} ceramic for efficient refrigeration and thermal energy harvesting

    SciTech Connect (OSTI)

    Vats, Gaurav; Vaish, Rahul; Bowen, Chris R.

    2014-01-07

    This article demonstrates the colossal energy harvesting capability of a lead-free (Bi{sub 0.5}Na{sub 0.5}){sub 0.915}-(Bi{sub 0.5}K{sub 0.5}){sub 0.05}Ba{sub 0.02}Sr{sub 0.015}TiO{sub 3} ceramic using the Olsen cycle. The maximum harvestable energy density estimated for this system is found to be 1523 J/L (1523 kJ/m{sup 3}) where the results are presented for extreme ambient conditions of 20–160 °C and electric fields of 0.1–4 MV/m. This estimated energy density is 1.7 times higher than the maximum reported to date for the lanthanum-doped lead zirconate titanate (thin film) system. Moreover, this study introduces a generalized and effective solid state refrigeration cycle in contrast to the ferroelectric Ericson refrigeration cycle. The cycle is based on a temperature induced polarization change on application of an unipolar electric field to ferroelectric ceramics.

  17. Success Stories | The Ames Laboratory

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Success Stories Touching The Lives Of Billions Worldwide: Lead Free Solder A lead free solder, developed at Ames Laboratory by Iver Anderson, John Smith, Chad Miller, and Robert Terpstra with a co-inventor, Frederick Yost, at Sandia National Laboratory, combines tin, silver and copper in a novel alloy combination that is low melting, applies easily on typical metal joints, and has a reasonable cost, serving as a direct (no-cost) swap in the industrial setting. This revolutionary solder alloy

  18. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

    SciTech Connect (OSTI)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-09-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in inconsistent proportions of metal and glassy phase particles present during the subsequent firing process. The consequences were subtle, intermittent changes to the thick film microstructure that gave rise to the reaction layer and, thus, the low pull strength phenomenon. A mitigation strategy would be the use of physical vapor deposition (PVD) techniques to create thin film bond pads; this is multi-chip module, deposited (MCM-D) technology.

  19. Bright reddish-orange emission and good piezoelectric properties of Sm{sub 2}O{sub 3}-modified (K{sub 0.5}Na{sub 0.5})NbO{sub 3}-based lead-free piezoelectric ceramics

    SciTech Connect (OSTI)

    Hao, Jigong; Xu, Zhijun Chu, Ruiqing; Li, Wei; Du, Juan

    2015-05-21

    Reddish orange-emitting 0.948(K{sub 0.5}Na{sub 0.5})NbO{sub 3}-0.052LiSbO{sub 3}-xmol%Sm{sub 2}O{sub 3} (KNN-5.2LS-xSm{sub 2}O{sub 3}) lead-free piezoelectric ceramics with good piezoelectric properties were fabricated in this study, and the photoluminescence and electrical properties of the ceramics were systematically studied. Results showed that Sm{sub 2}O{sub 3} substitution into KNN-5.2LS induces a phase transition from the coexistence of orthorhombic and tetragonal phases to a pseudocubic phase and shifts the polymorphic phase transition (PPT) to below room temperature. The temperature stability and fatigue resistance of the modified ceramics were significantly improved by Sm{sub 2}O{sub 3} substitution. The KNN-5.2LS ceramic with 0.4 mol. % Sm{sub 2}O{sub 3} exhibited temperature-independent properties (25–150 °C), fatigue-free behavior (up to 10{sup 6} cycles), and good piezoelectric properties (d{sub 33}{sup * }= 230 pm/V, d{sub 33} = 176 pC/N, k{sub p} = 35%). Studies on the photoluminescence properties of the samples showed strong reddish-orange emission upon blue light excitation; these emission intensities were strongly dependent on the doping concentration and sintering temperature. The 0.4 mol. % Sm{sub 2}O{sub 3}-modified sample exhibited temperature responses over a wide temperature range of 10–443 K. The maximum sensing sensitivity of the sample was 7.5 × 10{sup −4} K at 293 K, at which point PPT occurred. A relatively long decay lifetime τ of 1.27–1.40 ms and a large quantum yield η of 0.17–0.19 were obtained from the Sm-modified samples. These results suggest that the KNN-5.2LS-xSm{sub 2}O{sub 3} system presents multifunctional properties and significant technological potential in novel multifunctional devices.

  20. Our Science Explained | The Ames Laboratory

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    The information is provided in a one-page, easy-to-read, "print-ready" pdf format. Lead-free Solder Magnetic Refrigeration Nanocatalysts Organic Light-emitting Devices (OLEDs) ...

  1. Mechanical Behavior of Indium Nanostructures

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    26 May 2010 00:00 Indium is a key material in lead-free solder applications for microelectronics due to its excellent wetting properties, extended ductility, and high electrical...

  2. Pull strength evaluation of Sn-Pb solder joints made to Au-Pt-Pd and Au thick film structures on low-temperature co-fired ceramic -final report for the MC4652 crypto-coded switch (W80).

    SciTech Connect (OSTI)

    Uribe, Fernando; Vianco, Paul Thomas; Zender, Gary L.

    2006-06-01

    A study was performed that examined the microstructure and mechanical properties of 63Sn-37Pb (wt.%, Sn-Pb) solder joints made to thick film layers on low-temperature co-fired (LTCC) substrates. The thick film layers were combinations of the Dupont{trademark} 4596 (Au-Pt-Pd) conductor and Dupont{trademark} 5742 (Au) conductor, the latter having been deposited between the 4596 layer and LTCC substrate. Single (1x) and triple (3x) thicknesses of the 4596 layer were evaluated. Three footprint sizes were evaluated of the 5742 thick film. The solder joints exhibited excellent solderability of both the copper (Cu) lead and thick film surface. In all test sample configurations, the 5742 thick film prevented side wall cracking of the vias. The pull strengths were in the range of 3.4-4.0 lbs, which were only slightly lower than historical values for alumina (Al{sub 2}O{sub 3}) substrates. General (qualitative) observations: (a) The pull strength was maximized when the total number of thick film layers was between two and three. Fewer that two layers did not develop as strong of a bond at the thick film/LTCC interface; more than three layers and of increased footprint area, developed higher residual stresses at the thick film/LTCC interface and in the underlying LTCC material that weakened the joint. (b) Minimizing the area of the weaker 4596/LTCC interface (e.g., larger 5742 area) improved pull strength. Specific observations: (a) In the presence of vias and the need for the 3x 4596 thick film, the preferred 4596:5742 ratio was 1.0:0.5. (b) For those LTCC components that require the 3x 4596 layer, but do not have vias, it is preferred to refrain from using the 5742 layer. (c) In the absence of vias, the highest strength was realized with a 1x thick 5742 layer, a 1x thick 4596 layer, and a footprint ratio of 1.0:1.0.

  3. Getting the Lead Out | U.S. DOE Office of Science (SC)

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Getting the Lead Out Stories of Discovery & Innovation Getting the Lead Out Courtesy of Ames Laboratory Figure 1. A wire (upper left) of Ames Lab lead-free solder, an alloy of tin, silver, and copper, is shown melting into a droplet at the end of a hot soldering iron (upper right). 04.08.11 Getting the Lead Out Discarded electronics no longer pose an environmental hazard from lead solder thanks to a lead-free alternative developed at the Ames Laboratory. Lead has long been recognized as a

  4. Solder Joints of Power Electronics

    Broader source: Energy.gov [DOE]

    2010 DOE Vehicle Technologies and Hydrogen Programs Annual Merit Review and Peer Evaluation Meeting, June 7-11, 2010 -- Washington D.C.

  5. Solder Joints of Power Electronics

    Broader source: Energy.gov [DOE]

    2009 DOE Hydrogen Program and Vehicle Technologies Program Annual Merit Review and Peer Evaluation Meeting, May 18-22, 2009 -- Washington D.C.

  6. Lead-free and lead-based ABO3 perovskite relaxors with mixed...

    Office of Scientific and Technical Information (OSTI)

    ... Virginia Polytechnic Institute and State University Virginia Polytechnic Institute and State University National Institute of Standards and Technology (NIST), Gaithersburg, MD ...

  7. Tailoring of unipolar strain in lead-free piezoelectrics using the ceramic/ceramic composite approach

    SciTech Connect (OSTI)

    Khansur, Neamul H.; Daniels, John E.; Groh, Claudia; Jo, Wook; Webber, Kyle G.; Reinhard, Christina; Kimpton, Justin A.

    2014-03-28

    The electric-field-induced strain response mechanism in a polycrystalline ceramic/ceramic composite of relaxor and ferroelectric materials has been studied using in situ high-energy x-ray diffraction. The addition of ferroelectric phase material in the relaxor matrix has produced a system where a small volume fraction behaves independently of the bulk under an applied electric field. Inter- and intra-grain models of the strain mechanism in the composite material consistent with the diffraction data have been proposed. The results show that such ceramic/ceramic composite microstructure has the potential for tailoring properties of future piezoelectric materials over a wider range than is possible in uniform compositions.

  8. Thermodynamic and nonstoichiometric behavior of the lead-doped and lead-free Bi-2212 systems

    SciTech Connect (OSTI)

    Tetenbaum, M.; Hash, M.; Tani, B.S.; Luo, J.S.; Maroni, V.A.

    1997-02-01

    EMF measurements of oxygen fugacities as a function of stoichiometry were made on pb-doped and Pb-free superconducting ceramics at 700-815 C using oxygen titration. Equations of oxygen partial pressure vs composition and temperature were derived from the EMF measurements. Thermodynamic assessments of the partial molar quantities {Delta}{bar H}(O{sub 2}) and {Delta}{bar S}(O{sub 2}) for Pb-doped Bi- 2212 and Pb-free Bi-2212 indicate that the solid-state decomposition of these Bi cuprates at low oxygen partial pressure can be represented by the diphasic CuO-Cu{sub 2}O system. Comparison of these results with Pb-doped Bi-2223 in powder and silver sheath form is presented.

  9. Savannah River National Laboratory

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Savannah River National Laboratory srnl.doe.gov SRNL is a DOE National Laboratory operated by Savannah River Nuclear Solutions. At a glance 'Tin whiskers' suppression method Researchers at the Savannah River National Laboratory (SRNL) have identified a treatment method that slows or prevents the formation of whiskers in lead-free solder. Tin whiskers spontaneously grow from thin films of tin, often found in microelectronic devices in the form of solders and platings. Background This problem was

  10. The Ames Laboratory Creating Materials and Energy Solutions

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Steve Karsjen, Director, Public Affairs 111 TASF Ames, IA 50011 director@ameslab.gov 515-294-5643 WORLD-CHANGING SCIENCE The Ames Laboratory is a nationwide leader in understanding, designing and creating new materials to secure our energy future, such as developing better magnetic materials for wind turbines and hybrid cars, and improving catalysts for biofuel production. Ames Laboratory's science has global impact on our energy security and our environment. Lead-free solder: Our lead-free

  11. After 15 Years, A New Top Earning Patent At Ames Lab | Department of Energy

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    After 15 Years, A New Top Earning Patent At Ames Lab After 15 Years, A New Top Earning Patent At Ames Lab January 20, 2012 - 11:32am Addthis Ames Laboratory senior metallurgist Iver Anderson explains the importance of lead-free solder in taking hazardous lead out of the environment by eliminating it from discarded computers and electronics that wind up in landfills. Anderson led a team that developed a tin-silver-copper replacement for traditional lead solder that has been adopted by more than

  12. After 5 Years, NERSC's Franklin Retires

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    After 15 Years, A New Top Earning Patent At Ames Lab After 15 Years, A New Top Earning Patent At Ames Lab January 20, 2012 - 11:32am Addthis Ames Laboratory senior metallurgist Iver Anderson explains the importance of lead-free solder in taking hazardous lead out of the environment by eliminating it from discarded computers and electronics that wind up in landfills. Anderson led a team that developed a tin-silver-copper replacement for traditional lead solder that has been adopted by more than

  13. Mechanical Behavior of Indium Nanostructures

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Mechanical Behavior of Indium Nanostructures Print Indium is a key material in lead-free solder applications for microelectronics due to its excellent wetting properties, extended ductility, and high electrical conductivity. With the size of electronic devices continuing to shrink and the promise of indium-based nanotechnologies, it is important to develop a fundamental understanding of this material's small-scale mechanical properties and reliability. Researchers from the University of

  14. Mechanical Behavior of Indium Nanostructures

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Mechanical Behavior of Indium Nanostructures Print Indium is a key material in lead-free solder applications for microelectronics due to its excellent wetting properties, extended ductility, and high electrical conductivity. With the size of electronic devices continuing to shrink and the promise of indium-based nanotechnologies, it is important to develop a fundamental understanding of this material's small-scale mechanical properties and reliability. Researchers from the University of

  15. Mechanical Behavior of Indium Nanostructures

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Mechanical Behavior of Indium Nanostructures Print Indium is a key material in lead-free solder applications for microelectronics due to its excellent wetting properties, extended ductility, and high electrical conductivity. With the size of electronic devices continuing to shrink and the promise of indium-based nanotechnologies, it is important to develop a fundamental understanding of this material's small-scale mechanical properties and reliability. Researchers from the University of

  16. Mechanical Behavior of Indium Nanostructures

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Mechanical Behavior of Indium Nanostructures Print Indium is a key material in lead-free solder applications for microelectronics due to its excellent wetting properties, extended ductility, and high electrical conductivity. With the size of electronic devices continuing to shrink and the promise of indium-based nanotechnologies, it is important to develop a fundamental understanding of this material's small-scale mechanical properties and reliability. Researchers from the University of

  17. Mechanical Behavior of Indium Nanostructures

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Mechanical Behavior of Indium Nanostructures Print Indium is a key material in lead-free solder applications for microelectronics due to its excellent wetting properties, extended ductility, and high electrical conductivity. With the size of electronic devices continuing to shrink and the promise of indium-based nanotechnologies, it is important to develop a fundamental understanding of this material's small-scale mechanical properties and reliability. Researchers from the University of

  18. Mechanical Behavior of Indium Nanostructures

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Mechanical Behavior of Indium Nanostructures Mechanical Behavior of Indium Nanostructures Print Wednesday, 26 May 2010 00:00 Indium is a key material in lead-free solder applications for microelectronics due to its excellent wetting properties, extended ductility, and high electrical conductivity. With the size of electronic devices continuing to shrink and the promise of indium-based nanotechnologies, it is important to develop a fundamental understanding of this material's small-scale

  19. Mechanical Behavior of Indium Nanostructures

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Mechanical Behavior of Indium Nanostructures Print Indium is a key material in lead-free solder applications for microelectronics due to its excellent wetting properties, extended ductility, and high electrical conductivity. With the size of electronic devices continuing to shrink and the promise of indium-based nanotechnologies, it is important to develop a fundamental understanding of this material's small-scale mechanical properties and reliability. Researchers from the University of

  20. Mechanical Behavior of Indium Nanostructures

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Mechanical Behavior of Indium Nanostructures Print Indium is a key material in lead-free solder applications for microelectronics due to its excellent wetting properties, extended ductility, and high electrical conductivity. With the size of electronic devices continuing to shrink and the promise of indium-based nanotechnologies, it is important to develop a fundamental understanding of this material's small-scale mechanical properties and reliability. Researchers from the University of

  1. Electro-caloric effect in lead-free Sn doped BaTiO{sub 3} ceramics at room temperature and low applied fields

    SciTech Connect (OSTI)

    Upadhyay, Sanjay Kumar; Reddy, V. Raghavendra E-mail: vrreddy@csr.res.in; Bag, Pallab; Rawat, R.; Gupta, S. M.; Gupta, Ajay

    2014-09-15

    Structural, dielectric, ferroelectric (FE), {sup 119}Sn Mössbauer, and specific heat measurements of polycrystalline BaTi{sub 1–x}Sn{sub x}O{sub 3} (x = 0% to 15%) ceramics are reported. Phase purity and homogeneous phase formation with Sn doping is confirmed from x-ray diffraction and {sup 119}Sn Mössbauer measurements. With Sn doping, the microstructure is found to change significantly. Better ferroelectric properties at room temperature, i.e., increased remnant polarization (38% more) and very low field switchability (225% less) are observed for x = 5% sample as compared to other samples and the results are explained in terms of grain size effects. With Sn doping, merging of all the phase transitions into a single one is observed for x ≥ 10% and for x = 5%, the tetragonal to orthorhombic transition temperature is found close to room temperature. As a consequence better electro-caloric effects are observed for x = 5% sample and therefore is expected to satisfy the requirements for non-toxic, low energy (field) and room temperature based applications.

  2. Impacts of Cooling Technology on Solder Fatigue for Power Modules in Electric Traction Drive Vehicles: Preprint

    SciTech Connect (OSTI)

    O'Keefe, M.; Vlahinos, A.

    2009-08-01

    Describes three power module cooling topologies for electric traction drive vehicles: two advanced options using jet impingement cooling and one option using pin-fin liquid cooling.

  3. Temperature driven nano-domain evolution in lead-free Ba(Zr{sub 0.2}Ti{sub 0.8})O{sub 3}-50(Ba{sub 0.7}Ca{sub 0.3})TiO{sub 3} piezoceramics

    SciTech Connect (OSTI)

    Lu, Shengbo Xu, Zhengkui; Su, Shi; Zuo, Ruzhong

    2014-07-21

    Hierarchical micro- and nanoscale domain structures in Pb-free Ba(Zr{sub 0.2}Ti{sub 0.8})O{sub 3}-50(Ba{sub 0.7}Ca{sub 0.3})TiO{sub 3} piezoceramics were investigated by transmission electron microscopy. In situ heating and cooling studies of domain structure evolution reveal an irreversible domain transformation from a wedge-shaped rhombohedral nanodomain structure to a lamellar tetragonal domain structure, which could be associated with strong piezoelectricity in Ba(Zr{sub 0.2}Ti{sub 0.8})O{sub 3}-50(Ba{sub 0.7}Ca{sub 0.3})TiO{sub 3} piezoceramics.

  4. Phase transitions and the piezoelectricity around morphotropic phase boundary in Ba(Zr{sub 0.2}Ti{sub 0.8})O{sub 3}-x(Ba{sub 0.7}Ca{sub 0.3})TiO{sub 3} lead-free solid solution

    SciTech Connect (OSTI)

    Zhang, Le; Zhang, Ming; Wang, Liang; Zhou, Chao; Zhang, Zhen; Yao, Yonggang; Zhang, Lixue; Xue, Dezhen E-mail: xlou03@mail.xjtu.edu.cn Lou, Xiaojie E-mail: xlou03@mail.xjtu.edu.cn; Ren, Xiaobing E-mail: xlou03@mail.xjtu.edu.cn

    2014-10-20

    In this paper, two displacive phase transitions around the morphotropic phase boundary (MPB) in Ba(Zr{sub 0.2}Ti{sub 0.8})O{sub 3}-x(Ba{sub 0.7}Ca{sub 0.3})TiO{sub 3} (BZT-xBCT) ceramics were detected by inspecting two anomalies of the Raman Ti{sup 4+}-O{sup 2−} longitudinal optical mode (∼725 cm{sup −1}). Further, permittivity and X-ray diffraction results demonstrated these two phase transitions originate from tetragonal (T) to rhombohedral (R) through an intermediate orthorhombic (O) phase. Importantly, we found that the maximum piezoelectric response (d{sub 33} = 545pC/N) was achieved at the boundary between the T and O phase, indicating that the giant piezoelectricity of BZT-xBCT may mainly stem from the T-O phase boundary due to easier polarization rotation and larger lattice softening.

  5. Multiwire conductor having increased interwire resistance and good mechanical stability and method for making same

    DOE Patents [OSTI]

    Luhman, Thomas; Klamut, Carl

    1984-02-14

    An improved multiwire conductor of the type which is mechanically stabilized by a solder filler. A solder filled conductor is heated to a temperature sufficient to make the solder brittle, but below the melting point of the solder. While still hot, the conductor is flexed, causing the solder to separate from the wires comprising the conductor, thereby increasing the interwire resistance. In one embodiment the conductor may be heated to a temperature above the eutectic temperature of the solder so that a controlled amount of solder is removed. The subject invention is particularly suited for use with braided, ribbon-type, solder filled superconductors.

  6. USSR report: Materials science and metallurgy, [November 7, 1986

    SciTech Connect (OSTI)

    1986-11-07

    Partial contents include: Analysis and Testing, Coatings, Corrosion, Ferrous Metals, Nonferrous Metals and Alloys ;Brazes and Solders, Nonmetallic Materials, Preparation, Treatments, Welding, Brazing and Soldering.

  7. Multiwire conductor having increased interwire resistance and good mechanical stability and method for making same

    DOE Patents [OSTI]

    Luhman, T.; Klamut, C.

    1982-03-15

    An improved multiwire conductor of the type which is mechanically stabilized by a solder filler. A solder filled conductor is heated to a temperature sufficient to make the solder brittle, but below the melting point of the solder. While still hot, the conductor is flexed, causing the solder to separate from the wires comprising the conductor, thereby increasing the interwire resistance. In one embodiment the conductor may be heated to a temperature above the eutectic temperature of the solder so that a controlled amount of solder is removed. The subject invention is particularly suited for use with braided, ribbon-type, solder filled superconductors.

  8. CONTACT INFORMATION: Steve Karsjen Public Affairs Manager

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Manager karsjen@ameslab.gov 515.294.5643 111 TASF, Ames, IA 50011 Solder is the glue that holds many of our gadgets together. Unfortunately, much of the solder used today is made...

  9. Multiwire conductor having greatly increased interwire resistance and method for making same

    DOE Patents [OSTI]

    Luhman, Thomas; Suenaga, Masaki

    1984-01-17

    An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu.sub.5 Sn.sub.6 with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.

  10. Multiwire conductor having greatly increased interwire resistance and method for making same

    DOE Patents [OSTI]

    Luhman, T.; Suenaga, M.

    1982-03-15

    An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler is described. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu/sub 5/Sn/sub 6/ with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.

  11. Removal of aqueous rinsable flux residues in a batch spray dishwater

    SciTech Connect (OSTI)

    Slanina, J.T.

    1992-02-01

    An alkaline detergent solution used in an industrial dishwasher was evaluated to remove aqueous rinsable flux residues on printed wiring boards (PWBs) after hot air solder leveling and hot oil solder dip and leveling. The dishwasher, a batch cleaning process, was compared to an existing conveyorized aqueous cleaning process. The aqueous soluble flux residues from both soldering processes were removed with a solution of a mild alkaline detergent dissolved in hot deionized (DI) water.

  12. Stainless Steel Hotplate Heater for Long Objects --- Inventor...

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    and Hans Schneider This is an invention to aid soldering large conductors. High electrical current is passed through a stainless steel plate longer and slightly wider...

  13. Shenmao Technology | Open Energy Information

    Open Energy Info (EERE)

    Shenmao Technology Jump to: navigation, search Name: Shenmao Technology Place: Taoyuan, Taiwan Zip: 328 Product: Maker of solder paste and PV ribbons. Coordinates: 25.001909,...

  14. Vehicle Technologies Office: Laboratory Facilities and Collaborative...

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    ... Equipment for synthesizing samples, including a vacuum oven, ability to use the hot-press technique for synthesizing bonded interfaces (such as solders, sintered silver and ...

  15. Method for optical and mechanically coupling optical fibers

    DOE Patents [OSTI]

    Toeppen, J.S.

    1996-10-01

    A method and apparatus are disclosed for splicing optical fibers. A fluorescing solder glass frit having a melting point lower than the melting point of first and second optical fibers is prepared. The solder glass frit is then attached to the end of the first optical fiber and/or the end of the second optical fiber. The ends of the optical fibers are aligned and placed in close proximity to each other. The solder glass frit is then heated to a temperature which is lower than the melting temperature of the first and second optical fibers, but which is high enough to melt the solder glass frit. A force is applied to the first and second optical fibers pushing the ends of the fibers towards each other. As the solder glass flit becomes molten, the layer of molten solder glass is compressed into a thin layer between the first and second optical fibers. The thin compressed layer of molten solder glass is allowed to cool such that the first and second optical fibers are bonded to each other by the hardened layer of solder glass. 6 figs.

  16. Method for optical and mechanically coupling optical fibers

    DOE Patents [OSTI]

    Toeppen, John S. (Livermore, CA)

    1996-01-01

    A method and apparatus for splicing optical fibers. A fluorescing solder glass frit having a melting point lower than the melting point of first and second optical fibers is prepared. The solder glass frit is then attached to the end of the first optical fiber and/or the end of the second optical fiber. The ends of the optical fibers are aligned and placed in close proximity to each other. The solder glass frit is then heated to a temperature which is lower than the melting temperature of the first and second optical fibers, but which is high enough to melt the solder glass frit. A force is applied to the first and second optical fibers pushing the ends of the fibers towards each other. As the solder glass flit becomes molten, the layer of molten solder glass is compressed into a thin layer between the first and second optical fibers. The thin compressed layer of molten solder glass is allowed to cool such that the first and second optical fibers are bonded to each other by the hardened layer of solder glass.

  17. METHOD FOR JOINING ALUMINUM TO STAINLESS STEEL

    DOE Patents [OSTI]

    Lemon, L.C.

    1960-05-24

    Aluminum may be joined to stainless steel without the use of flux by tinning the aluminum with a tin solder containing 1% silver and 1% lead, tinning the stainless steel with a 50% lead 50% tin solder, and then sweating the tinned surfaces together.

  18. Methods of making metallic glass foil laminate composites

    DOE Patents [OSTI]

    Vianco, Paul T.; Fisher, Robert W.; Hosking, Floyd M.; Zanner, Frank J.

    1996-01-01

    A process for the fabrication of a rapidly solidified foil laminate composite. An amorphous metallic glass foil is flux treated and coated with solder. Before solidification of the solder the foil is collected on a take-up spool which forms the composite into a solid annular configuration. The resulting composite exhibits high strength, resiliency and favorable magnetic and electrical properties associated with amorphous materials. The composite also exhibits bonding strength between the foil layers which significantly exceeds the bulk strength of the solder alone.

  19. Methods of making metallic glass foil laminate composites

    DOE Patents [OSTI]

    Vianco, P.T.; Fisher, R.W.; Hosking, F.M.; Zanner, F.J.

    1996-08-20

    A process for the fabrication of a rapidly solidified foil laminate composite. An amorphous metallic glass foil is flux treated and coated with solder. Before solidification of the solder the foil is collected on a take-up spool which forms the composite into a solid annular configuration. The resulting composite exhibits high strength, resiliency and favorable magnetic and electrical properties associated with amorphous materials. The composite also exhibits bonding strength between the foil layers which significantly exceeds the bulk strength of the solder alone. 6 figs.

  20. Low-temperature hermetic sealing of optical fiber components

    DOE Patents [OSTI]

    Kramer, Daniel P. (Centerville, OH)

    1996-10-22

    A method for manufacturing low-temperature hermetically sealed optical fi components is provided. The method comprises the steps of: inserting an optical fiber into a housing, the optical fiber having a glass core, a glass cladding and a protective buffer layer disposed around the core and cladding; heating the housing to a predetermined temperature, the predetermined temperature being below a melting point for the protective buffer layer and above a melting point of a solder; placing the solder in communication with the heated housing to allow the solder to form an eutectic and thereby fill a gap between the interior of the housing and the optical fiber; and cooling the housing to allow the solder to form a hermetic compression seal between the housing and the optical fiber.

  1. Low-temperature hermetic sealing of optical fiber components

    DOE Patents [OSTI]

    Kramer, D.P.

    1996-10-22

    A method for manufacturing low-temperature hermetically sealed optical fiber components is provided. The method comprises the steps of: inserting an optical fiber into a housing, the optical fiber having a glass core, a glass cladding and a protective buffer layer disposed around the core and cladding; heating the housing to a predetermined temperature, the predetermined temperature being below a melting point for the protective buffer layer and above a melting point of a solder; placing the solder in communication with the heated housing to allow the solder to form an eutectic and thereby fill a gap between the interior of the housing and the optical fiber; and cooling the housing to allow the solder to form a hermetic compression seal between the housing and the optical fiber. 5 figs.

  2. Low-temperature hermetic sealing of optical fiber components

    SciTech Connect (OSTI)

    Kramer, D.P.

    1995-12-31

    A method for manufacturing low-temperature hermetically sealed optical fiber components is provided. The method comprises the steps of: inserting an optical fiber into a housing, the optical fiber having a glass core, a glass cladding and a protective buffer layer disposed around the core and cladding; heating the housing to a predetermined temperature, the predetermined temperature being below a melting point for the protective buffer layer and above a melting point of a solder; placing the solder in communication with the heated housing to allow the solder to form an eutectic and thereby fill a gap between the interior of the housing and the optical fiber; and cooling the housing to allow the solder to form a hermetic compression seal between the housing and the optical fiber.

  3. Materials for ultra-high vacuum

    SciTech Connect (OSTI)

    Lee, G.

    1989-08-15

    This report discusses materials for use in ultrahigh vacuum systems of 1 {times} 10{sup {minus}9} Torr or lower. The author briefly discusses alloys, solders, insulators and joining methods for vacuum systems. (JDL)

  4. Vacuum encapsulated, high temperature diamond amplified cathode capsule and method for making same

    SciTech Connect (OSTI)

    Rao, Triveni; Walsh, Josh; Gangone, Elizabeth

    2015-12-29

    A vacuum encapsulated, hermetically sealed cathode capsule for generating an electron beam of secondary electrons, which generally includes a cathode element having a primary emission surface adapted to emit primary electrons, an annular insulating spacer, a diamond window element comprising a diamond material and having a secondary emission surface adapted to emit secondary electrons in response to primary electrons impinging on the diamond window element, a first high-temperature solder weld disposed between the diamond window element and the annular insulating spacer and a second high-temperature solder weld disposed between the annular insulating spacer and the cathode element. The cathode capsule is formed by a high temperature weld process under vacuum such that the first solder weld forms a hermetical seal between the diamond window element and the annular insulating spacer and the second solder weld forms a hermetical seal between the annular spacer and the cathode element whereby a vacuum encapsulated chamber is formed within the capsule.

  5. Pressure activated diaphragm bonder

    DOE Patents [OSTI]

    Evans, Leland B.; Malba, Vincent

    1997-01-01

    A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto.

  6. DOE Publishes Report on Accelerated Life Testing of SSL Luminaires...

    Broader source: Energy.gov (indexed) [DOE]

    of which were attributed to solder-joint fatigue, and the other two to board-level corrosion. The findings reinforce the belief that LEDs in lighting systems are highly...

  7. Categorical Exclusion Determinations: B5.16 | Department of Energy

    Office of Energy Efficiency and Renewable Energy (EERE) Indexed Site

    ... Gwich'in Solar and Energy Efficiency in the Arctic Award ... and Back-Contact Cell Metallization and Solder ... Applied: A9, B3.6, B5.16 Solar Energy Technologies Office ...

  8. Pressure activated diaphragm bonder

    DOE Patents [OSTI]

    Evans, L.B.; Malba, V.

    1997-05-27

    A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto. 4 figs.

  9. Somont GmbH | Open Energy Information

    Open Energy Info (EERE)

    to: navigation, search Name: Somont GmbH Place: Umkirch, Germany Zip: 79224 Product: German manufacturer of PV module soldering equipment. References: Somont GmbH1 This article...

  10. Series A.

    Office of Legacy Management (LM)

    LAip; (2) sol&+ring; snd (3) all.oyirIg by heat treatment followed by solr?orii:g. 1% ... bath ,wovt?d to.be sufficiently adherent for ths soldering process without heat treatment. ...

  11. STUDY OF THE RHIC BPM SMA CONNECTOR FAILURE PROBLEM

    SciTech Connect (OSTI)

    LIAW,C.; SIKORA, R.; SCHROEDER, R.

    2007-06-25

    About 730 BPMs are mounted on the RHIC CQS and Triplet super-conducting magnets. Semi-rigid coaxial cables are used to bring the electrical signal from the BPM feedthroughs to the outside flanges. at the ambient temperature. Every year around 10 cables will lose their signals during the operation. The connection usually failed at the warm end of the cable. The problems were either the solder joint failed or the center conductor retracted out of the SMA connector. Finite element analyses were performed to understand the failure mechanism of the solder joint. The results showed that (1) The SMA center conductor can separate from the mating connector due to the thermal retraction. (2) The maximum thermal stress at the warm end solder joint can exceed the material strength of the Pb37/Sn63 solder material and (3) The magnet ramping frequency (-10 Hz), during the machine startup, can possibly resonant the coaxial cable and damage the solder joints, especially when a fracture is initiated. Test results confirmed that by using the silver bearing solder material (a higher strength material) and by crimping the cable at the locations close to the SMA connector (to prevent the center conductor from retracting) can effectively resolve the connector failure problem.

  12. Current Lead Design for the Accelerator Project for Upgrade of LHC

    SciTech Connect (OSTI)

    Brandt, Jeffrey S.; Cheban, Sergey; Feher, Sandor; Kaducak, Marc; Nobrega, Fred; Peterson, Tom

    2010-01-01

    The Accelerator Project for Upgrade of LHC (APUL) is a U.S. project participating in and contributing to CERN's Large Hadron Collider (LHC) upgrade program. In collaboration with Brookhaven National Laboratory, Fermilab is developing sub-systems for an upgrade of the LHC final focus magnet systems. A concept of main and auxiliary helium flow was developed that allows the superconductor to remain cold while the lead body warms up to prevent upper section frosting. The auxiliary flow will subsequently cool the thermal shields of the feed box and the transmission line cryostats. A thermal analysis of the current lead central heat exchange section was performed using analytic and FEA techniques. A method of remote soldering was developed that allows the current leads to be field replaceable. The remote solder joint was designed to be made without flux or additional solder, and able to be remade up to ten full cycles. A method of upper section attachment was developed that allows high pressure sealing of the helium volume. Test fixtures for both remote soldering and upper section attachment for the 13 kA lead were produced. The cooling concept, thermal analyses, and test results from both remote soldering and upper section attachment fixtures are presented.

  13. Solar cell array interconnects

    DOE Patents [OSTI]

    Carey, Paul G.; Thompson, Jesse B.; Colella, Nicolas J.; Williams, Kenneth A.

    1995-01-01

    Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

  14. Solar cell array interconnects

    DOE Patents [OSTI]

    Carey, P.G.; Thompson, J.B.; Colella, N.J.; Williams, K.A.

    1995-11-14

    Electrical interconnects are disclosed for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value. 4 figs.

  15. Process for electrically interconnecting electrodes

    DOE Patents [OSTI]

    Carey, Paul G.; Thompson, Jesse B.; Colella, Nicolas J.; Williams, Kenneth A.

    2002-01-01

    Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb--Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb--Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

  16. Method of assembling an electric power

    DOE Patents [OSTI]

    Rinehart, Lawrence E. (Lake Oswego, OR); Romero, Guillermo L. (Phoenix, AZ)

    2007-05-03

    A method of assembling and providing an electric power apparatus. The method uses a heat resistant housing having a structure adapted to accommodate and retain a power circuit card and also including a bracket adapted to accommodate and constrain a rigid conductive member. A power circuit card having an electrical terminal is placed into the housing and a rigid conductive member into the bracket. The rigid conductive member is flow soldered to the electrical terminal, thereby exposing the heat resistant housing to heat and creating a solder bond. Finally, the rigid conductive member is affirmatively connected to the housing. The bracket constrains the rigid conductive member so that the act of affirmatively connecting does not weaken the solder bond.

  17. Ceramic-polymer nanocomposites with increased dielectric permittivity and low dielectric loss

    SciTech Connect (OSTI)

    Bhardwaj, Sumit Paul, Joginder; Raina, K. K.; Thakur, N. S.; Kumar, Ravi

    2014-04-24

    The use of lead free materials in device fabrication is very essential from environmental point of view. We have synthesized the lead free ferroelectric polymer nanocomposite films with increased dielectric properties. Lead free bismuth titanate has been used as active ceramic nanofillers having crystallite size 24nm and PVDF as the polymer matrix. Ferroelectric ?-phase of the polymer composite films was confirmed by X-ray diffraction pattern. Mapping data confirms the homogeneous dispersion of ceramic particles into the polymer matrix. Frequency dependent dielectric constant increases up to 43.4 at 100Hz, whereas dielectric loss decreases with 7 wt% bismuth titanate loading. This high dielectric constant lead free ferroelectric polymer films can be used for energy density applications.

  18. Direct evidence of correlations between relaxor behavior and...

    Office of Scientific and Technical Information (OSTI)

    Direct evidence of correlations between relaxor behavior and polar nano-regions in relaxor ferroelectrics: A case study of lead-free piezoelectrics Nasub 0.5Bisub 0.5TiOsub ...

  19. Development of Readout Interconnections for the Si-W Calorimeter of SiD

    SciTech Connect (OSTI)

    Woods, M.; Fields, R.G.; Holbrook, B.; Lander, R.L.; Moskaleva, A.; Neher, C.; Pasner, J.; Tripathi, M.; Brau, J.E.; Frey, R.E.; Strom, D.; Breidenbach, M.; Freytag, D.; Haller, G.; Herbst, R.; Nelson, T.; Schier, S.; Schumm, B.; /UC, Santa Cruz

    2012-09-14

    The SiD collaboration is developing a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including oxidation removal processes, pad surface preparation, solder ball selection and placement, and bond quality assurance. Our results show that solder ball bonding is a promising technique for the Si-W ECAL, and unresolved issues are being addressed.

  20. Technique for Measuring Hybrid Electronic Component Reliability

    SciTech Connect (OSTI)

    Green, C.C.; Hernandez, C.L.; Hosking, F.M.; Robinson, D.; Rutherford, B.; Uribe, F.

    1999-01-01

    Materials compatibility studies of aged, engineered materials and hardware are critical to understanding and predicting component reliability, particularly for systems with extended stockpile life requirements. Nondestructive testing capabilities for component reliability would significantly enhance lifetime predictions. For example, if the detection of crack propagation through a solder joint can be demonstrated, this technique could be used to develop baseline information to statistically determine solder joint lifelengths. This report will investigate high frequency signal response techniques for nondestructively evaluating the electrical behavior of thick film hybrid transmission lines.

  1. CX-100380 Categorical Exclusion Determination

    Broader source: Energy.gov [DOE]

    Predictive Models and Novel Accelerated Tests for the Reliability of Front-Contact and Back-Contact Cell Metallization and Solder Joints in Photovoltaic Modules Award Number: DE-EE0007139 CX(s) Applied: A9, B3.6, B5.16 Solar Energy Technologies Office Date: 09/23/2015 Location(s): California Office(s): Golden Field Office

  2. Areal array jetting device for ball grid arrays

    SciTech Connect (OSTI)

    Frear, D.R.; Yost, F.G.; Schmale, D.T.; Essien, M.

    1997-08-01

    Package designs for microelectronics devices have moved from through-hole to surface mount technology in order to increase the printed wiring board real estate available by utilizing both sides of the board. The traditional geometry for surface mount devices is peripheral arrays where the leads are on the edges of the device. As the technology drives towards high input/output (I/O) count (increasing number of leads) and smaller packages with finer pitch (less distance between peripheral leads), limitations on peripheral surface mount devices arise. A solution to the peripheral surface mount issue is to shift the leads to the area under the device. This scheme is called areal array packaging and is exemplified by the ball grid array (BGA) package. In a BGA package, the leads are on the bottom surface of the package in the form of an array of solder balls. The current practice of joining BGA packages to printed wiring boards involves a hierarchy of solder alloy compositions. A high melting temperature ball is typically used for standoff. A promising alternative to current methods is the use of jetting technology to perform monolithic solder ball attachment. This paper describes an areal array jetter that was designed and built to simultaneously jet arrays of solder balls directly onto BGA substrates.

  3. IRON COATED URANIUM AND ITS PRODUCTION

    DOE Patents [OSTI]

    Gray, A.G.

    1960-03-15

    A method of applying a protective coating to a metallic uranium article is given. The method comprises etching the surface of the article with an etchant solution containlng chloride ions, such as a solution of phosphoric acid and hydrochloric acid, cleaning the etched surface, electroplating iron thereon from a ferrous ammonium sulfate electroplating bath, and soldering an aluminum sheath to the resultant iron layer.

  4. Reliability of emerging bonded interface materials for large-area attachments

    SciTech Connect (OSTI)

    Paret, Paul P.; DeVoto, Douglas J.; Narumanchi, Sreekant

    2015-12-30

    In this study, conventional thermal interface materials (TIMs), such as greases, gels, and phase change materials, pose bottlenecks to heat removal and have long caused reliability issues in automotive power electronics packages. Bonded interface materials (BIMs) with superior thermal performance have the potential to be a replacement to the conventional TIMs. However, due to coefficient of thermal expansion mismatches between different components in a package and resultant thermomechanical stresses, fractures or delamination could occur, causing serious reliability concerns. These defects manifest themselves in increased thermal resistance in the package. In this paper, the results of reliability evaluation of emerging BIMs for large-area attachments in power electronics packaging are reported. Thermoplastic (polyamide) adhesive with embedded near-vertical-aligned carbon fibers, sintered silver, and conventional lead solder (Sn63Pb37) materials were bonded between 50.8 mm x 50.8 mm cross-sectional footprint silicon nitride substrates and copper base plate samples, and were subjected to accelerated thermal cycling until failure or 2500 cycles. Damage in the BIMs was monitored every 100 cycles by scanning acoustic microscopy. Thermoplastic with embedded carbon fibers performed the best with no defects, whereas sintered silver and lead solder failed at 2300 and 1400 thermal cycles, respectively. Besides thermal cycling, additional lead solder samples were subjected to thermal shock and thermal cycling with extended dwell periods. A finite element method (FEM)-based model was developed to simulate the behavior of lead solder under thermomechanical loading. Strain energy density per cycle results were calculated from the FEM simulations. A predictive lifetime model was formulated for lead solder by correlating strain energy density results extracted from modeling with cycles-to-failure obtained from experimental accelerated tests. A power-law-based approach was used to formulate the - redictive lifetime model.

  5. Reliability of emerging bonded interface materials for large-area attachments

    DOE Public Access Gateway for Energy & Science Beta (PAGES Beta)

    Paret, Paul P.; DeVoto, Douglas J.; Narumanchi, Sreekant

    2015-12-30

    In this study, conventional thermal interface materials (TIMs), such as greases, gels, and phase change materials, pose bottlenecks to heat removal and have long caused reliability issues in automotive power electronics packages. Bonded interface materials (BIMs) with superior thermal performance have the potential to be a replacement to the conventional TIMs. However, due to coefficient of thermal expansion mismatches between different components in a package and resultant thermomechanical stresses, fractures or delamination could occur, causing serious reliability concerns. These defects manifest themselves in increased thermal resistance in the package. In this paper, the results of reliability evaluation of emerging BIMsmore » for large-area attachments in power electronics packaging are reported. Thermoplastic (polyamide) adhesive with embedded near-vertical-aligned carbon fibers, sintered silver, and conventional lead solder (Sn63Pb37) materials were bonded between 50.8 mm x 50.8 mm cross-sectional footprint silicon nitride substrates and copper base plate samples, and were subjected to accelerated thermal cycling until failure or 2500 cycles. Damage in the BIMs was monitored every 100 cycles by scanning acoustic microscopy. Thermoplastic with embedded carbon fibers performed the best with no defects, whereas sintered silver and lead solder failed at 2300 and 1400 thermal cycles, respectively. Besides thermal cycling, additional lead solder samples were subjected to thermal shock and thermal cycling with extended dwell periods. A finite element method (FEM)-based model was developed to simulate the behavior of lead solder under thermomechanical loading. Strain energy density per cycle results were calculated from the FEM simulations. A predictive lifetime model was formulated for lead solder by correlating strain energy density results extracted from modeling with cycles-to-failure obtained from experimental accelerated tests. A power-law-based approach was used to formulate the - redictive lifetime model.« less

  6. Multi-lead heat sink

    DOE Patents [OSTI]

    Roose, L.D.

    1982-08-25

    The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again.

  7. Multi-lead heat sink

    DOE Patents [OSTI]

    Roose, L.D.

    1984-07-03

    The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again. 4 figs.

  8. Multi-lead heat sink

    DOE Patents [OSTI]

    Roose, Lars D.

    1984-01-01

    The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again.

  9. Exploiting data representation for fault tolerance

    SciTech Connect (OSTI)

    Hoemmen, Mark Frederick; Elliott, J.; Mueller, F.

    2015-01-06

    Incorrect computer hardware behavior may corrupt intermediate computations in numerical algorithms, possibly resulting in incorrect answers. Prior work models misbehaving hardware by randomly flipping bits in memory. We start by accepting this premise, and present an analytic model for the error introduced by a bit flip in an IEEE 754 floating-point number. We then relate this finding to the linear algebra concepts of normalization and matrix equilibration. In particular, we present a case study illustrating that normalizing both vector inputs of a dot product minimizes the probability of a single bit flip causing a large error in the dot product's result. Moreover, the absolute error is either less than one or very large, which allows detection of large errors. Then, we apply this to the GMRES iterative solver. We count all possible errors that can be introduced through faults in arithmetic in the computationally intensive orthogonalization phase of GMRES, and show that when the matrix is equilibrated, the absolute error is bounded above by one.

  10. Exploiting data representation for fault tolerance

    DOE Public Access Gateway for Energy & Science Beta (PAGES Beta)

    Hoemmen, Mark Frederick; Elliott, J.; Sandia National Lab.; Mueller, F.

    2015-01-06

    Incorrect computer hardware behavior may corrupt intermediate computations in numerical algorithms, possibly resulting in incorrect answers. Prior work models misbehaving hardware by randomly flipping bits in memory. We start by accepting this premise, and present an analytic model for the error introduced by a bit flip in an IEEE 754 floating-point number. We then relate this finding to the linear algebra concepts of normalization and matrix equilibration. In particular, we present a case study illustrating that normalizing both vector inputs of a dot product minimizes the probability of a single bit flip causing a large error in the dot product'smore » result. Moreover, the absolute error is either less than one or very large, which allows detection of large errors. Then, we apply this to the GMRES iterative solver. We count all possible errors that can be introduced through faults in arithmetic in the computationally intensive orthogonalization phase of GMRES, and show that when the matrix is equilibrated, the absolute error is bounded above by one.« less

  11. Low resistivity contact to iron-pnictide superconductors

    DOE Patents [OSTI]

    Tanatar, Makariy; Prozorov, Ruslan; Ni, Ni; Bud'ko, Sergey; Canfield, Paul

    2013-05-28

    Method of making a low resistivity electrical connection between an electrical conductor and an iron pnictide superconductor involves connecting the electrical conductor and superconductor using a tin or tin-based material therebetween, such as using a tin or tin-based solder. The superconductor can be based on doped AFe.sub.2As.sub.2, where A can be Ca, Sr, Ba, Eu or combinations thereof for purposes of illustration only.

  12. Planar triode pulser socket

    DOE Patents [OSTI]

    Booth, R.

    1994-10-25

    A planar triode is mounted in a PC board orifice by means of a U-shaped capacitor housing and anode contact yoke removably attached to cathode leg extensions passing through and soldered to the cathode side of the PC board by means of a PC cathode pad. A pliant/flexible contact attached to the orifice make triode grid contact with a grid pad on the grid side of the PC board, permitting quick and easy replacement of bad triodes. 14 figs.

  13. Chris Golubieski | Bioenergy | NREL

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Chris Golubieski Research Technician Christopher.Golubieski@nrel.gov | 303-384-6341 Areas of Expertise Instrumentation Soldering Electrical (AC and DC) Rigging and Fall Protection Education B.A., Geology, Miami University, 1997 B.S., Areonautics/Meterology, Miami University, 1997 Professional Experience Research Technician, Thermochemical Process Development Unit, National Renewable Energy Laboratory, 2014-present Research Technician, National Center for Atmospheric Research, 2004--2014 Research

  14. Development of the bus joint for the ITER Central Solenoid

    SciTech Connect (OSTI)

    Martovetsky, Nicolai N; Irick, David Kim; Kenney, Steven J

    2013-01-01

    The terminations of the Central Solenoid (CS) modules are connected to the bus extensions by joints located outside the CS in the gap between the CS and Torodial Field (TF) assemblies. These joints have very strict space limitations. Low resistance is a common requirement for all ITER joints. In addition, the CS bus joints will experience and must be designed to withstand significant variation in the magnetic field of several tenths of a Tesla per second during initiation of plasma. The joint resistance is specified to be less than 4 nOhm. The joints also have to be soldered in the field and designed with the possibility to be installed and dismantled in order to allow cold testing in the cold test facility. We have developed coaxial joints that meet these requirements and have demonstrated the feasibility to fabricate and assemble them in the vertical configuration. We introduced a coupling cylinder with superconducting strands soldered to the surface of the cable that can be installed in the ITER assembly hall and at the Cold Test Facility. This cylinder serves as a transition area between the CS module and the bus extension. We made two racetrack samples and tested four bus joints in our Joint Test Apparatus. Resistance of the bus joints was measured by a decay method and by a microvoltmeter; the value of the current was measured by the Hall probes. This measurement method was verified in the previous tests. The resistance of the joints varied insignificantly from 1.5 to 2 nOhm. One of the challenges associated with a soldered joint is the inability to use corrosive chemicals that are difficult to clean. This paper describes our development work on cable preparation, chrome removal, compaction, soldering, and final assembly and presents the test results.

  15. Alternate protection concepts for second surface silver/glass solar mirrors

    SciTech Connect (OSTI)

    Buckwalter, C.Q.; Dake, L.S.; Hartman, J.S.; Lind, M.A.

    1980-10-01

    Investigations into three technologies having the potential of significantly enhancing the durability of solar mirrors are reported. The approaches are based on the assumption that sealing the silver layer on second surface mirrors from the external environment with protective overcoats will significantly extend their useful service life. Considered are: (1) edge sealing a second sheet of glass over the silver layer using solder glasses, (2) overcoating the silver layer with liquid applied SiO/sub 2/ or TiO/sub 2/ coatings, and (3) overcoating the silver layer with an electroless nickel film. Preliminary experiments were performed using Sb/sub 2/O/sub 5/-K/sub 2/O and PbO based solder glasses to edge seal a second sheet of glass over the silver mirror surface. Problems encountered in the formulation of the Sb/sub 2/O/sub 5/-K/sub 2/O glasses forced abandonment of these low melting point solder glass experiments. Materials compatibility problems were encountered when using several of the commercially available PbO based solder glasses alternatives. A cursory evaluation of liquid SiO/sub 2/ and TiO/sub 2/ coatings was also undertaken. The films were applied as direct overcoats on both silver only and silver/copper mirror substrates. Although the process appeared to yield visually acceptable coatings, under microscopic examination the films were found to be porous and pinhole riddled after the final curing step. Consequently, they did not stand up well to salt spray and HCl vapor tests. Background data were collected in an investigation of overcoating the silver or silver/copper mirrors with an electroless deposited nickel film. Two formulations, one a basic solution, the other a commercial acidic solution, were attempted. Film integrity problems were encountered for fairly thick films in the feasibility experiments attempted. Nevertheless, the concept appears sound and merits further investigation.

  16. Planar triode pulser socket

    DOE Patents [OSTI]

    Booth, Rex (Livermore, CA)

    1994-01-01

    A planar triode is mounted in a PC board orifice by means of a U-shaped capacitor housing and anode contact yoke removably attached to cathode leg extensions passing through and soldered to the cathode side of the PC board by means of a PC cathode pad. A pliant/flexible contact attached to the orifice make triode grid contact with a grid pad on the grid side of the PC board, permitting quick and easy replacement of bad triodes.

  17. In situ study on the effect of thermomigration on intermetallic compounds growth in liquid-solid interfacial reaction

    SciTech Connect (OSTI)

    Qu, Lin; Zhao, Ning; Ma, Haitao, E-mail: htma@dlut.edu.cn; Zhao, Huijing; Huang, Mingliang [School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085 (China)

    2014-05-28

    Synchrotron radiation real-time imaging technology was carried out in situ to observe and characterize the effect of thermomigration on the growth behavior of interfacial intermetallic compounds (IMCs) in Cu/Sn/Cu solder joint during soldering. The thermomigration resulted in asymmetrical formation and growth of the interfacial IMCs. Cu{sub 6}Sn{sub 5} and Cu{sub 3}Sn IMCs formed at the cold end and grew rapidly during the whole soldering process. However, only Cu{sub 6}Sn{sub 5} IMC formed at the hot end and remained relatively thin until solidification. The IMCs at the cold end were nearly seven times thicker than that at the hot end after solidification. The Cu dissolution at the cold end was significantly restrained, while that at the hot end was promoted, which supplied Cu atoms to diffuse toward the cold end under thermomigration to feed the rapid IMC growth. Moreover, the thermomigration also caused asymmetrical morphology of the interfacial IMCs at the cooling stage, i.e., the Cu{sub 6}Sn{sub 5} IMC at the cold end transformed into facet structure, while that at the hot end remained scallop-type. The asymmetrical growth behavior of the interfacial IMCs was analyzed from the view point of kinetics.

  18. Tool and Fixture Design

    SciTech Connect (OSTI)

    Graham, Mark W.

    2015-07-28

    In a manufacturing process, a need is identified and a product is created to fill this need. While design and engineering of the final product is important, the tools and fixtures that aid in the creation of the final product are just as important, if not more so. Power supplies assembled at the TA-55 PF-5 have been designed by an excellent engineering team. The task in PF-5 now is to ensure that all steps of the assembly and manufacturing process can be completed safely, reliably, and in a quality repeatable manner. One of these process steps involves soldering fine wires to an electrical connector. During the process development phase, the method of soldering included placing the power supply in a vice in order to manipulate it into a position conducive to soldering. This method is unacceptable from a reliability, repeatability, and ergonomic standpoint. To combat these issues, a fixture was designed to replace the current method. To do so, a twelve step engineering design process was used to create the fixture that would provide a solution to a multitude of problems, and increase the safety and efficiency of production.

  19. Phosphate glasses for radioactive, hazardous and mixed waste immobilization

    DOE Patents [OSTI]

    Cao, H.; Adams, J.W.; Kalb, P.D.

    1998-11-24

    Lead-free phosphate glass compositions are provided which can be used to immobilize low level and/or high level radioactive wastes in monolithic waste forms. The glass composition may also be used without waste contained therein. Lead-free phosphate glass compositions prepared at about 900 C include mixtures from about 1--6 mole % iron (III) oxide, from about 1--6 mole % aluminum oxide, from about 15--20 mole % sodium oxide or potassium oxide, and from about 30--60 mole % phosphate. The invention also provides phosphate, lead-free glass ceramic glass compositions which are prepared from about 400 C to about 450 C and which includes from about 3--6 mole % sodium oxide, from about 20--50 mole % tin oxide, from about 30--70 mole % phosphate, from about 3--6 mole % aluminum oxide, from about 3--8 mole % silicon oxide, from about 0.5--2 mole % iron (III) oxide and from about 3--6 mole % potassium oxide. Method of making lead-free phosphate glasses are also provided. 8 figs.

  20. Phosphate glasses for radioactive, hazardous and mixed waste immobilization

    DOE Patents [OSTI]

    Cao, Hui; Adams, Jay W.; Kalb, Paul D.

    1998-11-24

    Lead-free phosphate glass compositions are provided which can be used to immobilize low level and/or high level radioactive wastes in monolithic waste forms. The glass composition may also be used without waste contained therein. Lead-free phosphate glass compositions prepared at about 900.degree. C. include mixtures from about 1 mole % to about 6 mole % iron (III) oxide, from about 1 mole % to about 6 mole % aluminum oxide, from about 15 mole % to about 20 mole % sodium oxide or potassium oxide, and from about 30 mole % to about 60 mole % phosphate. The invention also provides phosphate, lead-free glass ceramic glass compositions which are prepared from about 400.degree. C. to about 450.degree. C. and which includes from about 3 mole % to about 6 mole % sodium oxide, from about 20 mole % to about 50 mole % tin oxide, from about 30 mole % to about 70 mole % phosphate, from about 3 mole % to about 6 mole % aluminum oxide, from about 3 mole % to about 8 mole % silicon oxide, from about 0.5 mole % to about 2 mole % iron (III) oxide and from about 3 mole % to about 6 mole % potassium oxide. Method of making lead-free phosphate glasses are also provided.

  1. Phosphate glasses for radioactive, hazardous and mixed waste immobilization

    DOE Patents [OSTI]

    Cao, H.; Adams, J.W.; Kalb, P.D.

    1999-03-09

    Lead-free phosphate glass compositions are provided which can be used to immobilize low level and/or high level radioactive wastes in monolithic waste forms. The glass composition may also be used without waste contained therein. Lead-free phosphate glass compositions prepared at about 900 C include mixtures from about 1 mole % to about 6 mole % iron (III) oxide, from about 1 mole % to about 6 mole % aluminum oxide, from about 15 mole % to about 20 mole % sodium oxide or potassium oxide, and from about 30 mole % to about 60 mole % phosphate. The invention also provides phosphate, lead-free glass ceramic glass compositions which are prepared from about 400 C to about 450 C and which includes from about 3 mole % to about 6 mole % sodium oxide, from about 20 mole % to about 50 mole % tin oxide, from about 30 mole % to about 70 mole % phosphate, from about 3 mole % to about 6 mole % aluminum oxide, from about 3 mole % to about 8 mole % silicon oxide, from about 0.5 mole % to about 2 mole % iron (III) oxide and from about 3 mole % to about 6 mole % potassium oxide. Method of making lead-free phosphate glasses are also provided. 8 figs.

  2. Phosphate glasses for radioactive, hazardous and mixed waste immobilization

    DOE Patents [OSTI]

    Cao, Hui; Adams, Jay W.; Kalb, Paul D.

    1999-03-09

    Lead-free phosphate glass compositions are provided which can be used to immobilize low level and/or high level radioactive wastes in monolithic waste forms. The glass composition may also be used without waste contained therein. Lead-free phosphate glass compositions prepared at about 900.degree. C. include mixtures from about 1 mole % to about 6 mole %.iron (III) oxide, from about 1 mole % to about 6 mole % aluminum oxide, from about 15 mole % to about 20 mole % sodium oxide or potassium oxide, and from about 30 mole % to about 60 mole % phosphate. The invention also provides phosphate, lead-free glass ceramic glass compositions which are prepared from about 400.degree. C. to about 450.degree. C. and which includes from about 3 mole % to about 6 mole % sodium oxide, from about 20 mole % to about 50 mole % tin oxide, from about 30 mole % to about 70 mole % phosphate, from about 3 mole % to about 6 mole % aluminum oxide, from about 3 mole % to about 8 mole % silicon oxide, from about 0.5 mole % to about 2 mole % iron (III) oxide and from about 3 mole % to about 6 mole % potassium oxide. Method of making lead-free phosphate glasses are also provided.

  3. Explosive complexes

    DOE Patents [OSTI]

    Huynh, My Hang V.

    2009-09-22

    Lead-free primary explosives of the formula [M.sup.II(A).sub.R(B.sup.X).sub.S](C.sup.Y).sub.T, where A is 1,5-diaminotetrazole, and syntheses thereof are described. Substantially stoichiometric equivalents of the reactants lead to high yields of pure compositions thereby avoiding dangerous purification steps.

  4. Explosive complexes

    DOE Patents [OSTI]

    Huynh, My Hang V.

    2011-08-16

    Lead-free primary explosives of the formula [M.sup.II(A).sub.R(B.sup.X).sub.S](C.sup.Y).sub.T, where A is 1,5-diaminotetrazole, and syntheses thereof are described. Substantially stoichiometric equivalents of the reactants lead to high yields of pure compositions thereby avoiding dangerous purification steps.

  5. Water supplier copes with lead paint removal regs

    SciTech Connect (OSTI)

    Becker, C.E. ); Lovejoy, D.R.; Bryck, J.L.; Rockensies, W.H.

    1993-12-01

    This article examines new paint removal methods that minimize releasing of paints containing lead to the environment and lead free coating systems for tank corrosion protection used in the Village of Freeport in Long Island, New York. The topics of the article include coating failures, removal tools and methods, paint and application methods.

  6. Packaging of solid state devices

    DOE Patents [OSTI]

    Glidden, Steven C.; Sanders, Howard D.

    2006-01-03

    A package for one or more solid state devices in a single module that allows for operation at high voltage, high current, or both high voltage and high current. Low thermal resistance between the solid state devices and an exterior of the package and matched coefficient of thermal expansion between the solid state devices and the materials used in packaging enables high power operation. The solid state devices are soldered between two layers of ceramic with metal traces that interconnect the devices and external contacts. This approach provides a simple method for assembling and encapsulating high power solid state devices.

  7. Phase 2 of the array automated assembly task for the low cost silicon solar array project. Final report

    SciTech Connect (OSTI)

    Petersen, R.C.

    1980-11-01

    Studies were conducted on several fundamental aspects of electroless nickel/solder metallization for silicon solar cells. A process proposed by Motorola, which precedes the electroless nickel plating with several steps of palladium plating and heat treatment, was compared directly with single step electroless nickel plating. Work has directed toward answering specific questions concerning the effect of silicon surface oxide on nickel plating, effects of thermal stresses on the metallization, sintering of nickel plated on silicon, and effects of exposure to the plating solution on solar cell characteristics. The Motorola process was compared with simple electroless nickel plating in a series of parallel experiments. Results are presented. (WHK)

  8. Repairable chip bonding/interconnect process

    DOE Patents [OSTI]

    Bernhardt, A.F.; Contolini, R.J.; Malba, V.; Riddle, R.A.

    1997-08-05

    A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules is disclosed. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder. 10 figs.

  9. Repairable chip bonding/interconnect process

    DOE Patents [OSTI]

    Bernhardt, Anthony F.; Contolini, Robert J.; Malba, Vincent; Riddle, Robert A.

    1997-01-01

    A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder.

  10. Color Anodizing of Titanium Coated Rolled Carbon Steel Plate

    SciTech Connect (OSTI)

    Sarajan, Zohair; Mobarakeh, Hooman Nikbakht; Namiranian, Sohrab

    2011-12-26

    As an important kind of structural materials, the titanium cladded steel plates have the advantages of both metals and have been applied in aviation, spaceflight, chemical and nuclear industries. In this study, the specimens which were prepared under soldering mechanism during rolling were anodized by electrochemical process under a given conditions. The color anodizing takes place by physical phenomenon of color interference. Part of incident light on the titanium oxide is reflected and the other part reflects inside coated titanium layer. Major part of the light which reflects from titanium-oxide interface, reflects again inside of the oxide layer.

  11. Direct cooled power electronics substrate

    DOE Patents [OSTI]

    Wiles, Randy H [Powell, TN; Wereszczak, Andrew A [Oak Ridge, TN; Ayers, Curtis W. [Kingston, TN; Lowe, Kirk T. [Knoxville, TN

    2010-09-14

    The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.

  12. Method of fabricating a solar cell array

    DOE Patents [OSTI]

    Lazzery, Angelo G. (Oaklyn, NJ); Crouthamel, Marvin S. (Pennsauken, NJ); Coyle, Peter J. (Oaklyn, NJ)

    1982-01-01

    A first set of pre-tabbed solar cells are assembled in a predetermined array with at least part of each tab facing upward, each tab being fixed to a bonding pad on one cell and abutting a bonding pad on an adjacent cell. The cells are held in place with a first vacuum support. The array is then inverted onto a second vacuum support which holds the tabs firmly against the cell pads they abut. The cells are exposed to radiation to melt and reflow the solder pads for bonding the tab portions not already fixed to bonding pads to these pads.

  13. Functionally graded alumina-based thin film systems

    DOE Patents [OSTI]

    Moore, John J.; Zhong, Dalong

    2006-08-29

    The present invention provides coating systems that minimize thermal and residual stresses to create a fatigue- and soldering-resistant coating for aluminum die casting dies. The coating systems include at least three layers. The outer layer is an alumina- or boro-carbide-based outer layer that has superior non-wettability characteristics with molten aluminum coupled with oxidation and wear resistance. A functionally-graded intermediate layer or "interlayer" enhances the erosive wear, toughness, and corrosion resistance of the die. A thin adhesion layer of reactive metal is used between the die substrate and the interlayer to increase adhesion of the coating system to the die surface.

  14. Design of a Probe for Strain Sensitivity Studies of Critical Current Densities in SC Wires and Tapes

    SciTech Connect (OSTI)

    Dhanaraj, N.; Barzi, E.; Turrioni, D.; Rusy, A.; Lombardo, V.; /Fermilab

    2011-07-01

    The design of a variable-temperature probe used to perform strain sensitivity measurements on LTS wires and HTS wires and tapes is described. The measurements are intended to be performed at liquid helium temperatures (4.2 K). The wire or tape to be measured is wound and soldered on to a helical spring device, which is fixed at one end and subjected to a torque at the free end. The design goal is to be able to achieve {+-} 0.8 % strain in the wire and tape. The probe is designed to carry a current of 2000A.

  15. Laminated photovoltaic modules using back-contact solar cells

    DOE Patents [OSTI]

    Gee, James M.; Garrett, Stephen E.; Morgan, William P.; Worobey, Walter

    1999-09-14

    Photovoltaic modules which comprise back-contact solar cells, such as back-contact crystalline silicon solar cells, positioned atop electrically conductive circuit elements affixed to a planar support so that a circuit capable of generating electric power is created. The modules are encapsulated using encapsulant materials such as EVA which are commonly used in photovoltaic module manufacture. The module designs allow multiple cells to be electrically connected in a single encapsulation step rather than by sequential soldering which characterizes the currently used commercial practices.

  16. Programmable Multi-Chip Module

    DOE Patents [OSTI]

    Kautz, David; Morgenstern, Howard; Blazek, Roy J.

    2005-05-24

    A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

  17. Programmable multi-chip module

    DOE Patents [OSTI]

    Kautz, David; Morgenstern, Howard; Blazek, Roy J.

    2004-03-02

    A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

  18. Programmable Multi-Chip Module

    DOE Patents [OSTI]

    Kautz, David; Morgenstern, Howard; Blazek, Roy J.

    2004-11-16

    A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

  19. Magnetically attached sputter targets

    DOE Patents [OSTI]

    Makowiecki, D.M.; McKernan, M.A.

    1994-02-15

    An improved method and assembly for attaching sputtering targets to cathode assemblies of sputtering systems which includes a magnetically permeable material is described. The magnetically permeable material is imbedded in a target base that is brazed, welded, or soldered to the sputter target, or is mechanically retained in the target material. Target attachment to the cathode is achieved by virtue of the permanent magnets and/or the pole pieces in the cathode assembly that create magnetic flux lines adjacent to the backing plate, which strongly attract the magnetically permeable material in the target assembly. 11 figures.

  20. Improved ion detector

    DOE Patents [OSTI]

    Tullis, A.M.

    1986-01-30

    An improved ion detector device of the ionization detection device chamber type comprises an ionization chamber having a central electrode therein surrounded by a cylindrical electrode member within the chamber with a collar frictionally fitted around at least one of the electrodes. The collar has electrical contact means carried in an annular groove in an inner bore of the collar to contact the outer surface of the electrode to provide electrical contact between an external terminal and the electrode without the need to solder leads to the electrode.

  1. GOMA 6.0 : a full-Newton finite element program for free and moving boundary problems with coupled fluid/solid momentum, energy, mass, and chemical species transport : user%3CU%2B2019%3Es guide.

    SciTech Connect (OSTI)

    Schunk, Peter Randall; Rao, Rekha Ranjana; Chen, Ken Shuang; Labreche, Duane A.; Sun, Amy Cha-Tien; Hopkins, Matthew Morgan; Moffat, Harry K.; Roach, Robert Allen; Hopkins, Polly L.; Notz, Patrick K.; Roberts, Scott Alan; Sackinger, Philip A.; Subia, Samuel Ramirez; Wilkes, Edward Dean; Baer, Thomas A.; Noble, David R.; Secor, Robert B.

    2013-07-01

    Goma 6.0 is a finite element program which excels in analyses of multiphysical processes, particularly those involving the major branches of mechanics (viz. fluid/solid mechanics, energy transport and chemical species transport). Goma is based on a full-Newton-coupled algorithm which allows for simultaneous solution of the governing principles, making the code ideally suited for problems involving closely coupled bulk mechanics and interfacial phenomena. Example applications include, but are not limited to, coating and polymer processing flows, super-alloy processing, welding/soldering, electrochemical processes, and solid-network or solution film drying. This document serves as a user's guide and reference.

  2. Development of manufacturing capability for the fabrication of the Nb/sub 3/Sn superconductor for the High Field Test Facility. Final report

    SciTech Connect (OSTI)

    Spencer, C R

    1981-01-01

    Construction of High Field Test Facility (HFTF) at Lawrence Livermore Laboratory (LLNL) requires an extended surface Nb/sub 3/Sn superconductor cable of carrying currents in excess of 7500 amperes in a 12 Tesla magnetic field. This conductor consists of a 5.4 mm x 11.0 mm superconducting core onto whose broad surfaces are soldered embossed oxygen free copper strips. Two different core designs have been developed and the feasibility of each design evaluated. Equipment necessary to produce the conductor were developed and techniques of production were explored.

  3. From: Meredith Brown <racer@lanl.gov> Subject: Yellow Alert: Fall Results in Injury

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Tue, 16 Jun 1998 13:57:16 -0500 From: Meredith Brown <racer@lanl.gov> Subject: Yellow Alert: Fall Results in Injury Title: Fall From Ladder Results in Fractured Vertebra Identifier: LLNL-1998-002 Date: January 5, 1998 Lesson Learned Statement: Work at elevated levels needs to be thoroughly evaluated. Discussion of Activities: A subcontractor employee was soldering a pipe while standing 2/3 of the way up a portable ten foot ladder when he lost his balance and fell six feet to the floor

  4. Method of monolithic module assembly

    DOE Patents [OSTI]

    Gee, James M.; Garrett, Stephen E.; Morgan, William P.; Worobey, Walter

    1999-01-01

    Methods for "monolithic module assembly" which translate many of the advantages of monolithic module construction of thin-film PV modules to wafered c-Si PV modules. Methods employ using back-contact solar cells positioned atop electrically conductive circuit elements affixed to a planar support so that a circuit capable of generating electric power is created. The modules are encapsulated using encapsulant materials such as EVA which are commonly used in photovoltaic module manufacture. The methods of the invention allow multiple cells to be electrically connected in a single encapsulation step rather than by sequential soldering which characterizes the currently used commercial practices.

  5. Micromechanical die attachment surcharge

    DOE Patents [OSTI]

    Filter, William F.; Hohimer, John P.

    2002-01-01

    An attachment structure is disclosed for attaching a die to a supporting substrate without the use of adhesives or solder. The attachment structure, which can be formed by micromachining, functions purely mechanically in utilizing a plurality of shaped pillars (e.g. round, square or polygonal and solid, hollow or slotted) that are formed on one of the die or supporting substrate and which can be urged into contact with various types of mating structures including other pillars, a deformable layer or a plurality of receptacles that are formed on the other of the die or supporting substrate, thereby forming a friction bond that holds the die to the supporting substrate. The attachment structure can further include an alignment structure for precise positioning of the die and supporting substrate to facilitate mounting the die to the supporting substrate. The attachment structure has applications for mounting semiconductor die containing a microelectromechanical (MEM) device, a microsensor or an integrated circuit (IC), and can be used to form a multichip module. The attachment structure is particularly useful for mounting die containing released MEM devices since these devices are fragile and can otherwise be damaged or degraded by adhesive or solder mounting.

  6. Experimental studies of helical solenoid model based on YBCO tape-bridge joints

    SciTech Connect (OSTI)

    Yu, M.; Lombardo, V.; Turrioni, D.; Zlobin, A.V.; Flangan, G.; Lopes, M.L.; Johnson, R.P.; /Fermilab

    2011-06-01

    Helical solenoids that provide solenoid, helical dipole and helical gradient field components are designed for a helical cooling channel (HCC) proposed for cooling of muon beams in a muon collider. The high temperature superconductor (HTS), 12 mm wide and 0.1 mm thick YBCO tape, is used as the conductor for the highest-field section of HCC due to certain advantages, such as its electrical and mechanical properties. To study and address the design, and technological and performance issues related to magnets based on YBCO tapes, a short helical solenoid model based on double-pancake coils was designed, fabricated and tested at Fermilab. Splicing joints were made with Sn-Pb solder as the power leads and the connection between coils, which is the most critical element in the magnet that can limit the performance significantly. This paper summarizes the test results of YBCO tape and double-pancake coils in liquid nitrogen and liquid helium, and then focuses on the study of YBCO splices, including the soldering temperatures and pressures, and splice bending test.

  7. Phase transformations during the Ag-In plating and bonding of vertical diode elements of multijunction solar cells

    SciTech Connect (OSTI)

    Klochko, N. P. Khrypunov, G. S.; Volkova, N. D.; Kopach, V. R.; Lyubov, V. N.; Kirichenko, M. V.; Momotenko, A. V.; Kharchenko, N. M.; Nikitin, V. A.

    2013-06-15

    The conditions of the bonding of silicon multijunction solar cells with vertical p-n junctions using Ag-In solder are studied. The compositions of electrodeposited indium films on silicon wafers silver plated by screen printing and silver and indium films fabricated by layer-by-layer electrochemical deposition onto the surface of silicon vertical diode cells silver plated in vacuum are studied. Studying the electrochemical-deposition conditions, structure, and surface morphology of the grown layers showed that guaranteed bonding is provided by 8-min heat treatment at 400 Degree-Sign C under the pressure of a stack of metallized silicon wafers; however, the ratio of the indium and silver layer thicknesses should not exceed 1: 3. As this condition is satisfied, the solder after wafer bonding has the InAg{sub 3} structure (or InAg{sub 3} with an Ag phase admixture), due to which the junction melting point exceeds 700 Degree-Sign C, which guarantees the functioning of such solar cells under concentrated illumination.

  8. Electrical and thermal finite element modeling of arc faults in photovoltaic bypass diodes.

    SciTech Connect (OSTI)

    Bower, Ward Isaac; Quintana, Michael A.; Johnson, Jay

    2012-01-01

    Arc faults in photovoltaic (PV) modules have caused multiple rooftop fires. The arc generates a high-temperature plasma that ignites surrounding materials and subsequently spreads the fire to the building structure. While there are many possible locations in PV systems and PV modules where arcs could initiate, bypass diodes have been suspected of triggering arc faults in some modules. In order to understand the electrical and thermal phenomena associated with these events, a finite element model of a busbar and diode was created. Thermoelectrical simulations found Joule and internal diode heating from normal operation would not normally cause bypass diode or solder failures. However, if corrosion increased the contact resistance in the solder connection between the busbar and the diode leads, enough voltage potentially would be established to arc across micron-scale electrode gaps. Lastly, an analytical arc radiation model based on observed data was employed to predicted polymer ignition times. The model predicted polymer materials in the adjacent area of the diode and junction box ignite in less than 0.1 seconds.

  9. Silicone injection restores failing submarine cables

    SciTech Connect (OSTI)

    Tilstra, M.

    1995-12-01

    Faced with the prospect of replacing nearly 10 miles of aging undersea cables, Orcas Power & Light Co (Opalco) elected instead to inject silicone into as many of the cables as possible. Silicone injection has been used extensively on underground residential distribution (URD) and feeder cables, but only two underwater cables had previously been injected: a feeder cable for Florida Power Corp under an intercoastal waterway and a cable for Washington Water Power Co under a lake in western Idaho. The compound restores power cables damaged by water treeing and prevents further water damage. Selection criteria included age, type, and whether the cables had ever been spliced. Older, soldered, hand-wrapped splices were avoided as they block the CableCure fluid from flowing through. This makes the cable uninjectable unless the splices are replaced with the molded type. The first cables chosen for injection were between 15 and 30 years old and clear of soldered splices. They also were free from faults. 4 figs.

  10. Continuous cross-over from ferroelectric to relaxor state and piezoelectric properties of BaTiO{sub 3}-BaZrO{sub 3}-CaTiO{sub 3} single crystals

    SciTech Connect (OSTI)

    Benabdallah, F.; Veber, P. Prakasam, M.; Viraphong, O.; Maglione, M.; Shimamura, K.

    2014-04-14

    Optimal properties like piezoelectricity can be found in polarizable materials for which the structure changes sharply under small composition variations in the vicinity of their morphotropic phase boundary or the triple point in their isobaric temperature-composition phase diagram. In the latter, lead-free (Ba{sub 0.850}Ca{sub 0.150})(Ti{sub 0.900}Zr{sub 0.100})O{sub 3} ceramics exhibit outstanding piezoelectric coefficients. For the first time, we report the growth of piezoelectric lead-free single crystals in the BaTiO{sub 3}-BaZrO{sub 3}-CaTiO{sub 3} pseudo-ternary system. The stoichiometry control in the CaO-BaO-TiO{sub 2}-ZrO{sub 2} solid solution led to single crystals with various compositions ranging from (Ba{sub 0.857}Ca{sub 0.143})(Ti{sub 0.928}Zr{sub 0.072})O{sub 3} to (Ba{sub 0.953}Ca{sub 0.047})(Ti{sub 0.427}Zr{sub 0.573})O{sub 3}. We evidenced a continuous cross-over from a ferroelectric state at high titanium content to a relaxor one on increasing the zirconium content. Such a property tuning is rather seldom observed in lead-free ferroelectrics and confirms what was already reported for ceramics. Single crystal with (Ba{sub 0.838}Ca{sub 0.162})(Ti{sub 0.854}Zr{sub 0.146})O{sub 3} composition, which has been grown and oriented along [001] crystallographic direction, displayed electromechanical coefficients d{sub 31} and k{sub 31} of 93 pC.N{sup −1} and 0.18, respectively, near the room temperature (T = 305 K)

  11. Method for measuring lead concentrations in blood

    DOE Patents [OSTI]

    Nogar, Nicholas S.

    2001-01-01

    Method for measuring lead concentrations in blood. The present invention includes the use of resonant laser ablation to analyze .ltoreq.1 .mu.L (or equivalent mass) samples of blood for lead content. A typical finger prick, for example, yields about 10 .mu.L. Solid samples may also readily be analyzed by resonant laser ablation. The sample is placed on a lead-free, electrically conducting substrate and irradiated with a single, focused laser beam which simultaneously vaporizes, atomizes, and resonantly ionizes an analyte of interest in a sample. The ions are then sorted, collected and detected using a mass spectrometer.

  12. Electric field-induced phase transitions in Li-modified Na{sub 0.5}K{sub 0.5}NbO{sub 3} at the polymorphic phase boundary

    SciTech Connect (OSTI)

    Iamsasri, Thanakorn; Jones, Jacob L.; Tutuncu, Goknur; Uthaisar, Chunmanus; Pojprapai, Soodkhet; Wongsaenmai, Supattra

    2015-01-14

    The electric field-induced phase transitions in Li-modified Na{sub 0.5}K{sub 0.5}NbO{sub 3} at the polymorphic phase boundary (PPB) were observed using in situ X-ray diffraction. The ratio of monoclinic to tetragonal phase fraction was used as an indicator of the extent and reversibility of the phase transitions. The reversibility of the phase transition was greater in compositions further from the PPB. These results demonstrate that the field-induced phase transition is one of the origins of high piezoelectric properties in lead-free ferroelectric materials.

  13. Feed mechanism and method for feeding minute items

    DOE Patents [OSTI]

    Stringer, Timothy Kent; Yerganian, Simon Scott

    2009-10-20

    A feeding mechanism and method for feeding minute items, such as capacitors, resistors, or solder preforms. The mechanism is adapted to receive a plurality of the randomly-positioned and randomly-oriented extremely small or minute items, and to isolate, orient, and position one or more of the items in a specific repeatable pickup location wherefrom they may be removed for use by, for example, a computer-controlled automated assembly machine. The mechanism comprises a sliding shelf adapted to receive and support the items; a wiper arm adapted to achieve a single even layer of the items; and a pushing arm adapted to push the items into the pickup location. The mechanism can be adapted for providing the items with a more exact orientation, and can also be adapted for use in a liquid environment.

  14. Effect of Dielectric Selection on Sintering Behavior of LTCC

    SciTech Connect (OSTI)

    Krueger, Daniel S.; Agee, Laura; Fadner, Cristie; Duncan, J. Brent

    2010-11-02

    Low Temperature Cofired Ceramic (LTCC) is a versatile ceramic packaging technology. LTCC’s functionality and performance can be enhanced with the incorporation of passive devices such as resistors, capacitors, and inductors into the structure of the substrate. This incorporation, which eliminates surface mount solder joints is desirable for improving system reliability and allows for increased package density. Commercially available dielectrics for embedding capacitors into LTCC are limited and the incorporation of such systems into LTCC substrates poses processing challenges related to material compatibility. This paper will review multiple dielectric systems and techniques for embedding capacitors into LTCC as well as present new data related to the cofiring behavior of LTCC and custom dielectrics.

  15. Sandia/Stanford Unified Creep Plasticity Damage Model for ANSYS

    Energy Science and Technology Software Center (OSTI)

    2006-09-03

    A unified creep plasticity (UCP) model was developed, based upon the time-dependent and time-independent deformation properties of the 95.5Sn-3.9Ag-0.6Cu (wt.%) soldier that were measured at Sandia. Then, a damage parameter, D, was added to the equation to develop the unified creep plasticity damage (UCPD) model. The parameter, D, was parameterized, using data obtained at Sandia from isothermal fatigue experiments on a double-lap shear test. The softwae was validated against a BGA solder joint exposed tomore » thermal cycling. The UCPD model was put into the ANSYS finite element as a subroutine. So, the softwae is the subroutine for ANSYS 8.1.« less

  16. Boron-copper neutron absorbing material and method of preparation

    DOE Patents [OSTI]

    Wiencek, Thomas C.; Domagala, Robert F.; Thresh, Henry

    1991-01-01

    A composite, copper clad neutron absorbing material is comprised of copper powder and boron powder enriched with boron 10. The boron 10 content can reach over 30 percent by volume, permitting a very high level of neutron absorption. The copper clad product is also capable of being reduced to a thickness of 0.05 to 0.06 inches and curved to a radius of 2 to 3 inches, and can resist temperatures of 900.degree. C. A method of preparing the material includes the steps of compacting a boron-copper powder mixture and placing it in a copper cladding, restraining the clad assembly in a steel frame while it is hot rolled at 900.degree. C. with cross rolling, and removing the steel frame and further rolling the clad assembly at 650.degree. C. An additional sheet of copper can be soldered onto the clad assembly so that the finished sheet can be cold formed into curved shapes.

  17. Method for fabricating fan-fold shielded electrical leads

    DOE Patents [OSTI]

    Rohatgi, Rajeev R. (Mountain View, CA); Cowan, Thomas E. (Livermore, CA)

    1994-01-01

    Fan-folded electrical leads made from copper cladded Kapton, for example, with the copper cladding on one side serving as a ground plane and the copper cladding on the other side being etched to form the leads. The Kapton is fan folded with the leads located at the bottom of the fan-folds. Electrical connections are made by partially opening the folds of the fan and soldering, for example, the connections directly to the ground plane and/or the lead. The fan folded arrangement produces a number of advantages, such as electrically shielding the leads from the environment, is totally non-magnetic, and has a very low thermal conductivity, while being easy to fabricate.

  18. Fan-fold shielded electrical leads

    DOE Patents [OSTI]

    Rohatgi, Rajeev R. (Mountain View, CA); Cowan, Thomas E. (Livermore, CA)

    1996-01-01

    Fan-folded electrical leads made from copper cladded Kapton, for example, with the copper cladding on one side serving as a ground plane and the copper cladding on the other side being etched to form the leads. The Kapton is fan folded with the leads located at the bottom of the fan-folds. Electrical connections are made by partially opening the folds of the fan and soldering, for example, the connections directly to the ground plane and/or the lead. The fan folded arrangement produces a number of advantages, such as electrically shielding the leads from the environment, is totally non-magnetic, and has a very low thermal conductivity, while being easy to fabricate.

  19. Method for fabricating fan-fold shielded electrical leads

    DOE Patents [OSTI]

    Rohatgi, R.R.; Cowan, T.E.

    1994-12-27

    Fan-folded electrical leads made from copper cladded Kapton, for example, with the copper cladding on one side serving as a ground plane and the copper cladding on the other side being etched to form the leads. The Kapton is fan folded with the leads located at the bottom of the fan-folds. Electrical connections are made by partially opening the folds of the fan and soldering, for example, the connections directly to the ground plane and/or the lead. The fan folded arrangement produces a number of advantages, such as electrically shielding the leads from the environment, is totally non-magnetic, and has a very low thermal conductivity, while being easy to fabricate. 3 figures.

  20. FMEA on the superconducting torus for the Jefferson Lab 12 GeV accelerator upgrade

    DOE Public Access Gateway for Energy & Science Beta (PAGES Beta)

    Ghoshal, Probir K.; Biallas, George H.; Fair, Ruben J.; Rajput-Ghoshal, Renuka; Schneider, William J.; Legg, Robert A.; Kashy, David H.; Hogan, John P.; Wiseman, Mark A.; Luongo, Cesar; et al

    2015-01-16

    As part of the Jefferson Lab 12GeV accelerator upgrade project, Hall B requires two conduction cooled superconducting magnets. One is a magnet system consisting of six superconducting trapezoidal racetrack-type coils assembled in a toroidal configuration and the second is an actively shielded solenoidal magnet system consisting of 5 coils. Both magnets are to be wound with Superconducting Super Collider-36 NbTi strand Rutherford cable soldered into a copper channel. This paper describes the various failure modes in torus magnet along with the failure modes that could be experienced by the torus and its interaction with the solenoid which is located inmore » close proximity.« less

  1. Fan-fold shielded electrical leads

    DOE Patents [OSTI]

    Rohatgi, R.R.; Cowan, T.E.

    1996-06-11

    Disclosed are fan-folded electrical leads made from copper cladded Kapton, for example, with the copper cladding on one side serving as a ground plane and the copper cladding on the other side being etched to form the leads. The Kapton is fan folded with the leads located at the bottom of the fan-folds. Electrical connections are made by partially opening the folds of the fan and soldering, for example, the connections directly to the ground plane and/or the lead. The fan folded arrangement produces a number of advantages, such as electrically shielding the leads from the environment, is totally non-magnetic, and has a very low thermal conductivity, while being easy to fabricate. 3 figs.

  2. Feed mechanism and method for feeding minute items

    DOE Patents [OSTI]

    Stringer, Timothy Kent; Yerganian, Simon Scott

    2012-11-06

    A feeding mechanism and method for feeding minute items, such as capacitors, resistors, or solder preforms. The mechanism is adapted to receive a plurality of the randomly-positioned and randomly-oriented extremely small or minute items, and to isolate, orient, and position the items in a specific repeatable pickup location wherefrom they may be removed for use by, for example, a computer-controlled automated assembly machine. The mechanism comprises a sliding shelf adapted to receive and support the items; a wiper arm adapted to achieve a single even layer of the items; and a pushing arm adapted to push the items into the pickup location. The mechanism can be adapted for providing the items with a more exact orientation, and can also be adapted for use in a liquid environment.

  3. Probabilistic Mechanical Reliability Prediction of Thermoelectric Legs

    SciTech Connect (OSTI)

    Jadaan, Osama M.; Wereszczak, Andrew A

    2009-05-01

    The probability of failure, Pf, for various square-arrayed thermoelectric device designs using bismuth telluride, lead telluride, or skutterudite thermoelectric materials were estimated. Only volume- or bulk-based Pf analysis was considered in this study. The effects of the choice of the thermoelectric material, the size of the leg array, the height of the thermoelectric legs, and the boundary conditions on the Pf of thermoelectric devices were investigated. Yielding of the solder contacts and mounting layer was taken into account. The modeling results showed that the use of longer legs, using skutterudites, allowing the thermoelectric device to freely deform while under a thermal gradient, and using smaller arrays promoted higher probabilities of survival.

  4. Thin-film chip-to-substrate interconnect and methods for making same

    DOE Patents [OSTI]

    Tuckerman, D.B.

    1988-06-06

    Integrated circuit chips are electrically connected to a silicon wafer interconnection substrate. Thin film wiring is fabricated down bevelled edges of the chips. A subtractive wire fabrication method uses a series of masks and etching steps to form wires in a metal layer. An additive method direct laser writes or deposits very thin lines which can then be plated up to form wires. A quasi-additive or subtractive/additive method forms a pattern of trenches to expose a metal surface which can nucleate subsequent electrolytic deposition of wires. Low inductance interconnections on a 25 micron pitch (1600 wires on a 1 cm square chip) can be produced. The thin film hybrid interconnect eliminates solder joints or welds, and minimizes the levels of metallization. Advantages include good electrical properties, very high wiring density, excellent backside contact, compactness, and high thermal and mechanical reliability. 6 figs.

  5. Thin-film chip-to-substrate interconnect and methods for making same

    DOE Patents [OSTI]

    Tuckerman, David B.

    1991-01-01

    Integrated circuit chips are electrically connected to a silica wafer interconnection substrate. Thin film wiring is fabricated down bevelled edges of the chips. A subtractive wire fabrication method uses a series of masks and etching steps to form wires in a metal layer. An additive method direct laser writes or deposits very thin metal lines which can then be plated up to form wires. A quasi-additive or subtractive/additive method forms a pattern of trenches to expose a metal surface which can nucleate subsequent electrolytic deposition of wires. Low inductance interconnections on a 25 micron pitch (1600 wires on a 1 cm square chip) can be produced. The thin film hybrid interconnect eliminates solder joints or welds, and minimizes the levels of metallization. Advantages include good electrical properties, very high wiring density, excellent backside contact, compactness, and high thermal and mechanical reliability.

  6. Electric lamp, base for use therewith and method of assembling same

    DOE Patents [OSTI]

    Hough, Harold L.; English, George J.; Chakrabarti, Kirti B.

    1989-02-14

    An electric lamp including a reflector, at least one conductive ferrule located within a surface of the reflector and a lead-in conductor electrically connected to the ferrule and extending within the reflector. The lamp includes a base having an insulative (e.g., ceramic) cap located substantially about the ferrule, barrier means (e.g., ceramic fiber) located within the cap to define an open chamber substantially about the ferrule, an electrical conductor (e.g., wire) extending within the cap and electrically connected (e.g., silver soldered) to the ferrule, and sealing means (e.g., high temperature cement) located within the cap to provide a seal therefore. The barrier means serves to separate the sealing means from the open chamber about the ferrule such that the heat generated by the ferrule can be vented through spaced apertures located within the cap's side wall. A method of assembling a base on an electric lamp is also provided.

  7. ES&H development activities for the W89 warhead

    SciTech Connect (OSTI)

    Pretzel, C.W.

    1995-08-01

    Environmental, Safety and Health (ES&H) issues became an important design consideration during the development of the W89 warhead for the SRAM 11 (Short-Range Attack Missile) missile. An action plan was developed to handle these issues at all the production agencies and at both the system and the component level. The main thrust was in the area of solvent substitution, in particular for solder flux removal. The cleaner d-limonene followed by an isopropyl alcohol rinse was selected for applications were the traditional cleaners were 1,1,1 trichloroethane or trichloroethylene. Compatibility testing rather than efficacy testing dominated the development effort. In addition to other solvent substitution applications, organic materials that were free of toluene diisocynate (TDI), and methylene dianiline (MDA) were explored for use in the W89.

  8. Module Experimental Process System Development Unit (MEPSDU). Quarterly report No. 1, November 26, 1980-February 28, 1981

    SciTech Connect (OSTI)

    Not Available

    1981-01-01

    The purpose of this program is to demonstrate the technical readiness of a cost-effective process sequence that has the potential for the production of flat plate photovoltaic modules which met the price goal in 1986 of 70 cents or less per Watt peak. During this initial program quarter, the efforts have included preparation and submission of the Work Breakdown Structure, the Baseline Cost Estimate and the Program Plan. The proposed process sequence was reviewed and laboratory verification experiments were conducted. The preliminary process includes the following features: semicrystalline silicon (10 cm x 10 cm) as the silicon input material, spray-on dopant diffusion source, Al paste BSF formation, spray-on AR coating, electroless Ni plate-solder dip Metallization, laser scribe edges, K and S tabbing and stringing machine, and laminated EVA modules.

  9. Portable TXRF Spectrometer with 10{sup -11}g Detection Limit and Portable XRF Spectromicroscope with Sub-mm Spatial Resolution

    SciTech Connect (OSTI)

    Kunimura, Shinsuke; Hatakeyama, So; Sasaki, Nobuharu; Yamamoto, Takashi; Kawai, Jun

    2010-04-06

    A portable total reflection X-ray fluorescence (TXRF) spectrometer that we have developed is applied to trace elemental analysis of water solutions. Although a 5 W X-ray tube is used in the portable TXRF spectrometer, detection limits of several ppb are achieved for 3d transition metal elements and trace elements in a leaching solution of soils, a leaching solution of solder, and alcoholic beverages are detected. Portable X-ray fluorescence (XRF) spectromicroscopes with a 1 W X-ray tube and an 8 W X-ray tube are also presented. Using the portable XRF spectromicroscope with the 1 W X-ray tube, 93 ppm of Cr is detected with an about 700 {mu}m spatial resolution. Spatially resolved elemental analysis of a mug painted with blue, red, green, and white is performed using the two portable spectromicroscopes, and the difference in elemental composition at each paint is detected.

  10. Capillary test specimen, system, and methods for in-situ visualization of capillary flow and fillet formation

    DOE Patents [OSTI]

    Hall, Aaron C.; Hosking, F. Michael ,; Reece, Mark

    2003-06-24

    A capillary test specimen, method, and system for visualizing and quantifying capillary flow of liquids under realistic conditions, including polymer underfilling, injection molding, soldering, brazing, and casting. The capillary test specimen simulates complex joint geometries and has an open cross-section to permit easy visual access from the side. A high-speed, high-magnification camera system records the location and shape of the moving liquid front in real-time, in-situ as it flows out of a source cavity, through an open capillary channel between two surfaces having a controlled capillary gap, and into an open fillet cavity, where it subsequently forms a fillet on free surfaces that have been configured to simulate realistic joint geometries. Electric resistance heating rapidly heats the test specimen, without using a furnace. Image-processing software analyzes the recorded images and calculates the velocity of the moving liquid front, fillet contact angles, and shape of the fillet's meniscus, among other parameters.

  11. Release Resistant Electrical Interconnections For Mems Devices

    DOE Patents [OSTI]

    Peterson, Kenneth A.; Garrett, Stephen E.; Reber, Cathleen A.

    2005-02-22

    A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device, without using any intermediate layers of aluminum, titanium, solder, or conductive adhesive disposed in-between the conductor and polysilicon pad. After the initial compression bond has been formed, subsequent heat treatment of the joint above 363 C creates a liquid eutectic phase at the bondline comprising gold plus approximately 3 wt % silicon, which, upon re-solidification, significantly improves the bond strength by reforming and enhancing the initial bond. This type of electrical interconnection is resistant to chemical attack from acids used for releasing MEMS elements (HF, HCL), thereby enabling the use of a "package-first, release-second" sequence for fabricating MEMS devices. Likewise, the bond strength of an Au--Ge compression bond may be increased by forming a transient liquid eutectic phase comprising Au-12 wt % Ge.

  12. Power module packaging with double sided planar interconnection and heat exchangers

    DOE Patents [OSTI]

    Liang, Zhenxian; Marlino, Laura D.; Ning, Puqi; Wang, Fei

    2015-05-26

    A double sided cooled power module package having a single phase leg topology includes two IGBT and two diode semiconductor dies. Each IGBT die is spaced apart from a diode semiconductor die, forming a switch unit. Two switch units are placed in a planar face-up and face-down configuration. A pair of DBC or other insulated metallic substrates is affixed to each side of the planar phase leg semiconductor dies to form a sandwich structure. Attachment layers are disposed on outer surfaces of the substrates and two heat exchangers are affixed to the substrates by rigid bond layers. The heat exchangers, made of copper or aluminum, have passages for carrying coolant. The power package is manufactured in a two-step assembly and heating process where direct bonds are formed for all bond layers by soldering, sintering, solid diffusion bonding or transient liquid diffusion bonding, with a specially designed jig and fixture.

  13. Low thermal resistance power module assembly

    DOE Patents [OSTI]

    Hassani, Vahab; Vlahinos, Andreas; Bharathan, Desikan

    2007-03-13

    A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer may be solder material which bonds to the upper surface of the plate to provide a continuous seal around the upper edge of each opening in the plate. The assembly includes power modules mounted on the circuit substrate on a surface opposite the bonding layer. The power modules are positioned over or proximal to the coolant passageways.

  14. Lead-based paint and lead-containing materials: The impact of recent EPA and OSHA regulations on maintenance and construction

    SciTech Connect (OSTI)

    Staker, R.D.; Scheffius, F.R.

    1998-07-01

    Over the past several years a number of new federal environmental, health, and safety regulations have been established which address various types of lead containing materials such as lead used in solder and lead-based paint. The regulations pertain to the use, removal, disposal, and handling of lead-containing materials during maintenance activities, renovation activities, and new construction. This paper will present a review of these new regulations, the impact on and applicability to maintenance and construction activities, and the risks to human health and environment. Examples will be used to illustrate the concepts discussed. This paper should be of particular interest to electric power senior managers, plant managers, environmental managers, and environmental staff.

  15. Real-Time Series Resistance Monitoring in PV Systems Without the Need for I-V Curves

    SciTech Connect (OSTI)

    Deceglie, Michael G.; Silverman, Timothy J.; Marion, Bill; Kurtz, Sarah R.

    2015-10-01

    We apply the physical principles of a familiar method, suns-Voc, to a new application: the real-time detection of series resistance changes in modules and systems operating outside. The real-time series resistance (RTSR) method that we describe avoids the need for collecting I-V curves or constructing full series resistance-free I-V curves. RTSR is most readily deployable at the module level on microinverters or module-integrated electronics, but it can also be extended to full strings. We found that automated detection of series resistance increases can provide early warnings of some of the most common reliability issues, which also pose fire risks, including broken ribbons, broken solder bonds, and contact problems in the junction or combiner box. We also describe the method in detail and describe a sample application to data collected from modules operating in the field.

  16. Automated solar cell assembly teamed process research. Semiannual subcontract report, 7 January 1993--30 June 1993

    SciTech Connect (OSTI)

    Nowlan, M.J.; Hogan, S.J.; Darkazalli, G.; Breen, W.F.; Murach, J.M.; Sutherland, S.F.

    1994-02-01

    This report describes work done under Phase 3A of the PVMaT project to address problems that are generic to the photovoltaics (PV) industry. Crystalline silicon solar cells were used in the majority of all terrestrial power modules shipped in 1992. Spire`s analysis in Phase 1 of the PVMaT project indicated that the use of thin ({le}200-{mu}m) silicon cells can substantially reduce module manufacturing costs, provided that processing yields remain as high as they are now for processing standard thickness cells. Because present solar cell tabbing and interconnecting processes have unacceptably high yield losses with such thin cells, the objective of this Phase 3A subcontract is to use Spire`s light soldering technology and experience in designing and fabricating solar cell tabbing and interconnecting equipment to develop high yield throughput, fully automated processes for tabbing and interconnecting thin cells.

  17. Automated solar cell assembly team process research. Annual subcontract report, 1 January 1993--31 December 1993

    SciTech Connect (OSTI)

    Nowlan, M.J.; Hogan, S.J.; Darkazalli, G.; Breen, W.F.; Murach, J.M.; Sutherland, S.F.; Patterson, J.S.

    1994-06-01

    This report describes work done under the Photovoltaic Manufacturing Technology (PVMaT) project, Phase 3A, which addresses problems that are generic to the photovoltaic (PV) industry. Spire`s objective during Phase 3A was to use its light soldering technology and experience to design and fabricate solar cell tabbing and interconnecting equipment to develop new, high-yield, high-throughput, fully automated processes for tabbing and interconnecting thin cells. Areas that were addressed include processing rates, process control, yield, throughput, material utilization efficiency, and increased use of automation. Spire teamed with Solec International, a PV module manufacturer, and the University of Massachusetts at Lowell`s Center for Productivity Enhancement (CPE), automation specialists, who are lower-tier subcontractors. A number of other PV manufacturers, including Siemens Solar, Mobil Solar, Solar Web, and Texas instruments, agreed to evaluate the processes developed under this program.

  18. Thermal calculation of a thermogenerator at changing temperatures along thermocontact surfaces

    SciTech Connect (OSTI)

    Varshavskiy, G.A.; Rezgol', I.A.

    1986-01-13

    The article finds expressions for the output power of efficiency of a thermoelectric generator and temperature distribution along the heat carrier under the condition that temperatures of the thermocontact surfaces vary due to the cooling and heating of the heat carriers. Simple approximation calculation formulas are given for the particular cases examined. This work is devoted to the finding of analytical bonds, which make it possible to make the calculation of the thermogenerator at changing (as a result of heat transfer) temperatures of the solderings. The obtained expressions can be useful in the preliminary determination of the optimal parameters of the generators (maximal power and efficiency, minimal weight, etc.) and an analysis of processes of regulation.

  19. CONTROL ROD

    DOE Patents [OSTI]

    Zinn, W.H.; Ross, H.V.

    1958-11-18

    A control rod is described for a nuclear reactor. In certaln reactor designs it becomes desirable to use a control rod having great width but relatively llttle thickness. This patent is addressed to such a need. The neutron absorbing material is inserted in a triangular tube, leaving volds between the circular insert and the corners of the triangular tube. The material is positioned within the tube by the use of dummy spacers to achleve the desired absorption pattern, then the ends of the tubes are sealed with suitable plugs. The tubes may be welded or soldered together to form two flat surfaces of any desired width, and covered with sheetmetal to protect the tubes from damage. This design provides a control member that will not distort under the action of outside forces or be ruptured by gases generated within the jacketed control member.

  20. Metallurgical characterization of brass objects from the Akko 1 shipwreck, Israel

    SciTech Connect (OSTI)

    Ashkenazi, D.; Cvikel, D.; Stern, A.; Klein, S.; Kahanov, Y.

    2014-06-01

    The Akko 1 shipwreck was a small Egyptian armed vessel or auxiliary naval brig built in the eastern Mediterranean at the beginning of the 19th century. During the underwater excavations, about 230 brass hook-and-eye closures were found, mainly in the bow area. In addition, 158 brass cases were found, mainly between midships and the aft extremity of the shipwreck. Metallurgical non-destructive and destructive characterizations of selected items were performed, including radiographic testing, XRF, lead isotope analysis, optical microscopy, SEM–EDS and microhardness tests. The hook-and-eye closures and the cases were both found to be made of binary copper–zinc alloy (about 30 wt.% zinc). While the brass cases were made from rolled sheets, hand-made using simple tools, and joined by tin–lead soldering material, the brass hook-and-eye closures were hand-made from drawn brass wire, and manufactured from commercial drawn brass bars by a cold-working process. The lead isotope analyses suggest different provenances of the raw materials used for making the brass objects, thus the different origins of the ores may hint that the brass wire and sheet were imported to the workshops in which the objects were manufactured. - Highlights: • Brass cases and hook-and-eye closures were retrieved from the Akko 1 shipwreck. • Both types of objects were made of binary copper–zinc alloy (about 30 wt.% zinc). • The cases were hand-made from rolled sheets and joined by tin–lead soldering. • Hook-and-eye closures were made from drawn brass wire manufactured by cold-working. • Lead isotope analyses suggest that the origins of the raw material were diverse.

  1. Materials Compatibility and Aging for Flux and Cleaner Combinations.

    SciTech Connect (OSTI)

    Archuleta, Kim; Piatt, Rochelle

    2015-01-01

    A materials study of high reliability electronics cleaning is presented here. In Phase 1, mixed type substrates underwent a condensed contaminants application to view a worst- case scenario for unremoved flux with cleaning agent residue for parts in a silicone oil filled environment. In Phase 2, fluxes applied to copper coupons and to printed wiring boards underwent gentle cleaning then accelerated aging in air at 65% humidity and 30 O C. Both sets were aged for 4 weeks. Contaminants were no-clean (ORL0), water soluble (ORH1 liquid and ORH0 paste), and rosin (RMA; ROL0) fluxes. Defluxing agents were water, solvents, and engineered aqueous defluxers. In the first phase, coupons had flux applied and heated, then were placed in vials of oil with a small amount of cleaning agent and additional coupons. In the second phase, pairs of copper coupons and PWB were hand soldered by application of each flux, using tin-lead solder in a strip across the coupon or a set of test components on the PWB. One of each pair was cleaned in each cleaning agent, the first with a typical clean, and the second with a brief clean. Ionic contamination residue was measured before accelerated aging. After aging, substrates were removed and a visual record of coupon damage made, from which a subjective rank was applied for comparison between the various flux and defluxer combinations; more corrosion equated to higher rank. The ORH1 water soluble flux resulted in the highest ranking in both phases, the RMA flux the least. For the first phase, in which flux and defluxer remained on coupons, the aqueous defluxers led to worse corrosion. The vapor phase cleaning agents resulted in the highest ranking in the second phase, in which there was no physical cleaning. Further study of cleaning and rinsing parameters will be required.

  2. Predicted thermal performance of triple vacuum glazing

    SciTech Connect (OSTI)

    Fang, Yueping; Hyde, Trevor J.; Hewitt, Neil

    2010-12-15

    The simulated triple vacuum glazing (TVG) consists of three 4 mm thick glass panes with two vacuum gaps, with each internal glass surface coated with a low-emittance coating with an emittance of 0.03. The two vacuum gaps are sealed by an indium based sealant and separated by a stainless steel pillar array with a height of 0.12 mm and a pillar diameter of 0.3 mm spaced at 25 mm. The thermal transmission at the centre-of-glazing area of the TVG was predicted to be 0.26 W m{sup -2} K{sup -1}. The simulation results show that although the thermal conductivity of solder glass (1 W m{sup -1} K{sup -1}) and indium (83.7 W m{sup -1} K{sup -1}) are very different, the difference in thermal transmission of TVGs resulting from the use of an indium and a solder glass edge seal was 0.01 W m{sup -2} K{sup -1}. This is because the edge seal is so thin (0.12 mm), consequently there is a negligible temperature drop across it irrespective of the material that the seal is made from relative to the total temperature difference across the glazing. The results also show that there is a relatively large increase in the overall thermal conductance of glazings without a frame when the width of the indium edge seal is increased. Increasing the rebate depth in a solid wood frame decreased the heat transmission of the TVG. The overall heat transmission of the simulated 0.5 m by 0.5 m TVG was 32.6% greater than that of the 1 m by 1 m TVG, since heat conduction through the edge seal of the small glazing has a larger contribution to the total glazing heat transfer than that of the larger glazing system. (author)

  3. Aging in the relaxor and ferroelectric state of Fe-doped (1-x)(Bi{sub 1/2}Na{sub 1/2})TiO₃-xBaTiO₃ piezoelectric ceramics

    SciTech Connect (OSTI)

    Sapper, Eva; Dittmer, Robert; Rödel, Jürgen; Damjanovic, Dragan; Erdem, Emre; Keeble, David J.; Jo, Wook; Granzow, Torsten

    2014-09-14

    Aging of piezoelectric properties was investigated in lead-free (1–x)(Bi{sub 1/2}Na{sub 1/2})TiO₃-xBaTiO₃ doped with 1at.% Fe. The relaxor character of the un-poled material prevents macroscopic aging effects, while in the field-induced ferroelectric phase aging phenomena are similar to those found in lead zirconate titanate or barium titanate. Most prominent aging effects are the development of an internal bias field and the decrease of switchable polarization. These effects are temperature activated, and can be explained in the framework of defect complex reorientation. This picture is further supported by electron paramagnetic resonance spectra indicating the existence of (Fe{sub Ti}´-V{sub O}{sup ••}){sup •} defect complexes in the Fe-doped material.

  4. Reduced Coercive Field in BiFeO3 Thin Films through Domain Engineering

    SciTech Connect (OSTI)

    Shelke, Vilas K; Mazumdar, Dipanjan; Srinivasan, Dr. Gopalan; Jesse, Stephen; Kalinin, Sergei V; Baddorf, Arthur P; Gupta, Dr. Arunava

    2011-01-01

    The bismuth ferrite (BiFeO3) material offers a comprehensive package of multifunctionality. In addition to the multiferroic behavior, i.e. coexistence of electric and magnetic orderings,[1] it also exhibits photovoltaic effect, [2] metal-insulator transition,[3] electric modulation of conduction,[4] and terahertz radiation emission.[5] The possibility of joint control of electric, magnetic, and optical properties provides several degrees of freedom to design exotic devices. It is a green energy material in the sense that it is lead-free and energy-efficient due to cryogen-less functionality. Therefore, a wide variety of applications in terms of sensors, memories and spintronic devices are foreseen.[6] However, the incipient lower value of magneto-electric coupling has raised skepticism regarding its multiferroic capabilities and allied applications.[6] Nevertheless, the highest value of ferroelectric polarization (~ 100 C.cm-2) is very promising for next generation ferroelectric random access memory devices.

  5. Microchannel heat sink assembly

    DOE Patents [OSTI]

    Bonde, W.L.; Contolini, R.J.

    1992-03-24

    The present invention provides a microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade. The heat sink can be used with a variety of fluids, such as cryogenic or corrosive fluids, and can be operated at a high pressure. The heat sink comprises a microchannel layer preferably formed of silicon, and a manifold layer preferably formed of glass. The manifold layer comprises an inlet groove and outlet groove which define an inlet manifold and an outlet manifold. The inlet manifold delivers coolant to the inlet section of the microchannels, and the outlet manifold receives coolant from the outlet section of the microchannels. In one embodiment, the manifold layer comprises an inlet hole extending through the manifold layer to the inlet manifold, and an outlet hole extending through the manifold layer to the outlet manifold. Coolant is supplied to the heat sink through a conduit assembly connected to the heat sink. A resilient seal, such as a gasket or an O-ring, is disposed between the conduit and the hole in the heat sink in order to provide a watertight seal. In other embodiments, the conduit assembly may comprise a metal tube which is connected to the heat sink by a soft solder. In still other embodiments, the heat sink may comprise inlet and outlet nipples. The present invention has application in supercomputers, integrated circuits and other electronic devices, and is suitable for cooling materials to superconducting temperatures. 13 figs.

  6. Performance of improved magnetostrictive vibrational power generator, simple and high power output for practical applications

    SciTech Connect (OSTI)

    Ueno, Toshiyuki

    2015-05-07

    Vibration based power generation technology is utilized effectively in various fields. Author has invented novel vibrational power generation device using magnetostrictive material. The device is based on parallel beam structure consisting of a rod of iron-gallium alloy wound with coil and yoke accompanied with permanent magnet. When bending force is applied on the tip of the device, the magnetization inside the rod varies with induced stress due to the inverse magnetostrictive effect. In vibration, the time variation of the magnetization generates voltage on the wound coil. The magnetostrictive type is advantageous over conventional such using piezoelectric or moving magnet types in high efficiency and high robustness, and low electrical impedance. Here, author has established device configuration, simple, rigid, and high power output endurable for practical applications. In addition, the improved device is lower cost using less volume of Fe-Ga and permanent magnet compared to our conventional, and its assembly by soldering is easy and fast suitable for mass production. Average power of 3 mW/cm{sup 3} under resonant vibration of 212 Hz and 1.2 G was obtained in miniature prototype using Fe-Ga rod of 2 × 0.5× 7 mm{sup 3}. Furthermore, the damping effect was observed, which demonstrates high energy conversion of the generator.

  7. In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples

    DOE Public Access Gateway for Energy & Science Beta (PAGES Beta)

    Yin, Qiyue; Stach, Eric A.; Gao, Fan; Zhou, Guangwen; Gu, Zhiyong

    2015-02-10

    The Cu–Sn metallurgical soldering reaction in two-segmented Cu–Sn nanowires is visualized by in-situ transmission electron microscopy. By varying the relative lengths of Cu and Sn segments, we show that the metallurgical reaction starts at ~ 200 ° with the formation of a Cu–Sn solid solution for the Sn/Cu length ratio smaller than 1:5 while the formation of Cu–Sn intermetallic compounds (IMCs) for larger Sn/Cu length ratios. Upon heating the nanowires up to ~ 500 °C, two phase transformation pathways occur, η-Cu₆Sn₅ → ε-Cu₃Sn → δ-Cu₄₁Sn₁₁ for nanowires with a long Cu segment and η-Cu₆Sn₅ → ε-Cu₃Sn → γ-Cu₃Sn with amore » short Cu segment. The dynamic in situ TEM visualization of the evolution of Kirkendall voids demonstrates that Cu diffuses faster both in Sn and IMCs than that of Sn in Cu₃ and IMCs, which is the underlying cause of the dependence of the IMC formation and associated phase evolution on the relative lengths of the Cu and Sn segments.« less

  8. A novel planar ion funnel design for miniature ion optics

    SciTech Connect (OSTI)

    Chaudhary, A.; Amerom, Friso H. W. van; Short, R. T.

    2014-10-01

    The novel planar ion funnel (PIF) design presented in this article emphasizes simple fabrication, assembly, and operation, making it amenable to extreme miniaturization. Simulations performed in SIMION 8.0 indicate that ion focusing can be achieved by using a gradient of electrostatic potentials on concentric metal rings in a plane. A prototype was fabricated on a 35 35 mm custom-designed printed circuit board (PCB) with a center hole for ions to pass through and a series of concentric circular metal rings of increasing diameter on the front side of the PCB. Metal vias on the PCB electrically connected each metal ring to a resistive potential divider that was soldered on the back of the PCB. The PIF was tested at 5.5 10?? Torr in a vacuum test setup that was equipped with a broad-beam ion source on the front and a micro channel plate (MCP) ion detector on the back of the PIF. The ion current recorded on the MCP anode during testing indicated a 23 increase in the ion transmission through the PIF when electric potentials were applied to the rings. These preliminary results demonstrate the functionality of a 2D ion funnel design with a much smaller footprint and simpler driving electronics than conventional 3D ion funnels. Future directions to improve the design and a possible micromachining approach to fabrication are discussed in the conclusions.

  9. Demountable externally anchored low-stress magnet system and related method

    DOE Patents [OSTI]

    Powell, James; Hsieh, Shih-Yung; Lehner, John R.

    1981-01-01

    Toroidal field coils are interlaced with other toroidal structures and are operated under supercooled conditions. To facilitate demounting the toroidal field coils, which are supercooled, they are made in the form of connected segments constituting coils of polygonal form. The segments may be rectilinear in form, but some may also be U-shaped or L-shaped. The segments are detachable from one another and are supported in load relieving manner. Power devices are used to displace the segments to facilitate removal of the coils from the aforesaid toroidal structures and to provide for the accommodation of dimensional changes and stresses due to thermal and magnetic conditions. The segments are formed of spaced parallel conductive slabs with the slabs of one segment being interdigitated with the slabs of the adjacent segment. The interdigitated slabs may be soldered together or slidingly engaged. The slabs are shaped to accommodate superconductors and to provide passages for a cooling medium. The slabs are moreover separated by insulator slabs with which they form a coil structure which is jacketed.

  10. Liquid cooled, linear focus solar cell receiver

    DOE Patents [OSTI]

    Kirpich, A.S.

    1983-12-08

    Separate structures for electrical insulation and thermal conduction are established within a liquid cooled, linear focus solar cell receiver for use with parabolic or Fresnel optical concentrators. The receiver includes a V-shaped aluminum extrusion having a pair of outer faces each formed with a channel receiving a string of solar cells in thermal contact with the extrusion. Each cell string is attached to a continuous glass cover secured within the channel with spring clips to isolate the string from the external environment. Repair or replacement of solar cells is effected simply by detaching the spring clips to remove the cover/cell assembly without interrupting circulation of coolant fluid through the receiver. The lower surface of the channel in thermal contact with the cells of the string is anodized to establish a suitable standoff voltage capability between the cells and the extrusion. Primary electrical insulation is provided by a dielectric tape disposed between the coolant tube and extrusion. Adjacent solar cells are soldered to interconnect members designed to accommodate thermal expansion and mismatches. The coolant tube is clamped into the extrusion channel with a releasably attachable clamping strip to facilitate easy removal of the receiver from the coolant circuit.

  11. Liquid cooled, linear focus solar cell receiver

    DOE Patents [OSTI]

    Kirpich, Aaron S.

    1985-01-01

    Separate structures for electrical insulation and thermal conduction are established within a liquid cooled, linear focus solar cell receiver for use with parabolic or Fresnel optical concentrators. The receiver includes a V-shaped aluminum extrusion having a pair of outer faces each formed with a channel receiving a string of solar cells in thermal contact with the extrusion. Each cell string is attached to a continuous glass cover secured within the channel with spring clips to isolate the string from the external environment. Repair or replacement of solar cells is effected simply by detaching the spring clips to remove the cover/cell assembly without interrupting circulation of coolant fluid through the receiver. The lower surface of the channel in thermal contact with the cells of the string is anodized to establish a suitable standoff voltage capability between the cells and the extrusion. Primary electrical insulation is provided by a dielectric tape disposed between the coolant tube and extrusion. Adjacent solar cells are soldered to interconnect members designed to accommodate thermal expansion and mismatches. The coolant tube is clamped into the extrusion channel with a releasably attachable clamping strip to facilitate easy removal of the receiver from the coolant circuit.

  12. The Calculated and Measured Resistance for Splices between Conductors in a MICE Superconducting Coil

    SciTech Connect (OSTI)

    Green, Michael A.; Dietderich, Dan; Higley, Hugh; Pan, Heng; Tam, Darren; Trillaud, Federic; Wang, Li; Wu, Hong; Xu, Feng Yu

    2009-03-19

    The resistance of superconducting joints within MICE coils is an important issue particularly for the coupling coils. The MICE tracker solenoids have only two superconducting joints in the three spectrometer set (end coil 1, the center coil and end coil 2). The AFC magnets may have only a single joint within the coil. The coupling coils may have as many as fifteen joints within the coil, due to relatively short piece lengths of the superconductor. LBNL and ICST looked at three types of coil joints. They are: (1) cold fusion butt joints, (2) side-by-side lap joints, and (3) up-down lap joints. A theoretical calculation of the joint resistance was done at LBNL and checked by ICST. After looking at the theoretical resistance of the three types of joints, it was decided that the cold welded butt joint was not an attractive alternative for joints within a MICE superconducting magnet coil. Side-by-side and up-down lap joints were fabricated at ICST using two types of soft solder between the conductors. These conductor joints were tested at LBNL at liquid helium temperatures over a range of magnetic fields. The joint resistance was compared with the theoretical calculations. Measurements of splice strength were also made at 300 K and 77 K.

  13. Apparatus And Method Of Using Flexible Printed Circuit Board In Optical Transceiver Device

    DOE Patents [OSTI]

    Anderson, Gene R.; Armendariz, Marcelino G.; Bryan, Robert P.; Carson, Richard F.; Duckett, III, Edwin B.; McCormick, Frederick B.; Peterson, David W.; Peterson, Gary D.; Reysen, Bill H.

    2005-03-15

    This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board. In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board, and a window is formed in the head region of the flexible printed circuit board. Optoelectronic devices are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board.

  14. Evaluation of permanent die coatings to improve the wear resistance of die casting dies. Final project report, January 1, 1995--April 30, 1997

    SciTech Connect (OSTI)

    Shivpuri, R.

    1997-09-18

    Die Casting dies are subject to severe service conditions during the die casting operation. While these severe conditions are necessary to achieve high production rates, they cause the dies which are commonly made of H13 die steel, to suffer frequent failures. The major die failure mechanisms are erosion or washout, Heat checking, soldering and corrosion. Due to their geometrical complexity, die casting dies are very expensive (some dies cost over a million dollars), and thus a large number of parts have to be produced by a die, to justify this cost and leverage the advantages of the die casting process (high production rates, low manpower costs). A potential increase in the die service life, thus has a significant impact on the economics of the die; casting operation. There are many ways to extend die life: developing new wear resistant die materials, developing new surface treatments including coatings, improving heat treatment of existing H13 dies, using better lubricants that can protect the die material, or modifying the die geometry and process parameters to reduce the intensity of wear. Of these the use of coatings to improve the wear resistance of the die surface has shown a lot of promise. Consequently, use of coatings in the die casting industry and their wide use to decrease die wear can improve significantly the productivity of shop operations resulting in large savings in material and energy usage.

  15. Low cost impulse compatible wideband antenna

    DOE Patents [OSTI]

    Rosenbury, Erwin T.; Burke, Gerald J.; Nelson, Scott D.; Stever, Robert D.; Governo, George K.; Mullenhoff, Donald J.

    2002-01-01

    An antenna apparatus and method for building the antenna is disclosed. Impulse signals travel through a feed point of the antenna with respect to a ground plane. A geometric fin structure is connected to the feed point, and through a termination resistance to the ground plane. A geometric ridge structure connected to the ground is positioned with respect to the fin in order to receive and radiate electromagnetic energy from the impulse signal at a predetermined impedance and over a predetermined set of frequencies. The fin and ridge can be either a wire or a planar surface. The fin and ridge may be disposed within a radiation cavity such as a horn. The radiation cavity is constructed of stamped and etched metal sheets bent and then soldered together. The fin and ridge are also formed from metal sheets or wires. The fin is attached to the feed point and then to the cavity through a termination resistance. The ridge is attached to the cavity and disposed with respect to the fin in order to achieve a particular set of antenna characteristics.

  16. Attachment method for stacked integrated circuit (IC) chips

    DOE Patents [OSTI]

    Bernhardt, Anthony F. (Berkeley, CA); Malba, Vincent (Livermore, CA)

    1999-01-01

    An attachment method for stacked integrated circuit (IC) chips. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM.

  17. Attachment method for stacked integrated circuit (IC) chips

    DOE Patents [OSTI]

    Bernhardt, A.F.; Malba, V.

    1999-08-03

    An attachment method for stacked integrated circuit (IC) chips is disclosed. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM. 12 figs.

  18. Photovoltaic concentrator module improvements study

    SciTech Connect (OSTI)

    Levy, S.L.; Kerschen, K.A. ); Hutchison, G. ); Nowlan, M.J. )

    1991-08-01

    This report presents results of a project to design and fabricate an improved photovoltaic concentrator module. Using previous work as a baseline, this study conducted analyses and testing to select major module components and design features. The lens parquet and concentrator solar cell were selected from the highest performing, available components. A single 185X point-focus module was fabricated by the project team and tested at Sandia. Major module characteristics include a 6 by 4 compression-molded acrylic lens parquet (0.737 m{sup 2} area), twenty-four 0.2 ohms-cm, FZ, p-Si solar cells (1.56 cm{sup 2} area) soldered to ceramic substrates and copper heat spreaders, and an aluminized steel housing with corrugated bottom. This project marked the first attempt to use prismatic covers on solar cells in a high-concentration, point-focus application. Cells with 15 percent metallization were obtained, but problems with the fabrication and placement of prismatic covers on these cells lead to the decision not to use covers in the prototype module. Cell assembly fabrication, module fabrication, and module optical design activities are presented here. Test results are also presented for bare cells, cell assemblies, and module. At operating conditions of 981 watts/m{sup 2} DNI and an estimated cell temperature of 65{degrees}C, the module demonstrated an efficiency of 13.9 percent prior to stressed environmental exposure. 12 refs., 56 figs., 7 tabs.

  19. Laser-induced breakdown spectroscopy in industrial and security applications

    SciTech Connect (OSTI)

    Bol'shakov, Alexander A.; Yoo, Jong H.; Liu Chunyi; Plumer, John R.; Russo, Richard E.

    2010-05-01

    Laser-induced breakdown spectroscopy (LIBS) offers rapid, localized chemical analysis of solid or liquid materials with high spatial resolution in lateral and depth profiling, without the need for sample preparation. Principal component analysis and partial least squares algorithms were applied to identify a variety of complex organic and inorganic samples. This work illustrates how LIBS analyzers can answer a multitude of real-world needs for rapid analysis, such as determination of lead in paint and children's toys, analysis of electronic and solder materials, quality control of fiberglass panels, discrimination of coffee beans from different vendors, and identification of generic versus brand-name drugs. Lateral and depth profiling was performed on children's toys and paint layers. Traditional one-element calibration or multivariate chemometric procedures were applied for elemental quantification, from single laser shot determination of metal traces at {approx}10 {mu}g/g to determination of halogens at 90 {mu}g/g using 50-shot spectral accumulation. The effectiveness of LIBS for security applications was demonstrated in the field by testing the 50-m standoff LIBS rasterizing detector.

  20. Innovative Seals for Solid Oxide Fuel Cells (SOFC)

    SciTech Connect (OSTI)

    Singh, Raj

    2008-06-30

    A functioning SOFC requires different type of seals such as metal-metal, metal-ceramic, and ceramic-ceramic. These seals must function at high temperatures between 600--900{sup o}C and in oxidizing and reducing environments of the fuels and air. Among the different type of seals, the metal-metal seals can be readily fabricated using metal joining, soldering, and brazing techniques. However, the metal-ceramic and ceramic-ceramic seals require significant research and development because the brittle nature of ceramics/glasses can lead to fracture and loss of seal integrity and functionality. Consequently, any seals involving ceramics/glasses require a significant attention and technology development for reliable SOFC operation. This final report is prepared to describe the progress made in the program on the needs, approaches, and performance of high temperature seals for SOFC. In particular, a new concept of self-healing glass seals is pursued for making seals between metal-ceramic material combinations, including some with a significant expansion mismatch.

  1. Low thermal resistance power module assembly

    DOE Patents [OSTI]

    Hassani, Vahab; Vlahinos, Andreas; Bharathan, Desikan

    2010-12-28

    A power module assembly (400) with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate (410) with passageways or openings (414) for coolant that extend through the plate from a lower surface (411) to an upper surface (412). A circuit substrate (420) is provided and positioned on the spreader plate (410) to cover the coolant passageways. The circuit substrate (420) includes a bonding layer (422) configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer (422) may be solder material which bonds to the upper surface (412) of the plate to provide a continuous seal around the upper edge of each opening (414) in the plate. The assembly includes power modules (430) mounted on the circuit substrate (420) on a surface opposite the bonding layer (422). The power modules (430) are positioned over or proximal to the coolant passageways.

  2. Real-time Series Resistance Monitoring in PV Systems; NREL (National Renewable Energy Laboratory)

    SciTech Connect (OSTI)

    Deceglie, M. G.; Silverman, T. J.; Marion, B.; Kurtz, S. R.

    2015-06-14

    We apply the physical principles of a familiar method, suns-Voc, to a new application: the real-time detection of series resistance changes in modules and systems operating outside. The real-time series resistance (RTSR) method that we describe avoids the need for collecting IV curves or constructing full series-resistance-free IV curves. RTSR is most readily deployable at the module level on apply the physical principles of a familiar method, suns-Voc, to a new application: the real-time detection of series resistance changes in modules and systems operating outside. The real-time series resistance (RTSR) method that we describe avoids the need for collecting IV curves or constructing full series-resistance-free IV curves. RTSR is most readily deployable at the module level on micro-inverters or module-integrated electronics, but it can also be extended to full strings. Automated detection of series resistance increases can provide early warnings of some of the most common reliability issues, which also pose fire risks, including broken ribbons, broken solder bonds, and contact problems in the junction or combiner box. We describe the method in detail and describe a sample application to data collected from modules operating in the field.

  3. Development of large-area monolithically integrated Silicon-Film photovoltaic modules. Annual subcontract report, 16 November 1991--31 December 1992

    SciTech Connect (OSTI)

    Rand, J.A.; Cotter, J.E.; Ingram, A.E.; Ruffins, T.R.; Shreve, K.P.; Hall, R.B.; Barnett, A.M.

    1993-06-01

    This report describes work to develop Silicon-Film{trademark} Product III into a low-cost, stable solar cell for large-scale terrestrial power applications. The Product III structure is a thin (< 100-{mu}m) polycrystalline layer of silicon on a durable, insulating, ceramic substrate. The insulating substrate allows the silicon layer to be isolated and metallized to form a monolithically interconnected array of solar cells. High efficiency is achievable with the use of light trapping and a passivated back surface. The long-term goal for the product is a 1200-cm{sup 2}, 18%-efficient, monolithic array. The short-term objectives are to improve material quality and to fabricate 100 cm{sup 2} monolithically interconnected solar cell arrays. Low minority-carrier diffusion length in the silicon film and series resistance in the interconnected device structure are presently limiting device performance. Material quality is continually improving through reduced impurity contamination. Metallization schemes, such as a solder-dipped interconnection process, have been developed that will allow low-cost production processing and minimize R{sub s} effects. Test data for a nine-cell device (16 cm{sup 2}) indicated a V{sub oc} of 3.72 V. These first-reported monolithically interconnected multicrystalline silicon-on-ceramic devices show low shunt conductance (< 0.1 mA/cm{sup 2}) due to limited conduction through the ceramic and no process-related metallization shunts.

  4. Microchannel heat sink assembly

    DOE Patents [OSTI]

    Bonde, Wayne L.; Contolini, Robert J.

    1992-01-01

    The present invention provides a microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade. The heat sink can be used with a variety of fluids, such as cryogenic or corrosive fluids, and can be operated at a high pressure. The heat sink comprises a microchannel layer preferably formed of silicon, and a manifold layer preferably formed of glass. The manifold layer comprises an inlet groove and outlet groove which define an inlet manifold and an outlet manifold. The inlet manifold delivers coolant to the inlet section of the microchannels, and the outlet manifold receives coolant from the outlet section of the microchannels. In one embodiment, the manifold layer comprises an inlet hole extending through the manifold layer to the inlet manifold, and an outlet hole extending through the manifold layer to the outlet manifold. Coolant is supplied to the heat sink through a conduit assembly connected to the heat sink. A resilient seal, such as a gasket or an O-ring, is disposed between the conduit and the hole in the heat sink in order to provide a watetight seal. In other embodiments, the conduit assembly may comprise a metal tube which is connected to the heat sink by a soft solder. In still other embodiments, the heat sink may comprise inlet and outlet nipples. The present invention has application in supercomputers, integrated circuits and other electronic devices, and is suitable for cooling materials to superconducting temperatures.

  5. Structure and ferroelectric studies of (Ba{sub 0.85}Ca{sub 0.15})(Ti{sub 0.9}Zr{sub 0.1})O{sub 3} piezoelectric ceramics

    SciTech Connect (OSTI)

    Venkata Ramana, E.; Mahajan, A.; Graa, M.P.F.; Mendiratta, S.K.; Monteiro, J.M.; Valente, M.A.

    2013-10-15

    Graphical abstract: - Highlights: (Ba{sub 0.85}Ca{sub 0.15})(Ti{sub 0.9}Zr{sub 0.1})O{sub 3} (BCTZO) ceramic was synthesized by the ceramic method. In situ XRD and Raman spectra showed the phase transition of BCTZO around 360 K. The ceramics showed a tunability of 82% at 40 kV cm{sup ?1} electric field. BCTZO exhibited good quality factor of 111 at microwave frequencies. Piezoforce microscopy studies indicated the switchability of ferroelectric domains. - Abstract: We have synthesized and studied the structural and ferroelectric properties of lead-free 0.5(Ba{sub 0.7}Ca{sub 0.3})TiO{sub 3}0.5Ba(Zr{sub 0.2}Ti{sub 0.8})O{sub 3} ceramics in the temperature region of its ferroelectric transition. The synthesized material showed high dielectric constant, low loss and good pyroelectric figure of merit. From the temperature dependent X-ray diffraction measurements, we determined the tricritical point to be in the temperature range of 303400 K. The dielectric measurements indicate a diffuse ferroelectric phase transition (DPT) around 360 K in agreement with the X-ray measurements. We studied the evolution of Raman spectra with temperature to understand the nature of phase transition in BaTiO{sub 3} (BTO) and the BCTZO. The results indicates that the transition of ferroelectricparaelectric state is not sharp as in the case of BTO and the polar state persists through the paraelectric state. In general, our study indicates that there are ferroelectric domains of nanometer size beyond the commonly defined transition temperature. The observation of local piezoelectric hysteresis loop indicated the existence of intrinsic ferroelectric property of the ceramic at the nanoscale. The ceramics exhibited electric field tunable dielectric properties with a tunability of 82% at an applied DC field of 40 kV cm{sup ?1}, low dielectric loss of 0.001 and room temperature pyroelectric coefficient of 6 10{sup ?8} C cm{sup ?2} K{sup ?1} and the detectivity of 1.9 10{sup ?8} C cm{sup ?1} J{sup ?1}; larger than those reported for other BaTiO{sub 3}-based materials. Overall, our results indicate that BCTZO ceramics with coexistence of rhombohedraltetragonal phases is a promising candidate for lead-free ferroelectric applications.

  6. Energy-Saving Melting and Revert Reduction Technology (E-SMARRT): Use of Laser Engineered Net Shaping for Rapid Manufacturing of Dies with Protective Coatings and Improved Thermal Management

    SciTech Connect (OSTI)

    Brevick, Jerald R.

    2014-06-13

    In the high pressure die casting process, molten metal is introduced into a die cavity at high pressure and velocity, enabling castings of thin wall section and complex geometry to be obtained. Traditional die materials have been hot work die steels, commonly H13. Manufacture of the dies involves machining the desired geometry from monolithic blocks of annealed tool steel, heat treating to desired hardness and toughness, and final machining, grinding and polishing. The die is fabricated with internal water cooling passages created by drilling. These materials and fabrication methods have been used for many years, however, there are limitations. Tool steels have relatively low thermal conductivity, and as a result, it takes time to remove the heat from the tool steel via the drilled internal water cooling passages. Furthermore, the low thermal conductivity generates large thermal gradients at the die cavity surfaces, which ultimately leads to thermal fatigue cracking on the surfaces of the die steel. The high die surface temperatures also promote the metallurgical bonding of the aluminum casting alloy to the surface of the die steel (soldering). In terms of process efficiency, these tooling limitations reduce the number of die castings that can be made per unit time by increasing cycle time required for cooling, and increasing downtime and cost to replace tooling which has failed either by soldering or by thermal fatigue cracking (heat checking). The objective of this research was to evaluate the feasibility of designing, fabricating, and testing high pressure die casting tooling having properties equivalent to H13 on the surface in contact with molten casting alloy - for high temperature and high velocity molten metal erosion resistance – but with the ability to conduct heat rapidly to interior water cooling passages. A layered bimetallic tool design was selected, and the design evaluated for thermal and mechanical performance via finite element analysis. H13 was retained as the exterior layer of the tooling, while commercially pure copper was chosen for the interior structure of the tooling. The tooling was fabricated by traditional machining of the copper substrate, and H13 powder was deposited on the copper via the Laser Engineered Net Shape (LENSTM) process. The H13 deposition layer was then final machined by traditional methods. Two tooling components were designed and fabricated; a thermal fatigue test specimen, and a core for a commercial aluminum high pressure die casting tool. The bimetallic thermal fatigue specimen demonstrated promising performance during testing, and the test results were used to improve the design and LENS TM deposition methods for subsequent manufacture of the commercial core. Results of the thermal finite element analysis for the thermal fatigue test specimen indicate that it has the ability to lose heat to the internal water cooling passages, and to external spray cooling, significantly faster than a monolithic H13 thermal fatigue sample. The commercial core is currently in the final stages of fabrication, and will be evaluated in an actual production environment at Shiloh Die casting. In this research, the feasibility of designing and fabricating copper/H13 bimetallic die casting tooling via LENS TM processing, for the purpose of improving die casting process efficiency, is demonstrated.

  7. Reactive multilayers fabricated by vapor deposition. A critical review

    SciTech Connect (OSTI)

    Adams, D. P.

    2014-10-02

    The reactive multilayer thin films are a class of energetic materials that continue to attract attention for use in joining applications and as igniters. Generally composed of two reactants, these heterogeneous solids can be stimulated by an external source to promptly release stored chemical energy in a sudden emission of light and heat. In our critical review article, results from recent investigations of these materials are discussed. Discussion begins with a brief description of the vapor deposition techniques that provide accurate control of layer thickness and film composition. More than 50 reactive film compositions have been reported to date, with most multilayers fabricated by magnetron sputter deposition or electron-beam evaporation. In later sections, we review how multilayer ignition threshold, reaction rate, and total heat are tailored via thin film design. For example, planar multilayers with nanometer-scale periodicity exhibit rapid, self-sustained reactions with wavefront velocities up to 100 m/s. Numeric and analytical models have elucidated many of the fundamental processes that underlie propagating exothermic reactions while demonstrating how reaction rates vary with multilayer design. Recent, time-resolved diffraction and imaging studies have further revealed the phase transformations and the wavefront dynamics associated with propagating chemical reactions. Many reactive multilayers (e.g., Co/Al) form product phases that are consistent with published equilibrium phase diagrams, yet a few systems, such as Pt/Al, develop metastable products. The final section highlights current and emerging applications of reactive multilayers. Examples include reactive Ni(V)/Al and Pd/Al multilayers which have been developed for localized soldering of heat-sensitive components.

  8. Mechanical stabilization of BSCCO-2223 superconducting tapes

    SciTech Connect (OSTI)

    King, C.G.; Grey, D.A.; Mantone, A.

    1996-12-31

    A system to provide mechanical stabilization to high temperature BSCCO-2223 superconducting tape by laminating 0.081 mm thick, spring hard, copper foil to both sides with lead-tin eutectic solder has been successfully optimized. This system has been applied as a method to create a strong, windable composite from pure silver BSCCO tapes with a minimum of critical current (I{sub c}) degradation. The {open_quotes}as received{close_quotes} conductor is evaluated for physical consistency of width and thickness over the 3000 meters that were later strengthened, insulated and wound into a demonstration coil. Electrical degradation in the strengthened tape as a result of lamination was found to average 24 percent with a range from 4 to 51 percent. This was less than the degradation that would have occurred in an unstrengthened tape during subsequent insulation and coil winding processes. Additional work was performed to evaluate the mechanical properties of the strengthened tapes. The copper can double the ultimate tensile strength of the pure silver tapes. Additionally, pure silver and dispersion strengthened silver matrix tapes are laminated with 0.025 mm thick copper and 304 stainless steel foil to investigate minimization of the cross sectional area of the strengthening component. The stainless steel can increase the UTS of the pure silver tapes sixfold. Metallography is used to examine the laminate and the conductor. Mechanical properties and critical currents of these tapes are also reported both before and after strengthening. The I{sub c} is also measured as a function of strain on the laminated tapes.

  9. Design and calibration of a test facility for MLI thermal performance measurements below 80K. [Multilayer insulation (MLI)

    SciTech Connect (OSTI)

    Boroski, W.; Kunzelman, R.; Ruschman, M.; Schoo, C.

    1992-04-01

    The design geometry of the SSC dipole cryostat includes active thermal radiation shields operating at 80K and 20K respectively. Extensive measurements conducted in a Heat Leak Test Facility (HLTF) have been used to evaluate the thermal performance of candidate multilayer insulation (MLI) systems for the 80K thermal shield, with the present system design based upon those measurement results. With the 80K MLI geometry established, efforts have focused on measuring the performance of MLI systems near 20K. A redesign of the HLTF has produced a measurement facility capable of conducting measurements with the warm boundary fixed at 80K and the cold boundary variable from 10K to 50K. Removing the 80K shield permits measurements with a warm boundary at 300K. The 80K boundary consists of a copper shield thermally anchored to a liquid nitrogen reservoir. The cold boundary consists of a copper anchor plate whose temperature is varied through boil-off gas from a 500 liter helium supply dewar. A transfer line heat exchanger supplies the boil-off gas to the anchor plate at a constant and controlled rate. The gas, which serves as cooling gas, is routed through a copper cooling tube soldered into the anchor plate. Varying the cooling gas flow rate varies the amount of refrigeration supplied to the anchor plate, thereby determining the plate temperature. A resistance heater installed on the anchor plate is regulated by a cryogenic temperature controller to provide final temperature control. Heat leak values are measured using a heatmeter which senses heat flow as a temperature gradient across a fixed thermal impedance. Since the thermal conductivity of the thermal impedance changes with temperature, the heatmeter is calibrated at key cold boundary temperatures. Thus, the system is capable of obtaining measurement data under a variety of system conditions. 7 refs.

  10. Design and calibration of a test facility for MLI thermal performance measurements below 80K

    SciTech Connect (OSTI)

    Boroski, W.; Kunzelman, R.; Ruschman, M.; Schoo, C.

    1992-04-01

    The design geometry of the SSC dipole cryostat includes active thermal radiation shields operating at 80K and 20K respectively. Extensive measurements conducted in a Heat Leak Test Facility (HLTF) have been used to evaluate the thermal performance of candidate multilayer insulation (MLI) systems for the 80K thermal shield, with the present system design based upon those measurement results. With the 80K MLI geometry established, efforts have focused on measuring the performance of MLI systems near 20K. A redesign of the HLTF has produced a measurement facility capable of conducting measurements with the warm boundary fixed at 80K and the cold boundary variable from 10K to 50K. Removing the 80K shield permits measurements with a warm boundary at 300K. The 80K boundary consists of a copper shield thermally anchored to a liquid nitrogen reservoir. The cold boundary consists of a copper anchor plate whose temperature is varied through boil-off gas from a 500 liter helium supply dewar. A transfer line heat exchanger supplies the boil-off gas to the anchor plate at a constant and controlled rate. The gas, which serves as cooling gas, is routed through a copper cooling tube soldered into the anchor plate. Varying the cooling gas flow rate varies the amount of refrigeration supplied to the anchor plate, thereby determining the plate temperature. A resistance heater installed on the anchor plate is regulated by a cryogenic temperature controller to provide final temperature control. Heat leak values are measured using a heatmeter which senses heat flow as a temperature gradient across a fixed thermal impedance. Since the thermal conductivity of the thermal impedance changes with temperature, the heatmeter is calibrated at key cold boundary temperatures. Thus, the system is capable of obtaining measurement data under a variety of system conditions. 7 refs.

  11. Inter-strand current sharing and ac loss measurements in superconducting YBCO Roebel cables

    DOE Public Access Gateway for Energy & Science Beta (PAGES Beta)

    Majoros, M.; Sumption, M. D.; Collings, E. W.; Long, N. J.

    2015-04-08

    A Roebel cable, one twist pitch long, was modified from its as-received state by soldering copper strips between the strands to provide inter-strand connections enabling current sharing. Various DC transport currents (representing different percentages of its critical current) were applied to a single strand of such a modified cable at 77 K in a liquid nitrogen bath. Simultaneous monitoring of I–V curves in different parts of the strand as well as in its interconnections with other strands was made using a number of sensitive Keithley nanovoltmeters in combination with a multichannel high-speed data acquisition card, all controlled via LabView software.more » Current sharing onset was observed at about 1.02 of strand Ic. At a strand current of 1.3Ic about 5% of the current was shared through the copper strip interconnections. A finite element method modeling was performed to estimate the inter-strand resistivities required to enable different levels of current sharing. The relative contributions of coupling and hysteretic magnetization (and loss) were compared, and for our cable and tape geometry, and at dB/dt=1 T s-1, and our inter-strand resistance of 0.77 mΩ, (enabling a current sharing of 5% at 1.3Ic) the coupling component was 0.32% of the hysteretic component. However, inter-strand contact resistance values of 100–1000 times smaller (close to those of NbTi and Nb3Sn based accelerator cables) would make the coupling components comparable in size to the hysteretic components.« less

  12. Inter-strand current sharing and ac loss measurements in superconducting YBCO Roebel cables

    DOE Public Access Gateway for Energy & Science Beta (PAGES Beta)

    sumption, Mike; Majoros, Milan; Collings, E. W.; Van der Laan, D. C.

    2014-11-07

    A Roebel cable, one twist pitch long, was modified from its as-received state by soldering copper strips between the strands to provide inter-strand connections enabling current sharing. Various DC transport currents (representing different percentages of its critical current) were applied to a single strand of such a modified cable at 77 K in a liquid nitrogen bath. Simultaneous monitoring of I–V curves in different parts of the strand as well as in its interconnections with other strands was made using a number of sensitive Keithley nanovoltmeters in combination with a multichannel high-speed data acquisition card, all controlled via LabView software.more » Current sharing onset was observed at about 1.02 of strand Ic. At a strand current of 1.3Ic about 5% of the current was shared through the copper strip interconnections. A finite element method modeling was performed to estimate the inter-strand resistivities required to enable different levels of current sharing. The relative contributions of coupling and hysteretic magnetization (and loss) were compared, and for our cable and tape geometry, and at dB/dt=1 T s-1, and our inter-strand resistance of 0.77 mΩ, (enabling a current sharing of 5% at 1.3Ic ) the coupling component was 0.32% of the hysteretic component. However, inter-strand contact resistance values of 100–1000 times smaller (close to those of NbTi and Nb3Sn based accelerator cables) would make the coupling components comparable in size to the hysteretic components.« less

  13. GOMA - A full-Newton finite element program for free and moving boundary problems with coupled fluid/solid momentum, energy, mass, and chemical species transport: User`s guide

    SciTech Connect (OSTI)

    Schunk, P.R.; Sackinger, P.A.; Rao, R.R.

    1996-01-01

    GOMA is a two- and three-dimensional finite element program which excels in analyses of manufacturing processes, particularly those involving free or moving interfaces. Specifically, the full-Newton-coupled heat, mass, momentum, and pseudo-solid mesh motion algorithm makes GOMA ideally suited for simulating processes in which the bulk fluid transport is closely coupled to the interfacial physics. Examples include, but are not limited to, coating and polymer processing flows, soldering, crystal growth, and solid-network or solution film drying. The code is based on the premise that any boundary can be (1) moving or free, with an apriori unknown position dictated by the distinguishing physics, (2) fixed, according to a global analytical representation, or (3) moving in time and space under user-prescribed kinematics. The goal is to enable the user to predict boundary position or motion simultaneously with the physics of the problem being analyzed and to pursue geometrical design studies and fluid-structure interaction problems. The moving mesh algorithm treats the entire domain as a computational Lagrangian solid that deforms subject to the physical principles which dictate boundary position. As an added benefit, the same Lagrangian solid mechanics can be exploited to solve multi-field problems for which the solid motion and stresses interact with other transport phenomena, either within the same material phase (e.g. shrinking coating) or in neighboring material phases (e.g. flexible blade coating). Thus, analyses of many fluid-structure interaction problems and deformable porous media problems are accessible. This document serves as a user`s guide and reference for GOMA and provides a brief overview of GOMA`s capabilities, theoretical background, and classes of problems for which it is targeted.

  14. Inter-strand current sharing and ac loss measurements in superconducting YBCO Roebel cables

    SciTech Connect (OSTI)

    Majoros, M.; Sumption, M. D.; Collings, E. W.; Long, N. J.

    2015-04-08

    A Roebel cable, one twist pitch long, was modified from its as-received state by soldering copper strips between the strands to provide inter-strand connections enabling current sharing. Various DC transport currents (representing different percentages of its critical current) were applied to a single strand of such a modified cable at 77 K in a liquid nitrogen bath. Simultaneous monitoring of I–V curves in different parts of the strand as well as in its interconnections with other strands was made using a number of sensitive Keithley nanovoltmeters in combination with a multichannel high-speed data acquisition card, all controlled via LabView software. Current sharing onset was observed at about 1.02 of strand Ic. At a strand current of 1.3Ic about 5% of the current was shared through the copper strip interconnections. A finite element method modeling was performed to estimate the inter-strand resistivities required to enable different levels of current sharing. The relative contributions of coupling and hysteretic magnetization (and loss) were compared, and for our cable and tape geometry, and at dB/dt=1 T s-1, and our inter-strand resistance of 0.77 mΩ, (enabling a current sharing of 5% at 1.3Ic) the coupling component was 0.32% of the hysteretic component. However, inter-strand contact resistance values of 100–1000 times smaller (close to those of NbTi and Nb3Sn based accelerator cables) would make the coupling components comparable in size to the hysteretic components.

  15. Highly Insulating Windows for Improved Energy Efficiency and Reliability in Fenestration Applications

    SciTech Connect (OSTI)

    Stark, David

    2010-11-30

    EverSealed Windows, Inc. (ESW) agreed in early 2006, prior to the contract award, to add three additional deliverables to the Project (new Milestones 30, 31 and 32), and have the results of these three deliverables form the basis of the go/no-go decision for proceeding from BP1 to BP2. ESW completed all three milestones and the DOE agreed in November 2006 to continue the Project. ESW subsequently initiated work on BP2 and its two milestones. These were to (1) Assemble and test glass-to-metal bonded coupons to test the strength of ESW's glass-to-metal bonds (ESW's Test Vehicle 1 or TV1), and (2) to assemble and test the hermeticity of glass and metal packages (ESW's Test Vehicle 2 or TV2). ESW completed both milestones of BP2 in late 2010, demonstrating that its bonds were both strong enough and hermetic enough that vacuum insulating glass units could be assembled and survive a 40+ year service life in any climate in North America. Based on the accomplishments in BP-1, the DOE held a go/no-go meeting in Washington, DC in mid-November 2006 and moved the Project into Budget Period 2 (BP-2). During this go/no-go meeting, the DOE expressed a concern that ESW did not have a back-up plan or process should ESW be unable to make its diffusion bonding process more than adequate for the necessary bond strength and hermeticity of the seal. ESW suggested and volunteered to investigate using a glass frit (i.e., solder glass) as a back-up to its diffusion bonding of glass to oxidized metal.

  16. Energy Saving Melting and Revert Reduction Technology (E-SMARRT): Development of Surface Engineered Coating Systems for Aluminum Pressure Die Casting Dies: Towards a 'Smart' Die Coating

    SciTech Connect (OSTI)

    Dr. John J. Moore; Dr. Jianliang Lin,

    2012-07-31

    The main objective of this research program was to design and develop an optimal coating system that extends die life by minimizing premature die failure. In high-pressure aluminum die-casting, the die, core pins and inserts must withstand severe processing conditions. Many of the dies and tools in the industry are being coated to improve wear-resistance and decrease down-time for maintenance. However, thermal fatigue in metal itself can still be a major problem, especially since it often leads to catastrophic failure (i.e. die breakage) as opposed to a wear-based failure (parts begin to go out of tolerance). Tooling costs remain the largest portion of production costs for many of these parts, so the ability prevent catastrophic failures would be transformative for the manufacturing industry.The technology offers energy savings through reduced energy use in the die casting process from several factors, including increased life of the tools and dies, reuse of the dies and die components, reduction/elimination of lubricants, and reduced machine down time, and reduction of Al solder sticking on the die. The use of the optimized die coating system will also reduce environmental wastes and scrap parts. Current (2012) annual energy saving estimates, based on initial dissemination to the casting industry in 2010 and market penetration of 80% by 2020, is 3.1 trillion BTU's/year. The average annual estimate of CO2 reduction per year through 2020 is 0.63 Million Metric Tons of Carbon Equivalent (MM TCE).

  17. Inter-strand current sharing and ac loss measurements in superconducting YBCO Roebel cables

    SciTech Connect (OSTI)

    sumption, Mike; Majoros, Milan; Collings, E. W.; Van der Laan, D. C.

    2014-11-07

    A Roebel cable, one twist pitch long, was modified from its as-received state by soldering copper strips between the strands to provide inter-strand connections enabling current sharing. Various DC transport currents (representing different percentages of its critical current) were applied to a single strand of such a modified cable at 77 K in a liquid nitrogen bath. Simultaneous monitoring of IV curves in different parts of the strand as well as in its interconnections with other strands was made using a number of sensitive Keithley nanovoltmeters in combination with a multichannel high-speed data acquisition card, all controlled via LabView software. Current sharing onset was observed at about 1.02 of strand Ic. At a strand current of 1.3Ic about 5% of the current was shared through the copper strip interconnections. A finite element method modeling was performed to estimate the inter-strand resistivities required to enable different levels of current sharing. The relative contributions of coupling and hysteretic magnetization (and loss) were compared, and for our cable and tape geometry, and at dB/dt=1 T s-1, and our inter-strand resistance of 0.77 m?, (enabling a current sharing of 5% at 1.3Ic ) the coupling component was 0.32% of the hysteretic component. However, inter-strand contact resistance values of 1001000 times smaller (close to those of NbTi and Nb3Sn based accelerator cables) would make the coupling components comparable in size to the hysteretic components.

  18. Concentrated Solar Thermoelectric Power

    SciTech Connect (OSTI)

    Chen, Gang; Ren, Zhifeng

    2015-07-09

    The goal of this project is to demonstrate in the lab that solar thermoelectric generators (STEGs) can exceed 10% solar-to-electricity efficiency, and STEGs can be integrated with phase-change materials (PCM) for thermal storage, providing operation beyond daylight hours. This project achieved significant progress in many tasks necessary to achieving the overall project goals. An accurate Themoelectric Generator (TEG) model was developed, which included realistic treatment of contact materials, contact resistances and radiative losses. In terms of fabricating physical TEGs, high performance contact materials for skutterudite TE segments were developed, along with brazing and soldering methods to assemble segmented TEGs. Accurate measurement systems for determining device performance (in addition to just TE material performance) were built for this project and used to characterize our TEGs. From the optical components’ side, a spectrally selective cermet surface was developed with high solar absorptance and low thermal emittance, with thermal stability at high temperature. A measurement technique was also developed to determine absorptance and total hemispherical emittance at high temperature, and was used to characterize the fabricated spectrally selective surfaces. In addition, a novel reflective cavity was designed to reduce radiative absorber losses and achieve high receiver efficiency at low concentration ratios. A prototype cavity demonstrated that large reductions in radiative losses were possible through this technique. For the overall concentrating STEG system, a number of devices were fabricated and tested in a custom built test platform to characterize their efficiency performance. Additionally, testing was performed with integration of PCM thermal storage, and the storage time of the lab scale system was evaluated. Our latest testing results showed a STEG efficiency of 9.6%, indicating promising potential for high performance concentrated STEGs.

  19. Reactive multilayers fabricated by vapor deposition. A critical review

    DOE Public Access Gateway for Energy & Science Beta (PAGES Beta)

    Adams, D. P.

    2014-10-02

    The reactive multilayer thin films are a class of energetic materials that continue to attract attention for use in joining applications and as igniters. Generally composed of two reactants, these heterogeneous solids can be stimulated by an external source to promptly release stored chemical energy in a sudden emission of light and heat. In our critical review article, results from recent investigations of these materials are discussed. Discussion begins with a brief description of the vapor deposition techniques that provide accurate control of layer thickness and film composition. More than 50 reactive film compositions have been reported to date, withmore » most multilayers fabricated by magnetron sputter deposition or electron-beam evaporation. In later sections, we review how multilayer ignition threshold, reaction rate, and total heat are tailored via thin film design. For example, planar multilayers with nanometer-scale periodicity exhibit rapid, self-sustained reactions with wavefront velocities up to 100 m/s. Numeric and analytical models have elucidated many of the fundamental processes that underlie propagating exothermic reactions while demonstrating how reaction rates vary with multilayer design. Recent, time-resolved diffraction and imaging studies have further revealed the phase transformations and the wavefront dynamics associated with propagating chemical reactions. Many reactive multilayers (e.g., Co/Al) form product phases that are consistent with published equilibrium phase diagrams, yet a few systems, such as Pt/Al, develop metastable products. The final section highlights current and emerging applications of reactive multilayers. Examples include reactive Ni(V)/Al and Pd/Al multilayers which have been developed for localized soldering of heat-sensitive components.« less

  20. Direct observation of intrinsic piezoelectricity of Pb(Zr,Ti)O{sub 3} by time-resolved x-ray diffraction measurement using single-crystalline films

    SciTech Connect (OSTI)

    Fujisawa, Takashi; Ehara, Yoshitaka; Yasui, Shintaro; Kamo, Takafumi; Funakubo, Hiroshi; Yamada, Tomoaki; Sakata, Osami

    2014-07-07

    Lead zirconate titanate, Pb(Zr,Ti)O{sub 3} or PZT, is one of the most widely investigated ferroelectric and piezoelectric materials due to its superior properties. However, the intrinsic properties of PZT have not been directly measured due to the lack of fabrication of single crystals even though a basic understanding of intrinsic properties has been of interest developing lead-free piezoelectric materials. We demonstrated the direct observation of the intrinsic piezoelectric property by means of the detection of electric-field induced crystal lattice distortion of thick Pb(Zr{sub 0.35}Ti{sub 0.65})O{sub 3} single-crystalline films with single polar-axis orientation and negligible residual strain using the time-resolved X-ray diffraction (XRD) together with the polarization response. Consequently, the effective converse piezoelectric response was experimentally revealed; hence, the electrostrictive coefficient, which is the conversion coefficient between the electrical and mechanical response, was determined. The obtained effective electrostrictive coefficient was 5.2–6.3 × 10{sup −2} m{sup 4}/C{sup 2}, which agrees with theoretical prediction.

  1. Effects of lithium doping on microstructure, electrical properties, and chemical bonds of sol-gel derived NKN thin films

    SciTech Connect (OSTI)

    Lin, Chun-Cheng; Chen, Chan-Ching; Weng, Chung-Ming; Chu, Sheng-Yuan; Tsai, Cheng-Che

    2015-02-28

    Highly (100/110) oriented lead-free Li{sub x}(Na{sub 0.5}K{sub 0.5}){sub 1−x}NbO{sub 3} (LNKN, x = 0, 0.02, 0.04, and 0.06) thin films are fabricated on Pt/Ti/SiO{sub 2}/Si substrates via a sol-gel processing method. The lithium (Li) dopants modify the microstructure and chemical bonds of the LNKN films, and therefore improve their electrical properties. The optimal values of the remnant polarization (P{sub r} = 14.3 μC/cm{sup 2}), piezoelectric coefficient (d{sub 33} = 48.1 pm/V), and leakage current (<10{sup −5} A/cm{sup 2}) are obtained for a lithium addition of x = 0.04 (i.e., 4 at. %). The observation results suggest that the superior electrical properties are the result of an improved crystallization, a larger grain size, and a smoother surface morphology. It is shown that the ion transport mechanism is dominated by an Ohmic behavior under low electric fields and the Poole-Frenkel emission effect under high electric fields.

  2. Electric-field-induced strain contributions in morphotropic phase boundary composition of (Bi{sub 1/2}Na{sub 1/2})TiO{sub 3}-BaTiO{sub 3} during poling

    SciTech Connect (OSTI)

    Khansur, Neamul H.; Daniels, John E.; Hinterstein, Manuel; Wang, Zhiyang; Groh, Claudia; Jo, Wook

    2015-12-14

    The microscopic contributions to the electric-field-induced macroscopic strain in a morphotropic 0.93(Bi{sub 1/2}Na{sub 1/2}TiO{sub 3})−0.07(BaTiO{sub 3}) with a mixed rhombohedral and tetragonal structure have been quantified using full pattern Rietveld refinement of in situ high-energy x-ray diffraction data. The analysis methodology allows a quantification of all strain mechanisms for each phase in a morphotropic composition and is applicable to use in a wide variety of piezoelectric compositions. It is shown that during the poling of this material 24%, 44%, and 32% of the total macroscopic strain is generated from lattice strain, domain switching, and phase transformation strains, respectively. The results also suggest that the tetragonal phase contributes the most to extrinsic domain switching strain, whereas the lattice strain primarily stems from the rhombohedral phase. The analysis also suggests that almost 32% of the total strain is lost or is a one-time effect due to the irreversible nature of the electric-field-induced phase transformation in the current composition. This information is relevant to on-going compositional development strategies to harness the electric-field-induced phase transformation strain of (Bi{sub 1/2}Na{sub 1/2})TiO{sub 3}-based lead-free piezoelectric materials for actuator applications.

  3. Chemical and structural effects on the high-temperature mechanical behavior of (1−x)(Na{sub 1/2}Bi{sub 1/2})TiO{sub 3}-xBaTiO{sub 3} ceramics

    SciTech Connect (OSTI)

    Deluca, Marco; Picht, Gunnar; Hoffmann, Michael J.; Rechtenbach, Annett; Töpfer, Jörg; Schader, Florian H.; Webber, Kyle G.

    2015-04-07

    Bismuth sodium titanate–barium titanate [(1−x)(Na{sub 1/2}Bi{sub 1/2})TiO{sub 3}-xBaTiO{sub 3}, NBT-100xBT] is one of the most well studied lead-free piezoelectric materials due in large part to the high field-induced strain attainable in compositions near the morphotropic phase boundary (x = 0.06). The BaTiO{sub 3}-rich side of the phase diagram, however, has not yet been as comprehensively studied, although it might be important for piezoelectric and positive temperature coefficient ceramic applications. In this work, we present a thorough study of BaTiO{sub 3}-rich NBT-100xBT by ferroelastic measurements, dielectric permittivity, X-ray diffraction, and Raman spectroscopy. We show that the high-temperature mechanical behavior, i.e., above the Curie temperature, T{sub C}, is influenced by local disorder, which appears also in pure BT. On the other hand, in NBT-100xBT (x < 1.0), lattice distortion, i.e., tetragonality, increases, and this impacts both the mechanical and dielectric properties. This increase in lattice distortion upon chemical substitution is counterintuitive by merely reasoning on the ionic size, and is due to the change in the A-O bond character induced by the Bi{sup 3+} electron lone pair, as indicated by Raman spectroscopy.

  4. Cyclic electric field response of morphotropic Bi{sub 1/2}Na{sub 1/2}TiO{sub 3}-BaTiO{sub 3} piezoceramics

    SciTech Connect (OSTI)

    Hinterstein, M.; Schmitt, L. A.; Hoelzel, M.; Jo, W.; Rödel, J.; Kleebe, H.-J.; Hoffman, M.

    2015-06-01

    In this study, the evolution of field induced mechanisms in lead-free piezoelectric ceramics (1−x)Bi{sub 1/2}Na{sub 1/2}TiO{sub 3}-xBaTiO{sub 3} with x = 0.06 and 0.07 was investigated by transmission electron microscopy, neutron, and X-ray diffraction. Preliminary investigations revealed a strong degradation of macroscopic electromechanical properties within the first 100 bipolar electric cycles. Therefore, this structural investigation focuses on a comparative diffraction study of freshly prepared, poled, and fatigued specimens. Transmission electron microscopy and neutron diffraction of the initial specimens reveal the coexistence of a rhombohedral and a tetragonal phase with space group R3c and P4bm, respectively. In situ electric field X-ray diffraction reveals a pronounced field induced phase transition from a pseudocubic state to a phase composition of significantly distorted phases upon poling with an external electric field of 4 kV/mm. Although the structures of the two compositions are pseudocubic and almost indistinguishable in the unpoled virgin state, the electric field response shows significant differences depending on composition. For both compositions, the application of an electric field results in a field induced phase transition in the direction of the minority phase. Electric cycling has an opposite effect on the phase composition and results in a decreased phase fraction of the minority phase in the fatigued remanent state at 0 kV/mm.

  5. Effect of mechanical alloying synthesis process on the dielectric properties of (Bi{sub 0.5}Na{sub 0.5}){sub 0.94}Ba{sub 0.06}TiO{sub 3} piezoceramics

    SciTech Connect (OSTI)

    Ghazanfari, Mohammad Reza; Amini, Rasool; Shams, Seyyedeh Fatemeh; Alizadeh, Morteza; Ardakani, Hamed Ahmadi

    2015-08-15

    Highlights: • MA samples show higher dielectric permittivity and Curie temperature. • In MA samples, dielectric loss is almost 27% less than conventional ones. • In MA samples, sintering time and temperature are lower than conventional ones. • In MA samples, particle morphology is more homogeneous conventional ones. • In MA samples, crystallite size is smaller conventional ones. - Abstract: In present work, in order to study the effects of synthesis techniques on dielectric properties, the BNBT lead-free piezoceramics with (Bi{sub 0.5}Na{sub 0.5}){sub 0.94}Ba{sub 0.06}TiO{sub 3} stoichiometry (called as BNBT6) were synthesized by mechanical alloying (MA) and conventional mixed oxides methods. The structural, microstructural, and dielectric properties were carried out by X-ray diffractometer (XRD), scanning electron microscope (SEM), and impedance analyzer LCR meter, respectively. Based on results, the density of MA samples is considerably higher than conventional samples owning to smaller particles size and more uniformity of particle shape of MA samples. Moreover, the dielectric properties of MA samples are comparatively improved in which the dielectric loss of these samples is almost 27% less than conventional ones. Furthermore, MA samples exhibit obviously higher dielectric permittivity and Curie temperature compared to the conventional samples.

  6. In situ electric field induced domain evolution in Ba(Zr{sub 0.2}Ti{sub 0.8})O{sub 3}-0.3(Ba{sub 0.7}Ca{sub 0.3})TiO{sub 3} ferroelectrics

    SciTech Connect (OSTI)

    Zakhozheva, M.; Kleebe, H.-J.; Schmitt, L. A.; Acosta, M.; Rödel, J.; Jo, W.

    2014-09-15

    In this work, the lead-free Ba(Zr{sub 0.2}Ti{sub 0.8})O{sub 3}-0.3(Ba{sub 0.7}Ca{sub 0.3})TiO{sub 3} piezoelectric ceramic was investigated in situ under an applied electric field by transmission electron microscopy. Significant changes in domain morphology of the studied material have been observed under an applied electric field. During the poling process, the domain configurations disappeared, forming a single-domain state. This multi- to single-domain state transition occurred with the formation of an intermediate nanodomain state. After removing the electric field, domain configurations reappeared. Selected area electron diffraction during electrical poling gave no indication of any structural changes as for example reflection splitting. Rather, a contribution of the extrinsic effect to the piezoelectric response of the Ba(Zr{sub 0.2}Ti{sub 0.8})O{sub 3}-0.3(Ba{sub 0.7}Ca{sub 0.3})TiO{sub 3} was found to be dominant.

  7. Diameter dependent thermoelectric properties of individual SnTe nanowires

    SciTech Connect (OSTI)

    Xu, E. Z.; Li, Z.; Martinez, J. A.; Sinitsyn, N.; Htoon, H.; Li, Nan; Swartzentruber, B.; Hollingsworth, J. A.; Wang, Jian; Zhang, S. X.

    2015-01-15

    The lead-free compound tin telluride (SnTe) has recently been suggested to be a potentially promising thermoelectric material because of its similar electronic band structure as the well-known lead telluride. Here we report on the first thermoelectric study of individual single crystalline SnTe nanowires (NWs) with different diameters ranging from ~200 to ~1000 nm. Measurements of thermopower S, electrical conductivity σ, and thermal conductivity κ were carried out on the same nanowires over a temperature range of 25 - 300 K. While σ does not show a strong diameter dependence, the thermopower increases by a factor of 2 when the nanowire diameter is decreased from 1000 nm to 200 nm. The thermal conductivities of the measured NWs are only about half of that of the bulk SnTe, which may arise from the enhanced phonon-grain boundary and phonon-defect scatterings. Temperature dependent figure-of-merit ZT was determined and the maximum value at room temperature is ~3 times higher than what was obtained in bulk samples of comparable carrier density.

  8. Lead induced stress corrosion cracking of Alloy 690 in high temperature water

    SciTech Connect (OSTI)

    Chung, K.K.; Lim, J.K.; Moriya, Shinichi; Watanabe, Yutaka; Shoji, Tetsuo

    1995-12-31

    Recent investigations of cracked steam generator tubes at nuclear power plants concluded that lead significantly contributed to cracking the Alloy 600 materials. In order to investigate the stress corrosion cracking (SCC) behavior of Alloy 690, slow strain rate tests (SSRT) and anodic polarization measurements were performed. The SSRTs were conducted in a lead-chloride solution (PbCl{sub 2}) and in a chloride but lead free solution (NaCl) at pH of 3 and 4.5 at 288 C. The anodic polarization measurements were carried out at 30 C using the same solutions as in SSRT. The SSRT results showed that Alloy 690 was susceptible to SCC in both solutions. In the lead chloride solution, cracking had slight dependence on lead concentration and pH. Cracking tend to increase with a higher lead concentration and a lower pH and was mainly intergranular and was to be a few tens to hundreds micrometers in length. In the chloride only solution, cracking was similar to the lead induced SCC. The results of anodic polarization measurement and electron probe micro analysis (EPMA) helped to understand lead induced SCC. Lead was a stronger active corrosive element but had a minor affect on cracking susceptibility of the alloy. While, chloride was quite different from lead effect to SCC. A possible mechanism of lead induced SCC of Alloy 690 was also discussed based on the test results.

  9. Diameter dependent thermoelectric properties of individual SnTe nanowires

    DOE Public Access Gateway for Energy & Science Beta (PAGES Beta)

    Xu, E. Z.; Li, Z.; Martinez, J. A.; Sinitsyn, N.; Htoon, H.; Li, Nan; Swartzentruber, B.; Hollingsworth, J. A.; Wang, Jian; Zhang, S. X.

    2015-01-15

    The lead-free compound tin telluride (SnTe) has recently been suggested to be a potentially promising thermoelectric material because of its similar electronic band structure as the well-known lead telluride. Here we report on the first thermoelectric study of individual single crystalline SnTe nanowires (NWs) with different diameters ranging from ~200 to ~1000 nm. Measurements of thermopower S, electrical conductivity σ, and thermal conductivity κ were carried out on the same nanowires over a temperature range of 25 - 300 K. While σ does not show a strong diameter dependence, the thermopower increases by a factor of 2 when the nanowiremore » diameter is decreased from 1000 nm to 200 nm. The thermal conductivities of the measured NWs are only about half of that of the bulk SnTe, which may arise from the enhanced phonon-grain boundary and phonon-defect scatterings. Temperature dependent figure-of-merit ZT was determined and the maximum value at room temperature is ~3 times higher than what was obtained in bulk samples of comparable carrier density.« less

  10. An evaluation of chemical screening test kits for lead in paint

    SciTech Connect (OSTI)

    Oglesby, L.S.

    1996-04-01

    The Residential Lead-Based Paint Hazard Reduction Act (Title X) requires abatement and management of lead-based paint. The purpose of this study was to evaluate three chemical screening test kits using materials and methods from one study and subjecting the results to the statistical analysis of another. The three kits were used to predict the presence of lead in paint at ten weight concentrations from 0.04 to 3.97%. Paint was applied to four wood boards yielding a sample size of 40. Four boards were painted with lead-free paint and used as blanks. All of the boards were tested with the three test kits by an untrained individual having no knowledge of the actual lead content. Sensitivity, specificity, and false positive and negative rates were calculated for the test kit results. The manufactures` detection limits, the observed sensitivity ranged from 1.00 to 0.80, specificity ranged from 1.00 to 0.42, false positive ranged from 0 to 58%, and false negatives ranged from 0 to 20%. At the 0.5% Federal threshold level, the observed sensitivity ranged from 1.00 to 0.94, specificity ranged from 1.00 to 0.5, false positives ranged from 0 to 11.1%, and false negatives ranged from 0 to 20%. The observed false positive and false negative rates for all three kits were found to be significantly lower than those reported in a previous study. These results indicate that the kits perform very well at the Federal threshold, with two of the kits having false negative rates below 12.5% and false positive rates of 3.13%. These results indicate that these two kits would probably be acceptable screening tests for lead in paint.

  11. Raman spectroscopy, dielectric properties and phase transitions of Ag{sub 0.96}Li{sub 0.04}NbO{sub 3} ceramics

    SciTech Connect (OSTI)

    Niewiadomski, Adrian; Kania, Antoni; Kugel, Godefroy E.; Hafid, Mustapha; Sitko, Dorota

    2015-05-15

    Highlights: • First Raman scattering studies of Ag{sub 0.96}Li{sub 0.04}NbO{sub 3}, allowed us to correlate temperature evolution of relaxational frequency γ{sub R}(T) with the Nb-ion dynamics and showed its changes at freezing temperature and ferrielectric transition. - Abstract: Silver lithium niobates Ag{sub 1−x}Li{sub x}NbO{sub 3} are promising lead free piezoelectrics. Good quality Ag{sub 0.96}Li{sub 0.04}NbO{sub 3} ceramics were obtained. Dielectric and DSC studies showed that, in comparison to AgNbO{sub 3,} temperatures of phase transitions slightly decrease. Dielectric studies pointed to enhancement of polar properties. Remnant polarisations achieves value of 0.6 μC/cm{sup 2}. Maximum of ϵ(T) dependences related to the relaxor-like ferroelectric/ferrielectric M{sub 1}–M{sub 2} transition becomes higher and more frequency dependent. Analysis of Raman spectra showed that two modes at 50 and 194 cm{sup −1} exhibit significant softening. Low frequency part of the Raman spectra which involve central peak and soft mode were analysed using two models. CP was assumed as relaxational vibration and described by Debye function. The slope of temperature dependences of relaxational frequency γ{sub R}(T) changes at approximately 470 and 330 K, indicating that slowing down process of relaxational vibrations changes in the vicinity of partial freezing of Nb-ion dynamics T{sub f} and further freezing at ferroelectric/ferrielectric phase transition.

  12. Stab Sensitivity of Energetic Nanolaminates

    SciTech Connect (OSTI)

    Gash, A; Barbee, T; Cervantes, O

    2006-05-22

    This work details the stab ignition, small-scale safety, and energy release characteristics of bimetallic Al/Ni(V) and Al/Monel energetic nanolaminate freestanding thin films. The influence of the engineered nanostructural features of the energetic multilayers is correlated with both stab initiation and small-scale energetic materials testing results. Structural parameters of the energetic thin films found to be important include the bi-layer period, total thickness of the film, and presence or absence of aluminum coating layers. In general the most sensitive nanolaminates were those that were relatively thick, possessed fine bi-layer periods, and were not coated. Energetic nanolaminates were tested for their stab sensitivity as freestanding continuous parts and as coarse powders. The stab sensitivity of mock M55 detonators loaded with energetic nanolaminate was found to depend strongly upon both the particle size of the material and the configuration of nanolaminate material, in the detonator cup. In these instances stab ignition was observed with input energies as low as 5 mJ for a coarse powder with an average particle dimension of 400 {micro}m. Selected experiments indicate that the reacting nanolaminate can be used to ignite other energetic materials such as sol-gel nanostructured thermite, and conventional thermite that was either coated onto the multilayer substrate or pressed on it. These results demonstrate that energetic nanolaminates can be tuned to have precise and controlled ignition thresholds and can initiate other energetic materials and therefore are viable candidates as lead-free impact initiated igniters or detonators.

  13. Treatability study Number PDC-1-O-T. Final report

    SciTech Connect (OSTI)

    1998-04-22

    Los Alamos National Laboratory provided treatability study samples from four waste streams, designated Stream {number_sign}1, Stream {number_sign}3, Stream {number_sign}6, and Stream {number_sign}7. Stream {number_sign}1 consisted of one 55-gallon drum of personal protective equipment (PPE), rags, and neutralizing agent (bicarbonate) generated during the cleanup of a sodium dichromate solution spill. Stream {number_sign}3 was one 55-gallon drum of paper, rags, lab utensils, tools, and tape from the decontamination of a glovebox. The sample of Stream {number_sign}6 was packaged in three 30-gallon drums and a 100 ft{sup 3} wooden box. It consisted of plastic sheeting, PPE, and paper generated from the cleanup of mock explosive (barium nitrate) from depleted uranium parts. Stream {number_sign}7 was scrap metal (copper, stainless and carbon steel joined with silver solder) from the disassembly of gas manifolds. The objective of the treatability study is to determine: (1) whether the Perma-Fix stabilization/solidification process can treat the waste sample to meet Land Disposal Restrictions and the Waste Acceptance Criteria for LANL Technical Area 54, Area G, and (2) optimum loading and resulting weight and volume of finished waste form. The stabilized waste was mixed into grout that had been poured into a lined drum. After each original container of waste was processed, the liner was closed and a new liner was placed in the same drum on top of the previous closed liner. This allowed an overall reduction in waste volume but kept waste segregated to minimize the amount of rework in case analytical results indicated any batch did not meet treatment standards. Samples of treated waste from each waste stream were analyzed by Perma-Fix Analytical Services to get a preliminary approximation of TCLP metals. Splits of these samples were sent to American Environmental Network`s mixed waste analytical lab in Cary, NC for confirmation analysis. Results were all below applicable limits.

  14. Challenges in the Packaging of MEMS

    SciTech Connect (OSTI)

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O'Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a gross lack of understanding between the package materials, induced stress, and the device performance. The material properties of these packaging materials are not well defined or understood. Modeling of these materials and processes is far from maturity. Current post-package yields are too low for commercial feasibility, and consumer operating environment reliability and compatibility are often difficult to simulate. With further understanding of the materials properties and behavior of the packaging materials, MEMS applications can be fully realized and integrated into countless commercial and military applications.

  15. High-Temperature High-Power Packaging Techniques for HEV Traction Applications

    SciTech Connect (OSTI)

    Elshabini, Aicha; Barlow, Fred D.

    2006-11-01

    A key issue associated with the wider adoption of hybrid-electric vehicles (HEV) and plug in hybrid-electric vehicles (PHEV) is the implementation of the power electronic systems that are required in these products. One of the primary industry goals is the reduction in the price of these vehicles relative to the cost of traditional gasoline powered vehicles. Today these systems, such as the Prius, utilize one coolant loop for the engine at approximately 100 C coolant temperatures, and a second coolant loop for the inverter at 65 C. One way in which significant cost reduction of these systems could be achieved is through the use of a single coolant loop for both the power electronics as well as the internal combustion engine (ICE). This change in coolant temperature significantly increases the junction temperatures of the devices and creates a number of challenges for both device fabrication and the assembly of these devices into inverters and converters for HEV and PHEV applications. Traditional power modules and the state-of-the-art inverters in the current HEV products, are based on chip and wire assembly and direct bond copper (DBC) on ceramic substrates. While a shift to silicon carbide (SiC) devices from silicon (Si) devices would allow the higher operating temperatures required for a single coolant loop, it also creates a number of challenges for the assembly of these devices into power inverters. While this traditional packaging technology can be extended to higher temperatures, the key issues are the substrate material and conductor stability, die bonding material, wire bonds, and bond metallurgy reliability as well as encapsulation materials that are stable at high operating temperatures. The larger temperature differential during power cycling, which would be created by higher coolant temperatures, places tremendous stress on traditional aluminum wire bonds that are used to interconnect power devices. Selection of the bond metallurgy and wire bond geometry can play a key role in mitigating this stress. An alternative solution would be to eliminate the wire bonds completely through a fundamentally different method of forming a reliable top side interconnect. Similarly, the solders used in most power modules exhibit too low of a liquidus to be viable solutions for maximum junction temperatures of 200 C. Commonly used encapsulation materials, such as silicone gels, also suffer from an inability to operate at 200 C for extended periods of time. Possible solutions to these problems exist in most cases but require changes to the traditional manufacturing process used in these modules. In addition, a number of emerging technologies such as Si nitride, flip-chip assembly methods, and the elimination of base-plates would allow reliable module development for operation of HEV and PHEV inverters at elevated junction temperatures.

  16. Implementing and diagnosing magnetic flux compression on the Z pulsed power accelerator

    SciTech Connect (OSTI)

    McBride, Ryan D.; Bliss, David E.; Gomez, Matthew R.; Hansen, Stephanie B.; Martin, Matthew R.; Jennings, Christopher Ashley; Slutz, Stephen A.; Rovang, Dean C.; Knapp, Patrick F.; Schmit, Paul F.; Awe, Thomas James; Hess, M. H.; Lemke, Raymond W.; Dolan, D. H.; Lamppa, Derek C.; Jobe, Marc Ronald Lee; Fang, Lu; Hahn, Kelly D.; Chandler, Gordon A.; Cooper, Gary Wayne; Ruiz, Carlos L.; Maurer, A. J.; Robertson, Grafton Kincannon; Cuneo, Michael E.; Sinars, Daniel; Tomlinson, Kurt; Smith, Gary; Paguio, Reny; Intrator, Tom; Weber, Thomas; Greenly, John

    2015-11-01

    We report on the progress made to date for a Laboratory Directed Research and Development (LDRD) project aimed at diagnosing magnetic flux compression on the Z pulsed-power accelerator (0-20 MA in 100 ns). Each experiment consisted of an initially solid Be or Al liner (cylindrical tube), which was imploded using the Z accelerator's drive current (0-20 MA in 100 ns). The imploding liner compresses a 10-T axial seed field, B z ( 0 ) , supplied by an independently driven Helmholtz coil pair. Assuming perfect flux conservation, the axial field amplification should be well described by B z ( t ) = B z ( 0 ) x [ R ( 0 ) / R ( t )] 2 , where R is the liner's inner surface radius. With perfect flux conservation, B z ( t ) and dB z / dt values exceeding 10 4 T and 10 12 T/s, respectively, are expected. These large values, the diminishing liner volume, and the harsh environment on Z, make it particularly challenging to measure these fields. We report on our latest efforts to do so using three primary techniques: (1) micro B-dot probes to measure the fringe fields associated with flux compression, (2) streaked visible Zeeman absorption spectroscopy, and (3) fiber-based Faraday rotation. We also mention two new techniques that make use of the neutron diagnostics suite on Z. These techniques were not developed under this LDRD, but they could influence how we prioritize our efforts to diagnose magnetic flux compression on Z in the future. The first technique is based on the yield ratio of secondary DT to primary DD reactions. The second technique makes use of the secondary DT neutron time-of-flight energy spectra. Both of these techniques have been used successfully to infer the degree of magnetization at stagnation in fully integrated Magnetized Liner Inertial Fusion (MagLIF) experiments on Z [P. F. Schmit et al. , Phys. Rev. Lett. 113 , 155004 (2014); P. F. Knapp et al. , Phys. Plasmas, 22 , 056312 (2015)]. Finally, we present some recent developments for designing and fabricating novel micro B-dot probes to measure B z ( t ) inside of an imploding liner. In one approach, the micro B-dot loops were fabricated on a printed circuit board (PCB). The PCB was then soldered to off-the-shelf 0.020- inch-diameter semi-rigid coaxial cables, which were terminated with standard SMA connectors. These probes were recently tested using the COBRA pulsed power generator (0-1 MA in 100 ns) at Cornell University. In another approach, we are planning to use new multi-material 3D printing capabilities to fabricate novel micro B-dot packages. In the near future, we plan to 3D print these probes and then test them on the COBRA generator. With successful operation demonstrated at 1-MA, we will then make plans to use these probes on a 20-MA Z experiment.