National Library of Energy BETA

Sample records for internal mem orandum

  1. MEMSNANO-2005 International conference on MEMS and Semiconductor Nanotechnology

    E-Print Network [OSTI]

    Mishra, Prabhat

    in place of polycrystalline metal oxide lead to large increase of free surface energy which in turn leads-22,2005,IIT Kharagpur,India MEMS BASED NANOCRYSTALLINE METAL OXIDE GAS SENSORS FOR COALMINE ENVIRONMENT P Metal Oxide gas sensors commonly used for sensing inflammable hydrocarbon gases and other toxic gases

  2. MEM.H

    E-Print Network [OSTI]

    /* mem.h Memory manipulation functions Copyright (c) Borland International 1987 All Rights Reserved. */ #if __STDC__ #define _Cdecl #else #define _Cdecl

  3. MEMS @MEMS @ Texas TechTexas Tech

    E-Print Network [OSTI]

    Gelfond, Michael

    MEMS @MEMS @ Texas TechTexas Tech #12;MEMS Research @ TTUMEMS Research @ TTU MEMS Design and Fabrication MEMS Testing, Characterization & Control MEMS Integration and Application MEMS Education MEMS Organization #12;MEMS Design, SimulationMEMS Design, Simulation and Fabricationand Fabrication AutoCAD (TTU

  4. Selected papers from the 9th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2009)

    E-Print Network [OSTI]

    Rubloff, Gary W.

    and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2009) Guest Editors Reza selected from the 9th International Workshop on Micro and Nanotechnology for Power Generation and EnergySelected papers from the 9th International Workshop on Micro and Nanotechnology for Power

  5. Thin Film Encapsulation Methods for Large Area MEMS Packaging

    E-Print Network [OSTI]

    Mahajerin, Armon

    2012-01-01

    2, pp. 124-126, 1987. H. Fujita, “A Decade of MEMS and ItsFuture,” IEEE MEMS Conference Proceedings, pp. 1-8, 1997. K.in the Packaging of MEMS,” International Symposium on

  6. MEMS Resonant Strain Sensor Integration

    E-Print Network [OSTI]

    Myers, David Richard

    2010-01-01

    MEMS Capacitive BasedStrain Gauges MEMS Double-Ended Tuning Fork Strainand MEMS Potential . . . . . . . . . . . . . . . . . . . .

  7. MEtlORANDUM DATE

    Office of Legacy Management (LM)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantity of NaturalDukeWakefield Municipal Gas &SCE-SessionsSouth DakotaRobbins and MyersHr. Anthony V. Andolina:I.)p'J abET/

  8. Ground Rules for MA 265, Spring 2013

    E-Print Network [OSTI]

    2013-01-03

    Students who need accommodations must deliver a copy of their Accommodation Notification Mem- orandum to the Undergraduate Services Office (MATH 242) ...

  9. Ground Rules for MA 26200, Fall 2011 Midterm Examinations: There ...

    E-Print Network [OSTI]

    2012-08-15

    Students who need accommodations must deliver a copy of their Accommodation Notification Mem- orandum to the Undergraduate Services Office (MATH 242) ...

  10. Thin Film Encapsulation Methods for Large Area MEMS Packaging

    E-Print Network [OSTI]

    Mahajerin, Armon

    2012-01-01

    Brown, “Challenges in the Packaging of MEMS,” InternationalSymposium on Advanced Packaging Materials, pp. 41-47,Wafer-Level Chip Scale Packaging?: Benefits for Integrated

  11. MEMS Resonant Strain Sensor Integration

    E-Print Network [OSTI]

    Myers, David Richard

    2010-01-01

    Strap-down microelectromechanical MEMS sensors for high-gdate of microelectromechanical systems (MEMS) is a bitmicroelectromechanical resonant output gyroscope. MEMS 2002,

  12. MS.5 MICROSYSTEMS TECHNOLOGY LABORATORIES ANNUAL RESEARCH REPORT 2009 MEMS & BioMEMS MEMS & BioMEMS

    E-Print Network [OSTI]

    microelectromechanical systems (MEMS) present several drawbacks including expense, incompatibility with flexibleMS.5 MICROSYSTEMS TECHNOLOGY LABORATORIES ANNUAL RESEARCH REPORT 2009 MEMS & BioMEMS MEMS & BioMEMS MATERiALS Direct Patterning of Metallic MEMS through Microcontact Printing C. E. Packard, A. Murarka, V

  13. MEtlORANDUM TO: FILE

    Office of Legacy Management (LM)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantity of NaturalDukeWakefield Municipal Gas &SCE-SessionsSouth DakotaRobbins and MyersHr. Anthony V. Andolina:I.)p'J abET/\

  14. Q MEtlORANDUM SUBJECT:

    Office of Legacy Management (LM)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantity of NaturalDukeWakefield Municipal Gas &SCE-SessionsSouth DakotaRobbins and700 GJO-2003-411-TACe - .'pJ3u44 2004 GJQ ,

  15. Eigenproblems in Resonant MEMS Design

    E-Print Network [OSTI]

    California at Davis, University of

    Eigenproblems in Resonant MEMS Design David Bindel UC Berkeley, CS Division Eigenproblems inResonant MEMS Design ­ p.1/21 #12;What are MEMS? Eigenproblems inResonant MEMS Design ­ p.2/21 #12;RF MEMSResonant MEMS Design ­ p.3/21 #12;Micromechanical filters Filtered signal Mechanical filter Capacitive sense

  16. MEMS technology for timing and frequency control

    E-Print Network [OSTI]

    Nguyen, CTC

    2007-01-01

    regard, microelectromechanical systems (MEMS) technology,focus upon microelectromechanical systems (MEMS) and include

  17. MTL ANNUAL RESEARCH REPORT 2014 MEMS, etc. 47 MEMS, Field-Emitter,

    E-Print Network [OSTI]

    Reif, Rafael

    MTL ANNUAL RESEARCH REPORT 2014 MEMS, etc. 47 MEMS, Field-Emitter, Thermal, Fluidic Devices Printed MEMS Membrane Electrostatic Microspeakers...................................................................................................................................52 MEMS Tactile Displays

  18. MEMS Resonant Strain Sensor Integration

    E-Print Network [OSTI]

    Myers, David Richard

    2010-01-01

    down microelectromechanical MEMS sensors for high-g munitionof making harsh environment MEMS sensors is the ability toG load forces. SiC MEMS sensors and actuators have potential

  19. Failure mechanisms in MEMS.

    SciTech Connect (OSTI)

    Walraven, Jeremy Allen

    2003-07-01

    MEMS components by their very nature have different and unique failure mechanisms than their macroscopic counterparts. This paper discusses failure mechanisms observed in various MEMS components and technologies. MEMS devices fabricated using bulk and surface micromachining process technologies are emphasized. MEMS devices offer uniqueness in their application, fabrication, and functionality. Their uniqueness creates various failure mechanisms not typically found in their bulk or IC counterparts. In ICs, electrical precautions are taken to mitigate failure. In MEMS, both electrical and mechanical precautions must be enacted to reduce the risk of failure and increased reliability. Unlike ICs, many MEMS components are designed to interact with their environment, making the fabrication, testing, and packaging processes critical for the success of the device.

  20. An electrothermally-actuated bistable MEMS relay for power applications

    E-Print Network [OSTI]

    Qiu, Jin, 1974-

    2003-01-01

    This thesis first develops a bistable mechanism that does not rely on internal stress or hinges for its bistability, which is then combined with transient electrothermal actuation and contact structure to develop a MEMS ...

  1. MEMS Aluminum Nitride Technology for Inertial Sensors

    E-Print Network [OSTI]

    Vigevani, Gabriele

    2011-01-01

    1, the growth of angular rate MEMS sensor is a growingdominant market in MEMS inertial sensors - with millions ofsector of the MEMS inertial sensor market. Being able to

  2. MEMS Aluminum Nitride Technology for Inertial Sensors

    E-Print Network [OSTI]

    Vigevani, Gabriele

    2011-01-01

    110 Working principle of a MEMS resonatingin IMU and in general for MEMS integrated solutions. To myand growing sector of MEMS industry. Market re- search ?rm

  3. Sign problem and MEM

    E-Print Network [OSTI]

    Masahiro Imachi; Yasuhiko Shinno; Hiroshi Yoneyama

    2006-01-13

    The sign problem is notorious in Monte Carlo simulations of lattice QCD with the finite density, lattice field theory (LFT) with a $\\theta$ term and quantum spin models. In this report, to deal with the sign problem, we apply the maximum entropy method (MEM) to LFT with the $\\theta$ term and investigate to what extent the MEM is applicable to this issue. Based on this study, we also make a brief comment about lattice QCD with the finite density in terms of the MEM.

  4. mem.c

    E-Print Network [OSTI]

    525, container = ___alloc_mem (extra + (words+modulus) * ___WS8);. 526. 527, if (container ..... 1066, if (waste > ___PSECTION_WASTE32 || words > ___PSECTION_SIZE4096). 1067, return ...... 1988, int i2 = find_msection (

  5. Templeton Mem. Freedom Coll. 

    E-Print Network [OSTI]

    Unknown

    2011-08-17

    This thesis presents an improved method for dynamic force computation applicable to both electrostatic and electromagnetic conductors with complex 3D geometries. During the transient simulation of electrostatic actuated MEMS, the positions...

  6. Templeton Mem. Freedom Coll. 

    E-Print Network [OSTI]

    Unknown

    2011-08-17

    method for dynamic force computation applica- ble to both electrostatic and electromagnetic conductors with complex 3D geometries. During the transient simulation of electrostatic actuated MEMS, the positions of the conductors as well as the potential... applied to the conductors may change, necessitat- ing recalculation of electrostatic forces at each time step of computation. Similarly, during the simulation of electromagnetic actuated MEMS, the current re-distribution in the conductors requires...

  7. Introduction to Microelectromechanical Systems (MEMS) failure...

    Office of Scientific and Technical Information (OSTI)

    Conference: Introduction to Microelectromechanical Systems (MEMS) failure analysis. Citation Details In-Document Search Title: Introduction to Microelectromechanical Systems (MEMS)...

  8. MEMS in microfluidic channels.

    SciTech Connect (OSTI)

    Ashby, Carol Iris Hill; Okandan, Murat; Michalske, Terry A.; Sounart, Thomas L.; Matzke, Carolyn M.

    2004-03-01

    Microelectromechanical systems (MEMS) comprise a new class of devices that include various forms of sensors and actuators. Recent studies have shown that microscale cantilever structures are able to detect a wide range of chemicals, biomolecules or even single bacterial cells. In this approach, cantilever deflection replaces optical fluorescence detection thereby eliminating complex chemical tagging steps that are difficult to achieve with chip-based architectures. A key challenge to utilizing this new detection scheme is the incorporation of functionalized MEMS structures within complex microfluidic channel architectures. The ability to accomplish this integration is currently limited by the processing approaches used to seal lids on pre-etched microfluidic channels. This report describes Sandia's first construction of MEMS instrumented microfluidic chips, which were fabricated by combining our leading capabilities in MEMS processing with our low-temperature photolithographic method for fabricating microfluidic channels. We have explored in-situ cantilevers and other similar passive MEMS devices as a new approach to directly sense fluid transport, and have successfully monitored local flow rates and viscosities within microfluidic channels. Actuated MEMS structures have also been incorporated into microfluidic channels, and the electrical requirements for actuation in liquids have been quantified with an elegant theory. Electrostatic actuation in water has been accomplished, and a novel technique for monitoring local electrical conductivities has been invented.

  9. Thin Film Encapsulation Methods for Large Area MEMS Packaging

    E-Print Network [OSTI]

    Mahajerin, Armon

    2012-01-01

    Judy, “Microelectromechanical systems (MEMS): fabrication,Packaging of Microelectromechanical Systems (MEMS),” IEEEbased on microelectromechanical systems (MEMS). However, one

  10. MEMS Actuated Deformable Mirror

    SciTech Connect (OSTI)

    Papavasiliou, A; Olivier, S; Barbee, T; Walton, C; Cohn, M

    2005-11-10

    This ongoing work concerns the creation of a deformable mirror by the integration of MEMS actuators with Nanolaminate foils through metal compression boning. These mirrors will use the advantages of these disparate technologies to achieve dense actuation of a high-quality, continuous mirror surface. They will enable advanced adaptive optics systems in large terrestrial telescopes. While MEMS actuators provide very dense actuation with high precision they can not provide large forces typically necessary to deform conventional mirror surfaces. Nanolaminate foils can be fabricated with very high surface quality while their extraordinary mechanical properties enable very thin, flexible foils to survive the rigors of fabrication. Precise metal compression bonding allows the attachment of the fragile MEMS actuators to the thin nanolaminate foils without creating distortions at the bond sites. This paper will describe work in four major areas: (1) modeling and design, (2) bonding development, (3) nanolaminate foil development, (4) producing a prototype. A first-principles analytical model was created and used to determine the design parameters. A method of bonding was determined that is both strong, and minimizes the localized deformation or print through. Work has also been done to produce nanolaminate foils that are sufficiently thin, flexible and flat to be deformed by the MEMS actuators. Finally a prototype was produced by bonding thin, flexible nanolaminate foils to commercially available MEMS actuators.

  11. MEMS fluidic actuator

    DOE Patents [OSTI]

    Kholwadwala, Deepesh K. (Albuquerque, NM); Johnston, Gabriel A. (Trophy Club, TX); Rohrer, Brandon R. (Albuquerque, NM); Galambos, Paul C. (Albuquerque, NM); Okandan, Murat (Albuquerque, NM)

    2007-07-24

    The present invention comprises a novel, lightweight, massively parallel device comprising microelectromechanical (MEMS) fluidic actuators, to reconfigure the profile, of a surface. Each microfluidic actuator comprises an independent bladder that can act as both a sensor and an actuator. A MEMS sensor, and a MEMS valve within each microfluidic actuator, operate cooperatively to monitor the fluid within each bladder, and regulate the flow of the fluid entering and exiting each bladder. When adjacently spaced in a array, microfluidic actuators can create arbitrary surface profiles in response to a change in the operating environment of the surface. In an embodiment of the invention, the profile of an airfoil is controlled by independent extension and contraction of a plurality of actuators, that operate to displace a compliant cover.

  12. Tilting at MEMS Windmills for Energy Harvesting?

    E-Print Network [OSTI]

    Chiao, Jung-Chih

    Tilting at MEMS Windmills for Energy Harvesting? Bill Schweber - February 19, 2015 MEMS and Development (yes, it was print), I saw the story "Micro-Windmills: From Lab to Market" on MEMS devices whichMEMS Technologies, a Taiwan-based company. Figure 1: The nickel-based MEMS micro-windmill can be bulk

  13. MEMS Materials and Temperature Sensors for Down Hole Geothermal System Monitoring

    E-Print Network [OSTI]

    Wodin-Schwartz, Sarah

    2013-01-01

    MEMS for Geothermal Monitoring . . . . . . . . . . . . .Existing MEMS Capacitive Temperature Sensors . . . . .In-Plane MEMS Temperature Sensor

  14. Trajectory-switching algorithm for a MEMS gyroscope

    E-Print Network [OSTI]

    Park, Sungsu; Horowitz, Roberto; Hong, Sung Kyung; Nam, Yoonsu

    2007-01-01

    roscope, microelectromechanical systems (MEMS), trajectoryI NTRODUCTION OST microelectromechanical-system (MEMS) gyro-

  15. Knowledge-Based Evolutionary Linkage in MEMS Design Synthesis

    E-Print Network [OSTI]

    Cobb, Corie L.; Zhang, Ying; Agogino, Alice M.; Mangold, Jennifer

    2008-01-01

    Introduction Microelectromechanical Systems (MEMS) are smallindustries for microelectromechanical sys- tems (MEMS). In:

  16. Knowledge-Based Evolutionary Linkage in MEMS Design Synthesis

    E-Print Network [OSTI]

    Cobb, Corie L.; Zhang, Ying; Agogino, Alice M.; Mangold, Jennifer

    2008-01-01

    and industries for microelectromechanical sys- tems (MEMS).1 Introduction Microelectromechanical Systems (MEMS) are

  17. First demonstration of a MEMS tunable vertical-cavity SOA

    E-Print Network [OSTI]

    2004-01-01

    amplifiers, microelectromechanical (MEMS) devices, opticalpromising method is microelectromechanical (MEMS) tuning. In

  18. MEMS technology for timing and frequency control

    E-Print Network [OSTI]

    Nguyen, CTC

    2007-01-01

    L. Kubena, and Y. -K. Yong, “A MEMS-based quartz resonatorT. -C. Nguyen, “Vibrating RF MEMS overview: applications tosupport,” in Proc. IEEE Int. MEMS Conf. , Maastricht, The

  19. Electroplating of low stress permalloy for MEMS

    SciTech Connect (OSTI)

    Zhang Yonghua [National Key Laboratory of Nano/Micro Fabrication Technology, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030 (China)]. E-mail: zyh@sjtu.edu.cn; Ding Guifu [National Key Laboratory of Nano/Micro Fabrication Technology, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030 (China); Cai Yuli [National Key Laboratory of Nano/Micro Fabrication Technology, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030 (China); Wang Hong [National Key Laboratory of Nano/Micro Fabrication Technology, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030 (China); Cai Bingchu [National Key Laboratory of Nano/Micro Fabrication Technology, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030 (China)

    2006-08-15

    With the wafer-bending method and spectrophotometry, the internal stress in electroplated Ni-Fe alloy for MEMS has been investigated as a function of bath concentration. This investigation demonstrated that low concentration plating solution is useful for the decrease of the residual stress in the electrodeposits, and the stress could further decrease with an increase of saccharin additive content. And the change of stress from tensile to compressive was not observed with the increase of the additive content in plating path. The low stress permalloy (Ni{sub 81}Fe{sub 19}) was reached in our experimental conditions. A bistable electromagnetic RF MEMS switch with deformation-free bilayer cantilever beam was fabricated successfully by electroplated permalloy.

  20. MEMS Resonant Strain Sensor Integration

    E-Print Network [OSTI]

    Myers, David Richard

    2010-01-01

    Placzankis. Strap-down microelectromechanical MEMS sensorssensing system. Microelectromechanical Systems, Journal of,amplifier. Microelectromechanical Systems, Journal of, 6(4):

  1. MEMS technology for timing and frequency control

    E-Print Network [OSTI]

    Nguyen, CTC

    2007-01-01

    Y. Kim, “Noise in microelectromechanical system resonators,”regard, microelectromechanical systems (MEMS) technology,focus upon microelectromechanical systems (MEMS) and include

  2. MEM Lab Archived News: September 03, 2013

    E-Print Network [OSTI]

    MEM Lab Archived News: September 03, 2013 The MEM Lab is happy to welcome Lauren Costello, Natalie, and the MEM Lab is enthusiastic to have Paul Hill join us this fall! Look for Paul under the "People" page this week. Thanks for all your hard work and good luck this year Stephanie! June 01, 2013 The MEM Lab

  3. Titanium MEMS Technology Development for Drug Delivery and Microfluidic Applications

    E-Print Network [OSTI]

    Khandan, Omid

    2015-01-01

    The use of microelectromechanical systems (MEMS) technologyof microelectromechanical systems (MEMS) technology hasMEMS technology have emerged, and include biomedical microelectromechanical

  4. Polymer-Ceramic MEMS Bimorphs as Thermal Infrared Sensors

    E-Print Network [OSTI]

    Warren, Clinton Gregory

    2010-01-01

    the fabrication of the MEMS sensors from the readout system,mechanical infrared sensors based on MEMS polymer-ceramicmechanical infrared sensors based on MEMS polymer-ceramic

  5. Robust metal contact and capacitive mini-MEMS switches

    E-Print Network [OSTI]

    Sedaghat Pisheh, Hojr

    2013-01-01

    Mini-MEMS MechanicalSpring Constant, High Contact Force RF MEMS Switch 3.1First Generation of Miniature MEMS Capacitive Switch . . 4.3

  6. Knowledge-Based Evolutionary Linkage in MEMS Design Synthesis

    E-Print Network [OSTI]

    Cobb, Corie L.; Zhang, Ying; Agogino, Alice M.; Mangold, Jennifer

    2008-01-01

    interaction in evolving MEMS designs: microresonator caseof evolu- tionary MEMS resonators. In: Proc. of the IEEESéquin, C.H. : Hierarchical MEMS synthesis and optimization.

  7. MEMS multi-pole electromagnets: Compact electron optics and undulators

    E-Print Network [OSTI]

    Harrison, Jere Charles

    2014-01-01

    electron laser system using MEMS optics . . . . . . . . .power soft x-ray source based on a 400-µm period MEMS un-micrograph of a MEMS ‘racetrack’ transformer. . . . . . .

  8. Polymer-Ceramic MEMS Bimorphs as Thermal Infrared Sensors

    E-Print Network [OSTI]

    Warren, Clinton Gregory

    2010-01-01

    C. Vieider, and H. Jakobsen. MEMS-based uncooled infraredin uncooled infrared imaging: A MEMS perspective. Bell Labsstudies of an uncooled MEMS capacitive infrared detector for

  9. MATHEMATICAL MODELING OF ELECTROSTATIC MEMS WITH TAILORED DIELECTRIC PROPERTIES

    E-Print Network [OSTI]

    Pelesko, John

    of electrostatically actuated MEMS devices. Key words. MEMS, microelectromechanical system, exact shooting, semilinear. The advent of microelectromechanical systems (MEMS) has revolutionized numerous branches of scienceMATHEMATICAL MODELING OF ELECTROSTATIC MEMS WITH TAILORED DIELECTRIC PROPERTIES JOHN A. PELESKO

  10. Piezoelectric MEMS for energy harvesting

    E-Print Network [OSTI]

    Kim, Sang-Gook

    Piezoelectric microelectromechanical systems (MEMS) have been proven to be an attractive technology for harvesting small magnitudes of energy from ambient vibrations. This technology promises to eliminate the need for ...

  11. Ovenized microelectromechanical system (MEMS) resonator

    DOE Patents [OSTI]

    Olsson, Roy H; Wojciechowski, Kenneth; Kim, Bongsang

    2014-03-11

    An ovenized micro-electro-mechanical system (MEMS) resonator including: a substantially thermally isolated mechanical resonator cavity; a mechanical oscillator coupled to the mechanical resonator cavity; and a heating element formed on the mechanical resonator cavity.

  12. MEMS & BioMEMS Chip-Scale Quadrupole Mass Filters for a Micro Gas Analyzer ...................................................................................................................MS.1

    E-Print Network [OSTI]

    Reif, Rafael

    MEMS & BioMEMS Chip-Scale Quadrupole Mass Filters for a Micro Gas Analyzer...................................................................................................................MS.2 MEMS-based Plasma Probes for Spacecraft Re-entry Monitoring.........................................................................MS.4 Direct Patterning of Metallic MEMS through Microcontact Printing

  13. BioMEMS DeviceBioMEMS Device Integration, PackagingIntegration, Packaging

    E-Print Network [OSTI]

    Rubloff, Gary W.

    BioMEMS DeviceBioMEMS Device Integration, PackagingIntegration, Packaging and Control forandMEMS Device Integration, Packaging andBioMEMS Device Integration, Packaging and Control for Bio Nonpermanent sealing provides ex situ, post-process analysis Reusable packaging components Microfluidic Control

  14. Cantilever MEMS Detection ofCantilever MEMS Detection of CancerCancer

    E-Print Network [OSTI]

    Petta, Jason

    Cantilever MEMS Detection ofCantilever MEMS Detection of CancerCancer O. Bravo, C. Milburn, W, NJ 08544 #12;OutlineOutline Introduction of bioMEMS AFM platform schematics Nanoindentations Vimentin antigen Graphs and data Clinical implications Future work #12;Introduction to BioMEMS Structure

  15. Microassembly of 3-D MEMS Structures Utilizing a MEMS Microgripper with a Robotic Manipulator

    E-Print Network [OSTI]

    Dechev, Nikolai

    Microassembly of 3-D MEMS Structures Utilizing a MEMS Microgripper with a Robotic Manipulator@mie.utoronto.ca, cleghrn@mie.utoronto.ca, mills@mie.utoronto.ca Abstract This paper describes the process of bonding a MEMS MEMS sub- components. The microgrippers bonded using the method described here are 1.5 mm by 0.6 mm

  16. Thermally actuated MEMS seal for vacuum applications

    E-Print Network [OSTI]

    Dighe, Aalap (Aalap Shirish)

    2011-01-01

    This thesis presents the design, fabrication and testing of a new, leak-free, permanently sealable MEMS valve for use in vacuum applications. This device is different from existing MEMS valves in that it is leak-free in ...

  17. Towards and industrial ecosystem for power MEMS

    E-Print Network [OSTI]

    Havel, Timothy Franklin

    2007-01-01

    This thesis is concerned with the commercial applications of MEMS (Micro-Electro-Mechanical Systems) manufacturing processes to advanced energy technologies. This field of engineering has come to be known as Power MEMS. ...

  18. RF MEMS switches : survey and analysis

    E-Print Network [OSTI]

    Machal-Cajigas, Antoinne Y

    2009-01-01

    Microelectromechanical systems known as MEMS, are an enabling technology that describe a field capable of creating very small electromechanical devices with feature sizes on the order of microns, or 10-6 meters. MEMS ...

  19. MEMS technology for timing and frequency control

    E-Print Network [OSTI]

    Nguyen, CTC

    2007-01-01

    Y. Kim, “Noise in microelectromechanical system resonators,”capac- itively coupled microelectromechanical ?lters,” IEEEchip. In this regard, microelectromechanical systems (MEMS)

  20. Microelectromechanical (MEM) thermal actuator

    DOE Patents [OSTI]

    Garcia, Ernest J. (Albuquerque, NM); Fulcher, Clay W. G. (Sandia Park, NM)

    2012-07-31

    Microelectromechanical (MEM) buckling beam thermal actuators are disclosed wherein the buckling direction of a beam is constrained to a desired direction of actuation, which can be in-plane or out-of-plane with respect to a support substrate. The actuators comprise as-fabricated, linear beams of uniform cross section supported above the substrate by supports which rigidly attach a beam to the substrate. The beams can be heated by methods including the passage of an electrical current through them. The buckling direction of an initially straight beam upon heating and expansion is controlled by incorporating one or more directional constraints attached to the substrate and proximal to the mid-point of the beam. In the event that the beam initially buckles in an undesired direction, deformation of the beam induced by contact with a directional constraint generates an opposing force to re-direct the buckling beam into the desired direction. The displacement and force generated by the movement of the buckling beam can be harnessed to perform useful work, such as closing contacts in an electrical switch.

  1. Edinburgh Research Explorer Integrated Magnetic MEMS Relays

    E-Print Network [OSTI]

    Millar, Andrew J.

    Edinburgh Research Explorer Integrated Magnetic MEMS Relays Citation for published version: Schiavone, G, Desmulliez, MPY & Walton, AJ 2014, 'Integrated Magnetic MEMS Relays: Status of the Technology.mdpi.com/journal/micromachines Review Integrated Magnetic MEMS Relays: Status of the Technology Giuseppe Schiavone 1,2, *, Marc P. Y

  2. Compensation, Tuning, and Trimming of MEMS Resonators

    E-Print Network [OSTI]

    Ayazi, Farrokh

    Compensation, Tuning, and Trimming of MEMS Resonators Farrokh Ayazi, Roozbeh Tabrizian, Logan Sorenson Center for MEMS and Microsystems Technologies Georgia Institute of Technology Atlanta, GA, USA ayazi@gatech.edu Abstract--Fundamental characteristics of MEMS resonators such as acoustic velocity

  3. Microassembly Technologies for MEMS Michael B. Cohn

    E-Print Network [OSTI]

    Microassembly Technologies for MEMS Michael B. Cohn¤ , Karl F. Böhringer+ º, J. Mark Noworolski 94720-1774 ºUniversity of Washington, Dept. of EE, 234 EE/CSE Bldg., Seattle, WA 98195-2500 § MEMS to extend MEMS beyond the confines of silicon micromachining. This paper surveys research in both serial

  4. Evolutionary Synthesis of MEMS Raffi Roupen Kamalian

    E-Print Network [OSTI]

    Agogino, Alice M.

    Evolutionary Synthesis of MEMS by Raffi Roupen Kamalian B.S. (University of California, Berkeley Professor Albert P. Pisano Professor Kristofer S.J. Pister Fall 2004 #12;Evolutionary Synthesis of MEMS Evolutionary Synthesis of MEMS by Raffi Roupen Kamalian Doctor of Philosophy in Engineering - Mechanical

  5. Partial Differential Equations of Electrostatic MEMS

    E-Print Network [OSTI]

    Fournier, John J.F.

    Partial Differential Equations of Electrostatic MEMS by Yujin Guo B.Sc., China Three Gorges) The University of British Columbia July 2007 c Yujin Guo 2007 #12;Abstract Micro-Electromechanical Systems (MEMS their initial development in the 1980s, MEMS has revolutionized numerous branches of science and industry

  6. BROADBAND LOW ACTUATIONVOLTAGE RF'MEM SWITCHES

    E-Print Network [OSTI]

    Shen, Shyh-Chiang

    (RF) Microelectromechanical (MEM) switches have been thought of as one of the most attractive devicesBROADBAND LOW ACTUATIONVOLTAGE RF'MEM SWITCHES Shyh-ChiangShen,David Caruth, and Milton Feng of Illinois at Urbana-Champaign,IL61801-2355 ABSTRACT- We demonstrate a sub-lovolts RF MEM switch built

  7. Inertial measurement unit using rotatable MEMS sensors

    DOE Patents [OSTI]

    Kohler, Stewart M. (Albuquerque, NM); Allen, James J. (Albuquerque, NM)

    2007-05-01

    A MEM inertial sensor (e.g. accelerometer, gyroscope) having integral rotational means for providing static and dynamic bias compensation is disclosed. A bias compensated MEM inertial sensor is described comprising a MEM inertial sense element disposed on a rotatable MEM stage. A MEM actuator drives the rotation of the stage between at least two predetermined rotational positions. Measuring and comparing the output of the MEM inertial sensor in the at least two rotational positions allows for both static and dynamic bias compensation in inertial calculations based on the sensor's output. An inertial measurement unit (IMU) comprising a plurality of independently rotatable MEM inertial sensors and methods for making bias compensated inertial measurements are disclosed.

  8. Inertial measurement unit using rotatable MEMS sensors

    DOE Patents [OSTI]

    Kohler, Stewart M.; Allen, James J.

    2006-06-27

    A MEM inertial sensor (e.g. accelerometer, gyroscope) having integral rotational means for providing static and dynamic bias compensation is disclosed. A bias compensated MEM inertial sensor is described comprising a MEM inertial sense element disposed on a rotatable MEM stage. A MEM actuator for drives the rotation of the stage between at least two predetermined rotational positions. Measuring and comparing the output of the MEM inertial sensor in the at least two rotational positions allows, for both static and dynamic bias compensation in inertial calculations based on the sensor's output. An inertial measurement unit (IMU) comprising a plurality of independently rotatable MEM inertial sensors and methods for making bias compensated inertial measurements are disclosed.

  9. W-Coating for MEMS

    SciTech Connect (OSTI)

    Fleming, J.G.; Mani, S.S.; Sniegowski, J.J.

    1999-07-08

    The integration of miniaturized mechanical components has spawned a new technology known as microelectromechanical systems (MEMS). Surface micromachining, defined as the fabrication of micromechanical structures from deposited thin films, is one of the core technological processes underlying MEMS. Surface micromachined structures have a large ratio of surface area to volume which makes them particularly vulnerable to adhesion to the substrate or adjacent structures during release or in use--a problem is called stiction. Since microactuators can have surfaces in normal or sliding contact, function and wear are critical issues for reliable operation of MEMS devices. Surface modifications are needed to reduce adhesion and friction in micromechanical structures. In this paper, we will present a process used to selectively coat MEMS devices with Tungsten using a CVD (Chemical Vapor Deposition) process. We will discuss the effect of wet and vapor phase cleans along with different process variables. Endurance of the W coating is important, especially in applications where wear due to repetitive contacts with the film may occur. Further, tungsten is hard and chemically inert, Tungsten CVD is used in the integrated-circuit industry, which makes this, approach manufacturable.

  10. DESIGN AND FABRICATION OF A SILICON-BASED MEMS ROTARY ENGINE Kelvin Fu, Aaron J. Knobloch, Fabian C. Martinez, David C. Walther,

    E-Print Network [OSTI]

    Liepmann, Dorian

    Q DESIGN AND FABRICATION OF A SILICON-BASED MEMS ROTARY ENGINE Kelvin Fu, Aaron J. Knobloch, Fabian of a Silicon-based MEMS rotary engine are discussed in this paper. This work is part of an effort currently of this power generation system are small-scale rotary internal combustion engines fueled by high energy density

  11. Thin Film Encapsulation Methods for Large Area MEMS Packaging

    E-Print Network [OSTI]

    Mahajerin, Armon

    2012-01-01

    stiction coatings for MEMS,” Sensors and Actuators A, vol.E. Jackson, “A Novel MEMS Pressure Sensor Fabricated on anIC package and (b) a MEMS pressure sensor package. [21] .

  12. Titanium MEMS Technology Development for Drug Delivery and Microfluidic Applications

    E-Print Network [OSTI]

    Khandan, Omid

    2015-01-01

    Etching of Bulk Titanium for MEMS Applications. ” Journal ofMeng. 2012. “An Implantable MEMS Micropump System for Drugand Ellis Meng. 2009. “A Passive MEMS Drug Delivery Pump for

  13. Trajectory-switching algorithm for a MEMS gyroscope

    E-Print Network [OSTI]

    Park, Sungsu; Horowitz, Roberto; Hong, Sung Kyung; Nam, Yoonsu

    2007-01-01

    mode of operation of MEMS gyroscope,” J. Microelectromech.SWITCHING ALGORITHM FOR A MEMS GYROSCOPE [5] S. Chang, M.design data of the MIT-SOI MEMS gyroscope was conducted to

  14. MEMS Lens Scanners for Free-Space Optical Interconnects

    E-Print Network [OSTI]

    Chou, Jeffrey Brian

    2011-01-01

    Chen, and P. -Z. Chang, “A MEMS micromirror fabricated usingand M. R. Douglass, “A MEMS-based projection display,”L. . Law, and A. Goldenberg, “MEMS optical switches,” IEEE

  15. High-Q Low-Impedance MEMS Resonators

    E-Print Network [OSTI]

    Hung, Li-Wen

    2011-01-01

    Digest. , 17 th IEEE Int. MEMS Conf. , pp. 821-824, 2004. [Digest. , 17th IEEE Int. MEMS Conf. , pp. 821-824, 2004 [2]Digest, 17 th IEEE Int. MEMS Conf. , 2004, pp. 641-644. [15

  16. Improving Evolutionary Synthesis of MEMS through Fabrication and Testing Feedback

    E-Print Network [OSTI]

    Agogino, Alice M.

    Improving Evolutionary Synthesis of MEMS through Fabrication and Testing Feedback Raffi Kamalian a microelectromechanical system (MEMS) synthesis characterization study, four modifications to the objectives: MEMS, genetic algorithms, resonator design, evolutionary computer-aided design, validation. 1

  17. Amorphous Diamond MEMS and Sensors

    SciTech Connect (OSTI)

    SULLIVAN, JOHN P.; FRIEDMANN, THOMAS A.; ASHBY, CAROL I.; DE BOER, MAARTEN P.; SCHUBERT, W. KENT; SHUL, RANDY J.; HOHLFELDER, ROBERT J.; LAVAN, D.A.

    2002-06-01

    This report describes a new microsystems technology for the creation of microsensors and microelectromechanical systems (MEMS) using stress-free amorphous diamond (aD) films. Stress-free aD is a new material that has mechanical properties close to that of crystalline diamond, and the material is particularly promising for the development of high sensitivity microsensors and rugged and reliable MEMS. Some of the unique properties of aD include the ability to easily tailor film stress from compressive to slightly tensile, hardness and stiffness 80-90% that of crystalline diamond, very high wear resistance, a hydrophobic surface, extreme chemical inertness, chemical compatibility with silicon, controllable electrical conductivity from insulating to conducting, and biocompatibility. A variety of MEMS structures were fabricated from this material and evaluated. These structures included electrostatically-actuated comb drives, micro-tensile test structures, singly- and doubly-clamped beams, and friction and wear test structures. It was found that surface micromachined MEMS could be fabricated in this material easily and that the hydrophobic surface of the film enabled the release of structures without the need for special drying procedures or the use of applied hydrophobic coatings. Measurements using these structures revealed that aD has a Young's modulus of {approx}650 GPa, a tensile fracture strength of 8 GPa, and a fracture toughness of 8 MPa{center_dot}m {sup 1/2}. These results suggest that this material may be suitable in applications where stiction or wear is an issue. Flexural plate wave (FPW) microsensors were also fabricated from aD. These devices use membranes of aD as thin as {approx}100 nm. The performance of the aD FPW sensors was evaluated for the detection of volatile organic compounds using ethyl cellulose as the sensor coating. For comparable membrane thicknesses, the aD sensors showed better performance than silicon nitride based sensors. Greater than one order of magnitude increase in chemical sensitivity is expected through the use of ultra-thin aD membranes in the FPW sensor. The discoveries and development of the aD microsystems technology that were made in this project have led to new research projects in the areas of aD bioMEMS and aD radio frequency MEMS.

  18. SDSU MEMS Cleanroom Instructions Page 1 of 2 SDSU MEMS Lab., Department of Mechanical Engineering

    E-Print Network [OSTI]

    Kassegne, Samuel Kinde

    SDSU ­ MEMS Cleanroom Instructions Page 1 of 2 SDSU MEMS Lab., Department of Mechanical Engineering time in the login ledger. 3. Maintain a journal and a personal (labeled) cleanroom box 4. Make sure you to the Cleanroom Folder & MEMS Lab folder. 3. Also please get permission from Dr. Sam Kassegne & the Cleanroom

  19. Research Projects inResearch Projects in Microelectromechanical Systems (MEMS) andMicroelectromechanical Systems (MEMS) and

    E-Print Network [OSTI]

    Frechette, Luc G.

    Research Projects inResearch Projects in Microelectromechanical Systems (MEMS) andMicroelectromechanical Systems (MEMS) and MicrofluidicsMicrofluidics Luc G. Fréchette, Ph.D. Associate Professor Canada Research Chair in Microfluidics and Power MEMS Department of Mechanical Engineering Université de Sherbrooke

  20. High Efficiency Optical MEMS by the Integration of Photonic Lattices with Surface MEMS

    SciTech Connect (OSTI)

    FLEMING, JAMES G.; LIN, SHAWN-YU; MANI, SEETHAMBAL S.; RODGERS, M. STEVEN; DAGEL, DARYL J.

    2002-11-01

    This report outlines our work on the integration of high efficiency photonic lattice structures with MEMS (MicroElectroMechanical Systems). The simplest of these structures were based on 1-D mirror structures. These were integrated into a variety of devices, movable mirrors, switchable cavities and finally into Bragg fiber structures which enable the control of light in at least 2 dimensions. Of these devices, the most complex were the Bragg fibers. Bragg fibers consist of hollow tubes in which light is guided in a low index media (air) and confined by surrounding Bragg mirror stacks. In this work, structures with internal diameters from 5 to 30 microns have been fabricated and much larger structures should also be possible. We have demonstrated the fabrication of these structures with short wavelength band edges ranging from 400 to 1600nm. There may be potential applications for such structures in the fields of integrated optics and BioMEMS. We have also looked at the possibility of waveguiding in 3 dimensions by integrating defects into 3-dimensional photonic lattice structures. Eventually it may be possible to tune such structures by mechanically modulating the defects.

  1. MEMS packaging efforts at Sandia National Laboratories.

    SciTech Connect (OSTI)

    Custer, Jonathan Sloane

    2003-02-01

    Sandia National Laboratories has programs covering a broad range of MEMS technologies from LIGA to bulk to surface micromachining. These MEMS technologies are being considered for an equally broad range of applications, including sensors, actuators, optics, and microfluidics. As these technologies have moved from the research to the prototype product stage, packaging has been required to develop new capabilities to integrated MEMS and other technologies into functional microsystems. This paper discusses several of Sandia's MEMS packaging efforts, focusing mainly on inserting Sandia's SUMMIT V (5-level polysilicon) surface micromachining technology into fieldable microsystems.

  2. Failure analysis issues in microelectromechanical systems (MEMS...

    Office of Scientific and Technical Information (OSTI)

    Conference: Failure analysis issues in microelectromechanical systems (MEMS). Citation Details In-Document Search Title: Failure analysis issues in microelectromechanical systems...

  3. MEMS multi-pole electromagnets: Compact electron optics and undulators

    E-Print Network [OSTI]

    Harrison, Jere Charles

    2014-01-01

    laser system using MEMS optics . . . . . . . . . Heatattempt at MEMS undulators and focusing optics. . . . . .all published quadrupole optics by more than an order of

  4. Trajectory-switching algorithm for a MEMS gyroscope

    E-Print Network [OSTI]

    Park, Sungsu; Horowitz, Roberto; Hong, Sung Kyung; Nam, Yoonsu

    2007-01-01

    control for a microelectromechanical-system z-axis gyroscoperoscope, microelectromechanical systems (MEMS), trajectoryI NTRODUCTION OST microelectromechanical-system (MEMS) gyro-

  5. Trajectory-switching algorithm for a MEMS gyroscope

    E-Print Network [OSTI]

    Park, Sungsu; Horowitz, Roberto; Hong, Sung Kyung; Nam, Yoonsu

    2007-01-01

    control for a microelectromechanical-system z-axis gyroscopecontrol, gy- roscope, microelectromechanical systems (MEMS),I NTRODUCTION OST microelectromechanical-system (MEMS) gyro-

  6. Addressing mechanical reliability issues in Sandia MEMS devices...

    Office of Scientific and Technical Information (OSTI)

    Addressing mechanical reliability issues in Sandia MEMS devices. Citation Details In-Document Search Title: Addressing mechanical reliability issues in Sandia MEMS devices. No...

  7. MEMS-based chemical analysis systems development at Sandia National...

    Office of Scientific and Technical Information (OSTI)

    Conference: MEMS-based chemical analysis systems development at Sandia National Labs. Citation Details In-Document Search Title: MEMS-based chemical analysis systems development at...

  8. MEMS-based Speckle Spectrometer

    E-Print Network [OSTI]

    A. I. Sheinis; L. Nigra; M. Q. Kuhlen

    2006-06-07

    We describe a new concept for a MEMS-based active spatial filter for astronomical spectroscopy. The goal of this device is to allow the use of a diffraction-limited spectrometer on a seeing limited observation at improved throughput over a comparable seeing-limited spectrometer, thus reducing the size and cost of the spectrometer by a factor proportional to r0/D (For the case of a 10 meter telescope this size reduction will be approximately a factor of 25 to 50). We use a fiber-based integral field unit (IFU) that incorporates an active MEMS mirror array to feed an astronomical spectrograph. A fast camera is used in parallel to sense speckle images at a spatial resolution of lambda/D and at a temporal frequency greater than that of atmospheric fluctuations. The MEMS mirror-array is used as an active shutter to feed speckle images above a preset intensity threshold to the spectrometer, thereby increasing the signal-to-noise ratio (SNR) of the spectrogram. Preliminary calculations suggests an SNR improvement of a factor of about 1.4. Computer simulations have shown an SNR improvement of 1.1, but have not yet fully explored the parameter space.

  9. Challenges in the Packaging of MEMS

    SciTech Connect (OSTI)

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O'Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a gross lack of understanding between the package materials, induced stress, and the device performance. The material properties of these packaging materials are not well defined or understood. Modeling of these materials and processes is far from maturity. Current post-package yields are too low for commercial feasibility, and consumer operating environment reliability and compatibility are often difficult to simulate. With further understanding of the materials properties and behavior of the packaging materials, MEMS applications can be fully realized and integrated into countless commercial and military applications.

  10. Inductively Coupled Plasma Etching of Bulk Titanium for MEMS Applications

    E-Print Network [OSTI]

    MacDonald, Noel C.

    Inductively Coupled Plasma Etching of Bulk Titanium for MEMS Applications E. R. Parker,a, * B. J for the bulk micromachining of microelectromechanical MEMS devices. Titanium- based MEMS have the potential for the microfabrication of titanium-based MEMS devices. © 2005 The Electrochemical Society. DOI: 10.1149/1.2006647 All

  11. Structured Custom Design of MEMS Devices Dr. Debjyoti Banerjee

    E-Print Network [OSTI]

    Banerjee, Debjyoti

    Structured Custom Design of MEMS Devices Dr. Debjyoti Banerjee Senior Consulting Engineer COVENTOR, Macro-model, Netlist, MEMS, CAD. ABSTRACT A top down design is essential to minimize time-to-market of MEMS devices. A structured custom design approach for MEMS design based on the concept of using

  12. Asymptotics of Nonlinear Biharmonic Eigenvalue Problems of MEMS

    E-Print Network [OSTI]

    Ward, Michael Jeffrey

    Asymptotics of Nonlinear Biharmonic Eigenvalue Problems of MEMS Alan E. Lindsay and Michael J. Ward Problems of MEMS Overview of Nonlinear Eigenvalue Problems of MEMS Calculation of the Pull-In Voltage of the Maximal Solution Branch. Of more mathematical interest in PDE. CAIMS ­ p. #12;A MEMS Capacitor d L

  13. MEMS Research Lab, EL-104 College of Engineering

    E-Print Network [OSTI]

    Kassegne, Samuel Kinde

    MEMS Research Lab, EL-104 College of Engineering 5500 Campanile Drive, San Diego CA 92182-1323 Tel: 619-594-1815 Fax: 619-594-3599 SDSU MEMS CLEANROOM CERTIFICATION PROGRAM Every new student with intention to work in SDSU MEMS cleanroom facility has to complete the SDSU MEMS Lithography certification

  14. Predictive modeling of thermoelastic energy dissipation in tunable MEMS mirrors

    E-Print Network [OSTI]

    Yi, Yun-Bo

    Predictive modeling of thermoelastic energy dissipation in tunable MEMS mirrors Houwen Tang is of significant importance in many microelectromechanical sys- tem MEMS applications. Thermoelastic damping can such as MEMS mirrors. We deal with the simulation and analysis of thermoelastic damping of MEMS mirrors based

  15. Development of MEMS photoacoustic spectroscopy

    SciTech Connect (OSTI)

    Robinson, Alex Lockwood; Eichenfield, Matthew S.; Griffin, Benjamin; Harvey, Heidi Alyssa; Nielson, Gregory N.; Okandan, Murat; Langlois, Eric; Resnick, Paul James; Shaw, Michael J.; Young, Ian; Givler, Richard C.; Reinke, Charles M.

    2014-01-01

    After years in the field, many materials suffer degradation, off-gassing, and chemical changes causing build-up of measurable chemical atmospheres. Stand-alone embedded chemical sensors are typically limited in specificity, require electrical lines, and/or calibration drift makes data reliability questionable. Along with size, these "Achilles' heels" have prevented incorporation of gas sensing into sealed, hazardous locations which would highly benefit from in-situ analysis. We report on development of an all-optical, mid-IR, fiber-optic based MEMS Photoacoustic Spectroscopy solution to address these limitations. Concurrent modeling and computational simulation are used to guide hardware design and implementation.

  16. MEMS Materials and Temperature Sensors for Down Hole Geothermal System Monitoring

    E-Print Network [OSTI]

    Wodin-Schwartz, Sarah

    2013-01-01

    In-Plane MEMS Temperature SensorExisting MEMS Capacitive Temperature Sensors . . . . .suite of encapsulated MEMS sensors to monitor the down hole

  17. MEMS-based Massively-parallelized Mechanoporation Instrumentation for Ultrahigh Throughput Cellular Manipulation

    E-Print Network [OSTI]

    Zhang, Yanyan

    2012-01-01

    OF CALIFORNIA RIVERSIDE MEMS-based Massively-parallelizedOF THE DISSERTATION MEMS-based Massively-parallelizeda massively- parallelized MEMS-based platform for passively

  18. High performance RF MEMS metal-contact switches and switching networks

    E-Print Network [OSTI]

    Patel, Chirag D.; Patel, Chirag D.

    2012-01-01

    MEMS switches for RF applications,” MicroelectromechanicalMEMS switch with a corrugated diaphragm,” MicroelectromechanicalMEMS switch technology for high frequency applications,” in Microelectromechanical

  19. Fatigue of polycrystalline silicon for MEMS applications: Crack growth and stability under resonant loading conditions

    E-Print Network [OSTI]

    Muhlstein, C.L.; Howe, R.T.; Ritchie, R.O.

    2001-01-01

    Science of Microelectromechanical System (MEMS) Devices III.Science of Microelectromechanical System (MEMS) Devices III.2001) and microelectromechanical systems (MEMS), there has

  20. Micro electromechanical systems (MEMS) for mechanical engineers

    SciTech Connect (OSTI)

    Lee, A. P., LLNL

    1996-11-18

    The ongoing advances in Microelectromechanical Systems (MEMS) are providing man-kind the freedom to travel to dimensional spaces never before conceivable. Advances include new fabrication processes, new materials, tailored modeling tools, new fabrication machines, systems integration, and more detailed studies of physics and surface chemistry as applied to the micro scale. In the ten years since its inauguration, MEMS technology is penetrating industries of automobile, healthcare, biotechnology, sports/entertainment, measurement systems, data storage, photonics/optics, computer, aerospace, precision instruments/robotics, and environment monitoring. It is projected that by the turn of the century, MEMS will impact every individual in the industrial world, totaling sales up to $14 billion (source: System Planning Corp.). MEMS programs in major universities have spawned up all over the United States, preparing the brain-power and expertise for the next wave of MEMS breakthroughs. It should be pointed out that although MEMS has been initiated by electrical engineering researchers through the involvement of IC fabrication techniques, today it has evolved such that it requires a totally multi-disciplinary team to develop useful devices. Mechanical engineers are especially crucial to the success of MEMS development, since 90% of the physical realm involved is mechanical. Mechanical engineers are needed for the design of MEMS, the analysis of the mechanical system, the design of testing apparatus, the implementation of analytical tools, and the packaging process. Every single aspect of mechanical engineering is being utilized in the MEMS field today, however, the impact could be more substantial if more mechanical engineers are involved in the systems level designing. In this paper, an attempt is made to create the pathways for a mechanical engineer to enter in the MEMS field. Examples of application in optics and medical devices will be used to illustrate how mechanical engineers made impact. Through a basic understanding of the history of MEMS, the background physics and scaling in micromechanical systems, and an introduction to baseline MEMS processes, a mechanical engineer should be well on his way to Alice's wonderland in the ever-exciting playground of MEMS.

  1. 2/24/2014 2014/02/23 MEMS @

    E-Print Network [OSTI]

    Chiao, Jung-Chih

    2/24/2014 2014/02/23 MEMS @ :: PIXNET :: http://spiderman186.pixnet.net/blog/post/103451560 1/3 Feb 23 Sun 2014 23:23 2014/02/23 MEMS 10Like 10 people like this. Sign Up to see what your friends like.Like micro-windmillsMEMS10 JC Chiao100 WinMEMS " " 1.8mm MEMS : BLOG 41 509893 (1) (18

  2. MEMS reliability in shock environments

    SciTech Connect (OSTI)

    TANNER,DANELLE M.; WALRAVEN,JEREMY A.; HELGESEN,KAREN SUE; IRWIN,LLOYD W.; BROWN,FREDERICK A.; SMITH,NORMAN F.; MASTERS,NATHAN

    2000-02-09

    In order to determine the susceptibility of the MEMS (MicroElectroMechanical Systems) devices to shock, tests were performed using haversine shock pulses with widths of 1 to 0.2 ms in the range from 500g to 40,000g. The authors chose a surface-micromachined microengine because it has all the components needed for evaluation: springs that flex, gears that are anchored, and clamps and spring stops to maintain alignment. The microengines, which were unpowered for the tests, performed quite well at most shock levels with a majority functioning after the impact. Debris from the die edges moved at levels greater than 4,000g causing shorts in the actuators and posing reliability concerns. The coupling agent used to prevent stiction in the MEMS release weakened the die-attach bond, which produced failures at 10,000g and above. At 20,000g the authors began to observe structural damage in some of the thin flexures and 2.5-micron diameter pin joints. The authors observed electrical failures caused by the movement of debris. Additionally, they observed a new failure mode where stationary comb fingers contact the ground plane resulting in electrical shorts. These new failure were observed in the control group indicating that they were not shock related.

  3. Design of Surface Micromachined Compliant MEMS

    SciTech Connect (OSTI)

    Joe Anthony Bradley

    2002-12-31

    The consideration of compliant mechanisms as Microelectromechanical Systems (MEMS) is the focus of this research endeavor. MEMS are micron to millimeter devices that combine electrical, mechanical, and information processing capabilities on the same device. These MEMS need some mechanical motion or parts that move relative to each other. This relative motion, using multiple parts, is not desired because of the assembly requirement and the friction introduced. Compliant devices limits or eliminates friction and the need for multi-component assembly. Compliant devices improve designs by creating single piece mechanisms. The purpose of this research is to validate surface micromachining as a viable fabrication process for compliant MEMS designs. Specifically, this research has sought to fabricate a micro-compliant gripper and a micro-compliant clamp to illustrate the process. While other researchers have created compliant MEMs, most have used comb-drive actuation methods and bulk micromachining processes. This research focused on fully-compliant devices that use device flexibility for motion and actuation. Validation of these compliant MEMS is achieved by structural optimization of device design and functional performance testing. This research contributes to the ongoing research in MEMS by evaluating the potential of using surface micromachining as a process for fabricating compliant micro-mechanisms.

  4. Design of Surface micromachined Compliant MEMS

    SciTech Connect (OSTI)

    Joe Anthony Bradley

    2002-08-01

    The consideration of compliant mechanisms as Microelectromechanical Systems (MEMS) is the focus of this research endeavor. MEMS are micron to millimeter devices that combine electrical, mechanical, and information processing capabilities on the same device. These MEMS need some mechanical motion or parts that move relative to each other. This relative motion, using multiple parts, is not desired because of the assembly requirement and the friction introduced. Compliant devices limits or eliminates friction and the need for multi-component assembly. Compliant devices improve designs by creating single piece mechanisms. The purpose of this research is to validate surface micromachining as a viable fabrication process for compliant MEMS designs. Specifically, this research has sought to fabricate a micro-compliant gripper and a micro-compliant clamp to illustrate the process. While other researchers have created compliant MEMS, most have used comb-drive actuation methods and bulk micromachining processes. This research focuses on fully-compliant devices that use device flexibility for motion and actuation. Validation of these compliant MEMS is achieved by structural optimization of device design and functional performance testing. This research contributes to the ongoing research in MEMS by evaluating the potential of using surface micromachining as a process for fabricating compliant micro-mechanisms.

  5. Real-time inclinometer using accelerometer MEMS

    E-Print Network [OSTI]

    Hanto, D; Hermanto, B; Puranto, P; Handoko, L T

    2011-01-01

    A preliminary design of inclinometer for real-time monitoring system of soil displacement is proposed. The system is developed using accelerometer sensor with microelectromechanical system (MEMS) device. The main apparatus consists of a single MEMS sensor attached to a solid pipe and stucked pependicularly far away below the soil surface. The system utilizes small fractions of electrical signals from MEMS sensor induced by the pipe inclination due to soil displacements below the surface. It is argued that the system is accurate enough to detect soil displacements responsible for landslides, and then realizes a simple and low cost landslide early warning system.

  6. Solder self-assembly for MEMS fabrication

    E-Print Network [OSTI]

    Au, Hin Meng, 1977-

    2004-01-01

    This thesis examines and demonstrates self-assembly of MEMS components on the 25 micron scale onto substrates using the capillary force of solder. This is an order of magnitude smaller than current solder self-assembly in ...

  7. Si-based RF MEMS components.

    SciTech Connect (OSTI)

    Stevens, James E.; Nordquist, Christopher Daniel; Baker, Michael Sean; Fleming, James Grant; Stewart, Harold D.; Dyck, Christopher William

    2005-01-01

    Radio frequency microelectromechanical systems (RF MEMS) are an enabling technology for next-generation communications and radar systems in both military and commercial sectors. RF MEMS-based reconfigurable circuits outperform solid-state circuits in terms of insertion loss, linearity, and static power consumption and are advantageous in applications where high signal power and nanosecond switching speeds are not required. We have demonstrated a number of RF MEMS switches on high-resistivity silicon (high-R Si) that were fabricated by leveraging the volume manufacturing processes available in the Microelectronics Development Laboratory (MDL), a Class-1, radiation-hardened CMOS manufacturing facility. We describe novel tungsten and aluminum-based processes, and present results of switches developed in each of these processes. Series and shunt ohmic switches and shunt capacitive switches were successfully demonstrated. The implications of fabricating on high-R Si and suggested future directions for developing low-loss RF MEMS-based circuits are also discussed.

  8. MEMS Materials and Processes: a research overview

    E-Print Network [OSTI]

    Spearing, S. Mark

    An overview is provided of materials and processes research currently being conducted in support of MEMS device design at MIT. Underpinning research is being conducted in five areas: room temperature strength characterization, ...

  9. Piezoelectric MEMS resonator characterization and filter design

    E-Print Network [OSTI]

    Kang, Joung-Mo, 1978-

    2004-01-01

    This thesis presents modeling and first measurements of a new piezoelectric MEMS resonator developed at Draper Laboratory. In addition, some simple filter designs incorporating the resonator with predicted performance ...

  10. 05670_MEMS | netl.doe.gov

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Fabry-Perot MEMS Accelerometers for Advanced Seismic Imaging Last Reviewed 1212015 DE-FC26-09NT0005670 Goal The objective of this project is to build an accelerometer and...

  11. Fatigue of polycrystalline silicon for MEMS applications: Crack growth and stability under resonant loading conditions

    E-Print Network [OSTI]

    Muhlstein, C.L.; Howe, R.T.; Ritchie, R.O.

    2001-01-01

    Materials Science of Microelectromechanical System (MEMS)Materials Science of Microelectromechanical System (MEMS)Muhlstein, C. (Eds. ), Microelectromechanical Structures for

  12. Challenges in the Packaging of MEMS

    SciTech Connect (OSTI)

    BROWN, WILLIAM D.; EATON, WILLIAM P.; MALSHE, AJAY P.; MILLER, WILLIAM M.; O'NEAL, CHAD; SINGH, SUSHILA B.

    1999-09-24

    Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended function, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress relaxation overtime which can lead to scale factor shifts in sensor devices. The fabrication processes used in creating the devices must be compatible with each other, and not result in damage to the devices. Many devices are application specific requiring custom packages that are not commercially available. Devices may also need media compatible packages that can protect the devices from harsh environments in which the MEMS device may operate. Techniques are being developed to handle, process, and package the devices such that high yields of functional packaged parts will result. Currently, many of the processing steps are potentially harmful to MEMS devices and negatively affect yield. It is the objective of this paper to review and discuss packaging challenges that exist for MEMS systems and to expose these issues to new audiences from the integrated circuit packaging community.

  13. Polymer-Ceramic MEMS Bimorphs as Thermal Infrared Sensors

    E-Print Network [OSTI]

    Warren, Clinton Gregory

    2010-01-01

    et al. , Trilayered Ceramic-Metal-Polymer MicrocantileversPolymer-Ceramic MEMS Bimorphs as Thermal Infrared Sensors byLin Spring 2010 Polymer-Ceramic MEMS Bimorphs as Thermal

  14. Dynamics of Electrostatic MEMS Actuators

    E-Print Network [OSTI]

    Yang, Yisong; Zhao, Le

    2012-01-01

    Electrostatic actuators are simple but important switching devices for MEMS applications. Due to the difficulties associated with the electrostatic nonlinearity, precise mathematical description is often hard to obtain for the dynamics of these actuators. Here we present two sharp theorems concerning the dynamics of an undamped electrostatic actuator with one-degree of freedom, subject to linear and nonlinear elastic forces, respectively. We prove that both situations are characterized by the onset of one-stagnation-point periodic response below a well-defined pull-in voltage and a finite-time touch-down or collapse of the actuator above this pull-in voltage. In the linear-force situation, the stagnation level, pull-in voltage, and pull-in coordinate of the movable electrode may all be determined explicitly, following the recent work of Leus and Elata based on numerics. Furthermore, in the nonlinear-force situation, the stagnation level, pull-in voltage, and pull-in coordinate may be described completely in t...

  15. A Nuclear Microbattery for MEMS Devices

    SciTech Connect (OSTI)

    Blanchard, James; Henderson, Douglass; Lal, Amit

    2002-08-20

    This project was designed to demonstrate the feasibility of producing on-board power for MEMS devices using radioisotopes. MEMS is a fast growing field, with hopes for producing a wide variety of revolutionary applications, including ''labs on a chip,'' micromachined scanning tunneling microscopes, microscopic detectors for biological agents, microsystems for DNA identification, etc. Currently, these applications are limited by the lack of an on-board power source. Research is ongoing to study approaches such as fuel cells, fossil fuels, and chemical batteries, but all these concepts have limitations. For long-lived, high energy density applications, on-board radioisotope power offers the best choice. We have succeeded in producing such devices using a variety of isotopes, incorporation methods, and device geometries. These experiments have demonstrated the feasibility of using radioisotope power and that there are a variety of options available for MEMS designers. As an example of an integrated, self-powered application, we have created an oscillating cantilever beam that is capable of consistent, periodic oscillations over very long time periods without the need for refueling. Ongoing work will demonstrate that this cantilever is capable of radio frequency transmission, allowing MEMS devices to communicate with one another wirelessly. Thus, this will be the first self-powered wireless transmitter available for use in MEMS devices, permitting such applications as sensors embedded in buildings for continuous monitoring of the building performance and integrity.

  16. Combined photonics and MEMs function demonstration

    SciTech Connect (OSTI)

    Blum, O.; Warren, M.E.; Hou, H.Q.; Choquette, K.D.; Rogers, M.S.; Sniegowski, J.J. [Sandia National Labs., Albuquerque, NM (United States); Carson, R.F. [Microoptical Devices, Inc., Albuquerque, NM (United States)

    1998-01-01

    The authors have recently demonstrated two prototypes where photonics and microelectromechanical system (MEMs) technologies have been integrated to show proof-of-principle functionality for weapon surety functions. These activities are part of a program which is exploring the miniaturization of electromechanical components for making weapon systems safer. Such miniaturization can lead to a low-cost, small, high-performance ``systems-on-a-chip``, and have many applications ranging from advanced military systems to large-volume commercial markets like automobiles, rf or land-based communications networks and equipment, or commercial electronics. One of the key challenges in realization of the microsystem is integration of several technologies including digital electronics; analog and rf electronics, optoelectronics (light emitting and detecting devices and circuits), sensors and actuators, and advanced packaging technologies. In this work the authors describe efforts in integrating MEMs and photonic functions and the fabrication constraints on both system components. Here, they discuss two examples of integration of MEMs and a photonic device. In the first instance, a MEMs locking device pin is driven by a voltage generated by photovoltaic cells connected in series, which are driven by a laser. In the second case, a VCSEL emitting at 1.06 {micro}m is packaged together with a metallized MEMs shutter. By appropriate alignment to the opening in the shutter, the VCSEL is turned on and off by the movement of the Si chopper wheel.

  17. DEVELOPMENT OF BROADBAND LOW-VOLTAGE RF MEM SWITCHES

    E-Print Network [OSTI]

    Shen, Shyh-Chiang

    DEVELOPMENT OF BROADBAND LOW-VOLTAGE RF MEM SWITCHES S.C. Shen, D. T. Becher, D. C. Caruth, and M)333-4054 Fax: (217) 244-6375 Abstract We present novel RF switches using micro-electro- mechanical (MEM) technology. These MEM switches are built on GaAs substrates using GaAs MESFET MMIC- compatible processes

  18. Operating System Management of MEMS-based Storage Devices

    E-Print Network [OSTI]

    : Microelectromechanical systems (MEMS), operating systems, secondary storage, request schedul- ing, data placement, faultOperating System Management of MEMS-based Storage Devices John Linwood GriÃ?n, Steven W. Schlosser University Pittsburgh, PA 15213 Abstract MEMS-based storage devices promise signi#12;cant performance

  19. Digital Fingerprints for Low-Cost Platforms using MEMS sensors

    E-Print Network [OSTI]

    Schaumont, Patrick

    Digital Fingerprints for Low-Cost Platforms using MEMS sensors Aydin Aysu, Nahid Farhady Ghalaty. In this paper, we target a commonly used MEMS sensor, an accelerometer, and utilize its process variations electrostatic impulse and its inherent offset values. Our results revealed that MEMS sensors could be used

  20. Model Reduction for RF MEMS Simulation David S. Bindel1

    E-Print Network [OSTI]

    California at Davis, University of

    Model Reduction for RF MEMS Simulation David S. Bindel1 , Zhaojun Bai2 , and James W. Demmel3 1@eecs.berkeley.edu Abstract. Radio-frequency (RF) MEMS resonators, integrated into CMOS chips, are of great interest-preserving model-reduction techniques and apply them to the frequency-domain analysis of two proposed MEMS

  1. Characterization of Contour Shapes Achievable with a MEMS Deformable Mirror

    E-Print Network [OSTI]

    Bifano, Thomas

    Characterization of Contour Shapes Achievable with a MEMS Deformable Mirror Yaopeng Zhou and Thomas for a particular AO application can be determined. In this paper, we characterize one MEMS DM that was recently electrostatic actuation in an architecture that has been described previously. We incorporated the MEMS mirror

  2. RF MEMS DC CONTACT SWTCHES FOR RECONFIGURABLE Presented to the

    E-Print Network [OSTI]

    Kassegne, Samuel Kinde

    RF MEMS DC CONTACT SWTCHES FOR RECONFIGURABLE ANTENNAS _______________ A Thesis Presented STATE UNIVERSITY The Undersigned Faculty Committee Approves the Thesis of Lei Zhou: RF DC Contact MEMS rock and water, water, through persistence, eventually wins. #12;vi ABSTRACT OF THE THESIS RF MEMS DC

  3. PARAMETRICALLY EXICITED MEMS-BASED Steven W. Shaw1

    E-Print Network [OSTI]

    PARAMETRICALLY EXICITED MEMS-BASED FILTERS Steven W. Shaw1 , Kimberly L. Turner2 , Jeffrey F: In this paper we describe the dynamics of MEMS oscillators that can be used as frequency filters. The unique of the input and the nonlinear nature of the response. Here we provide a brief background on filters, a MEMS

  4. MEMS: Detection and Tracking of Mobile Eevents Using Mobile Sensors

    E-Print Network [OSTI]

    Han, Qi "Chee"

    MEMS: Detection and Tracking of Mobile Eevents Using Mobile Sensors Na Yu and Qi Han Department interchangeably in the following. This paper presents MEMS--a novel pipelined approach for dynamic event detection and tracking. The noteworthy features of MEMS are that it (1) uses detection robots in a distributed way; (2

  5. A CMOS Potentiostat for Control of Integrated MEMS Actuators

    E-Print Network [OSTI]

    Maryland at College Park, University of

    A CMOS Potentiostat for Control of Integrated MEMS Actuators Somashekar Bangalore Prakash, Pamela-- We describe a potentiostat designed for in situ electrochemical control of MEMS actuators. This module is tailored for integration into a hybrid CMOS-MEMS system-on- a-chip to confine cells and measure

  6. MEMS-based storage devices and standard disk interfaces

    E-Print Network [OSTI]

    MEMS-based storage devices and standard disk interfaces: A square peg in a round hole? Steven W University Pittsburgh, PA 15213-3890 Abstract MEMS-based storage devices are a new technology works for existing systems, and by showing that these reasons hold for MEMS-based storage. This result

  7. Diamond and Polycrystalline Diamond for MEMS Applications: Simulations and Experiments

    E-Print Network [OSTI]

    Çagin, Tahir

    Diamond and Polycrystalline Diamond for MEMS Applications: Simulations and Experiments Tahir C¸ a Communication Systems, El Segundo, CA 90025, U.S.A. Abstract To date most of the MEMS devices are been based both to surface chemistry and cohesive energy density of these likely MEMS bearing materials. Therefore

  8. Multiple Solutions in Electrostatic MEMS J.A. Pelesko*

    E-Print Network [OSTI]

    Pelesko, John

    Multiple Solutions in Electrostatic MEMS J.A. Pelesko* * Georgia Institute of Technology, School is the principle phe- nomena limiting the design of nearly every electrostat- ically actuated MEMS device for the system. Here a generalized model of a small aspect ratio electrostatically actuated MEMS device

  9. Design and Fabrication of a MEMS Capacitive Chemical Sensor System

    E-Print Network [OSTI]

    Baker, R. Jacob

    Design and Fabrication of a MEMS Capacitive Chemical Sensor System Vishal Saxena, Todd J. Plum-- This paper describes the development of a MEMS sensor system to detect volatile compounds. The sensor consists of a MEMS capacitive sensor element monolithically integrated with a sensing circuit. The sensor

  10. Distributed MEMS Transmission Lines for Tunable Filter Applications

    E-Print Network [OSTI]

    York, Robert A.

    Distributed MEMS Transmission Lines for Tunable Filter Applications Yu Liu, Andrea Borgioli, Amit S: This paper describes the design and fabrication of a distributed MEMS ( )transmission line DMTL , used is a coplanar waveguide periodically loaded with continuously-variable MEMS capacitors. A tunable bandpass

  11. Hierarchical MEMS Synthesis and Optimization Ying Zhang1

    E-Print Network [OSTI]

    Agogino, Alice M.

    Hierarchical MEMS Synthesis and Optimization Ying Zhang1 , Raffi Kamalian2 , Alice M. Agogino3 and Computer Sciences, University of California, Berkeley ABSTRACT A hierarchical MEMS synthesis and optimization architecture has been developed for MEMS design automation. The architecture integrates an object

  12. Micro Contacts and Micro Manipulation with MEMS Actuator Arrays

    E-Print Network [OSTI]

    Richardson, David

    Micro Contacts and Micro Manipulation with MEMS Actuator Arrays Karl­Friedrich B¨ohringer Bruce technology for MEMS (micro electro mechanical systems) increase the availability and diversity out tasks using coordinated systems of MEMS units motivates the development of automated, algorithmic

  13. Alternative structures for two-dimensional MEMS optical switches [Invited

    E-Print Network [OSTI]

    Wai, Ping-kong Alexander

    Two-dimensional (2-D) microelectromechanical system (MEMS) optical switches have the merits of easy technologies have been proposed for building OXCs. Microelectromechanical system (MEMS) optical switches haveAlternative structures for two-dimensional MEMS optical switches [Invited] Victor O. K. Li

  14. Failure analysis issues in microelectromechanical systems (MEMS).

    SciTech Connect (OSTI)

    Walraven, Jeremy Allen

    2005-07-01

    Failure analysis and device characterization of MEMS components are critical steps in understanding the root causes of failure and improving device performance. At the wafer and die level these tasks can be performed with little or no sample preparation. Larger challenges occur after fabrication when the device is packaged, capped, sealed, or otherwise obstructed from view. The challenges and issues of MEMS failure analysis lie in identifying the root cause of failure for these packaged, capped, and sealed devices without perturbing the device or its immediate environment. Novel methods of gaining access to the device or preparing the device for analysis are crucial to accurately determining the root cause of failure. This paper will discuss issues identified in performing root cause failure analysis of packaged MEMS devices, as well as the methods employed to analyze them.

  15. IC-Compatible Technologies for Optical MEMS

    SciTech Connect (OSTI)

    Krygowski, T.W.; Sniegowski, J.J.

    1999-04-30

    Optical Micro Electro Mechanical Systems (Optical MEMS) Technology holds the promise of one-day producing highly integrated optical systems on a common, monolithic substrate. The choice of fabrication technology used to manufacture Optical MEMS will play a pivotal role in the size, functionality and ultimately the cost of optical Microsystems. By leveraging the technology base developed for silicon integrated circuits, large batches of routers, emitters, detectors and amplifiers will soon be fabricated for literally pennies per part. In this article we review the current status of technologies used for Optical MEMS, as well as fabrication technologies of the future, emphasizing manufacturable surface micromachining approaches to producing reliable, low-cost devices for optical communications applications.

  16. Release Resistant Electrical Interconnections For Mems Devices

    DOE Patents [OSTI]

    Peterson, Kenneth A. (Albuquerque, NM); Garrett, Stephen E. (Albuquerque, NM); Reber, Cathleen A. (Corrales, NM)

    2005-02-22

    A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device, without using any intermediate layers of aluminum, titanium, solder, or conductive adhesive disposed in-between the conductor and polysilicon pad. After the initial compression bond has been formed, subsequent heat treatment of the joint above 363 C creates a liquid eutectic phase at the bondline comprising gold plus approximately 3 wt % silicon, which, upon re-solidification, significantly improves the bond strength by reforming and enhancing the initial bond. This type of electrical interconnection is resistant to chemical attack from acids used for releasing MEMS elements (HF, HCL), thereby enabling the use of a "package-first, release-second" sequence for fabricating MEMS devices. Likewise, the bond strength of an Au--Ge compression bond may be increased by forming a transient liquid eutectic phase comprising Au-12 wt % Ge.

  17. MEMS reliability: The challenge and the promise

    SciTech Connect (OSTI)

    Miller, W.M.; Tanner, D.M.; Miller, S.L.; Peterson, K.A.

    1998-05-01

    MicroElectroMechanical Systems (MEMS) that think, sense, act and communicate will open up a broad new array of cost effective solutions only if they prove to be sufficiently reliable. A valid reliability assessment of MEMS has three prerequisites: (1) statistical significance; (2) a technique for accelerating fundamental failure mechanisms, and (3) valid physical models to allow prediction of failures during actual use. These already exist for the microelectronics portion of such integrated systems. The challenge lies in the less well understood micromachine portions and its synergistic effects with microelectronics. This paper presents a methodology addressing these prerequisites and a description of the underlying physics of reliability for micromachines.

  18. Introduction to applications and industries for Microelectromechanical Systems (MEMS).

    SciTech Connect (OSTI)

    Walraven, Jeremy Allen

    2003-07-01

    Microelectromechanical Systems (MEMS) have gained acceptance as viable products for many commercial and government applications. MEMS are currently being used as displays for digital projection systems, sensors for airbag deployment systems, inkjet print head systems, and optical routers. This paper will discuss current and future MEMS applications. What are MEMS? MEMS are typically defined as microscopic devices designed, processed, and used to interact or produce changes within a local environment. A mechanical, electrical, or chemical stimulus can be used to create a mechanical, electrical, or chemical response in a local environment. These smaller, more sophisticated devices that think, act, sense, and communicate are replacing their bulk counterparts in many traditional applications.

  19. Design of a Class of Antennas Utilizing MEMS, EBG and Septum Polarizers including Near-field Coupling Analysis

    E-Print Network [OSTI]

    Kim, Ilkyu

    2012-01-01

    packaged MEMS (microelectromechanical system) switch, and aantennas based on MEMS (Microelectromechanical ii Systems)design, based on MEMS (Microelectromechanical Systems) and

  20. MEMS micropump for a Micro Gas Analyzer

    E-Print Network [OSTI]

    Sharma, Vikas, 1979-

    2009-01-01

    This thesis presents a MEMS micro-vacuum pump designed for use in a portable gas analysis system. It is designed to be pneumatically-driven and as such does not have self-contained actuation (the focus of future work). ...

  1. HIGH-ASPECT-RATIO INDUCTIVELY COUPLED PLASMA ETCHING OF BULK TITANIUM FOR MEMS APPLICATIONS

    E-Print Network [OSTI]

    MacDonald, Noel C.

    HIGH-ASPECT-RATIO INDUCTIVELY COUPLED PLASMA ETCHING OF BULK TITANIUM FOR MEMS APPLICATIONS E. R system for the bulk micromachining of MEMS devices. Titanium-based MEMS have the potential to be used for the microfabrication of titanium- based MEMS devices. INTRODUCTION Traditionally, microelectromechanical systems (MEMS

  2. Page 1 of 24 Case-based Reasoning for Evolutionary MEMS Design

    E-Print Network [OSTI]

    Agogino, Alice M.

    Page 1 of 24 Case-based Reasoning for Evolutionary MEMS Design Corie L. Cobb1 and Alice M. Agogino2-aided design tool for microelectromechanical systems (MEMS) design synthesis called CaSyn-MEMS (Case-based Synthesis of MEMS) has been developed. MEMS-based technologies have the potential to revolutionize many

  3. Sandia Agile MEMS Prototyping, Layout Tools, Education and Services Program

    SciTech Connect (OSTI)

    Schriner, H.; Davies, B.; Sniegowski, J.; Rodgers, M.S.; Allen, J.; Shepard, C.

    1998-05-01

    Research and development in the design and manufacture of Microelectromechanical Systems (MEMS) is growing at an enormous rate. Advances in MEMS design tools and fabrication processes at Sandia National Laboratories` Microelectronics Development Laboratory (MDL) have broadened the scope of MEMS applications that can be designed and manufactured for both military and commercial use. As improvements in micromachining fabrication technologies continue to be made, MEMS designs can become more complex, thus opening the door to an even broader set of MEMS applications. In an effort to further research and development in MEMS design, fabrication, and application, Sandia National Laboratories has launched the Sandia Agile MEMS Prototyping, Layout Tools, Education and Services Program or SAMPLES program. The SAMPLES program offers potential partners interested in MEMS the opportunity to prototype an idea and produce hardware that can be used to sell a concept. The SAMPLES program provides education and training on Sandia`s design tools, analysis tools and fabrication process. New designers can participate in the SAMPLES program and design MEMS devices using Sandia`s design and analysis tools. As part of the SAMPLES program, participants` designs are fabricated using Sandia`s 4 level polycrystalline silicon surface micromachine technology fabrication process known as SUMMiT (Sandia Ultra-planar, Multi-level MEMS Technology). Furthermore, SAMPLES participants can also opt to obtain state of the art, post-fabrication services provided at Sandia such as release, packaging, reliability characterization, and failure analysis. This paper discusses the components of the SAMPLES program.

  4. MEMS Materials and Temperature Sensors for Down Hole Geothermal System Monitoring

    E-Print Network [OSTI]

    Wodin-Schwartz, Sarah

    2013-01-01

    introduces microelectromechanical systems (MEMS) sensors asMEMS temperature sensors for 275C applications - part 2 design and technology. Journal of MicroelectromechanicalMEMS temperature sensors for 275C applications - part 2 creep and cycling performance. Journal of Microelectromechanical

  5. Method and instrumentation for the measurement and characterization of MEMS fabricated electrical contacts

    E-Print Network [OSTI]

    Read, Melissa B. (Melissa Beth), 1982-

    2010-01-01

    MEMS fabricated electrical contacts consist of two MEMS fabricated surfaces which are physically separated and brought together for the purpose of carrying current. MEMS fabricated electrical contacts are used in a wide ...

  6. Analytical study on arbitrary waveform generation by MEMS micro mirror arrays.

    E-Print Network [OSTI]

    Kalyoncu, Salih K; Huang, Yuewang; Song, Qi; Boyraz, Ozdal

    2012-01-01

    waveform generation by MEMS micro mirror arrays Salih K.generation technique by using MEMS digital micro-mirrormodulator [11,12]. Up to date MEMS micro-mirror arrays have

  7. Imaging the foveal cone mosaic with a MEMS-based adaptive optics scanning laser ophthalmoscope

    E-Print Network [OSTI]

    Li, Yiang

    2010-01-01

    YH, Poonja S, Roorda A. MEMS-based adaptive optics scanningcontrol algorithms for a MEMS-based adaptive optics scanningTG. Open-loop control of a MEMS deformable mirror for large-

  8. A MEMS Thin Film AlN Supercritical Carbon Dioxide Valve

    E-Print Network [OSTI]

    Chen, Ya-Mei

    2011-01-01

    D. P. Bame, and T. K. Tang, “MEMS micro-valve for spaceof the fabricated thermal MEMS valve by Kim et al. [Y. -C. Tai, and C-M. Ho, “A MEMS thermopneumatic silicone

  9. Robust free space board-to-board optical interconnect with closed loop MEMS tracking

    E-Print Network [OSTI]

    2009-01-01

    Optical beam steering using MEMS-controllable mi- crolensNikola- jeff, G. Andersson, MEMS-based vcsel beam steeringWu, O. Solgaard, Optical MEMS for lightwave commu- nication.

  10. High performance RF MEMS metal-contact switches and switching networks

    E-Print Network [OSTI]

    Patel, Chirag D.; Patel, Chirag D.

    2012-01-01

    A Compact Cantilever-Based RF MEMS Switch andA High-Performance RF MEMS Metal-Contact Switch and Switch-B High-Q 3-/4-Bit RF MEMS Digitally Tunable Capacitors for

  11. Quasi-optical network analyzers and high-reliability RF MEMS switched capacitors

    E-Print Network [OSTI]

    Grichener, Alexander

    2011-01-01

    Chapter 3 High-Reliability RF MEMS Switched Capacitors 3.1Technology 1.2 RF MEMS Technology . . . . . . . . . . . . .Reliability High-Q Switched RF MEMS Capacitors” IEEE Int.

  12. Algorithmic MEMS Karl Friedrich Bohringer, University of California at Berkeley, Berkeley, CA 94720

    E-Print Network [OSTI]

    Richardson, David

    Algorithmic MEMS Karl Friedrich B¨ohringer, University of California at Berkeley, Berkeley, CA technology for MEMS (microelectromechanical systems) increase the avail­ ability and diversity out tasks using large coordinated systems of MEMS units motivates the de­ velopment of automated

  13. Monolithic integration of a MOSFET with a MEMS device

    DOE Patents [OSTI]

    Bennett, Reid (Albuquerque, NM); Draper, Bruce (Albuquerque, MN)

    2003-01-01

    An integrated microelectromechanical system comprises at least one MOSFET interconnected to at least one MEMS device on a common substrate. A method for integrating the MOSFET with the MEMS device comprises fabricating the MOSFET and MEMS device monolithically on the common substrate. Conveniently, the gate insulator, gate electrode, and electrical contacts for the gate, source, and drain can be formed simultaneously with the MEMS device structure, thereby eliminating many process steps and materials. In particular, the gate electrode and electrical contacts of the MOSFET and the structural layers of the MEMS device can be doped polysilicon. Dopant diffusion from the electrical contacts is used to form the source and drain regions of the MOSFET. The thermal diffusion step for forming the source and drain of the MOSFET can comprise one or more of the thermal anneal steps to relieve stress in the structural layers of the MEMS device.

  14. MEMS Packaging - Current Issues and Approaches

    SciTech Connect (OSTI)

    DRESSENDORFER,PAUL V.; PETERSON,DAVID W.; REBER,CATHLEEN ANN

    2000-01-19

    The assembly and packaging of MEMS (Microelectromechanical Systems) devices raise a number of issues over and above those normally associated with the assembly of standard microelectronic circuits. MEMS components include a variety of sensors, microengines, optical components, and other devices. They often have exposed mechanical structures which during assembly require particulate control, space in the package, non-contact handling procedures, low-stress die attach, precision die placement, unique process schedules, hermetic sealing in controlled environments (including vacuum), and other special constraints. These constraints force changes in the techniques used to separate die on a wafer, in the types of packages which can be used in the assembly processes and materials, and in the sealing environment and process. This paper discusses a number of these issues and provides information on approaches being taken or proposed to address them.

  15. Strength of Polysilicon for MEMS Devices

    SciTech Connect (OSTI)

    Buchheit, Thomas E.; LaVan, David A.

    1999-07-20

    The safe, secure and reliable application of Microelectromechanical Systems (MEMS) devices requires knowledge about the distribution in material and mechanical properties of the small-scale structures. A new testing program at Sandia is quantifying the strength distribution using polysilicon samples that reflect the dimensions of critical MEMS components. The strength of polysilicon fabricated at Sandia's Microelectronic Development Laboratory was successfully measured using samples 2.5 microns thick, 1.7 microns wide with lengths between 15 and 25 microns. These tensile specimens have a freely moving hub on one end that anchors the sample to the silicon die and allows free rotation. Each sample is loaded in uniaxial tension by pulling laterally with a flat tipped diamond in a computer-controlled Nanoindenter. The stress-strain curve is calculated using the specimen cross section and gage length dimensions verified by measuring against a standard in the SEM.

  16. Accurate Telescope Mount Positioning with MEMS Accelerometers

    E-Print Network [OSTI]

    Mészáros, László; Pál, András; Csépány, Gergely

    2014-01-01

    This paper describes the advantages and challenges of applying microelectromechanical accelerometer systems (MEMS accelerometers) in order to attain precise, accurate and stateless positioning of telescope mounts. This provides a completely independent method from other forms of electronic, optical, mechanical or magnetic feedback or real-time astrometry. Our goal is to reach the sub-arcminute range which is well smaller than the field-of-view of conventional imaging telescope systems. Here we present how this sub-arcminute accuracy can be achieved with very cheap MEMS sensors and we also detail how our procedures can be extended in order to attain even finer measurements. In addition, our paper discusses how can a complete system design be implemented in order to be a part of a telescope control system.

  17. Porous Alumina Based Capacitive MEMS RH Sensor

    E-Print Network [OSTI]

    Juhasz, L; Timar-Horvath, Veronika; Desmulliez, Marc; Dhariwal, Resh

    2008-01-01

    The aim of a joint research and development project at the BME and HWU is to produce a cheap, reliable, low-power and CMOS-MEMS process compatible capacitive type relative humidity (RH) sensor that can be incorporated into a state-of-the-art, wireless sensor network. In this paper we discuss the preparation of our new capacitive structure based on post-CMOS MEMS processes and the methods which were used to characterize the thin film porous alumina sensing layer. The average sensitivity is approx. 15 pF/RH% which is more than a magnitude higher than the values found in the literature. The sensor is equipped with integrated resistive heating, which can be used for maintenance to reduce drift, or for keeping the sensing layer at elevated temperature, as an alternative method for temperature-dependence cancellation.

  18. Image Registration for Stability Testing of MEMS

    E-Print Network [OSTI]

    Memarsadeghi, Nargess; Blake, Peter N; Morey, Peter A; Landsman, Wayne B; Chambers, Victor J; Moseley, Samuel H; 10.1117/12.872076

    2013-01-01

    Image registration, or alignment of two or more images covering the same scenes or objects, is of great interest in many disciplines such as remote sensing, medical imaging, astronomy, and computer vision. In this paper, we introduce a new application of image registration algorithms. We demonstrate how through a wavelet based image registration algorithm, engineers can evaluate stability of Micro-Electro-Mechanical Systems (MEMS). In particular, we applied image registration algorithms to assess alignment stability of the MicroShutters Subsystem (MSS) of the Near Infrared Spectrograph (NIRSpec) instrument of the James Webb Space Telescope (JWST). This work introduces a new methodology for evaluating stability of MEMS devices to engineers as well as a new application of image registration algorithms to computer scientists.

  19. Predicting fracture in micron-scale polycrystalline silicon MEMS...

    Office of Scientific and Technical Information (OSTI)

    Predicting fracture in micron-scale polycrystalline silicon MEMS structures. Citation Details In-Document Search Title: Predicting fracture in micron-scale polycrystalline silicon...

  20. The Sandia MEMS Passive Shock Sensor : FY08 failure analysis...

    Office of Scientific and Technical Information (OSTI)

    analysis activities. Citation Details In-Document Search Title: The Sandia MEMS Passive Shock Sensor : FY08 failure analysis activities. No abstract prepared. Authors:...

  1. Ultra-lightweight telescope with MEMS adaptive optic for distortion...

    Office of Scientific and Technical Information (OSTI)

    on the deployable mirrors. To meet this challenge, MEMS micromirrors must meet stringent criteria on their performance in terms of flatness, roughness and resolution of position....

  2. Thin Film Encapsulation Methods for Large Area MEMS Packaging

    E-Print Network [OSTI]

    Mahajerin, Armon

    2012-01-01

    Journal of Microelectromechanical Systems, vol. 2, no. 1,Journal of Microelectromechanical Systems, vol. 13, no. 5,Judy, “Microelectromechanical systems (MEMS): fabrication,

  3. Thin Film Encapsulation Methods for Large Area MEMS Packaging

    E-Print Network [OSTI]

    Mahajerin, Armon

    2012-01-01

    Machinery,” Journal of Microelectromechanical Systems, vol.Journal of Microelectromechanical Systems, vol. 13, no. 5,1995. J. W. Judy, “Microelectromechanical systems (MEMS):

  4. Thin Silicon MEMS Contact-Stress Sensor Kotovksy, J; Tooker,...

    Office of Scientific and Technical Information (OSTI)

    A; Horsley, D 42 ENGINEERING; 42 ENGINEERING; ACCURACY; ACTUATORS; SILICON This thin, MEMS contact-stress sensor continuously and accurately measures time-varying, solid...

  5. Characterization of monolayer surface treatments for MEMS exposed...

    Office of Scientific and Technical Information (OSTI)

    Conference: Characterization of monolayer surface treatments for MEMS exposed to possible back-end-of-line conditions. Citation Details In-Document Search Title: Characterization...

  6. Thin Silicon MEMS Contact-Stress Sensor Kotovsky, J; Tooker,...

    Office of Scientific and Technical Information (OSTI)

    ACCURACY; ACTUATORS; CALIBRATION; DIAPHRAGM; SILICON; STABILITY; THICKNESS This thin, MEMS contact-stress (CS) sensor continuously and accurately measures time-varying, solid...

  7. Thin Silicon MEMS Contact-Stress Sensor Kotovsky, J; Tooker,...

    Office of Scientific and Technical Information (OSTI)

    LIFETIME; PACKAGING; PERFORMANCE; SILICON; THICKNESS This work offers the first, thin, MEMS contact-stress (CS) sensor capable of accurate in situ measruement of time-varying,...

  8. Polymer-Ceramic MEMS Bimorphs as Thermal Infrared Sensors

    E-Print Network [OSTI]

    Warren, Clinton Gregory

    2010-01-01

    Recent Developments in Polymer MEMS. Advanced Materials,using thin silicon/polymer bimorph membranes. Sensors andof cantilever arrays reveal polymer film expansion and

  9. Stress-tolerant and temperature-stable RF MEMS capacitive switches and tunable filters

    E-Print Network [OSTI]

    Reines, Isak C.

    2010-01-01

    Millimeter-wave microelectromechanical MEMS switches forMEMS switched capac- itors with stress-tolerance and temperature-stability ,” accepted for publication in IEEE Journal Microelectromechanical

  10. Assessment of MeMS Sensors in an Urban Traffic Environment

    E-Print Network [OSTI]

    Varaiya, Pravin

    2004-01-01

    BERKELEY Assessment of MeMS Sensors in an Urban Traf?cAND HIGHWAYS Assessment of MeMS Sensors in an Urban Traffic

  11. Automated MEMS-based Drosophila embryo injection system for high-throughput RNAi screens

    E-Print Network [OSTI]

    Scott, Matthew

    Automated MEMS-based Drosophila embryo injection system for high-throughput RNAi screens Stefan developed an automated system based on microelectromechanical systems (MEMS) injectors for reliable mass

  12. Tunable Young's Modulus in Carbon MEMS using Graphene-based Stiffeners...

    Office of Scientific and Technical Information (OSTI)

    Tunable Young's Modulus in Carbon MEMS using Graphene-based Stiffeners. Citation Details In-Document Search Title: Tunable Young's Modulus in Carbon MEMS using Graphene-based...

  13. The challenge of reliability in MEMS commercialization

    SciTech Connect (OSTI)

    Miller, W.M.; Tanner, D.M.; Miller, S.L.

    1998-09-01

    MicroElectroMechanical Systems (MEMS) that think, sense, act and communicate will open up a broad new array of cost-effective solutions only if MEMS is demonstrated to be sufficiently reliable. This could prove to be a major challenge if it is not addressed concurrently with technology development. There are three requirements for a valid assessment of reliability: statistical significance, identification of fundamental failure mechanisms and development of techniques for accelerating them, and valid physical models to allow prediction of failures during actual use. While these already exist for the microelectronics portion of such integrated systems, the real challenge lies in the less well-understood micromachine portions and its synergistic effects with microelectronics. This requires the elicitation of a methodology focused on MEMS reliability, which the authors discuss. A new testing and analysis infrastructure must also be developed to meet the needs of this methodology. They describe their implementation of this infrastructure and its success in addressing the three requirements for a valid reliability assessment.

  14. Radioisotope Power Sources for MEMS Devices,

    SciTech Connect (OSTI)

    Blanchard, J.P.

    2001-06-17

    Microelectromechanical systems (MEMS) comprise a rapidly expanding research field with potential applications varying from sensors in airbags to more recent optical applications. Depending on the application, these devices often require an on-board power source for remote operation, especially in cases requiring operation for an extended period of time. Previously suggested power sources include fossil fuels and solar energy, but nuclear power sources may provide significant advantages for certain applications. Hence, the objective of this study is to establish the viability of using radioisotopes to power realistic MEMS devices. A junction-type battery was constructed using silicon and a {sup 63}Ni liquid source. A source volume containing 64 {micro}Ci provided a power of {approx}0.07 nW. A more novel application of nuclear sources for MEMS applications involves the creation of a resonator that is driven by charge collection in a cantilever beam. Preliminary results have established the feasibility of this concept, and future work will optimize the design for various applications.

  15. Solid polymer MEMS-based fuel cells

    DOE Patents [OSTI]

    Jankowski, Alan F. (Livermore, CA); Morse, Jeffrey D. (Pleasant Hill, CA)

    2008-04-22

    A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. The electrolyte layer can consist of either a solid oxide or solid polymer material, or proton exchange membrane electrolyte materials may be used. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.

  16. Solid oxide MEMS-based fuel cells

    DOE Patents [OSTI]

    Jankowksi, Alan F.; Morse, Jeffrey D.

    2007-03-13

    A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. The electrolyte layer can consist of either a solid oxide or solid polymer material, or proton exchange membrane electrolyte materials may be used. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.

  17. VERSATILE VACUUM PACKAGING FOR EXPERIMENTAL STUDY OF RESONANT MEMS

    E-Print Network [OSTI]

    Tang, William C

    VERSATILE VACUUM PACKAGING FOR EXPERIMENTAL STUDY OF RESONANT MEMS Adam R. Schofield, Alexander A a versatile sub-mTorr vacuum packaging approach ideally suited for R&D of high performance dynamic MEMS techniques and experimentally characterized to determine the sealed vacuum level. The combination of high

  18. Tools and techniques for failure analysis and qualification of MEMS.

    SciTech Connect (OSTI)

    Walraven, Jeremy Allen

    2003-07-01

    Many of the tools and techniques used to evaluate and characterize ICs can be applied to MEMS technology. In this paper we discuss various tools and techniques used to provide structural, chemical, and electrical analysis and how these data aid in qualifying MEMS technologies.

  19. RF-MEMS capacitive switches with high reliability

    DOE Patents [OSTI]

    Goldsmith, Charles L.; Auciello, Orlando H.; Carlisle, John A.; Sampath, Suresh; Sumant, Anirudha V.; Carpick, Robert W.; Hwang, James; Mancini, Derrick C.; Gudeman, Chris

    2013-09-03

    A reliable long life RF-MEMS capacitive switch is provided with a dielectric layer comprising a "fast discharge diamond dielectric layer" and enabling rapid switch recovery, dielectric layer charging and discharging that is efficient and effective to enable RF-MEMS switch operation to greater than or equal to 100 billion cycles.

  20. Pre-release plastic packaging of MEMS and IMEMS devices

    DOE Patents [OSTI]

    Peterson, Kenneth A. (Albuquerque, NM); Conley, William R. (Tijeras, NM)

    2002-01-01

    A method is disclosed for pre-release plastic packaging of MEMS and IMEMS devices. The method can include encapsulating the MEMS device in a transfer molded plastic package. Next, a perforation can be made in the package to provide access to the MEMS elements. The non-ablative material removal process can include wet etching, dry etching, mechanical machining, water jet cutting, and ultrasonic machining, or any combination thereof. Finally, the MEMS elements can be released by using either a wet etching or dry plasma etching process. The MEMS elements can be protected with a parylene protective coating. After releasing the MEMS elements, an anti-stiction coating can be applied. The perforating step can be applied to both sides of the device or package. A cover lid can be attached to the face of the package after releasing any MEMS elements. The cover lid can include a window for providing optical access. The method can be applied to any plastic packaged microelectronic device that requires access to the environment, including chemical, pressure, or temperature-sensitive microsensors; CCD chips, photocells, laser diodes, VCSEL's, and UV-EPROMS. The present method places the high-risk packaging steps ahead of the release of the fragile portions of the device. It also provides protection for the die in shipment between the molding house and the house that will release the MEMS elements and subsequently treat the surfaces.

  1. SUSPENSION VIBRATION COMPENSATION USING A MEMS MICROACTUATOR IN HARD

    E-Print Network [OSTI]

    Horowitz, Roberto

    SUSPENSION VIBRATION COMPENSATION USING A MEMS MICROACTUATOR IN HARD DISK DRIVES Tsung-Lin Chen Kenn Oldham Yunfeng Li Roberto Horowitz ,1,2 Department of Mechanical Engineering, University of a prototype MEMS microactuator and vibration sensors, and controller design for suspension vibration

  2. Reliability Testing of Polysilicon For MEMs Devices

    SciTech Connect (OSTI)

    LaVan, D.A.; Buchheit, T.E.

    1999-04-05

    Mission critical applications of MEMS devices require knowledge of the distribution in their material properties and long-term reliability of the small-scale structures. This project reports on a new testing program at Sandia to quantify the strength distribution using samples that reflect the dimensions of critical MEMS components. The strength of polysilicon fabricated with Sandia's SUMMiT 4-layer process was successfully measured using samples with gage sections 2.5 {micro}m thick by 1.7 {micro}m wide and lengths of 15 and 25 {micro}m. These tensile specimens have a freely moving pivot on one end that anchors the sample to the silicon die and prevents off axis loading during testing. Each sample is loaded in uniaxial tension by pulling laterally with a flat tipped diamond in a computer-controlled Nanoindenter. The stress-strain curve is calculated using the specimen cross section and gage length dimensions verified by measuring against a standard in the SEM. The first 48 samples had a means strength of 2.24 {+-} 0.35 GPa. Fracture strength measurements grouped into three strength levels, which matched three failure modes observed in post mortem examinations. The seven samples in the highest strength group failed in the gage section (strength of 2.77 {+-} 0.04 GPa), the moderate strength group failed at the gage section fillet and the lowest strength group failed at a dimple in the hub. With this technique, multiple tests can be programmed at one time and performed without operator assistance at a rate of 20-30 per day allowing the collection of significant populations of data. Since the new test geometry has been proven, the project is moving to test the distributions seen from real geometric features typical to MEMS such as the effect of gage length, fracture toughness, bonding between layers, etch holes, dimples and shear of gear teeth.

  3. INTERNAL ELECTROSTATIC TRANSDUCTION FOR BULK-MODE MEMS RESONATORS

    E-Print Network [OSTI]

    Afshari, Ehsan

    This paper demonstrates a new approach to electrostatic drive and detection of bulk acoustic resonators coupled into the fundamental bending mode. The approach was deemed inefficient because air-gap capacitive by filling the air-gaps with a low Young's modulus, high- dielectric material. A more practical approach

  4. MEMS Materials and Temperature Sensors for Down Hole Geothermal System Monitoring

    E-Print Network [OSTI]

    Wodin-Schwartz, Sarah

    2013-01-01

    Monitoring Geothermal Environments . . . . . . . . . . . . . . . . . . . . . . . . . . . .down hole environment monitoring. Harsh environment sensorsfor Geothermal Monitoring Harsh environment MEMS sensors

  5. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 23, NO. 3, JUNE 2014 517 Optical MEMS: From Micromirrors

    E-Print Network [OSTI]

    Peter, Yves-Alain

    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 23, NO. 3, JUNE 2014 517 Optical MEMS: From-Alain Peter, Senior Member, IEEE, and Hans Zappe Abstract--Microelectromechanical system (MEMS) technol- ogy from miniaturization through MicroElectroMechanical Sys- tems (MEMS). Optical MEMS is a focus

  6. Mem. S.A.It. Suppl. Vol. 21, 168 c SAIt 2012

    E-Print Network [OSTI]

    California at Berkeley, University of

    Mem. S.A.It. Suppl. Vol. 21, 168 c SAIt 2012 Memorie della Supplementi The New Ultra-Fast Flash. MEMS mirror arrays fabricated at the Research Center for MEMS Space Telescopes (RCMST) of Ewha Woman (UFFO) concept uses an X-ray coded mask camera to trigger a MEMS mirror array to point an optical

  7. American Institute of Aeronautics and Astronautics A MEMS Floating Element with Bump Shear Stress Sensor

    E-Print Network [OSTI]

    White, Robert D.

    and temporal resolution. In the last two decades, MEMS-based shear stress sensors have emerged as a possible-9]. The previous MEMS-based sensors to appear in the literature have two common features: 1) all MEMS wafer and calibrated only up to 1~2 Pa; 2) A majority of MEMS-based sensors besides floating element

  8. This paper presents the development of a simulation program (SUGAR) for planar MEMS devices. The approach

    E-Print Network [OSTI]

    California at Berkeley, University of

    ABSTRACT This paper presents the development of a simulation program (SUGAR) for planar MEMS, and high-level sim- ulation package for MEMS. Keywords: MEMS, SUGAR, nodal analysis, nonlinear model, Matlab INTRODUCTION Rapid development of MEMS technology requires CAD tools for support. Most

  9. RF-MEMS load sensors with enhanced Q-factor and sensitivity in a suspended architecture

    E-Print Network [OSTI]

    Demir, Hilmi Volkan

    RF-MEMS load sensors with enhanced Q-factor and sensitivity in a suspended architecture Rohat Melik-implant RF-MEMS a b s t r a c t In this paper, we present and demonstrate RF-MEMS load sensors designed the strain change in real-time. For this purpose, we present RF- MEMS resonator sensors that shift

  10. A modular process for integrating thick polysilicon MEMS devices with sub-micron CMOS

    E-Print Network [OSTI]

    Afshari, Ehsan

    A modular process for integrating thick polysilicon MEMS devices with sub-micron CMOS John-1774 ABSTRACT A new MEMS process module, called Mod MEMS, has been developed to monolithically integrate thick (5-10um), multilayer polysilicon MEMS structures with sub-micron CMOS. This process is particularly

  11. Biological Micro-Electrical Mechanical Systems Micro-electrical mechanical systems (MEMS) created new

    E-Print Network [OSTI]

    Hill, Wendell T.

    Biological Micro-Electrical Mechanical Systems (bioMEMS) Micro-electrical mechanical systems (MEMS beginning to be explored. bioMEMS combine the potential of cell-sized systems with the advantages in cutting edge research in bioMEMS to revolutionize mechanized drug discovery processes, non- invasive

  12. A Novel Adaptive Approach to Modeling MEMS Tunable Capacitors Using MRTD and FDTD Techniques

    E-Print Network [OSTI]

    Tentzeris, Manos

    A Novel Adaptive Approach to Modeling MEMS Tunable Capacitors Using MRTD and FDTD Techniques Nathan for modeling MEMS tunable capacitors that is based on the coupling of physical motion of the MEMS device MEMS devices are discussed, and ways to compensate for several of these are presented. The proposed

  13. Microwave Laminate PCB Compatible RF MEMS Technology for Wireless Communication Systems

    E-Print Network [OSTI]

    De Flaviis, Franco

    Microwave Laminate PCB Compatible RF MEMS Technology for Wireless Communication Systems * Bedri A microwave laminate printed circuit board (PCB) compatible RF MEMS technology for wireless communication systems. This technology is novel in that RF MEMS components, particularly RF MEM switches, can

  14. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 18, NO. 1, FEBRUARY 2009 103 Indium Phosphide MEMS Cantilever Resonator

    E-Print Network [OSTI]

    Rubloff, Gary W.

    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 18, NO. 1, FEBRUARY 2009 103 Indium Phosphide MEMS, microelectromechanical system (MEMS) cantilevers, pentacene, III­V MEMS. I. INTRODUCTION THE NEED to monitor. Fan, N. Goldsman, and R. Ghodssi are with the MEMS Sensors and Actuators Laboratory, Department

  15. IEEE SENSORS JOURNAL, VOL. 3, NO. 5, OCTOBER 2003 595 Active Structural Error Suppression in MEMS

    E-Print Network [OSTI]

    Chen, Zhongping

    -run perturbations are presented. Index Terms--Error suppression, microelectromechanical sys- tems (MEMS), rate integrating gyroscopes, smart MEMS. I. INTRODUCTION AS MICROELECTROMECHANICAL systems (MEMS) inertial sensorsIEEE SENSORS JOURNAL, VOL. 3, NO. 5, OCTOBER 2003 595 Active Structural Error Suppression in MEMS

  16. MEMS-reconfigurable metamaterials and antenna applications

    E-Print Network [OSTI]

    Debogovic, Tomislav

    2014-01-01

    This paper reviews some of our contributions to reconfigurable metamaterials, where dynamic control is enabled by micro-electro-mechanical systems (MEMS) technology. First, we show reconfigurable composite right/left handed transmission lines (CRLH-TLs) having state of the art phase velocity variation and loss, thereby enabling efficient reconfigurable phase shifters and leaky-wave antennas (LWA). Second, we present very low loss metasurface designs with reconfigurable reflection properties, applicable in reflectarrays and partially reflective surface (PRS) antennas. All the presented devices have been fabricated and experimentally validated. They operate in X- and Ku-bands.

  17. High fidelity frictional models for MEMS.

    SciTech Connect (OSTI)

    Carpick, Robert W. (University of Wisconsin, Madison, WI); Reedy, Earl David, Jr.; Bitsie, Fernando; de Boer, Maarten Pieter; Corwin, Alex David; Ashurst, William Robert (Auburn University, Auburn, AL); Jones, Reese E.; Subhash, Ghatu S. (Michigan Technological Institute, Houghton, MI); Street, Mark D. (University of Wisconsin, Madison, WI); Sumali, Anton Hartono; Antoun, Bonnie R.; Starr, Michael James; Redmond, James Michael; Flater, Erin E. (University of Wisconsin, Madison, WI)

    2004-10-01

    The primary goals of the present study are to: (1) determine how and why MEMS-scale friction differs from friction on the macro-scale, and (2) to begin to develop a capability to perform finite element simulations of MEMS materials and components that accurately predicts response in the presence of adhesion and friction. Regarding the first goal, a newly developed nanotractor actuator was used to measure friction between molecular monolayer-coated, polysilicon surfaces. Amontons law does indeed apply over a wide range of forces. However, at low loads, which are of relevance to MEMS, there is an important adhesive contribution to the normal load that cannot be neglected. More importantly, we found that at short sliding distances, the concept of a coefficient of friction is not relevant; rather, one must invoke the notion of 'pre-sliding tangential deflections' (PSTD). Results of a simple 2-D model suggests that PSTD is a cascade of small-scale slips with a roughly constant number of contacts equilibrating the applied normal load. Regarding the second goal, an Adhesion Model and a Junction Model have been implemented in PRESTO, Sandia's transient dynamics, finite element code to enable asperity-level simulations. The Junction Model includes a tangential shear traction that opposes the relative tangential motion of contacting surfaces. An atomic force microscope (AFM)-based method was used to measure nano-scale, single asperity friction forces as a function of normal force. This data is used to determine Junction Model parameters. An illustrative simulation demonstrates the use of the Junction Model in conjunction with a mesh generated directly from an atomic force microscope (AFM) image to directly predict frictional response of a sliding asperity. Also with regards to the second goal, grid-level, homogenized models were studied. One would like to perform a finite element analysis of a MEMS component assuming nominally flat surfaces and to include the effect of roughness in such an analysis by using a homogenized contact and friction models. AFM measurements were made to determine statistical information on polysilicon surfaces with different roughnesses, and this data was used as input to a homogenized, multi-asperity contact model (the classical Greenwood and Williamson model). Extensions of the Greenwood and Williamson model are also discussed: one incorporates the effect of adhesion while the other modifies the theory so that it applies to the case of relatively few contacting asperities.

  18. Metal MEMS Devices | GE Global Research

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantity ofkandz-cm11 Outreach Home Room NewsInformationJesse BergkampCentermillionStockpile Stewardship NationalMEMS: Inside the Global

  19. Numerical Study of the Impact of Vibration Localization on the Motional Resistance of Weakly Coupled MEMS Resonators

    E-Print Network [OSTI]

    Erbes, Andreja; Thiruvenkatanathan, Pradyumna; Woodhouse, Jim; Seshia, Ashwin A.

    2014-12-04

    resonators and CMOS circuits for low power wireless communications and timing applications. Pradyumna Thiruvenkatanathan received his B.E. in Electrical and electronics engineering from Anna University, Chennai, India in 2006, the M.Phil in Micro... normalized internal coupling ? > 10?2. Keywords—Mechanical coupling, motional resistance, vibration localization, mode localization, MEMS resonators. I. INTRODUCTION The demand for high performance and reduced size wireless communication devices has pushed...

  20. Photonic MEMS for NIR in-situ

    SciTech Connect (OSTI)

    Bond, T C; Cole, G D; Goddard, L L; Behymer, E

    2007-07-03

    We report on a novel sensing technique combining photonics and microelectromechanical systems (MEMS) for the detection and monitoring of gas emissions for critical environmental, medical, and industrial applications. We discuss how MEMS-tunable vertical-cavity surface-emitting lasers (VCSELs) can be exploited for in-situ detection and NIR spectroscopy of several gases, such as O{sub 2}, N{sub 2}O, CO{sub x}, CH{sub 4}, HF, HCl, etc., with estimated sensitivities between 0.1 and 20 ppm on footprints {approx}10{sup -3} mm{sup 3}. The VCSELs can be electrostatically tuned with a continuous wavelength shift up to 20 nm, allowing for unambiguous NIR signature determination. Selective concentration analysis in heterogeneous gas compositions is enabled, thus paving the way to an integrated optical platform for multiplexed gas identification by bandgap and device engineering. We will discuss here, in particular, our efforts on the development of a 760 nm AlGaAs based tunable VCSEL for O{sub 2} detection.

  1. The Sandia MEMS passive shock sensor : FY07 maturation activities.

    SciTech Connect (OSTI)

    Houston, Jack E.; Blecke, Jill; Mitchell, John Anthony; Wittwer, Jonathan W.; Crowson, Douglas A.; Clemens, Rebecca C.; Walraven, Jeremy Allen; Epp, David S.; Baker, Michael Sean

    2008-08-01

    This report describes activities conducted in FY07 to mature the MEMS passive shock sensor. The first chapter of the report provides motivation and background on activities that are described in detail in later chapters. The second chapter discusses concepts that are important for integrating the MEMS passive shock sensor into a system. Following these two introductory chapters, the report details modeling and design efforts, packaging, failure analysis and testing and validation. At the end of FY07, the MEMS passive shock sensor was at TRL 4.

  2. Superhydrophobic Surface Coatings for Microfluidics and MEMs.

    SciTech Connect (OSTI)

    Branson, Eric D.; Singh, Seema [Sandia National Laboratories, Livermore, CA] [Sandia National Laboratories, Livermore, CA; Houston, Jack E.; van Swol, Frank B.; Brinker, C. Jeffrey

    2006-11-01

    Low solid interfacial energy and fractally rough surface topography confer to Lotus plants superhydrophobic (SH) properties like high contact angles, rolling and bouncing of liquid droplets, and self-cleaning of particle contaminants. This project exploits the porous fractal structure of a novel, synthetic SH surface for aerosol collection, its self-cleaning properties for particle concentration, and its slippery nature 3 to enhance the performance of fluidic and MEMS devices. We propose to understand fundamentally the conditions needed to cause liquid droplets to roll rather than flow/slide on a surface and how this %22rolling transition%22 influences the boundary condition describing fluid flow in a pipe or micro-channel. Rolling of droplets is important for aerosol collection strategies because it allows trapped particles to be concentrated and transported in liquid droplets with no need for a pre-defined/micromachined fluidic architecture. The fluid/solid boundary condition is important because it governs flow resistance and rheology and establishes the fluid velocity profile. Although many research groups are exploring SH surfaces, our team is the first to unambiguously determine their effects on fluid flow and rheology. SH surfaces could impact all future SNL designs of collectors, fluidic devices, MEMS, and NEMS. Interfaced with inertial focusing aerosol collectors, SH surfaces would allow size-specific particle populations to be collected, concentrated, and transported to a fluidic interface without loss. In microfluidic systems, we expect to reduce the energy/power required to pump fluids and actuate MEMS. Plug-like (rather than parabolic) velocity profiles can greatly improve resolution of chip-based separations and enable unprecedented control of concentration profiles and residence times in fluidic-based micro-reactors. Patterned SH/hydrophilic channels could induce mixing in microchannels and enable development of microflow control elements. Acknowledgements This work was funded by Sandia National Laboratory's Laboratory Directed Research & Development program (LDRD). Some coating processes were conducted in the cleanroom facility located at the University of New Mexico's Center for High Technology Materials (CHTM). SEM images were performed at UNM's Center for Micro-Engineering on equipment funded by a NSF New Mexico EPSCoR grant. 4

  3. Reduced-order modeling of MEMS using modal basis functions

    E-Print Network [OSTI]

    Varghese, Mathew, 1973-

    2002-01-01

    The field of MEMS has matured significantly over the last two decades increasing in both complexity and level of integration. To keep up with the demands placed by these changes requires the development of computer-aided ...

  4. Characterization and modeling of polysilicon MEMS chemical-mechanical polishing

    E-Print Network [OSTI]

    Tang, Brian D. (Brian David), 1980-

    2004-01-01

    Heavily used in the manufacture of integrated circuits, chemical-mechanical polishing (CMP) is becoming an enabling technology for microelectromechanical systems (MEMS). To reliably use CMP in the manufacturing process, ...

  5. Magnetic machines and power electronics for power MEMS applications

    E-Print Network [OSTI]

    Das, Sauparna, 1979-

    2005-01-01

    This thesis presents the modeling, design, and characterization of microfabricated, surface-wound, permanent-magnet (PM) generators, and their power electronics, for use in Watt-level Power MEMS applications such as a ...

  6. Modeling and design of a MEMS piezoelectric vibration energy harvester

    E-Print Network [OSTI]

    Du Toit, Noël Eduard

    2005-01-01

    The modeling and design of MEMS-scale piezoelectric-based vibration energy harvesters (MPVEH) are presented. The work is motivated by the need for pervasive and limitless power for wireless sensor nodes that have application ...

  7. MemTable : contextual memory in group workspaces

    E-Print Network [OSTI]

    Hunter, Seth E

    2009-01-01

    This thesis presents the design and implementation of MemTable, an interactive touch table that supports co-located group meetings by capturing both digital and physical interactions in its memory. The goal of the project ...

  8. Multidisciplinary adaptive wireless communication systems: Reconfigurable MEMS integrated antennas &

    E-Print Network [OSTI]

    De Flaviis, Franco

    Multidisciplinary adaptive wireless communication systems: Reconfigurable MEMS integrated antennas of California, Irvine, USA Wireless communication systems with reconfigurability capabilities that can for the next generation communication scenarios. A communication system capable of changing its output

  9. Planarization techniques for MEMS: enabling new structures and enhancing manufacturability

    SciTech Connect (OSTI)

    Smith, J.H.

    1996-12-31

    Planarization techniques such as chemical-mechanical polishing (CMP) have emerged as enabling technologies for the manufacturing of multi- level metal interconnects used in high-density Integrated Circuits (IC). An overview of general planarization techniques for MicroElectroMechanical Systems (MEMS) and, in particular, the extension of CMP from sub-micron IC manufacturing to the fabrication of complex surface-micromachined MEMS will be presented. Planarization technique alleviates processing problems associated with fabrication of multi-level polysilicon structures, eliminates design constraints linked with non-planar topography, and provides an avenue for integrating different process technologies. The CMP process and present examples of the use of CMP in fabricating MEMS devices such as microengines, pressure sensors, and proof masses for accelerometers along with its use for monolithically integrating MEMS devices with microelectronics are presented.

  10. System architecture for mode-matching a MEMS gyroscope

    E-Print Network [OSTI]

    Wu, Henry, M. Eng. Massachusetts Institute of Technology

    2009-01-01

    MEMS gyroscopes are used to detect rotation rates and have enabled a variety of motion-based technologies in a range of industries. They are composed of micro-machined polysilicon structures that resonate and deflect when ...

  11. Control of a MEMS fast steering mirror for laser applications

    E-Print Network [OSTI]

    Lane, Joseph Kerivan

    2012-01-01

    A control system for a MEMS fast steering mirror is designed and implemented to accurately steer a laser beam. This document contains a characterization of important mirror characteristics and the full analysis of an analog ...

  12. GE MEMS for LTE Advanced Mobile Devices | GE Global Research

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    MEMS Switch Technology Demonstrates Performance Which Could Meet Demands for Next-Generation "True 4G" Mobile Devices Click to email this to a friend (Opens in new window) Share on...

  13. Thin Silicon MEMS Contact-Stress Sensor

    SciTech Connect (OSTI)

    Kotovsky, J; Tooker, A; Horsley, D

    2010-03-22

    This thin, MEMS contact-stress (CS) sensor continuously and accurately measures time-varying, solid interface loads in embedded systems over tens of thousands of load cycles. Unlike all other interface load sensors, the CS sensor is extremely thin (< 150 {micro}m), provides accurate, high-speed measurements, and exhibits good stability over time with no loss of calibration with load cycling. The silicon CS sensor, 5 mm{sup 2} and 65 {micro}m thick, has piezoresistive traces doped within a load-sensitive diaphragm. The novel package utilizes several layers of flexible polyimide to mechanically and electrically isolate the sensor from the environment, transmit normal applied loads to the diaphragm, and maintain uniform thickness. The CS sensors have a highly linear output in the load range tested (0-2.4 MPa) with an average accuracy of {+-} 1.5%.

  14. MEMS inertial sensors with integral rotation means.

    SciTech Connect (OSTI)

    Kohler, Stewart M.

    2003-09-01

    The state-of-the-art of inertial micro-sensors (gyroscopes and accelerometers) has advanced to the point where they are displacing the more traditional sensors in many size, power, and/or cost-sensitive applications. A factor limiting the range of application of inertial micro-sensors has been their relatively poor bias stability. The incorporation of an integral sensitive axis rotation capability would enable bias mitigation through proven techniques such as indexing, and foster the use of inertial micro-sensors in more accuracy-sensitive applications. Fabricating the integral rotation mechanism in MEMS technology would minimize the penalties associated with incorporation of this capability, and preserve the inherent advantages of inertial micro-sensors.

  15. Mechanics and tribology of MEMS materials.

    SciTech Connect (OSTI)

    Prasad, Somuri V.; Dugger, Michael Thomas; Boyce, Brad Lee; Buchheit, Thomas Edward

    2004-04-01

    Micromachines have the potential to significantly impact future weapon component designs as well as other defense, industrial, and consumer product applications. For both electroplated (LIGA) and surface micromachined (SMM) structural elements, the influence of processing on structure, and the resultant effects on material properties are not well understood. The behavior of dynamic interfaces in present as-fabricated microsystem materials is inadequate for most applications and the fundamental relationships between processing conditions and tribological behavior in these systems are not clearly defined. We intend to develop a basic understanding of deformation, fracture, and surface interactions responsible for friction and wear of microelectromechanical system (MEMS) materials. This will enable needed design flexibility for these devices, as well as strengthen our understanding of material behavior at the nanoscale. The goal of this project is to develop new capabilities for sub-microscale mechanical and tribological measurements, and to exercise these capabilities to investigate material behavior at this size scale.

  16. Testing MEM with Diquark and thermal Meson Correlation Functions

    E-Print Network [OSTI]

    I. Wetzorke; F. Karsch

    2000-11-03

    When applying the maximum entropy method (MEM) to the analysis of hadron correlation functions in QCD a central issue is to understand to what extent this method can distinguish bound states, resonances and continuum contributions to spectral functions. We discuss these issues by analyzing meson and diquark correlation functions at zero temperature as well as free quark anti-quark correlators. The latter test the applicability of MEM to high temperature QCD.

  17. Flat Is Not Dead: Current and Future Performance of Si-MEMS Quad Mass Gyro (QMG) System

    E-Print Network [OSTI]

    Chen, Zhongping

    /Honeywell MEMS gyroscope and the majority of MEMS gyroscopes in the consumer electronics and automotive the drift of Class I CVGs is to mount the MEMS IMU on a gimbaled platform, which reorients the sensors

  18. Design of a Class of Antennas Utilizing MEMS, EBG and Septum Polarizers including Near-field Coupling Analysis

    E-Print Network [OSTI]

    Kim, Ilkyu

    2012-01-01

    inverted-F antenna with an RF MEMS switch for the correctionP. G. Steeneken, “A Five-band MEMS Switched PIFA for MobileApplications to Reconfigurable MEMS Filters,” in IEEE MTT-S

  19. High linearity 1.5-2.5 GHz RF-MEMS and varactor diodes based tunable filters for wireless applications

    E-Print Network [OSTI]

    El-Tanani, Mohammed Ahmed

    2009-01-01

    5.2.3 RF-MEMS Tunable Capacitive Network . . . . . . . .5.3Wide-Bandwidth Miniaturized RF-MEMS Tun- ableApplications104 Appendix B RF MEMS Cantilever Fabrication

  20. MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes

    SciTech Connect (OSTI)

    TANNER,DANELLE M.; SMITH,NORMAN F.; IRWIN,LLOYD W.; EATON,WILLIAM P.; HELGESEN,KAREN SUE; CLEMENT,J. JOSEPH; MILLER,WILLIAM M.; MILLER,SAMUEL L.; DUGGER,MICHAEL T.; WALRAVEN,JEREMY A.; PETERSON,KENNETH A.

    2000-01-01

    The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.

  1. MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

    DOE Patents [OSTI]

    Chanchani, Rajen; Nordquist, Christopher; Olsson, Roy H; Peterson, Tracy C; Shul, Randy J; Ahlers, Catalina; Plut, Thomas A; Patrizi, Gary A

    2013-12-03

    In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.

  2. Integrated optical MEMS using through-wafer vias and bump-bonding.

    SciTech Connect (OSTI)

    McCormick, Frederick Bossert; Frederick, Scott K.

    2008-01-01

    This LDRD began as a three year program to integrate through-wafer vias, micro-mirrors and control electronics with high-voltage capability to yield a 64 by 64 array of individually controllable micro-mirrors on 125 or 250 micron pitch with piston, tip and tilt movement. The effort was a mix of R&D and application. Care was taken to create SUMMiT{trademark} (Sandia's ultraplanar, multilevel MEMS technology) compatible via and mirror processes, and the ultimate goal was to mate this MEMS fabrication product to a complementary metal-oxide semiconductor (CMOS) electronics substrate. Significant progress was made on the via and mirror fabrication and design, the attach process development as well as the electronics high voltage (30 volt) and control designs. After approximately 22 months, the program was ready to proceed with fabrication and integration of the electronics, final mirror array, and through wafer vias to create a high resolution OMEMS array with individual mirror electronic control. At this point, however, mission alignment and budget constraints reduced the last year program funding and redirected the program to help support the through-silicon via work in the Hyper-Temporal Sensors (HTS) Grand Challenge (GC) LDRD. Several months of investigation and discussion with the HTS team resulted in a revised plan for the remaining 10 months of the program. We planned to build a capability in finer-pitched via fabrication on thinned substrates along with metallization schemes and bonding techniques for very large arrays of high density interconnects (up to 2000 x 2000 vias). Through this program, Sandia was able to build capability in several different conductive through wafer via processes using internal and external resources, MEMS mirror design and fabrication, various bonding techniques for arrayed substrates, and arrayed electronics control design with high voltage capability.

  3. Design, fabrication and testing of a lateral self-cleaning MEMS switch

    E-Print Network [OSTI]

    Shi, Yong, 1965-

    2004-01-01

    A lateral contact MEMS switch has been developed to address the need for a long life cycle, low contact resistance RF switch. At the present time, there is no commercial MEMS switch that meets all the requirements. The ...

  4. A MEMS Thin Film AlN Supercritical Carbon Dioxide Valve

    E-Print Network [OSTI]

    Chen, Ya-Mei

    2011-01-01

    and T. K. Tang, “MEMS micro-valve for space applications”,of the fabricated thermal MEMS valve by Kim et al. [An electrostatically actuated gas valve with an s-shape film

  5. Performance and characterization of a MEMS-based device for alignment...

    Office of Scientific and Technical Information (OSTI)

    of a MEMS-based device for alignment and manipulation of x-ray nanofocusing optics Title: Performance and characterization of a MEMS-based device for alignment and...

  6. INTEGRATED MEMS STRUCTURES AND CMOS CIRCUITS FOR BIOELECTRONIC INTERFACE WITH SINGLE CELLS

    E-Print Network [OSTI]

    Maryland at College Park, University of

    INTEGRATED MEMS STRUCTURES AND CMOS CIRCUITS FOR BIOELECTRONIC INTERFACE WITH SINGLE CELLS N of Maryland, College Park, Maryland 20742, USA {smela,pabshire}@glue.umd.edu ABSTRACT We describe a bioMEMS

  7. Acoustic Bragg Reflectors for Q-Enhancement of Unreleased MEMS Resonators

    E-Print Network [OSTI]

    Wang, Wentao

    This work presents the design of acoustic Bragg reflectors (ABRs) for unreleased MEMS resonators through analysis and simulation. Two of the greatest challenges to the successful implementation of MEMS are those of packaging ...

  8. High performance RF MEMS metal-contact switches and switching networks

    E-Print Network [OSTI]

    Patel, Chirag D.; Patel, Chirag D.

    2012-01-01

    3.2.1 Switch Overview . . . . . . . . . . . . . . . . . . .MEMS Switch and Networks . . . . . . . . . . . . . . . . . .4.1 Switch Design . . . . . . . . . . . . . . . . . . 4.2

  9. Testing of Critical Features of Polysilicon MEMS

    SciTech Connect (OSTI)

    LAVAN,DAVID A.; BUCHHEIT,THOMAS E.

    1999-12-02

    The behavior of MEMS devices is limited by the strength of critical features such as thin ligaments, oxide cuts joining layers, pin joints and hinges. Devices fabricated at Sandia's Microelectronic Development Laboratory have been successfully tested to investigate these features. A series of measurements were performed on samples with gage lengths of 15 to 1000 microns, using conventional and tungsten coated samples as well as samples that include the critical features of standard components in the test section. Specimens have a freely moving pin joint on one end that anchors the sample to the silicon die to allow rotation to reduce effects of bending. Each sample is loaded in uniaxial tension by pulling laterally with a flat tipped diamond in a computer-controlled Nanoindenter. Load is calculated by resolving the measured lateral and normal forces into the applied tensile force and frictional losses. The specimen cross section and gage length dimensions were verified by measuring against a standard in the SEM. Multiple tests can be programmed at one time and performed without operator assistance allowing the collection of significant populations of data.

  10. Differentially-driven MEMS spatial light modulator

    DOE Patents [OSTI]

    Stappaerts, Eddy A.

    2004-09-14

    A MEMS SLM and an electrostatic actuator associated with a pixel in an SLM. The actuator has three electrodes: a lower electrode; an upper electrode fixed with respect to the lower electrode; and a center electrode suspended and actuable between the upper and lower electrodes. The center electrode is capable of resiliently-biasing to restore the center electrode to a non-actuated first equilibrium position, and a mirror is operably connected to the center electrode. A first voltage source provides a first bias voltage across the lower and center electrodes and a second voltage source provides a second bias voltage across the upper and center electrodes, with the first and second bias voltages determining the non-actuated first equilibrium position of the center electrode. A third voltage source provides a variable driver voltage across one of the lower/center and upper/center electrode pairs in series with the corresponding first or second bias voltage, to actuate the center electrode to a dynamic second equilibrium position.

  11. Novel Fabrication and Simple Hybridization of Exotic Material MEMS

    SciTech Connect (OSTI)

    Datskos, P.G.; Rajic, S.

    1999-11-13

    Work in materials other than silicon for MEMS applications has typically been restricted to metals and metal oxides instead of more ''exotic'' semiconductors. However, group III-V and II-VI semiconductors form a very important and versatile collection of material and electronic parameters available to the MEMS and MOEMS designer. With these materials, not only are the traditional mechanical material variables (thermal conductivity, thermal expansion, Young's modulus, etc.) available, but also chemical constituents can be varied in ternary and quaternary materials. This flexibility can be extremely important for both friction and chemical compatibility issues for MEMS. In addition, the ability to continually vary the bandgap energy can be particularly useful for many electronics and infrared detection applications. However, there are two major obstacles associated with alternate semiconductor material MEMS. The first issue is the actual fabrication of non-silicon devices and the second impediment is communicating with these novel devices. We will describe an essentially material independent fabrication method that is amenable to most group III-V and II-VI semiconductors. This technique uses a combination of non-traditional direct write precision fabrication processes such as diamond turning, ion milling, laser ablation, etc. This type of deterministic fabrication approach lends itself to an almost trivial assembly process. We will also describe in detail the mechanical, electrical, and optical self-aligning hybridization technique used for these alternate-material MEMS.

  12. Computation of Electrostatic Properties of 3D MEMS Structures

    E-Print Network [OSTI]

    N. Majumdar; S. Mukhopadhyay

    2006-04-05

    Micro-Electro-Mechanical Systems (MEMS) normally have fixed or moving structures with cross-sections of the order of microns ($\\mu m$) and lengths of the order of tens or hundreds of microns. These structures are often plates or array of thin beams which, owing to their smallness, can be moved or deflected easily through the application of low voltages. Since electrostatic forces play a very major role in maneuvering these devices, a thorough understanding of the electrostatic properties of these structures is of critical importance, especially in the design phase of MEMS. In many cases, the electrostatic analysis of MEMS is carried out using boundary element method (BEM), while the structural analysis is carried out using finite element method (FEM). In this paper, we focus on accurate electrostatic analysis of MEMS using BEM. In particular, we consider the problem of computing the charge distribution and capacitance of thin conducting plates relevant to the numerical simulation of MEMS. The reason behind the accuracy of the solver is the fact that it uses closed-form analytic expressions that are valid seamlessly throughout the physical domain for computing the influence coefficients. Thus, it is possible to avoid one of the most serious approximations of the BEM, namely, the assumption that the effect of a charge distributed over a boundary element can be approximated by charge located at the centroid of the element. Comparison with other results available in the literature seems to indicate that the present results are more accurate than the existing ones.

  13. The Impact of Emerging MEMS-Based Microsystems on US Defense Applications

    SciTech Connect (OSTI)

    STAPLE,BEVAN D.; JAKUBCZAK II,JEROME F.

    2000-01-20

    This paper examines the impact of inserting Micro-Electro-Mechanical Systems (MEMS) into US defense applications. As specific examples, the impacts of micro Inertial Measurement Units (IMUs), radio frequency MEMS (RF MEMS), and Micro-Opto-Electro-Mechanical Systems (MOEMS) to provide integrated intelligence, communication, and control to the defense infrastructure with increased affordability, functionality, and performance are highlighted.

  14. OPTO-ACOUSTIC OSCILLATOR USING SILICON MEMS OPTICAL MODULATOR Suresh Sridaran and Sunil A. Bhave

    E-Print Network [OSTI]

    Afshari, Ehsan

    is chosen for oscillation by the RF filter. The superior phase noise is due to the long energy storage timesOPTO-ACOUSTIC OSCILLATOR USING SILICON MEMS OPTICAL MODULATOR Suresh Sridaran and Sunil A. Bhave OxideMEMS Lab, Cornell University, Ithaca, NY, USA ABSTRACT We show operation of a silicon MEMS based

  15. ARTICLE IN PRESS BioMEMS: state-of-the-art in detection,

    E-Print Network [OSTI]

    Bashir, Rashid

    or Biological Micro-Electro-Mechanical Systems [BioMEMS]) have become increasingly prevalent and have found . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 1. Introduction and BioMEMS defined Since the inception of micro-electro-mechanical systemsARTICLE IN PRESS BioMEMS: state-of-the-art in detection, opportunities and prospects Rashid Bashir

  16. A System for Calibration and Reliability Testing of MEMS Devices Under Mechanical Stress

    E-Print Network [OSTI]

    Polian, Ilia

    ), University of Freiburg, Germany Abstract Microelectromechanical systems (MEMS) are employed in safety Introduction Microelectromechanical systems (MEMS) are em- ployed in safety-critical fields such as automotiveA System for Calibration and Reliability Testing of MEMS Devices Under Mechanical Stress S. Spinner

  17. Motivation Measuring Speedup Parallel Out of Mem Automation Introduction to High-Performance R

    E-Print Network [OSTI]

    Pudlo, Pierre

    Motivation Measuring Speedup Parallel Out of Mem Automation Introduction to High-Performance R Use-Performance R / UseR! 2008 Tutorial #12;Motivation Measuring Speedup Parallel Out of Mem Automation Motivation Speedup Parallel Out of Mem Automation Motivation cont. Roadmap: We will start by measuring how we

  18. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 16, NO. 5, OCTOBER 2007 1185 RF MEMS Sequentially Reconfigurable Sierpinski

    E-Print Network [OSTI]

    Tentzeris, Manos

    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 16, NO. 5, OCTOBER 2007 1185 RF MEMS Sequentially, RF microelectromechanical systems (RF MEMS), Sierpinski fractal antenna. I. INTRODUCTION THE RF microelectromechanical systems (RF MEMS) switches are quickly becoming a popular switching ele- ment among microwave

  19. MEM Project Guidelines revised 6/25/09 Master of Environmental Management

    E-Print Network [OSTI]

    MEM Project Guidelines revised 6/25/09 Master of Environmental Management Project Guidelines (MEM) degree is completion of a project. This element of the curriculum serves to integrate coursework and presents the results of the project to an appropriate audience. Project Committee: MEM students

  20. 3D MEMS Simulation Modeling Using Modified Nodal Analysis J. V. Clark, N. Zhou, D. Bindel,

    E-Print Network [OSTI]

    California at Berkeley, University of

    3D MEMS Simulation Modeling Using Modified Nodal Analysis J. V. Clark, N. Zhou, D. Bindel, L, and experimental verification of several MEMS devices are presented. Simulated results include 3D mode analysis. To simulate the performance of these MEMS devices a modified nodal analysis approach is used to formulate

  1. MEMS Deformable Mirrors for Astronomical Adaptive Optics S.A. Cornelissen1

    E-Print Network [OSTI]

    Bifano, Thomas

    on the development of high actuator count, micro-electromechanical (MEMS) deformable mirrors designed for high order Microelectromechanical systems (MEMS) based deformable mirrors (DMs) are an emerging class of wavefront correctors usedMEMS Deformable Mirrors for Astronomical Adaptive Optics S.A. Cornelissen1 , A.L. Hartzell1 , J

  2. MEMS Needle-type Sensor Array for in Situ Measurements of Dissolved

    E-Print Network [OSTI]

    Papautsky, Ian

    a multisensor device (1, 5, 16-18). Microelectromechanical systems (MEMS) technologies permit the integrationMEMS Needle-type Sensor Array for in Situ Measurements of Dissolved Oxygen and Redox Potential J I systems (MEMS) technologies. The MEA exhibits fast response times for both DO and ORP measurements

  3. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 22, NO. 6, DECEMBER 2013 1257 What is MEMS Gyrocompassing? Comparative

    E-Print Network [OSTI]

    Chen, Zhongping

    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 22, NO. 6, DECEMBER 2013 1257 What is MEMS an in-house developed vibratory silicon MEMS quadruple mass gyroscope (QMG). We instru- mented a vacuum a simple turn table, but requires calibration due to temperature-induced drifts. [2012-0378] Index Terms--MEMS

  4. CEE 812 Structural Engineering Seminar Series A Family of MEMS Sensors

    E-Print Network [OSTI]

    Kamat, Vineet R.

    CEE 812 ­ Structural Engineering Seminar Series A Family of MEMS Sensors for Redundant Structural multiple MEMS sensors on the same package tackles several limitations of the SHM methods such as the need wave problem, nonlinear ultrasonics for stress measurement of thick plates, MEMS sensors for multi-sensor

  5. UNIVERSITY OF CALGARY Integration of WiFi and MEMS Sensors for Indoor Navigation

    E-Print Network [OSTI]

    Calgary, University of

    UNIVERSITY OF CALGARY Integration of WiFi and MEMS Sensors for Indoor Navigation by Yuan Zhuang of MEMS sensors and WiFi offer an efficient integration for indoor navigation applications. Two automatic-coupled) integration and TC (Tightly-coupled) integration are implemented for WiFi and MEMS sensors to further limit

  6. Effect of cubic nonlinearity on auto-parametrically amplified resonant MEMS mass sensor

    E-Print Network [OSTI]

    Effect of cubic nonlinearity on auto-parametrically amplified resonant MEMS mass sensor Wenhua. Keywords: Mass sensor; Chemical sensor; Nonlinearity; Parametric resonance; Damping; Mathieu equation; MEMS detection [10­12], etc. cantilever-based MEMS sensors have been utilized. Micro- scale oscillators

  7. Origami-like Folded MEMS for Realization of TIMU: Fabrication Technology and Initial

    E-Print Network [OSTI]

    Chen, Zhongping

    single-axis sensors and then folding them into a 3-D Fig. 1. Commercial MEMS IMUs Performance Fig. 2 for assembly of the integrated MEMS sensor cluster in a 3-D configuration, or folding in a 3-D shape. FoldedOrigami-like Folded MEMS for Realization of TIMU: Fabrication Technology and Initial Demonstration

  8. Bio-inspired MEMS Pressure and Flow Sensors for Underwater Navigation and Object Imaging "

    E-Print Network [OSTI]

    Bio-inspired MEMS Pressure and Flow Sensors for Underwater Navigation and Object Imaging " MIT. - A. G. P. Kottapalli et. al., "Liquid crystal polymer membrane MEMS sensor for flow rate and flow for waterproofing. Fabrication Kayak Testing Commercial Sensors (Reference) MEMS Sensor When mounted on the side

  9. Nondestructive Monitoring of a Pipe Network using a MEMS-Based Wireless Network

    E-Print Network [OSTI]

    Shinozuka, Masanobu

    , MEMS sensors, ruptures, wireless sensor network 1. INTRODUCTION Pressurized pipeline systems-electro-mechanical systems (MEMS)-based wireless sensor network (WSN). It is composed of sensing nodes, each of which for data uplink. A sensor board is equipped with MEMS accelerometers for measuring vibration

  10. > REPLACE THIS LINE WITH YOUR PAPER IDENTIFICATION NUMBER (DOUBLE-CLICK HERE TO EDIT) MEMS Switches

    E-Print Network [OSTI]

    De Flaviis, Franco

    Monolithic Integration of RF MEMS Switches With a Diversity Antenna on PCB Substrate B. A. Cetiner, J. Y integration of RF MEMS switches with three-dimensional (3-D) antenna elements on a microwave laminate printed applications. A two- element diversity antenna system monolithically integrated with RF MEMS switches

  11. Development of a 4096 Element MEMS Continuous Membrane Deformable Mirror for High Contrast

    E-Print Network [OSTI]

    Bifano, Thomas

    Development of a 4096 Element MEMS Continuous Membrane Deformable Mirror for High Contrast star. This surface micromachined MEMS deformable mirror will have an active aperture of 25.2mm developed for commercially available 1024 and 140 element MEMS deformable mirrors to achieve unprecedented

  12. MEMS Deformable Mirror Actuators with Enhanced Reliability S.A. Cornelissena

    E-Print Network [OSTI]

    Bifano, Thomas

    MEMS Deformable Mirror Actuators with Enhanced Reliability S.A. Cornelissena , T.G. Bifanoa,b , P, 15 St. Mary's St., Boston, MA 02215 ABSTRACT MEMS deformable mirrors with thousands of actuators due to electrical overstress. We report on advances made in the development of MEMS deformable mirror

  13. Modeling and Design of RF MEMS Structures Using Computationally Efficient Numerical Techniques

    E-Print Network [OSTI]

    Tentzeris, Manos

    Modeling and Design of RF MEMS Structures Using Computationally Efficient Numerical Techniques N. A Abstract The modeling of MEMS structures using MRTD is presented. Many complex RF structures have been communication systems efficiently and accurately. Specifically, micromachined structures such as MEMS

  14. Requirements for MEMS Mirrors for Adaptive Optics in the Elizabeth Daly, Eugenie Dalimier and Chris Dainty

    E-Print Network [OSTI]

    Dainty, Chris

    Requirements for MEMS Mirrors for Adaptive Optics in the Eye Elizabeth Daly, Eugenie Dalimier, Galway, Ireland. ABSTRACT MEMS is one of several emerging technologies for fabricating wavefront mirrors, including a 12x12 MEMS device. The key point is that it is the effectiveness of each actuator

  15. Processor-Embedded Distributed MEMS-Based Storage Systems for High-Performance I/O

    E-Print Network [OSTI]

    Processor-Embedded Distributed MEMS-Based Storage Systems for High-Performance I/O Steve C. Chiu new data organization and access character- istics, MEMS-based storage devices have come under con production, MEMS-based storage devices have outperformed disks in device-level simulations. Processor

  16. Rapid Earthquake Characterization Using MEMS Accelerometers and Volunteer Hosts Following the M 7.2 Darfield,

    E-Print Network [OSTI]

    Allen, Richard M.

    Rapid Earthquake Characterization Using MEMS Accelerometers and Volunteer Hosts Following the M 7. Small low-cost ($30­$3000) microelectrome- chanical systems (MEMS) triaxial sensors provide ground of cyber-social-seismic network. In the QCN architecture, MEMS sensors are con- nected directly

  17. MN 555 MEMS: Fabrication and Materials Spring 2004 Department of Manufacturing Engineering

    E-Print Network [OSTI]

    Lin, Xi

    MN 555 MEMS: Fabrication and Materials Spring 2004 Instructor Xin Zhang Department of Manufacturing meetings by appointment) 2003-2004 Catalog Data: MN 555 MEMS: Fabrication and Materials This course will explore the world of microelectromechanical devices and systems (MEMS). This requires an awareness

  18. MEMS-based Disk Buffer for Streaming Media Servers Raju Rangaswami

    E-Print Network [OSTI]

    Rangaswami, Raju

    MEMS-based Disk Buffer for Streaming Media Servers Raju Rangaswami raju@cs.ucsb.edu Zoran of large DRAM buffers to im- prove the overall streaming throughput. MEMS-based stor- age is an exciting on the class of streaming media applications. We evaluate the use of MEMS-based storage for buffering

  19. Designing Computer Systems With MEMS-based Storage Steven W. Schlosser, John Linwood Grin,

    E-Print Network [OSTI]

    Designing Computer Systems With MEMS-based Storage Steven W. Schlosser, John Linwood GriÆn, David F architects. An exciting new storage technology based on microelectromechanical systems (MEMS) is poised many new classes of applications. This research explores the impact that several di#11;erent MEMS

  20. Modeling of Large Scale RF-MEMS Circuits Using Efficient Time-Domain Techniques

    E-Print Network [OSTI]

    Tentzeris, Manos

    Modeling of Large Scale RF-MEMS Circuits Using Efficient Time-Domain Techniques N. Bushyager, E Engineering Georgia Institute of Technology Atlanta, GA 30332-0250, USA Abstract RF-MEMS design is made difficult due to the lack of tools capable of simulating both MEMS devices and their surrounding circuits

  1. MEMS Design Synthesis Based on Hybrid Evolutionary Computation B.S. (Tongji University, Shanghai) 1995

    E-Print Network [OSTI]

    Agogino, Alice M.

    MEMS Design Synthesis Based on Hybrid Evolutionary Computation by Ying Zhang B.S. (Tongji is approved: Chair Date Date Date Date University of California, Berkeley Fall 2006 #12;MEMS Design Synthesis Based on Hybrid Evolutionary Computation © 2006 by Ying Zhang #12;1 Abstract MEMS Design Synthesis Based

  2. MEMS Design Synthesis: Integrating Case-based Reasoning and Multi-objective Genetic Algorithms

    E-Print Network [OSTI]

    Agogino, Alice M.

    MEMS Design Synthesis: Integrating Case-based Reasoning and Multi-objective Genetic Algorithms-Electro-Mechanical Systems (MEMS) design tool that uses a multi-objective genetic algorithm (MOGA) to synthesize and optimize conceptual designs. CBR utilizes previously successful MEMS designs and sub-assemblies as building blocks

  3. Ferroelectric PZT RF MEMS Resonators Jeffrey S. Pulskamp, Sarah S. Bedair, Ronald G.

    E-Print Network [OSTI]

    Afshari, Ehsan

    Ferroelectric PZT RF MEMS Resonators Jeffrey S. Pulskamp, Sarah S. Bedair, Ronald G. Polcawich- piezoelectric lead zirconate titanate (PZT) RF MEMS resonators. Several research topics are introduced including (~117dB) parallel resonant mode with DC bias tunable rejection, a MEMS support design for the mitigation

  4. Statistical Design and Optimization for Adaptive Post-silicon Tuning of MEMS Filters

    E-Print Network [OSTI]

    Li, Xin

    Statistical Design and Optimization for Adaptive Post-silicon Tuning of MEMS Filters Fa Wang, Gokce of microelectro-mechanical systems (MEMS) for RF (radio frequency) applications. In this paper we describe a novel technique of adaptive post-silicon tuning to reliably design MEMS filters that are robust to process

  5. Nonlocal Problems in MEMS Device Control J.A.Pelesko pelesko@math.gatech.edu

    E-Print Network [OSTI]

    Pelesko, John

    Nonlocal Problems in MEMS Device Control J.A.Pelesko pelesko@math.gatech.edu Georgia Institute the most ubiquitous phenomena associated with electrostati- cally actuated MEMS devices is the pull, a mathematical model of an idealized electrostatically actuated MEMS device is constructed for the purpose

  6. RF-MEMS Capacitive Series Switches of CPW & MSL Configurations for Reconfigurable Antenna Application

    E-Print Network [OSTI]

    De Flaviis, Franco

    RF-MEMS Capacitive Series Switches of CPW & MSL Configurations for Reconfigurable Antenna, University of California Irvine, Irvine, CA, 92697 Abstract: The air-bridged RF-MEMS switches in single pole) and coplanar waveguide (CPW) structures. RF-MEMS series switches are monolithic fabricated in both transmission

  7. SI-BASED UNRELEASED HYBRID MEMS-CMOS RESONATORS IN 32NM TECHNOLOGY

    E-Print Network [OSTI]

    Reif, Rafael

    SI-BASED UNRELEASED HYBRID MEMS-CMOS RESONATORS IN 32NM TECHNOLOGY Radhika Marathe*, Wentao Wang*, and Dana Weinstein HybridMEMS Lab, Massachusetts Institute of Technology, Cambridge, MA 02139, USA *authors before the presence of parasitics. This enables RF-MEMS resonators at orders of magnitude higher

  8. A 100 MHz MEMS SiBAR Phase Modulator for Quadrature Phase Shift Keying

    E-Print Network [OSTI]

    Ayazi, Farrokh

    A 100 MHz MEMS SiBAR Phase Modulator for Quadrature Phase Shift Keying Logan Sorenson and Farrokh of a MEMS resonator to form the basic component of a switchless quadrature phase shift keying (QPSK) scheme. INTRODUCTION In recent years, microelectromechanical systems (MEMS)- based solutions have gained acceptance

  9. Through-Wafer Interconnects for High Degree of Freedom MEMS Deformable Mirrors

    E-Print Network [OSTI]

    Bifano, Thomas

    Through-Wafer Interconnects for High Degree of Freedom MEMS Deformable Mirrors Alioune Diouf 1 Spinelli Place, Cambridge, MA 02138 Abstract The development of an assembly and packaging process for MEMS University MEMS DMs are surface-micromachined polysilicon double-cantilever actuator architecture

  10. Wavelength selection in MEMS tunable vertical-cavity SOAs Garrett Cole1

    E-Print Network [OSTI]

    MacDonald, Noel C.

    Wavelength selection in MEMS tunable vertical-cavity SOAs Garrett Cole1 , Qi Chen2 , Staffan: gcole@engineering.ucsb.edu Abstract: We analyze the tuning characteristics of MEMS tunable vertical promising method is microelectromechanical (MEMS) tuning. In this case mechanical alteration of the resonant

  11. PHASE NOISE PERFORMANCE COMPARISON BETWEEN LIGA-MEMS AND ON-CHIP CMOS CAPACITORS

    E-Print Network [OSTI]

    Saskatchewan, University of

    PHASE NOISE PERFORMANCE COMPARISON BETWEEN LIGA-MEMS AND ON-CHIP CMOS CAPACITORS FOR A VCO between the VCO using a new type of MEMS vari- able capacitor and that using conventional CMOS varactor, which is built on-chip together with the CMOS VCO. A representative MEMS variable capacitor, fabricated

  12. Modeling and Scheduling of MEMS-Based Storage Devices John Linwood Grin, Steven W. Schlosser,

    E-Print Network [OSTI]

    Modeling and Scheduling of MEMS-Based Storage Devices John Linwood GriÆn, Steven W. Schlosser University Pittsburgh, PA 15213 Abstract MEMS-based storage devices are seen by many as promising replacements for disk drives. Fabricated on CMOS, MEMS-based storage uses thousands of small, mechanical probe

  13. Nonlocal Problems in MEMS Device Control J.A. Pelesko* and A.A. Triolo**

    E-Print Network [OSTI]

    Pelesko, John

    Nonlocal Problems in MEMS Device Control J.A. Pelesko* and A.A. Triolo** *Georgia Institute associated with electrostaticallyactuated MEMS devices is the pull- in" voltage instability electrostatically actuated MEMS device is constructed for the purpose of analyzingvarious schemes proposed

  14. Modeling and Optimization of RF-MEMS Reconfigurable Tuners with Computationally Efficient Time-Domain Techniques

    E-Print Network [OSTI]

    Tentzeris, Manos

    Modeling and Optimization of RF-MEMS Reconfigurable Tuners with Computationally Efficient Time of Technology, Atlanta, GA 30332 2 Raytheon Company, Tucson AZ, 85734 Abstract -- Modern RF-MEMS device design methods in which the FDTD technique can be used to model a reconfigurable RF-MEMS tuner. A new method

  15. How much power from MEMS windmills? January 20, 2014 // Peter Clarke

    E-Print Network [OSTI]

    Chiao, Jung-Chih

    How much power from MEMS windmills? January 20, 2014 // Peter Clarke A University of Texas Arlington research team has enjoyed considerable publicity for its development of a MEMS windmill of the photographs or the Youtube video of the prototype MEMS windmill, is any electrical wiring. Similarly

  16. Identification of Residual Stress State in an RF-MEMS Device

    E-Print Network [OSTI]

    Espinosa, Horacio D.

    Identification of Residual Stress State in an RF-MEMS Device l Horacio D. Espinosa, M. Fischer Dept Microelectromechanical Systems (MEMS) are among the most significant technological advances of this decade. The objective is of a few nanometers. The study of "thin films" and "ultra thin films" employed in MEMS devices is being

  17. Low Profile Packaging for MEMS Aero-acoustic Sensors John R. Burns1

    E-Print Network [OSTI]

    White, Robert D.

    Low Profile Packaging for MEMS Aero-acoustic Sensors John R. Burns1 , Robert D. White1 , and Joshua 02155 Abstract: This paper describes a semi-automated conductive ink process used for packaging MEMS devices. The method is applied to packaging of MEMS sensors for wind tunnel testing. The primary advantage

  18. Role of oxide thickening in fatigue crack initiation in LIGA nickel MEMS thin films

    E-Print Network [OSTI]

    Shan, Wanliang

    Role of oxide thickening in fatigue crack initiation in LIGA nickel MEMS thin films W.L. Shan a 2012 Accepted 16 October 2012 Available online 24 October 2012 Keywords: LIGA Ni MEMS thin films Oxide micro-electro-mechanical-systems (MEMS) structures. & 2012 Elsevier B.V. All rights reserved. 1

  19. Two-axis MEMS scanner with transfer-printed high-reflectivity, broadband monolithic silicon

    E-Print Network [OSTI]

    Rogers, John A.

    Two-axis MEMS scanner with transfer-printed high-reflectivity, broadband monolithic silicon@illinois.edu Abstract: We present a two-axis electrostatic MEMS scanner with high- reflectivity monolithic. The reflective surfaces of the MEMS scanner are transfer-printed PC mirrors with low polarization dependence, low

  20. Non-autonomous saddle-node bifurcation in a canonical electrostatic MEMS

    E-Print Network [OSTI]

    Arias, Cristina M.

    Non-autonomous saddle-node bifurcation in a canonical electrostatic MEMS Alexander Gutiérrez of electrostatically actuated micro-electro-mechanical system (MEMS) by means of classical topological techniques like of electrostatically actuated micro-electro-mechanical system (MEMS) which has become canonical in the related

  1. System-Level Synthesis of MEMS via Genetic Programming and Bond Graphs

    E-Print Network [OSTI]

    Hu, Jianjun

    System-Level Synthesis of MEMS via Genetic Programming and Bond Graphs Zhun Fan+ , Kisung Seo for automatic synthesis of MEMS system-level lumped parameter models using genetic programming and bond graphs. This paper first dis- cusses the necessity of narrowing the problem of MEMS synthesis into a certain specific

  2. Reliability of Capacitive RF MEMS Switches at High and Low Temperatures

    E-Print Network [OSTI]

    Espinosa, Horacio D.

    Reliability of Capacitive RF MEMS Switches at High and Low Temperatures Yong Zhu, Horacio D 60208-3111 Received 1 September 2003; accepted 24 February 2003 ABSTRACT: Some applications of RF MEMS temperatures in the range 60°C to 100°C are envisioned. The basic operation of a capacitive MEMS switch

  3. Low Cost RF MEMS Switches Fabricated on Microwave Laminate Printed Circuit Boards

    E-Print Network [OSTI]

    De Flaviis, Franco

    1 Low Cost RF MEMS Switches Fabricated on Microwave Laminate Printed Circuit Boards Hung-Pin Chang process for directly constructing RF MEMS capacitive switches has been developed on microwave laminate among components. Index Terms--RF MEMS switches, compressive molding planarization, high density

  4. Towards Understanding Architectural Tradeoffs in MEMS Closed-Loop Feedback Control

    E-Print Network [OSTI]

    Sherwood, Tim

    Towards Understanding Architectural Tradeoffs in MEMS Closed-Loop Feedback Control Greg Hoover, California 93106 sherwood@cs.ucsb.edu ABSTRACT Micro-Electro-Mechanical Systems (MEMS) combine litho on the scale of microns. However, the physical scale of MEMS devices can make controlling them computationally

  5. Tuning of MEMS devices using Evolutionary Computation and Open-Loop Frequency Response.

    E-Print Network [OSTI]

    Arizona, University of

    1 Tuning of MEMS devices using Evolutionary Computation and Open-Loop Frequency Response. Didier.keymeulen@jpl.nasa.gov Abstract-- 12 We propose a tuning method for MEMS gyroscopes based on evolutionary computation that has the capacity to efficiently increase the sensitivity of MEMS gyroscopes through tuning and, furthermore

  6. 2/3/2014 How much power from MEMS windmills? -Electronics Eetimes http://www.electronics-eetimes.com/en/how-much-power-from-mems-windmills-63.html?cmp_id=7&news_id=222919711 1/4

    E-Print Network [OSTI]

    Chiao, Jung-Chih

    2/3/2014 How much power from MEMS windmills? - Electronics Eetimes http://www.electronics-eetimes.com/en/how-much-power-from-mems-windmills 2014? Five lessons from Lenovo's Motorola deal How much power from MEMS windmills? January 20, 2014 development of a MEMS windmill that the developers have said could, when produced in array, provide energy

  7. Chemical-mechanical polishing: Enhancing the manufacturability of MEMS

    SciTech Connect (OSTI)

    Sniegowski, J.J.

    1996-10-01

    The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi-level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in Micro Electro Mechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. Thus, the CMP planarization technique alleviates processing problems associated with fabrication of multi-level polysilicon structures, eliminates design constraints linked with non-planar topography, and provides an avenue for integrating different process technologies. Examples of these enhancements include: an simpler extension of surface micromachining fabrication to multiple mechanical layers, a novel method of monolithic integration of electronics and MEMS, and a novel combination of bulk and surface micromachining.

  8. MEMS: A new approach to micro-optics

    SciTech Connect (OSTI)

    Sniegowski, J.J.

    1997-12-31

    MicroElectroMechanical Systems (MEMS) and their fabrication technologies provide great opportunities for application to micro-optical systems (MOEMS). Implementing MOEMS technology ranges from simple, passive components to complicated, active systems. Here, an overview of polysilicon surface micromachining MEMS combined with optics is presented. Recent advancements to the technology, which may enhance its appeal for micro-optics applications are emphasized. Of all the MEMS fabrication technologies, polysilicon surface micromachining technology has the greatest basis in and leverages the most the infrastructure for silicon integrated circuit fabrication. In that respect, it provides the potential for very large volume, inexpensive production of MOEMS. This paper highlights polysilicon surface micromachining technology in regards to its capability to provide both passive and active mechanical elements with quality optical elements.

  9. SAMPLE (Sandia Agile MEMS Prototyping, Layout tools, and Education)

    SciTech Connect (OSTI)

    Davies, B.R.; Barron, C.C.; Sniegowski, J.J.; Rodgers, M.S.

    1997-08-01

    The SAMPLE (Sandia Agile MEMS Protyping, Layout tools, and Education) service makes Sandia`s state-of-the-art surface-micromachining fabrication process, known as SUMMiT, available to US industry for the first time. The service provides a short cause and customized computer-aided design (CAD) tools to assist customers in designing micromachine prototypes to be fabricated in SUMMiT. Frequent small-scale manufacturing runs then provide SAMPLE designers with hundreds of sophisticated MEMS (MicroElectroMechanical Systems) chips. SUMMiT (Sandia Ultra-planar, Multi-level MEMS Technology) offers unique surface-micromachining capabilities, including four levels of polycrystalline silicon (including the ground layer), flanged hubs, substrate contacts, one-micron design rules, and chemical-mechanical polishing (CMP) planarization. This paper describes the SUMMiT process, design tools, and other information relevant to the SAMPLE service and SUMMiT process.

  10. Finite Element Modeling of Micromachined MEMS Photon Devices

    SciTech Connect (OSTI)

    Datskos, P.G.; Evans, B.M.; Schonberger, D.

    1999-09-20

    The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness.

  11. 332 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 51, NO. 1, JANUARY 2003 Monolithic Integration of RF MEMS Switches

    E-Print Network [OSTI]

    Cetiner, Bedri A.

    Integration of RF MEMS Switches With a Diversity Antenna on PCB Substrate B. A. Cetiner, Member, IEEE, J. Y integration of RF mi- croelectromechanical system (MEMS) switches with three-dimen- sional antenna elements with RF MEMS switches is designed and demonstrated. Index Terms--RF microelectromechanical system (MEMS

  12. MEMS/NEMS Design Automation and Synthesis Annual Report for NSF Grant # CCR-DES/CC-0306557

    E-Print Network [OSTI]

    Agogino, Alice M.

    1 MEMS/NEMS Design Automation and Synthesis Annual Report for NSF Grant # CCR-DES/CC-0306557 (2004: The goal of the project is to extend the existing SUGAR MEMS simulator into a design synthesis tool that supports the early stages of MEMS/NEMS conceptual design. We are developing a broad base of MEMS building

  13. MEMS/NEMS Design Automation and Synthesis Annual Report for NSF Grant # CCR-DES/CC-0306557

    E-Print Network [OSTI]

    Agogino, Alice M.

    1 MEMS/NEMS Design Automation and Synthesis Annual Report for NSF Grant # CCR-DES/CC-0306557 (2005: The goal of the project is to extend the existing SUGAR MEMS simulator into a design synthesis tool that supports the early stages of MEMS/NEMS conceptual design. We are developing a broad base of MEMS building

  14. Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers

    E-Print Network [OSTI]

    Z. Szucs; G. Nagy; S. Hodossy; M. Rencz; A. Poppe

    2008-01-07

    In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for Reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME - DED. Twenty thermal cycles of combined Temperature Cycle Test and Fatigue Vibration Test has been carried out on 5 samples. Statistical evaluation of the test results showed that degradation has started in 3 out of the 5 samples.

  15. APPLICATION OF MILLISECOND PULSED LASER WELDING IN MEMS P. Bozorgi*

    E-Print Network [OSTI]

    MacDonald, Noel C.

    APPLICATION OF MILLISECOND PULSED LASER WELDING IN MEMS PACKAGING P. Bozorgi* , C.B. Burgner, Z:YAG pulsed laser is used as a localized heating source to micro-weld a 350 µm titanium cap to the substrate distortion of the welding, several geometries at the cap and substrate interface were investigated

  16. Rehabilitation program faculty mem-bers Chow Lam, Patrick Corrigan,

    E-Print Network [OSTI]

    Heller, Barbara

    Rehabilitation program faculty mem- bers Chow Lam, Patrick Corrigan, and Jon Larson, and Institute in rehabilitation and education. There are very few universities in China that offer studies on rehabili- tation psychology, and Lam believes IIT's MOU with CAS and his efforts in training future rehabilitation pro

  17. Enhanced Performance of Micro-Electro-Mechanical-Systems (MEMS) Microbial

    E-Print Network [OSTI]

    Cincinnati, University of

    the energy-climate cri- sis and environmental pollution, microbial fuel cells (MFCs) are a major focusEnhanced Performance of Micro-Electro- Mechanical-Systems (MEMS) Microbial Fuel Cells Using as a potential source for renewable energy production. A MFC can transform the chemical energy of bio- degradable

  18. Hidden Challenges to MEMS Commercialization: Design Realization and Reliability Assurance

    SciTech Connect (OSTI)

    McWhorter, P.J.; Miller, S.L.; Miller, W.M.; Rodger, M.S.; Yarberry, V.R.

    1999-01-20

    The successful commercialization of MicroElectroMechanical Systems (MEMS) is an essential prerequisite for their implementation in many critical government applications. Several unique challenges must be overcome to achieve this widespread commercialization. Challenges associated with design realization and reliability assurance are discussed, along with approaches taken by Sandia to successfully overcome these challenges.

  19. Characterization of a MEMS Accelerometer for Inertial Navigating Applications

    SciTech Connect (OSTI)

    Kinney, R.D.

    1999-02-12

    Inertial MEMS sensors such as accelerometers and angular rotation sensing devices continue to improve in performance as advances in design and processing are made. Present state-of-the-art accelerometers have achieved performance levels in the laboratory that are consistent with requirements for successful application in tactical weapon navigation systems. However, sensor performance parameters that are of interest to the designer of inertial navigation systems are frequently not adequately addressed by the MEMS manufacturer. This paper addresses the testing and characterization of a MEMS accelerometer from an inertial navigation perspective. The paper discusses test objectives, data reduction techniques and presents results from the test of a three-axis MEMS accelerometer conducted at Sandia National Laboratories during 1997. The test was structured to achieve visibility and characterization of the accelerometer bias and scale factor stability overtime and temperature. Sandia is a multi-program laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the US Department of Energy under contract DE-AC04-94AL85000.

  20. Piezoresistive and Piezoelectric MEMS Strain Sensors for Vibration Detection

    E-Print Network [OSTI]

    Horowitz, Roberto

    , vibration 1. INTRODUCTION Vibrations are a common phenomena of mechanical structures that can be detrimental vibrations of the structure. In this case, sensors are applied to the mechanical structure to be monitoredPiezoresistive and Piezoelectric MEMS Strain Sensors for Vibration Detection Stanley Kona, Kenn

  1. MEM imaging of multi-wavelength VLBA polarisation observations of Active Galactic Nuclei

    E-Print Network [OSTI]

    Coughlan, Colm P

    2013-01-01

    We have developed a C++ implementation of the Maximum Entropy Method (MEM) suitable for deconvolving VLBI polarisation data. The first results of this implementation are presented and compared with CLEAN-based deconvolutions of the same data. We present Faraday rotation measure and intrinsic polarisation maps of AGN which have been made from MEM deconvolutions of multi-wavelength observations of Stokes parameters I, Q and U. The advantages of using MEM are demonstrated, in particular its enhanced resolution over the CLEAN algorithm.

  2. Damage of MEMS thermal actuators heated by laser irradiation.

    SciTech Connect (OSTI)

    Walraven, Jeremy Allen; Klody, Kelly Anne; Sackos, John T.; Phinney, Leslie Mary

    2005-01-01

    Optical actuation of microelectromechanical systems (MEMS) is advantageous for applications for which electrical isolation is desired. Thirty-two polycrystalline silicon opto-thermal actuators, optically-powered MEMS thermal actuators, were designed, fabricated, and tested. The design of the opto-thermal actuators consists of a target for laser illumination suspended between angled legs that expand when heated, providing the displacement and force output. While the amount of displacement observed for the opto-thermal actuators was fairly uniform for the actuators, the amount of damage resulting from the laser heating ranged from essentially no damage to significant amounts of damage on the target. The likelihood of damage depended on the target design with two of the four target designs being more susceptible to damage. Failure analysis of damaged targets revealed the extent and depth of the damage.

  3. Damage of MEMS thermal actuators heated by laser irradiation.

    SciTech Connect (OSTI)

    Walraven, Jeremy Allen; Klody, Kelly Anne; Sackos, John T.; Phinney, Leslie Mary

    2004-11-01

    Optical actuation of microelectromechanical systems (MEMS) is advantageous for applications for which electrical isolation is desired. Thirty-two polycrystalline silicon opto-thermal actuators, optically-powered MEMS thermal actuators, were designed, fabricated, and tested. The design of the opto-thermal actuators consists of a target for laser illumination suspended between angled legs that expand when heated, providing the displacement and force output. While the amount of displacement observed for the opto-thermal actuators was fairly uniform for the actuators, the amount of damage resulting from the laser heating ranged from essentially no damage to significant amounts of damage on the target. The likelihood of damage depended on the target design with two of the four target designs being more susceptible to damage. Failure analysis of damaged targets revealed the extent and depth of the damage.

  4. Piston-Driven Fluid Ejectors In Silicon Mems

    DOE Patents [OSTI]

    Galambos, Paul C. (Albuquerque, NM); Benavides, Gilbert L. (Los Ranchos, NM); Jokiel, Jr., Bernhard (Albuquerque, NM); Jakubczak II, Jerome F. (Rio Rancho, NM)

    2005-05-03

    A surface-micromachined fluid-ejection apparatus is disclosed which utilizes a piston to provide for the ejection of jets or drops of a fluid (e.g. for ink-jet printing). The piston, which is located at least partially inside a fluid reservoir, is moveable into a cylindrical fluid-ejection chamber connected to the reservoir by a microelectromechanical (MEM) actuator which is located outside the reservoir. In this way, the reservoir and fluid-ejection chamber can be maintained as electric-field-free regions thereby allowing the apparatus to be used with fluids that are electrically conductive or which may react or break down in the presence of a high electric field. The MEM actuator can comprise either an electrostatic actuator or a thermal actuator.

  5. Atomic Calligraphy: The Direct Writing of Nanoscale Structures using MEMS

    E-Print Network [OSTI]

    Matthias Imboden; Han Han; Jackson Chang; Flavio Pardo; Cristian A. Bolle; Evan Lowell; David J. Bishop

    2013-04-04

    We present a micro-electromechanical system (MEMS) based method for the resist free patterning of nano-structures. Using a focused ion beam (FIB) to customize larger MEMS machines, we fabricate apertures as small as 50 nm on plates that can be moved with nanometer precision over an area greater than 20x20 {\\mu}m^2. Depositing thermally evaporated gold atoms though the apertures while moving the plate results in the deposition of nanoscale metal patterns. Adding a shutter only microns above the aperture, enables high speed control of not only where but also when atoms are deposited. Using a shutter, different sized apertures can be selectively opened and closed for nano-structure fabrication with features ranging from nano- to micrometers in scale. The ability to evaporate materials with high precision, and thereby fabricate circuits and structures in situ, enables new kinds of experiments based on the interactions of a small number of atoms and eventually even single atoms.

  6. Recent Developments in Mems-Based Micro Fuel Cells

    E-Print Network [OSTI]

    Pichonat, T

    2007-01-01

    Micro fuel cells ($\\mu$-FC) represent promising power sources for portable applications. Today, one of the technological ways to make $\\mu$-FC is to have recourse to standard microfabrication techniques used in the fabrication of micro electromechanical systems (MEMS). This paper shows an overview on the applications of MEMS techniques on miniature FC by presenting several solutions developed throughout the world. It also describes the latest developments of a new porous silicon-based miniature fuel cell. Using a silane grafted on an inorganic porous media as the proton-exchange membrane instead of a common ionomer such as Nafion, the fuel cell achieved a maximum power density of 58 mW cm-2 at room temperature with hydrogen as fuel.

  7. Broadband Terahertz Modulators based on MEMS-Reconfigurable Mesh Filters

    E-Print Network [OSTI]

    Unlu, Mehmet; Li, Shenglin; Yang, Shang-Hua; Hashemi, Mohammad R; Jarrahi, Mona

    2013-01-01

    Despite the extensive progress in terahertz technology, existing terahertz modulators have not yet offered the modulation specifications required for high-performance terahertz imaging, spectroscopy, and communication systems. Here, we present a novel terahertz intensity modulation technique based on MEMS-reconfigurable double-layered mesh filters, which offers record-high modulation depths and modulation bandwidths, without a considerable compromise in modulation speed or modulation voltage through a fully integrated device configuration. The unique advantage of the presented modulation technique compared with the previously demonstrated terahertz modulation schemes based on tunable metamaterials is reconfiguring the device geometry, which enables radical changes in the device scattering parameters over a broad range of frequencies. Device geometry reconfiguration is made possible through integration of a double-layered mesh filter with an array of electrostatically-actuated MEMS switches. We experimentally ...

  8. An on-chip test circuit for characterization of MEMS resonators

    E-Print Network [OSTI]

    Lee, John Haeseon

    2011-01-01

    There has been much interest in developing microelectromechanical systems (MEMS) resonators that achieve comparable performance to traditional resonators yet have smaller footprint and are compatible with CMOS. Recently, ...

  9. Stress-tolerant and temperature-stable RF MEMS capacitive switches and tunable filters

    E-Print Network [OSTI]

    Reines, Isak C.

    2010-01-01

    4.2 UCSD Switch Design . . . . . . . . . . . . . . .5.2 Switch Design . . . . . . . . . . . . . . .2.2 Switch Design in the Raytheon RF MEMS Process . . . . .

  10. The Sandia MEMS Passive Shock Sensor : FY08 testing for functionality...

    Office of Scientific and Technical Information (OSTI)

    and technology readiness. Citation Details In-Document Search Title: The Sandia MEMS Passive Shock Sensor : FY08 testing for functionality, model validation, and technology...

  11. Critical issues for the application of integrated MEMS/CMOS technologies to inertial measurement units

    SciTech Connect (OSTI)

    Smith, J.H.; Ellis, J.R.; Montague, S.; Allen, J.J.

    1997-03-01

    One of the principal applications of monolithically integrated micromechanical/microelectronic systems has been accelerometers for automotive applications. As integrated MEMS/CMOS technologies such as those developed by U.C. Berkeley, Analog Devices, and Sandia National Laboratories mature, additional systems for more sensitive inertial measurements will enter the commercial marketplace. In this paper, the authors will examine key technology design rules which impact the performance and cost of inertial measurement devices manufactured in integrated MEMS/CMOS technologies. These design parameters include: (1) minimum MEMS feature size, (2) minimum CMOS feature size, (3) maximum MEMS linear dimension, (4) number of mechanical MEMS layers, (5) MEMS/CMOS spacing. In particular, the embedded approach to integration developed at Sandia will be examined in the context of these technology features. Presently, this technology offers MEMS feature sizes as small as 1 {micro}m, CMOS critical dimensions of 1.25 {micro}m, MEMS linear dimensions of 1,000 {micro}m, a single mechanical level of polysilicon, and a 100 {micro}m space between MEMS and CMOS. This is applicable to modern precision guided munitions.

  12. Performance Characteristics of a MEMS Quadrupole Mass Filter With Square Electrodes: Experimental and Simulated Results

    E-Print Network [OSTI]

    Hogan, Thomas J.

    Size reduction in quadrupole mass spectrometers (QMSs) is an ongoing requirement driven by the needs of space exploration, portable, and covert monitoring applications. Microelectromechanical systems (MEMS) technology ...

  13. Research and Development of Non-Spectroscopic MEMS-Based Sensor...

    Office of Scientific and Technical Information (OSTI)

    experiments that the combination of thermal conductivity detection (TCD) and coating-free damped resonance detection (CFDRD) using micro-electromechanical systems (MEMS)...

  14. Performance and characterization of a MEMS-based device for alignment...

    Office of Scientific and Technical Information (OSTI)

    of a MEMS-based device for alignment and manipulation of x-ray nanofocusing optics Xu, Weihe Brookhaven National Laboratory, Upton, NY, 11973 USA; Lauer, Kenneth...

  15. Theory on Measuring Orientation with MEMS Accelerometers in a Centrifuge

    E-Print Network [OSTI]

    Beemer, Ryan D.; Murali, Madhuri; Biscontin, Giovanna; Aubeny, Charles

    2015-03-21

    , in brief, examples include: evaluation of MEMS accelerometers in dynamic centrifuge testing (Stringer et al. 2010), seismic evaluation of pile reinforced slopes (Al-Defae and Knappett 2014), and measurement of pile rotation (Lau et al. 2014). However... Eq. 13 Since the across is dependent on ?n and ?n is dependent on across an iterative process is required for calculating sensor orientation. DISCUSSION Basket Orientation It is possible for the basket to rotate and not be at ? from vertical...

  16. Selective W for coating and releasing MEMS devices

    SciTech Connect (OSTI)

    Mani, S.S.; Fleming, J.G.; Sniegowski, J.J.; Boer, M.P. de; Irwin, L.W.; Walraven, J.A.; Tanner, D.M.; Lavan, D.A.

    2000-01-04

    Two major problems associated with Si-based MEMS (MicroElectroMechanical Systems) devices are stiction and wear. Surface modifications are needed to reduce both adhesion and friction in micromechanical structures to solve these problems. In this paper, the authors will present a CVD (Chemical Vapor Deposition) process that selectively coats MEMS devices with tungsten and significantly enhances device durability. Tungsten CVD is used in the integrated-circuit industry, which makes this approach manufacturable. This selective deposition process results in a very conformal coating and can potentially address both stiction and wear problems confronting MEMS processing. The selective deposition of tungsten is accomplished through the silicon reduction of WF{sub 6}. The self-limiting nature of this selective W deposition process ensures the consistency necessary for process control. The tungsten is deposited after the removal of the sacrificial oxides to minimize stress and process integration problems. Tungsten coating adheres well and is hard and conducting, requirements for device performance. Furthermore, since the deposited tungsten infiltrates under adhered silicon parts and the volume of W deposited is less than the amount of Si consumed, it appears to be possible to release stuck parts that are contacted over small areas such as dimples. The wear resistance of selectively coated W parts has been shown to be significantly improved on microengine test structures.

  17. Friction of different monolayer lubricants in MEMs interfaces.

    SciTech Connect (OSTI)

    Carpick, Robert W. (University of Wisconsin, Madison, WI); Street, Mark D.; Ashurst, William Robert; Corwin, Alex David

    2006-01-01

    This report details results from our last year of work (FY2005) on friction in MEMS as funded by the Campaign 6 program for the Microscale Friction project. We have applied different monolayers to a sensitive MEMS friction tester called the nanotractor. The nanotractor is also a useful actuator that can travel {+-}100 {micro}m in 40 nm steps, and is being considered for several MEMS applications. With this tester, we can find static and dynamic coefficients of friction. We can also quantify deviations from Amontons' and Coulomb's friction laws. Because of the huge surface-to-volume ratio at the microscale, surface properties such as adhesion and friction can dominate device performance, and therefore such deviations are important to quantify and understand. We find that static and dynamic friction depend on the monolayer lubricant applied. The friction data can be modeled with a non-zero adhesion force, which represents a deviation from Amontons' Law. Further, we show preliminary data indicating that the adhesion force depends not only on the monolayer, but also on the normal load applied. Finally, we also observe slip deflections before the transition from static to dynamic friction, and find that they depend on the monolayer.

  18. MEMS-based thin-film fuel cells

    DOE Patents [OSTI]

    Jankowksi, Alan F.; Morse, Jeffrey D.

    2003-10-28

    A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.

  19. MEMS-based contact stress field measurements at a rough elastomeric layer: local test of Amontons' friction law in static

    E-Print Network [OSTI]

    Adda-Bedia, Mokhtar

    MEMS-based contact stress field measurements at a rough elastomeric layer: local test of Amontons/Universit´e Paris 6, Paris, France Abstract. We present the results of recent friction experiments in which a MEMS

  20. Performance-Driven Microfabrication-Oriented Methodology for MEMS Conceptual Design with Application in Microfluidic Device Design

    E-Print Network [OSTI]

    Deng, Y.-M.

    Performance and manufacturability are two important issues that must be taken into account during MEMS design. Existing MEMS design models or systems follow a process-driven design paradigm, that is, design starts from the ...

  1. Integration of TCAD Tools into CAD Tools for MEMS Nathan M. Wilson 1 , Robert W. Dutton 2

    E-Print Network [OSTI]

    Dutton, Robert W.

    @stanford.edu Micro-Electro-Mechanical Systems (MEMS) o#11;er dramatic new functional capabilities. Analysis of MEMSIntegration of TCAD Tools into CAD Tools for MEMS Nathan M. Wilson 1 , Robert W. Dutton 2- dimensional. The multi-domain physics for MEMS includes electrical, mechanical, and uidic interactions. E#11

  2. GNSS -05, December 8-10, 2005, Hong Kong 1 Development of a DGPS/MEMS IMU Integrated System for

    E-Print Network [OSTI]

    Calgary, University of

    navigation solution. Advances in MEMS inertial sensor technology constitute an increasingly attractive lowGNSS -05, December 8-10, 2005, Hong Kong 1 Development of a DGPS/MEMS IMU Integrated System Drive N.W., Calgary, Alberta, CANADA, T2N 1N4 Abstract. The aim of this paper is to develop a DGPS/MEMS

  3. Sensors and Actuators A 132 (2006) 139146 MEMS based digital variable capacitors with a high-k dielectric insulator

    E-Print Network [OSTI]

    Fleck, Norman A.

    2006-01-01

    Sensors and Actuators A 132 (2006) 139­146 MEMS based digital variable capacitors with a high Abstract A novel MEMS based digital variable capacitor was designed and fabricated. The device consists and keep the cantilever stuck on the substrate. © 2006 Elsevier B.V. All rights reserved. Keywords: MEMS

  4. 390 IEEE JOURNAL OF QUANTUM ELECTRONICS, VOL. 41, NO. 3, MARCH 2005 MEMS-Tunable Vertical-Cavity SOAs

    E-Print Network [OSTI]

    MacDonald, Noel C.

    390 IEEE JOURNAL OF QUANTUM ELECTRONICS, VOL. 41, NO. 3, MARCH 2005 MEMS-Tunable Vertical properties, and noise figure (NF) of MEMS-based widely tunable vertical-cavity semiconductor optical electrostatic actuator are outlined. It is found that MEMS-tunable VCSOAs follow many of the same design trends

  5. 608 IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 23, NO. 4, NOVEMBER 2000 MEMS Post-Packaging by Localized Heating and

    E-Print Network [OSTI]

    Lin, Liwei

    608 IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 23, NO. 4, NOVEMBER 2000 MEMS Post of microelectromechanical systems (MEMS). Establishing a versatile post-packaging process not only advances the field technologies of MEMS packaging and wafer bonding is followed by an innovative post-packaging approach

  6. An Overview on MEMS-based Storage, Its Research Issues and Open Problems Department of Computer Science and Engineering

    E-Print Network [OSTI]

    Zhu, Yifeng

    An Overview on MEMS-based Storage, Its Research Issues and Open Problems Yifeng Zhu Department technology based on Microelectromechanical Systems (MEMS) is emerging as an exciting complement to the memory potential research issues in MEMS storage are identified, including (1) exploiting idle read/write tips

  7. Engineering Analysis with Boundary Elements 30 (2006) 940948 Dual BIE approaches for modeling electrostatic MEMS problems with

    E-Print Network [OSTI]

    Liu, Yijun

    2006-01-01

    electrostatic MEMS problems with thin beams and accelerated by the fast multipole method Y.J. Liuà Department of electrostatic fields exterior to thin-beam structures as found in some micro-electro-mechanical systems (MEMS that the dual BIEs are very effective in solving MEMS problems with thin beams and the fast multipole BEM

  8. IEEE MICROWAVE AND GUIDED WAVE LETTERS, VOL. 10, NO. 1, JANUARY 2000 7 Low-Loss Distributed MEMS Phase Shifter

    E-Print Network [OSTI]

    York, Robert A.

    IEEE MICROWAVE AND GUIDED WAVE LETTERS, VOL. 10, NO. 1, JANUARY 2000 7 Low-Loss Distributed MEMS a one-bit low-loss -band phase shifter circuit that employs microelectromechanical systems (MEMS, demonstrates the potential for the implementation of a very low-loss multibit digital MEMS phase shifter. Index

  9. 15th Biennial University/Government/Industry Microelectronics Symposium, Boise, Idaho, June 30 -July 2, 2003. Hands-On MEMS

    E-Print Network [OSTI]

    Frechette, Luc G.

    - July 2, 2003. Hands-On MEMS Luc Frechette1 , Vijay Modi1 , Floyd Miller2 and K. R. Farmer3 1Dept, NJ 07102 Abstract-- We have developed an innovative MEMS education program that combines virtual fabrication with actual testing of classic MEMS devices. This approach is suitable both for large classes

  10. A High Aspect Ratio Parylene Micro-Stencil for Large Scale Micro-Patterning for MEMS Applications

    E-Print Network [OSTI]

    Dokmeci, Mehmet

    A High Aspect Ratio Parylene Micro-Stencil for Large Scale Micro- Patterning for MEMS Applications and selective metal deposition onto fragile MEMS devices. This paper will discuss the details of the parylene substrates (lacking chemical and thermal stability) and on released MEMS (fragile) devices. Hence, Shadow

  11. Abstract --We describe a MEMS-on-CMOS microsystem to encage, culture, and monitor cells. The system was designed

    E-Print Network [OSTI]

    Maryland at College Park, University of

    Abstract -- We describe a MEMS-on-CMOS microsystem to encage, culture, and monitor cells. A MEMS process flow was developed for the fabrication of closeable micro-vials to contain each cell, a custom bio-amplifier CMOS chip was designed, fabricated, and tested, and the fabrication of the MEMS

  12. Low Actuation Voltage RF MEMS SwitchesWith Signal Frequencies From 0.25GHz to 40GHz

    E-Print Network [OSTI]

    Shen, Shyh-Chiang

    Low Actuation Voltage RF MEMS SwitchesWith Signal Frequencies From 0.25GHz to 40GHz Shyh-voltage radio-frequency micro- electromechanical system (RF MEMS) switch is reported. The device switching of better than 27 dB over the frequency band from 0.25GHz to 40GHz was achieved. The RF MEMS switch

  13. Low-voltage small-size double-arm MEMS N. Biyikli, Y. Damgaci and B.A. Cetiner

    E-Print Network [OSTI]

    Cetiner, Bedri A.

    Low-voltage small-size double-arm MEMS actuator N. Biyikli, Y. Damgaci and B.A. Cetiner The fabrication and characterisation of a double-arm cantilever-type metallic DC-contact MEMS actuator with low MEMS actuator, this actuator showed actuation vol- tages lower than 10 V. RF measurements of the 10 mm

  14. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 17, NO. 1, FEBRUARY 2008 85 Vertically-Shaped Tunable MEMS Resonators

    E-Print Network [OSTI]

    Rubloff, Gary W.

    -Shaped Tunable MEMS Resonators Brian Morgan, Member, IEEE, and Reza Ghodssi, Member, IEEE Abstract--We report], and vibration-to- electric energy conversion [6]­[8]. Multiple MEMS approaches have been investigated for tuning, Adelphi, MD 20783 USA (e-mail: brian.morgan6@arl.army.mil). R. Ghodssi is with the MEMS Sensors

  15. Reconfigurable Multi-Beam Spiral Antenna with RF-MEMS Capacitive Series Switches Fabricated on Rigid Substrates

    E-Print Network [OSTI]

    De Flaviis, Franco

    Reconfigurable Multi-Beam Spiral Antenna with RF-MEMS Capacitive Series Switches Fabricated antenna, which radiates multi-beam with radio frequency-micro electro mechanical system (RF-MEMS.8). The spiral is configured by three-arms, which can be interconnected by two RF-MEMS series switches

  16. IEEE PHOTONICS TECHNOLOGY LETTERS, VOL. 17, NO. 10, OCTOBER 2005 2029 Linewidth Measurements of MEMS-Based Tunable

    E-Print Network [OSTI]

    Kahn, Joseph M.

    and the frequency noise spectrum method--to measure linewidths of microelectromechanical systems (MEMS)-based tun) based on microelectromechanical systems (MEMS). We find that the two methods yield similar results of MEMS-Based Tunable Lasers for Phase-Locking Applications Ezra Ip, Joseph M. Kahn, Fellow, IEEE, Doug

  17. A LOW COST WAFER-LEVEL MEMS PACKAGING TECHNOLOGY Pejman Monajemi, Paul J. Joseph*

    E-Print Network [OSTI]

    Ayazi, Farrokh

    A LOW COST WAFER-LEVEL MEMS PACKAGING TECHNOLOGY Pejman Monajemi, Paul J. Joseph* , Paul A. Kohl-cost low-temperature packaging technique for wafer-level encapsulation of MEMS devices fabricated on any arbitrary substrate. The packaging process presented here does not involve wafer bonding and can be applied

  18. A Novel Pump for MEMS Applications Mihir Sen, Daniel Wajerski, and Mohamed Gad-el-Hak

    E-Print Network [OSTI]

    Gad-el-Hak, Mohamed

    1 A Novel Pump for MEMS Applications Mihir Sen, Daniel Wajerski, and Mohamed Gad-el-Hak Department of Fluids Engineering, vol. 118, pp. 624-627, 1996. #12;2 A Novel Pump for MEMS Applications Mihir Sen1 of Notre Dame Notre Dame, IN 46556 We present a novel approach for pumping fluids in micromechanical

  19. A System for Electro-Mechanical Reliability Testing of MEMS Devices Stefan Spinner

    E-Print Network [OSTI]

    Polian, Ilia

    A System for Electro-Mechanical Reliability Testing of MEMS Devices Stefan Spinner Computer and a method that enables automated analysis of mechanical stress impact on microelectromechanical systems (MEMS). In this setup both electrical and optical inspection are available. Reliability testing

  20. Bio-implantable passive on-chip RF-MEMS strain sensing resonators for orthopaedic applications

    E-Print Network [OSTI]

    Demir, Hilmi Volkan

    Bio-implantable passive on-chip RF-MEMS strain sensing resonators for orthopaedic applications. Micromech. Microeng. 18 (2008) 115017 (9pp) doi:10.1088/0960-1317/18/11/115017 Bio-implantable passive on designed novel, bio-implantable, passive, on-chip, RF-MEMS strain sensors that rely on the resonance

  1. APPLICATION OF MEMS TECHNOLOGY TO MICRO DIRECT METHANOL FUEL CELL Xiaowei Liu*

    E-Print Network [OSTI]

    Paris-Sud XI, Université de

    APPLICATION OF MEMS TECHNOLOGY TO MICRO DIRECT METHANOL FUEL CELL Xiaowei Liu* , Chunguang Suo, email: lxw@hit.edu.cn) ABSTRACT In view of micro fuel cells, the silicon processes are employed for microfabrication of the micro direct methanol fuel cell (DMFC). Using the MEMS technology we have successfully made

  2. Design of Compliant Meanders for Applications in MEMS, Actuators, and Flexible Electronics

    E-Print Network [OSTI]

    Shapiro, Benjamin

    1 Design of Compliant Meanders for Applications in MEMS, Actuators, and Flexible Electronics Bavani-electro-mechanical systems (MEMS) to stretchable electrodes in flexible electronics and dielectric elastomer actuators are required in flexible displays [4], stretchable circuits [5], flexible antennas [6], and dielectric

  3. Electrostatic Operation and Curvature Modeling for a MEMS Flexible Film Actuator

    E-Print Network [OSTI]

    Electrostatic Operation and Curvature Modeling for a MEMS Flexible Film Actuator B. Edmonds, Jr.1 Introduction and Motivation The electrostatic flexible film actuator, also known as an "Artificial Eyelid," is a unique MEMS (MicroElectronic Mechanical System) actuator fabricated from polyimide and thin metal films

  4. EXPERIMENTAL INVESTIGATION OF ORGANIC MEMS BASED CONDUCTIVE POLYMER-METAL COMPOSITE

    E-Print Network [OSTI]

    Kassegne, Samuel Kinde

    by focusing on composite mixing methods and solid fabrication parameters for organic solar cell fabricationEXPERIMENTAL INVESTIGATION OF ORGANIC MEMS BASED CONDUCTIVE POLYMER-METAL COMPOSITE. Sam Kassegne #12;vi ABSTRACT OF THE THESIS Experimental Investigation of Organic MEMS based conductive

  5. 2780 IEEE SENSORS JOURNAL, VOL. 11, NO. 11, NOVEMBER 2011 Folded MEMS Pyramid Inertial Measurement Unit

    E-Print Network [OSTI]

    Chen, Zhongping

    2780 IEEE SENSORS JOURNAL, VOL. 11, NO. 11, NOVEMBER 2011 Folded MEMS Pyramid Inertial Measurement. A prototype of the folded MEMS pyramid IMU with co-fabricated iner- tial sensors, electrical interconnects-on-insulator (SOI) backbone with in-situ fabricated high-aspect-ratio sensors. A planar multi- sensor unit

  6. Beam control in multiphoton microscopy using a MEMS spatial light Thomas Bifano*, Hari Paudel

    E-Print Network [OSTI]

    Bifano, Thomas

    . The combination of MPM and a fast microelectromechanical spatial light modulator (MEMS SLM) offers a compellingBeam control in multiphoton microscopy using a MEMS spatial light modulator Thomas Bifano*, Hari instrument. S-MPM's imaging advantages are enabled by a high-speed, microelectromechanical spatial light

  7. 4096-element continuous face-sheet MEMS deformable mirror for high-contrast imaging

    E-Print Network [OSTI]

    Bifano, Thomas

    microelectromechanical systems MEMS DM that has been demonstrated to be capable of flattening a wavefront 0.54 nm rms4096-element continuous face-sheet MEMS deformable mirror for high-contrast imaging Steven A 02138 Abstract. We present the progress in the development of a 4096- element microelectromechanical

  8. A Membrane Deflection Fracture Experiment to Investigate Fracture Toughness of Freestanding MEMS Materials

    E-Print Network [OSTI]

    Espinosa, Horacio D.

    A Membrane Deflection Fracture Experiment to Investigate Fracture Toughness of Freestanding MEMS Materials H.D. Espinosa* and B. Peng ABSTRACT This paper presents a novel Membrane Deflection Fracture Experiment (MDFE) to investigate the fracture toughness of MEMS and other advanced materials in thin film

  9. Validation of thermal models for a prototypical MEMS thermal actuator.

    SciTech Connect (OSTI)

    Gallis, Michail A.; Torczynski, John Robert; Piekos, Edward Stanley; Serrano, Justin Raymond; Gorby, Allen D.; Phinney, Leslie Mary

    2008-09-01

    This report documents technical work performed to complete the ASC Level 2 Milestone 2841: validation of thermal models for a prototypical MEMS thermal actuator. This effort requires completion of the following task: the comparison between calculated and measured temperature profiles of a heated stationary microbeam in air. Such heated microbeams are prototypical structures in virtually all electrically driven microscale thermal actuators. This task is divided into four major subtasks. (1) Perform validation experiments on prototypical heated stationary microbeams in which material properties such as thermal conductivity and electrical resistivity are measured if not known and temperature profiles along the beams are measured as a function of electrical power and gas pressure. (2) Develop a noncontinuum gas-phase heat-transfer model for typical MEMS situations including effects such as temperature discontinuities at gas-solid interfaces across which heat is flowing, and incorporate this model into the ASC FEM heat-conduction code Calore to enable it to simulate these effects with good accuracy. (3) Develop a noncontinuum solid-phase heat transfer model for typical MEMS situations including an effective thermal conductivity that depends on device geometry and grain size, and incorporate this model into the FEM heat-conduction code Calore to enable it to simulate these effects with good accuracy. (4) Perform combined gas-solid heat-transfer simulations using Calore with these models for the experimentally investigated devices, and compare simulation and experimental temperature profiles to assess model accuracy. These subtasks have been completed successfully, thereby completing the milestone task. Model and experimental temperature profiles are found to be in reasonable agreement for all cases examined. Modest systematic differences appear to be related to uncertainties in the geometric dimensions of the test structures and in the thermal conductivity of the polycrystalline silicon test structures, as well as uncontrolled nonuniform changes in this quantity over time and during operation.

  10. Sources of stress gradients in electrodeposited Ni MEMS.

    SciTech Connect (OSTI)

    Hearne, Sean Joseph; Floro, Jerrold Anthony; Dyck, Christopher William

    2004-06-01

    The ability of future integrated metal-semiconductor micro-systems such as RF MEMS to perform highly complex functions will depend on developing freestanding metal structures that offer improved conductivity and reflectivity over polysilicon structures. For example, metal-based RF MEMS technology could replace the bulky RF system presently used in communications, navigation, and avionics systems. However, stress gradients that induce warpage of active components have prevented the implementation of this technology. Figure 1, is an interference micrograph image of a series of cantilever beams fabricated from electrodeposited Ni. The curvature in the beams was the result of stress gradients intrinsic to the electrodeposition process. To study the sources of the stress in electrodeposition of Ni we have incorporated a wafer curvature based stress sensor, the multibeam optical stress sensor, into an electrodeposition cell. We have determined that there are two regions of stress induced by electrodepositing Ni from a sulfamate-based bath (Fig 2). The stress evolution during the first region, 0-1000{angstrom}, was determined to be dependent only on the substrate material (Au vs. Cu), whereas the stress evolution during the second region, >1000{angstrom}, was highly dependent on the deposition conditions. In this region, the stress varied from +0.5 GPa to -0.5GPa, depending solely on the deposition rate. We examined four likely sources for the compressive intrinsic stress, i.e. reduction in tensile stress, and determined that only the adatom diffusion into grain boundaries model of Sheldon, et al. could account for the observed compressive stress. In the presentation, we shall discuss the compressive stress generation mechanisms considered and the ramifications of these results on fabrication of electrodeposited Ni for MEMS applications.

  11. PHYS 4xx Mem 6 1 2010 by David Boal, Simon Fraser University. All rights reserved; further copying or resale is strictly prohibited.

    E-Print Network [OSTI]

    Boal, David

    PHYS 4xx Mem 6 1 2010 by David Boal, Simon Fraser University. All rights reserved; further copying or resale is strictly prohibited. 4xx Mem 6 - Van der Waals and electrostatic interactions Lecture Mem 5 A B #12;PHYS 4xx Mem 6 2 2010 by David Boal, Simon Fraser University. All rights reserved; further

  12. IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS--I: FUNDAMENTAL THEORY AND APPLICATIONS, VOL. 48, NO. 2, FEBRUARY 2001 133 Synchronization of MEMS Resonators and

    E-Print Network [OSTI]

    Izhikevich, Eugene

    , FEBRUARY 2001 133 Synchronization of MEMS Resonators and Mechanical Neurocomputing Frank C. Hoppensteadt: microelectromechanical systems (MEMS) and neu- rocomputing. First, we consider MEMS oscillators having low amplitude. Then, we investigate a theoretical possibility of using MEMS oscillators to build an oscillatory

  13. Aluminum Nitride Thin Films on Titanium for Piezoelectric MEMS Applications Seth Boeshore, Emily Parker, Vanni Lughi, Noel C. MacDonald

    E-Print Network [OSTI]

    MacDonald, Noel C.

    Aluminum Nitride Thin Films on Titanium for Piezoelectric MEMS Applications Seth Boeshore, Emily piezoelectric MEMS. Titanium is a new and attractive platform for MEMS because of its corrosion resistance with standard silicon MEMS processing and has found widespread use in film bulk acoustic resonators (FBARs

  14. Charging characteritiscs of ultrananocrystalline diamond in RF MEMS capacitive switches.

    SciTech Connect (OSTI)

    Sumant, A. V.; Goldsmith, C.; Auciello, O.; Carlisle, J.; Zheng, H.; Hwang, J. C. M.; Palego, C.; Wang, W.; Carpick, R.; Adiga, V.; Datta, A.; Gudeman, C.; O'Brien, S.; Sampath, S.

    2010-05-01

    Modifications to a standard capacitive MEMS switch process have been made to allow the incorporation of ultra-nano-crystalline diamond as the switch dielectric. The impact on electromechanical performance is minimal. However, these devices exhibit uniquely different charging characteristics, with charging and discharging time constants 5-6 orders of magnitude quicker than conventional materials. This operation opens the possibility of devices which have no adverse effects of dielectric charging and can be operated near-continuously in the actuated state without significant degradation in reliability.

  15. Micro Electro-Mechanical System (MEMS) Pressure Sensor for Footwear

    DOE Patents [OSTI]

    Kholwadwala, Deepesh K. (Albuquerque, NM); Rohrer, Brandon R. (Albuquerque, NM); Spletzer, Barry L. (Albuquerque, NM); Galambos, Paul C. (Albuquerque, NM); Wheeler, Jason W. (Albuquerque, NM); Hobart, Clinton G. (Albuquerque, NM); Givler, Richard C. (Albuquerque, NM)

    2008-09-23

    Footwear comprises a sole and a plurality of sealed cavities contained within the sole. The sealed cavities can be incorporated as deformable containers within an elastic medium, comprising the sole. A plurality of micro electro-mechanical system (MEMS) pressure sensors are respectively contained within the sealed cavity plurality, and can be adapted to measure static and dynamic pressure within each of the sealed cavities. The pressure measurements can provide information relating to the contact pressure distribution between the sole of the footwear and the wearer's environment.

  16. A novel method of fabricating integrated FETs for MEMS applications.

    SciTech Connect (OSTI)

    Okandan, Murat; Bennett, Reid Stuart; Draper, Bruce Leroy; Mani, Seethambal S.

    2003-07-01

    This paper demonstrates a simple technique for building n-channel MOSFETs and complex micromechanical systems simultaneously instead of serially, allowing a more straightforward integration of complete systems. The fabrication sequence uses few additional process steps and only one additional masking layer compared to a MEMS-only technology. The process flow forms the MOSFET gate electrode using the first level of mechanical polycrystalline silicon, while the MOSFET source and drain regions are formed by dopant diffusions into the substrate from subsequent levels of heavily doped poly that is used for mechanical elements. The process yields devices with good, repeatable electrical characteristics suitable for a wide range of digital and analog applications.

  17. MEMS design rule checking: a batch approach for remote operation

    SciTech Connect (OSTI)

    Yarberry, V.R.

    1998-01-01

    This paper describes a design rule checking (DRC) tool developed as an aid for designing microelectromechanical structures (MEMS) using AutoCAD running on a Windows NT workstation. The application suite, MEMSdrc, consists of: a graphical user interface integrated into AutoCAD to invoke DRC, translation and interface software to communicate with a commercial IC layout design checking software package, and routines to interactively display and review the results. The user interface provides the capability to select a checking window area and specific DRC rules to be applied to the design. The MEMS structures, defined as 2D AutoCAD geometry are translated first into DXF format, then to GDSII format. A remote process transfers the files to a Unix workstation where Mentor Graphics ICverify is invoked to perform the layout design rule checks. Upon completion, the results are translated into DXF geometry and returned back to the Windows NT workstation to be overlaid onto the original design. A set of icons are provided for the user to interactively review the results inside of AutoCAD using a first/next/previous technique.

  18. Design tools and issues of silicon micromachined (MEMS) devices

    SciTech Connect (OSTI)

    Davies, B.R.; Rodgers, M.S.; Montague, S.

    1998-05-01

    This paper describes the design and design issues associated with silicon surface micromachined device design Some of the tools described are adaptations of macro analysis tools. Design issues in the microdomain differ greatly from design issues encountered in the macrodomain. Microdomain forces caused by electrostatic attraction, surface tension, Van der Walls forces, and others can be more significant than inertia, friction, or gravity. Design and analysis tools developed for macrodomain devices are inadequate in most cases for microdomain devices. Microdomain specific design and analysis tools are being developed, but are still immature and lack adequate functionality. The fundamental design process for surface micromachined devices is significantly different than the design process employed in the design of macro-sized devices. In this paper, MEMS design will be discussed as well as the tools used to develop the designs and the issues relating fabrication processes to design. Design and analysis of MEMS devices is directly coupled to the silicon micromachining processes used to fabricate the devices. These processes introduce significant design limitations and must be well understood before designs can be successfully developed. In addition, some silicon micromachining fabrication processes facilitate the integration of silicon micromachines with microelectronics on-chip. For devices requiring on-chip electronics, the fabrication processes introduce additional design constraints that must be taken into account during design and analysis.

  19. Progress toward a MEMS fabricated 100 GHz oscillator.

    SciTech Connect (OSTI)

    Loubriel, Guillermo Manuel; Lemp, Thomas; Weyn, Mark L.; Coleman, Phillip Dale; Rowley, James E. (SAIC, Albuquerque, NM)

    2006-02-01

    This report summarizes an LDRD effort which looked at the feasibility of building a MEMS (Micro-Electro-Mechanical Systems) fabricated 100 GHz micro vacuum tube. PIC Simulations proved to be a very useful tool in investigating various device designs. Scaling parameters were identified. This in turn allowed predictions of oscillator growth based on beam parameters, cavity geometry, and cavity loading. The electron beam source was identified as a critical element of the design. FEA's (Field Emission Arrays) were purchased to be built into the micro device. Laboratory testing of the FEA's was also performed which pointed out care and handling issues along with maximum current capabilities. Progress was made toward MEMS fabrication of the device. Techniques were developed and successfully employed to build up several of the subassemblies of the device. However, the lower wall fabrication proved to be difficult and a successful build was not completed. Alternative approaches to building this structure have been identified. Although these alternatives look like good solutions for building the device, it was not possible to complete a redesign and build during the timeframe of this effort.

  20. Frequency-dependent electrostatic actuation in microfluidic MEMS.

    SciTech Connect (OSTI)

    Zavadil, Kevin Robert; Michalske, Terry A.; Sounart, Thomas L.

    2003-09-01

    Electrostatic actuators exhibit fast response times and are easily integrated into microsystems because they can be fabricated with standard IC micromachining processes and materials. Although electrostatic actuators have been used extensively in 'dry' MEMS, they have received less attention in microfluidic systems probably because of challenges such as electrolysis, anodization, and electrode polarization. Here we demonstrate that ac drive signals can be used to prevent electrode polarization, and thus enable electrostatic actuation in many liquids, at potentials low enough to avoid electrochemistry. We measure the frequency response of an interdigitated silicon comb-drive actuator in liquids spanning a decade of dielectric permittivities and four decades of conductivity, and present a simple theory that predicts the characteristic actuation frequency. The analysis demonstrates the importance of the native oxide on silicon actuator response, and suggests that the actuation frequency can be shifted by controlling the thickness of the oxide. For native silicon devices, actuation is predicted at frequencies less than 10 MHz, in electrolytes of ionic strength up to 100 mmol/L, and thus electrostatic actuation may be feasible in many bioMEMS and other microfluidic applications.

  1. The use of a high-order MEMS deformable mirror in the Gemini Planet Imager

    SciTech Connect (OSTI)

    Poyneer, L A; Bauman, B; Cornelissen, S; Jones, S; Macintosh, B; Palmer, D; Isaacs, J

    2010-12-17

    We briefly review the development history of the Gemini Planet Imager's 4K Boston Micromachines MEMS deformable mirror. We discuss essential calibration steps and algorithms to control the MEMS with nanometer precision, including voltage-phase calibration and influence function characterization. We discuss the integration of the MEMS into GPI's Adaptive Optics system at Lawrence Livermore and present experimental results of 1.5 kHz closed-loop control. We detail mitigation strategies in the coronagraph to reduce the impact of abnormal actuators on final image contrast.

  2. Monotonic and fatigue testing of spring-bridged freestanding microbeams application for MEMS

    E-Print Network [OSTI]

    Lin, Ming-Tzer; Tong, Chi-Jia

    2008-01-01

    Microelectromechanical systems (MEMS) technologies are developing rapidly with increasing study of the design, fabrication and commercialization of microscale systems and devices. Accurate knowledge on the mechanical behaviors of thin film materials used for MEMS is important for successful design and development of MEMS. Here a novel electroplating spring-bridge micro-tensile specimen integrates pin-pin align holes, misalignment compensate spring, load sensor beam and freestanding thin film is demonstrated and fabricated. The specimen is fit into a specially designed micro-mechanical apparatus to carry out a series of monotonic tensile testing on sub-micron freestanding thin films. Certain thin films applicable as structure or motion gears in MEMS were tested including sputtered gold, copper and tantalum nitride thin films. Metal specimens were fabricated by sputtering; for tantalum nitride film samples, nitrogen gas was introduced into the chamber during sputtering tantalum films on the silicon wafer. The s...

  3. Emergency delivery of Vasopressin from an implantable MEMS rapid drug delivery device

    E-Print Network [OSTI]

    Ho Duc, Hong Linh, 1978-

    2009-01-01

    An implantable rapid drug delivery device based on micro-electro-mechanical systems (MEMS) technology was designed, fabricated and validated for the in vivo rapid delivery of vasopressin in a rabbit model. In vitro ...

  4. Payload characterization for CubeSat demonstration of MEMS deformable mirrors

    E-Print Network [OSTI]

    Cahoy, Kerri

    Coronagraphic space telescopes require wavefront control systems for high-contrast imaging applications such as exoplanet direct imaging. High-actuator-count MEMS deformable mirrors (DM) are a key element of these wavefront ...

  5. A MEMS-based, high-resolution Electric-Field meter

    E-Print Network [OSTI]

    Shafran, John Sawa

    2005-01-01

    In MEMS-based inertial sensors, such as accelerometers and gyroscopes, known electrical waveforms are applied to a modulating capacitive element to determine an unknown deflection. However, the inverse of this scheme can ...

  6. An Implantable MEMS Drug Delivery Device for Rapid Delivery in Ambulatory Emergency Care

    E-Print Network [OSTI]

    Elman, Noel

    We introduce the first implantable drug delivery system based on MEMS (Micro-Electro-Mechanical-Systems) technology specifically designed as a platform for treatment in ambulatory emergency care. The device is named ...

  7. Assembling 3D MEMS structures by folding, aligning and latching 2D patterned films

    E-Print Network [OSTI]

    Shaar, Nader S. (Nader Salah)

    2014-01-01

    The techniques used in the fabrication of micro-electro-mechanical systems (MEMS) were adopted from the integrated circuits (IC) industry and are mostly limited to patterning thin films on a flat substrate. As a consequence, ...

  8. The use of a high-order MEMS deformable mirror in the Gemini...

    Office of Scientific and Technical Information (OSTI)

    function characterization. We discuss the integration of the MEMS into GPI's Adaptive Optics system at Lawrence Livermore and present experimental results of 1.5 kHz closed-loop...

  9. Self-powered wireless sensor system using MEMS piezoelectric micro power generator (PMPG)

    E-Print Network [OSTI]

    Xia, YuXin, M.B.A. Sloan School of Management.

    2006-01-01

    A thin-film lead zirconate titanate, Pb(Zr,Ti)03, MEMS Piezoelectric Micro Power Generator (PMPG) has been integrated with a commercial wireless sensor node (Telos), to demonstrate a self-powered RF temperature sensor ...

  10. Piezoelectric Micro Power Generator (PMPG) : a MEMS-based energy scavenger

    E-Print Network [OSTI]

    Sood, Rajendra K. (Rajendra Kumar), 1979-

    2003-01-01

    As MEMS and smart material technologies begin to mature, their applications, such as medical implants and wireless communications are becoming more attractive. Traditionally, remote devices have used chemical batteries to ...

  11. High-G testing of MEMS mechanical non-volatile memory and silicon...

    Office of Scientific and Technical Information (OSTI)

    g's over a period of 1.5 ms. For the second test the MEMS devices were assembled in a gun-fired penetrator and shot into a cement target at the Army Waterways Experiment Station...

  12. Mem. S.A.It. Vol. 73, 23 SAIt 2002 Memorie della

    E-Print Network [OSTI]

    Mem. S.A.It. Vol. 73, 23 c SAIt 2002 Memorie della High Performance Computing at INAF/OAPA Fabio and in high performance computing (HPC). During 2000, INAF/OAPA has acquired a HPC facility, entirely devoted

  13. Performance of a MEMS-base Adaptive Optics Optical Coherency Tomography System

    SciTech Connect (OSTI)

    Evans, J; Zadwadzki, R J; Jones, S; Olivier, S; Opkpodu, S; Werner, J S

    2008-01-16

    We have demonstrated that a microelectrical mechanical systems (MEMS) deformable mirror can be flattened to < 1 nm RMS within controllable spatial frequencies over a 9.2-mm aperture making it a viable option for high-contrast adaptive optics systems (also known as Extreme Adaptive Optics). The Extreme Adaptive Optics Testbed at UC Santa Cruz is being used to investigate and develop technologies for high-contrast imaging, especially wavefront control. A phase shifting diffraction interferometer (PSDI) measures wavefront errors with sub-nm precision and accuracy for metrology and wavefront control. Consistent flattening, required testing and characterization of the individual actuator response, including the effects of dead and low-response actuators. Stability and repeatability of the MEMS devices was also tested. An error budget for MEMS closed loop performance will summarize MEMS characterization.

  14. Planning and control for microassembly of structures composed of stress-engineered MEMS microrobots

    E-Print Network [OSTI]

    Rus, Daniela L.

    We present control strategies that implement planar microassembly using groups of stress-engineered MEMS microrobots (MicroStressBots) controlled through a single global control signal. The global control signal couples ...

  15. Tunable Substrate Integrated Waveguide Filters Implemented with PIN Diodes and RF MEMS Switches 

    E-Print Network [OSTI]

    Armendariz, Marcelino

    2012-02-14

    This thesis presents the first fully tunable substrate integrated waveguide (SIW) filter implemented with PIN diodes and RF MEMS switches. The methodology for tuning SIW filters is explained in detail and is used to create three separate designs...

  16. A physically based model for dielectric charging in an integrated optical MEMS wavelength selective switch.

    SciTech Connect (OSTI)

    Nielson, Gregory N.; Barbastathis, George (Massachusetts Institute of Technology)

    2005-07-01

    A physical parameter based model for dielectric charge accumulation is proposed and used to predict the displacement versus applied voltage and pull-in response of an electrostatic MEMS wavelength selective integrated optical switch.

  17. Lateral-Line Inspired MEMS-Array Pressure Sensing for Passive Underwater Navigation

    E-Print Network [OSTI]

    Fernandez, Vicente Ignacio

    This paper presents work toward the development of a novel MEMS sensing technology for AUVs. The proposed lateral line-inspired sensor system is a high-density array of pressure sensors for measuring hydrodynamic disturbances. ...

  18. High-speed ultra-broad tuning MEMS-VCSELs for imaging and spectroscopy

    E-Print Network [OSTI]

    Jayaraman, V.

    In the last 2 years, the field of micro-electro-mechanical systems tunable vertical cavity surface-emitting lasers (MEMS-VCSELs) has seen dramatic improvements in laser tuning range and tuning speed, along with expansion ...

  19. Acoustic Bragg reflectors for Q-enhancement of unreleased MEMS resonators

    E-Print Network [OSTI]

    Wang, Wentao, S.M. Massachusetts Institute of Technology

    2011-01-01

    In this thesis, the author introduces the first fully unreleased Micro-Electro-Mechanical (MEM) resonator, and the design of acoustic Bragg reflectors (ABRs) for energy localization and quality factor (Q)- enhancement for ...

  20. The effect of carouseling on MEMS IMU performance for gyrocompassing applications

    E-Print Network [OSTI]

    Renkoski, Benjamin Matthew

    2008-01-01

    The concept of carouseling an IMU is simulated in order to improve the accuracy of MEMS IMUs. Carouseling consists of slewing the IMU through a pre-determined trajectory that is selected based on inherent properties that ...

  1. Ultrasensitive measurement of MEMS cantilever displacement sensitivity below the shot noise limit

    E-Print Network [OSTI]

    R. C. Pooser; B. J. Lawrie

    2015-06-29

    The displacement of micro-electro-mechanical-systems (MEMS) cantilevers is used to measure a broad variety of phenomena in devices ranging from force microscopes to biochemical sensors to thermal imaging systems. We demonstrate the first direct measurement of a MEMS cantilever displacement with a noise floor at 40% of the shot noise limit (SNL). By combining multi-spatial-mode quantum light sources with a simple ?differential measurement, we show that sub-SNL MEMS displacement sensitivity is highly accessible compared to previous efforts that measured the displacement of macroscopic mirrors with very distinct spatial structures crafted with multiple optical parametric amplifiers and locking loops. These results support a new class of quantum MEMS sensor with an ultimate signal to noise ratio determined by quantum correlations, enabling ultra-trace sensing, imaging, and microscopy applications in which signals were previously obscured by shot noise.

  2. CNT-based MEMS/NEMS gas ionizers for portable mass spectrometry applications

    E-Print Network [OSTI]

    Velasquez-Heller, Luis Fernand

    We report the fabrication and experimental characterization of a carbon nanotube (CNT)-based MEMS/NEMS electron impact gas ionizer with an integrated extractor gate for portable mass spectrometry. The ionizer achieves ...

  3. Ultrasensitive measurement of MEMS cantilever displacement sensitivity below the shot noise limit

    E-Print Network [OSTI]

    Pooser, R C

    2014-01-01

    The displacement of micro-electro-mechanical-systems(MEMs) cantilevers is used to measure a variety of phenomena in devices ranging from force microscopes for single spin detection[1] to biochemical sensors[2] to uncooled thermal imaging systems[3]. The displacement readout is often performed optically with segmented detectors or interference measurements. Until recently, various noise sources have limited the minimum detectable displacement in MEMs systems, but it is now possible to minimize all other sources[4] so that the noise level of the coherent light field, called the shot noise limit(SNL), becomes the dominant source. Light sources dis- playing quantum-enhanced statistics below this limit are available[5, 6], with applications in gravitational wave astronomy[7] and bioimaging[8], but direct displacement measurements of MEMS cantilevers below the SNL have been impossible until now. Here, we demonstrate the first direct measurement of a MEMs cantilever displacement with sub-SNL sensitivity, thus enabli...

  4. Mechanical characterization and in vivo operation of an implantable drug delivery MEMS device

    E-Print Network [OSTI]

    Li, Yawen, 1972-

    2005-01-01

    The goal of this thesis was to advance an implantable drug delivery MEMS (MicroElectroMechanical Systems) device developed in our laboratory. This device was designed to locally deliver multiple substances in complex release ...

  5. Inertial sensing microelectromechanical (MEM) safe-arm device

    SciTech Connect (OSTI)

    Roesler, Alexander W. (Tijeras, NM); Wooden, Susan M. (Sandia Park, NM)

    2009-05-12

    Microelectromechanical (MEM) safe-arm devices comprise a substrate upon which a sense mass, that can contain an energetic material, is constrained to move along a pathway defined by a track disposed on the surface of the substrate. The pathway has a first end comprising a "safe" position and a second end comprising an "armed" position, whereat the second end the sense mass can be aligned proximal to energetic materials comprising the explosive train, within an explosive component. The sense mass can be confined in the safe position by a first latch, operable to release the sense mass by an acceleration acting in a direction substantially normal to the surface of the substrate. A second acceleration, acting in a direction substantially parallel to the surface of the substrate, can cause the sense mass to traverse the pathway from the safe position to the armed position.

  6. Polycrystalline diamond MEMS resonator technology for sensor applications.

    SciTech Connect (OSTI)

    Sullivan, John P.; Aslam, Dean (Michigan State University, East Lansing, MI); Sepulveda-Alancastro, Nelson (Michigan State University, East Lansing, MI)

    2005-07-01

    Due to material limitations of poly-Si resonators, polycrystalline diamond (poly-C) has been explored as a new MEMS resonator material. The poly-C resonators are designed, fabricated and tested using electrostatic (Michigan State University) and piezoelectric (Sandia National Laboratories) actuation methods, and the results are compared. For comparable resonator structures, although the resonance frequencies are similar, the measured Q values in the ranges of 1000-2000 and 10,000-15,000 are obtained for electrostatic and piezoelectric actuation methods, respectively. The difference in Q for the two methods is related to different pressures used during the measurement and not to the method of measurement. For the poly-C cantilever beam resonators, the highest value of their quality factor (Q) is reported for the first time (15,263).

  7. Self-limiting excitation of MEMS devices with surface electrodes

    E-Print Network [OSTI]

    Kornilovitch, Pavel

    2013-01-01

    An excitation method for MEMS devices with planar electrodes is described. The stationary part of the device (the stator) consists of three electrode arrays arranged in the 'ABCABC' order. 'A', 'B', and 'C' carry time-independent potentials and together form a spatially-periodic electrostatic profile. The moving part of the device (the translator) has two electrode arrays 'ababab', with 'a' and 'b' carrying time-dependent out-of-phase voltages. When the frequency of the time-dependent voltage is close to the natural frequency of the spring-mass system, the translator is driven into resonance. By adjusting the spatial phase of the stationary profile, the driving force on the translator can be maximized for any equilibrium position. Physical misalignment between the stator and translator resulting from imperfect fabrication can be corrected electrically. A dynamical equation describing translator motion is derived and analyzed for resonant and parametric driving. In both cases, the driving force depends on the ...

  8. MEMS tunable optical filter based on multi-ring resonator

    SciTech Connect (OSTI)

    Dessalegn, Hailu, E-mail: hailudessalegn@yahoo.com, E-mail: tsrinu@ece.iisc.ernet.in; Srinivas, T., E-mail: hailudessalegn@yahoo.com, E-mail: tsrinu@ece.iisc.ernet.in [Department of Electrical Communication Engineering, Indian Institute of Science, Bangalore-560012 (India)

    2014-10-15

    We propose a novel MEMS tunable optical filter with a flat-top pass band based on multi-ring resonator in an electrostatically actuated microcantilever for communication application. The filter is basically structured on a microcantilever beam and built in optical integrated ring resonator which is placed in one end of the beam to gain maximum stress on the resonator. Thus, when a DC voltage is applied, the beam will bend, that induces a stress and strain in the ring, which brings a change in refractive index and perimeter of the rings leading to change in the output spectrum shift, providing the tenability as high as 0.68nm/?N and it is capable of tuning up to 1.7nm.

  9. Method and system for automated on-chip material and structural certification of MEMS devices

    DOE Patents [OSTI]

    Sinclair, Michael B.; DeBoer, Maarten P.; Smith, Norman F.; Jensen, Brian D.; Miller, Samuel L.

    2003-05-20

    A new approach toward MEMS quality control and materials characterization is provided by a combined test structure measurement and mechanical response modeling approach. Simple test structures are cofabricated with the MEMS devices being produced. These test structures are designed to isolate certain types of physical response, so that measurement of their behavior under applied stress can be easily interpreted as quality control and material properties information.

  10. Integration of optoelectronics and MEMS by free-space micro-optics

    SciTech Connect (OSTI)

    WARREN,MIAL E.; SPAHN,OLGA B.; SWEATT,WILLIAM C.; SHUL,RANDY J.; WENDT,JOEL R.; VAWTER,GREGORY A.; KRYGOWSKI,TOM W.; REYES,DAVID NMN; RODGERS,M. STEVEN; SNIEGOWSKI,JEFFRY J.

    2000-06-01

    This report represents the completion of a three-year Laboratory-Directed Research and Development (LDRD) program to investigate combining microelectromechanical systems (MEMS) with optoelectronic components as a means of realizing compact optomechanical subsystems. Some examples of possible applications are laser beam scanning, switching and routing and active focusing, spectral filtering or shattering of optical sources. The two technologies use dissimilar materials with significant compatibility problems for a common process line. This project emphasized a hybrid approach to integrating optoelectronics and MEMS. Significant progress was made in developing processing capabilities for adding optical function to MEMS components, such as metal mirror coatings and through-vias in the substrate. These processes were used to demonstrate two integration examples, a MEMS discriminator driven by laser illuminated photovoltaic cells and a MEMS shutter or chopper. Another major difficulty with direct integration is providing the optical path for the MEMS components to interact with the light. The authors explored using folded optical paths in a transparent substrate to provide the interconnection route between the components of the system. The components can be surface-mounted by flip-chip bonding to the substrate. Micro-optics can be fabricated into the substrate to reflect and refocus the light so that it can propagate from one device to another and them be directed out of the substrate into free space. The MEMS components do not require the development of transparent optics and can be completely compatible with the current 5-level polysilicon process. They report progress on a MEMS-based laser scanner using these concepts.

  11. Ultrananocrystalline diamond films with optimized dielectric properties for advanced RF MEMS capacitive switches

    DOE Patents [OSTI]

    Sumant, Anirudha V.; Auciello, Orlando H.; Mancini, Derrick C.

    2013-01-15

    An efficient deposition process is provided for fabricating reliable RF MEMS capacitive switches with multilayer ultrananocrystalline (UNCD) films for more rapid recovery, charging and discharging that is effective for more than a billion cycles of operation. Significantly, the deposition process is compatible for integration with CMOS electronics and thereby can provide monolithically integrated RF MEMS capacitive switches for use with CMOS electronic devices, such as for insertion into phase array antennas for radars and other RF communication systems.

  12. Development of a Compact Optical-MEMS Scanner with Integrated VCSEL Light Source and Diffractive Optics

    SciTech Connect (OSTI)

    Krygowski, Thomas W.; Reyes, David; Rodgers, M. Steven; Smith, James H.; Warren, Mial; Sweatt, William; Blum-Spahn, Olga; Wendt, Joel R.; Asbill, Randy

    1999-06-30

    In this work the design and initial fabrication results are reported for the components of a compact optical-MEMS laser scanning system. This system integrates a silicon MEMS laser scanner, a Vertical Cavity Surface Emitting Laser (VCSEL) and passive optical components. The MEMS scanner and VCSEL are mounted onto a fused silica substrate which serves as an optical interconnect between the devices. Two Diffractive Optical Elements (DOEs) are etched into the fused silica substrate to focus the VCSEL beam and increase the scan range. The silicon MEMS scanner consists of an actuator that continuously scans the position of a large polysilicon gold-coated shuttle containing a third DOE. Interferometric measurements show that the residual stress in the 500 {micro}m x 1000 {micro}m shuttle is extremely low, with a maximum deflection of only 0.18{micro}m over an 800 {micro}m span for an unmetallized case and a deflection of 0.56{micro}m for the metallized case. A conservative estimate for the scan range is {approximately}{+-}4{degree}, with a spot size of about 0.5 mm, producing 50 resolvable spots. The basic system architecture, optical and MEMS design is reported in this paper, with an emphasis on the design and fabrication of the silicon MEMS scanner portion of the system.

  13. February 8, 2005 Lecturer Dmitri Zaitsev Hilary Term 2005 Course 2E1 2004-05 (SF Engineers & MSISS & MEMS)

    E-Print Network [OSTI]

    Zaitsev, Dmitri

    & MEMS) S h e e t 13 Due: in the tutorial sessions next Wednesday/Thursday Exercise 1 Find the standard

  14. February 19, 2006 Lecturer Dmitri Zaitsev Hilary Term 2006 Course 2E1 2005-06 (SF Engineers & MSISS & MEMS)

    E-Print Network [OSTI]

    Zaitsev, Dmitri

    & MEMS) S h e e t 14 Due: in the tutorial sessions next Wednesday/Thursday Exercise 1 Find the matrix

  15. MEMS Lab., Department of Mechanical Engineering, College of Engineering, SDSU, San Diego, CA 92182 Name: Mid Term Exam -April 6, 2011

    E-Print Network [OSTI]

    Kassegne, Samuel Kinde

    Name: Mid Term Exam - April 6, 2011 SOLAR CELL FABRICATION PROCEDURE KASSEGNE'S MEMS LAB CLASS 100 container 2 hours Annealing in N2 environment oven 12 hours #12;MEMS Lab., Department of Mechanical

  16. Robust hermetic packaging techniques for MEMS integrated microsystems.

    SciTech Connect (OSTI)

    Chae, Junseok (University of Michigan); Stark, Brian H. (University of Michigan); Kuo, Andrew (University of Michigan); Oliver, Andrew David; Najafi, Khalil (University of Michigan)

    2005-03-01

    This work is the result of a Sandia National Laboratories LDRD funded fellowship at the University of Michigan. Although, guidance and suggestions were offered by Sandia, the work contained here is primarily the work of Brian H. Stark, and his advisor, Professor Khalil Najafi. Junseok Chae, Andrew Kuo, and their coworkers at the University of Michigan helped to record some of the data. The following is an abstract of their work. We have developed a vacuum packaging technology using a thick nickel film to seal MEMS structures at the wafer level. The package is fabricated in a three-mask process by electroplating a 40 micro-meter thick nickel film over an 8 micro-meter sacrificial photoresist that is removed prior to package sealing. Implementation of electrical feedthroughs in this process requires no planarization. The large release channel enables an 800x800 micro-meter package to be released in less than three hours. Several mechanisms, based upon localized melting and lead/tin solder bumping, for sealing the release channel have been investigated. We have also developed Pirani gauges, integrated with this package, which can be used to establish the hermeticity of the different sealing technologies. They have measured a sealing pressure of approximately 1.5 Torr. Our work differs from previous Pirani gauges in that we utilize a novel doubly anchored structure that stiffens the structural membrane while not substantially degrading performance in order to measure fine leak rates.

  17. MEMS CHIP CO2 SENSOR FOR BUILDING SYSTEMS INTEGRATION

    SciTech Connect (OSTI)

    Anton Carl Greenwald

    2005-09-14

    The objective of this research was to develop an affordable, reliable sensor to enable demand controlled ventilation (DCV). A significant portion of total energy consumption in the United States is used for heating or air conditioning (HVAC) buildings. To assure occupant safety and fresh air levels in large buildings, and especially those with sealed windows, HVAC systems are frequently run in excess of true requirements as automated systems cannot now tell the occupancy level of interior spaces. If such a sensor (e.g. thermostat sized device) were available, it would reduce energy use between 10 and 20% in such buildings. A quantitative measure of ''fresh air'' is the concentration of carbon dioxide (CO{sub 2}) present. An inert gas, CO{sub 2} is not easily detected by chemical sensors and is usually measured by infrared spectroscopy. Ion Optics research developed a complete infrared sensor package on a single MEMS chip. It contains the infrared (IR) source, IR detector and IR filter. The device resulting from this DOE sponsored research has sufficient sensitivity, lifetime, and drift rate to meet the specifications of commercial instrument manufacturers who are now testing the device for use in their building systems.

  18. Self-limiting excitation of MEMS devices with surface electrodes

    E-Print Network [OSTI]

    Pavel Kornilovitch; Robert Walmsley

    2013-04-03

    An excitation method for MEMS devices with planar electrodes is described. The stationary part of the device (the stator) consists of three electrode arrays arranged in the 'ABCABC' order. 'A', 'B', and 'C' carry time-independent potentials and together form a spatially-periodic electrostatic profile. The moving part of the device (the translator) has two electrode arrays 'ababab', with 'a' and 'b' carrying time-dependent out-of-phase voltages. When the frequency of the time-dependent voltage is close to the natural frequency of the spring-mass system, the translator is driven into resonance. By adjusting the spatial phase of the stationary profile, the driving force on the translator can be maximized for any equilibrium position. Physical misalignment between the stator and translator resulting from imperfect fabrication can be corrected electrically. A dynamical equation describing translator motion is derived and analyzed for resonant and parametric driving. In both cases, the driving force depends on the translator displacement in a periodic fashion. Such nonlinearity of the driving force results in self-stabilization of forced oscillations. This property has implications for the stability of vibratory gyroscopes.

  19. Final report : compliant thermo-mechanical MEMS actuators, LDRD #52553.

    SciTech Connect (OSTI)

    Walraven, Jeremy Allen; Baker, Michael Sean; Headley, Thomas Jeffrey; Plass, Richard Anton

    2004-12-01

    Thermal actuators have proven to be a robust actuation method in surface-micromachined MEMS processes. Their higher output force and lower input voltage make them an attractive alternative to more traditional electrostatic actuation methods. A predictive model of thermal actuator behavior has been developed and validated that can be used as a design tool to customize the performance of an actuator to a specific application. This tool has also been used to better understand thermal actuator reliability by comparing the maximum actuator temperature to the measured lifetime. Modeling thermal actuator behavior requires the use of two sequentially coupled models, the first to predict the temperature increase of the actuator due to the applied current and the second to model the mechanical response of the structure due to the increase in temperature. These two models have been developed using Matlab for the thermal response and ANSYS for the structural response. Both models have been shown to agree well with experimental data. In a parallel effort, the reliability and failure mechanisms of thermal actuators have been studied. Their response to electrical overstress and electrostatic discharge has been measured and a study has been performed to determine actuator lifetime at various temperatures and operating conditions. The results from this study have been used to determine a maximum reliable operating temperature that, when used in conjunction with the predictive model, enables us to design in reliability and customize the performance of an actuator at the design stage.

  20. Ultrananocrystalline and nanocrystalline diamond thin films for NEMS/MEMS applications.

    SciTech Connect (OSTI)

    Sumant, A. V.; Auciello, O.; Carpick, R. W.; Srinivasan, S.; Butler, J. E. (Center for Nanoscale Materials); ( MSD); ( PSC-USR)

    2010-04-01

    There has been a tireless quest by the designers of micro- and nanoelectro mechanical systems (MEMS/NEMS) to find a suitable material alternative to conventional silicon. This is needed to develop robust, reliable, and long-endurance MEMS/NEMS with capabilities for working under demanding conditions, including harsh environments, high stresses, or with contacting and sliding surfaces. Diamond is one of the most promising candidates for this because of its superior physical, chemical, and tribomechanical properties. Ultrananocrystalline diamond (UNCD) and nanocrystalline diamond (NCD) thin films, the two most studied forms of diamond films in the last decade, have distinct growth processes and nanostructures but complementary properties. This article reviews the fundamental and applied science performed to understand key aspects of UNCD and NCD films, including the nucleation and growth, tribomechanical properties, electronic properties, and applied studies on integration with piezoelectric materials and CMOS technology. Several emerging diamond-based MEMS/NEMS applications, including high-frequency resonators, radio frequency MEMS and photonic switches, and the first commercial diamond MEMS product - monolithic diamond atomic force microscopy probes - are discussed.

  1. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 51, NO. 1, JANUARY 2003 271 Reconfigurable Double-Stub Tuners Using MEMS

    E-Print Network [OSTI]

    Papapolymerou, Ioannis "John"

    -stub tuners that utilize electrostatically activated microelectromechanical system (MEMS) switches. The tuners-on-a-chip. Index Terms--Intelligent RF front-ends, reconfigurable tuner, RF microelectromechanical system (MEMS Reconfigurable Double-Stub Tuners Using MEMS Switches for Intelligent RF Front-Ends John Papapolymerou, Member

  2. PHYS 4xx Mem 3 1 2010 by David Boal, Simon Fraser University. All rights reserved; further copying or resale is strictly prohibited.

    E-Print Network [OSTI]

    Boal, David

    PHYS 4xx Mem 3 1 2010 by David Boal, Simon Fraser University. All rights reserved; further copying or resale is strictly prohibited. PHYS 4xx Mem 3 - Mechanical instability and failure When a membrane boundary, Edisk = 4RV. dbl (a) (b) waterwater 2RV RV (a) (b) #12;PHYS 4xx Mem 3 2 2010 by David Boal, Simon

  3. PHYS 4xx Mem 8 1 2010 by David Boal, Simon Fraser University. All rights reserved; further copying or resale is strictly prohibited.

    E-Print Network [OSTI]

    Boal, David

    PHYS 4xx Mem 8 1 2010 by David Boal, Simon Fraser University. All rights reserved; further copying or resale is strictly prohibited. PHYS 4xx Mem 8 - Model for signal propagation (Note: the equation numbers 4xx Mem 8 2 2010 by David Boal, Simon Fraser University. All rights reserved; further copying

  4. PHYS 4xx Mem 7 1 2010 by David Boal, Simon Fraser University. All rights reserved; further copying or resale is strictly prohibited.

    E-Print Network [OSTI]

    Boal, David

    PHYS 4xx Mem 7 1 2010 by David Boal, Simon Fraser University. All rights reserved; further copying or resale is strictly prohibited. PHYS 4xx Mem 7 - The action potential in nerves Shapes of nerve cells in the same direction (in or out) while antiporters are #12;PHYS 4xx Mem 7 2 2010 by David Boal, Simon Fraser

  5. PHYS 4xx Mem 1 1 2010 by David Boal, Simon Fraser University. All rights reserved; further copying or resale is strictly prohibited.

    E-Print Network [OSTI]

    Boal, David

    PHYS 4xx Mem 1 1 2010 by David Boal, Simon Fraser University. All rights reserved; further copying or resale is strictly prohibited. PHYS 4xx Mem 1 - Composition and self-assembly of biomembranes choline ethanolamine glycerol serine #12;PHYS 4xx Mem 1 2 2010 by David Boal, Simon Fraser University. All

  6. PHYS 4xx Mem 2 1 2010 by David Boal, Simon Fraser University. All rights reserved; further copying or resale is strictly prohibited.

    E-Print Network [OSTI]

    Boal, David

    PHYS 4xx Mem 2 1 2010 by David Boal, Simon Fraser University. All rights reserved; further copying or resale is strictly prohibited. PHYS 4xx Mem 2 - Compression and bending resistance In the next few = /a + a. S = xx = yy dp z y x #12;PHYS 4xx Mem 2 2 2010 by David Boal, Simon Fraser University. All

  7. IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 10, NO. 3, MAY/JUNE 2004 629 The Application of MEMS Technology for

    E-Print Network [OSTI]

    The Application of MEMS Technology for Adaptive Optics in Vision Science Nathan Doble and David R. Williams using microelectromechanical systems (MEMS) has been actively pursued. This paper explains the chal- lenges in high-resolution imaging of the human eye and details how MEMS technology has been used

  8. Appears in Proceedings of the 4th Symposium on Operating Systems Design and Implementation, 2000 Operating System Management of MEMS-based Storage Devices

    E-Print Network [OSTI]

    Operating System Management of MEMS-based Storage Devices John Linwood GriÆn, Steven W. Schlosser, Gregory R. Ganger, David F. Nagle Carnegie Mellon University Abstract MEMS-based storage devices promise signi#12 and contrasts these two storage technologies and ex- plores how the physical characteristics of MEMS- based

  9. IEEE MICROWAVE AND GUIDED WAVE LETTERS, VOL. 10, NO. 10, OCTOBER 2000 415 K-Band 3-Bit Low-Loss Distributed MEMS Phase

    E-Print Network [OSTI]

    York, Robert A.

    -Loss Distributed MEMS Phase Shifter Yu Liu, Andrea Borgioli, Amit S. Nagra, and Robert A. York Abstract systems (MEMS) capacitive switches. The measured results demonstrate an average 1.7 dB insertion loss. Index Terms--Distributed phase shifter, K-band, MEMS, multi- bit, switches. I. INTRODUCTION

  10. 1.3 Towards MEMS Probes for Intracellular Y. Hanein, K. F. Bhringer, R. C. Wyeth, and A. O. D. Willows,

    E-Print Network [OSTI]

    1.3 Towards MEMS Probes for Intracellular Recording Y. Hanein, K. F. BÎhringer, R. C. Wyeth, and A the complex interactions of brain cells. Recent interest in microelectromechanical systems (MEMS) and in particular in bio- MEMS research has led to miniaturization of microelectrodes for ex- tracellular neuronal

  11. Amplitude saturation of MEMS resonators explained by autoparametric resonance This article has been downloaded from IOPscience. Please scroll down to see the full text article.

    E-Print Network [OSTI]

    Hulshof, Joost

    Amplitude saturation of MEMS resonators explained by autoparametric resonance This article has been. Microeng. 20 (2010) 105012 (15pp) doi:10.1088/0960-1317/20/10/105012 Amplitude saturation of MEMS This paper describes a phenomenon that limits the power handling of MEMS resonators. It is observed

  12. Intracellular Neuronal Recording with High Aspect Ratio MEMS Probes Yael Hanein*, U. Lang*, J. Theobald**, R. Wyeth**, T. Daniel**, A. O. D. Willows**, D. D.

    E-Print Network [OSTI]

    Daniel, Tom

    Intracellular Neuronal Recording with High Aspect Ratio MEMS Probes Yael Hanein*, U. Lang*, J. INTRODUCTION Extensive work in recent years has shown the potential of Micro-Electro-Mechanical Systems (MEMS) for neurological and electrochemical sensing applications. MEMS devices are particularly promising due

  13. Proc. IEEE Workshop on Micro Electro Mechanical Structures (MEMS), San Diego, CA, February 1996. SINGLECRYSTAL SILICON ACTUATOR ARRAYS FOR MICRO MANIPULATION TASKS

    E-Print Network [OSTI]

    Richardson, David

    Proc. IEEE Workshop on Micro Electro Mechanical Structures (MEMS), San Diego, CA, February 1996://www.cs.cornell.edu/Info/People/karl/MicroActuators ABSTRACT Arrays of electrostatic MEMS actuators have been fab­ ricated using a modified, multi­layer SCREAM, sorting, and assembly of small parts. INTRODUCTION We investigate MEMS actuator arrays for micro manip

  14. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 16, NO. 5, OCTOBER 2007 1219 Design and Operation of a MEMS-Based Material

    E-Print Network [OSTI]

    Espinosa, Horacio D.

    , and operation of a novel microelectromechanical-systems (MEMS)-based material testing system used for in situ systems that possess superior resolution and accuracy. Microelectromechanical systems (MEMS) offerJOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 16, NO. 5, OCTOBER 2007 1219 Design and Operation

  15. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 12, NO. 3, JUNE 2003 355 The Design and Operation of a MEMS Differential

    E-Print Network [OSTI]

    Allen, Leslie H.

    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 12, NO. 3, JUNE 2003 355 The Design and Operation of a MEMS Differential Scanning Nanocalorimeter for High-Speed Heat Capacity Measurements of Ultrathin Films Eric A. Olson, Mikhail Yu. Efremov, Ming Zhang, Zishu Zhang, and Leslie H. Allen Abstract--A MEMS

  16. IEEE SENSORS JOURNAL, VOL. 8, NO. 12, DECEMBER 2008 2027 A High-Resolution MEMS Piezoelectric Strain

    E-Print Network [OSTI]

    Horowitz, Roberto

    IEEE SENSORS JOURNAL, VOL. 8, NO. 12, DECEMBER 2008 2027 A High-Resolution MEMS Piezoelectric strain sensor. Using microelectromechanical systems (MEMS) technology, ZnO piezo- electric microsensors Strain Sensor for Structural Vibration Detection Stanley Kon, Member, IEEE, and Roberto Horowitz, Member

  17. A MEMS device for In Situ TEM/AFM/SEM/STM Testing of Carbon Nanotubes and Nanowires

    E-Print Network [OSTI]

    Espinosa, Horacio D.

    A MEMS device for In Situ TEM/AFM/SEM/STM Testing of Carbon Nanotubes and Nanowires H. D. Espinosa, Evanston, IL 60208-3111, USA ABSTRACT A MEMS device for in-situ TEM/AFM/SEM/STM testing of nano structures of a comb-drive actuator, specimen stage and a beam-type load sensor. The load and displacement

  18. 1438 IEEE PHOTONICS TECHNOLOGY LETTERS, VOL. 16, NO. 6, JUNE 2004 First Demonstration of a MEMS Tunable

    E-Print Network [OSTI]

    MacDonald, Noel C.

    1438 IEEE PHOTONICS TECHNOLOGY LETTERS, VOL. 16, NO. 6, JUNE 2004 First Demonstration of a MEMSB of device gain through 11 nm of tuning. Index Terms--Laser amplifiers, microelectromechanical (MEMS) devices been investigated [4], but a more promising method is microelectromechanical (MEMS) tuning

  19. MEMS-based arrays of micro ion traps for quantum simulation scaling.

    SciTech Connect (OSTI)

    Berkeland, Dana J. (Los Alamos National Laboratory); Blain, Matthew Glenn; Jokiel, Bernhard, Jr.

    2006-11-01

    In this late-start Tier I Seniors Council sponsored LDRD, we have designed, simulated, microfabricated, packaged, and tested ion traps to extend the current quantum simulation capabilities of macro-ion traps to tens of ions in one and two dimensions in monolithically microfabricated micrometer-scaled MEMS-based ion traps. Such traps are being microfabricated and packaged at Sandia's MESA facility in a unique tungsten MEMS process that has already made arrays of millions of micron-sized cylindrical ion traps for mass spectroscopy applications. We define and discuss the motivation for quantum simulation using the trapping of ions, show the results of efforts in designing, simulating, and microfabricating W based MEMS ion traps at Sandia's MESA facility, and describe is some detail our development of a custom based ion trap chip packaging technology that enables the implementation of these devices in quantum physics experiments.

  20. Significance of the Casimir force and surface roughness for actuation dynamics of MEMS

    E-Print Network [OSTI]

    Wijnand Broer; George Palasantzas; Jasper Knoester; Vitaly B. Svetovoy

    2013-03-14

    Using the measured optical response and surface roughness topography as inputs, we perform realistic calculations of the combined effect of Casimir and electrostatic forces on the actuation dynamics of micro-electromechanical systems (MEMS). In contrast with the expectations, roughness can influence MEMS dynamics even at distances between bodies significantly larger than the root-mean-square roughness. This effect is associated with statistically rare high asperities that can be locally close to the point of contact. It is found that, even though surface roughness appears to have a detrimental effect on the availability of stable equilibria, it ensures that those equilibria can be reached more easily than in the case of flat surfaces. Hence our findings play a principal role for the stability of microdevices such as vibration sensors, switches, and other related MEM architectures operating at distances below 100 nm.

  1. Fast and Precise 3D Computation of Capacitance of Parallel Narrow Beam MEMS Structures

    E-Print Network [OSTI]

    N. Majumdar; S. Mukhopadhyay

    2007-03-06

    Efficient design and performance of electrically actuated MEMS devices necessitate accurate estimation of electrostatic forces on the MEMS structures. This in turn requires thorough study of the capacitance of the structures and finally the charge density distribution on the various surfaces of a device. In this work, nearly exact BEM solutions have been provided in order to estimate these properties of a parallel narrow beam structure found in MEMS devices. The effect of three-dimensionality, which is an important aspect for these structures, and associated fringe fields have been studied in detail. A reasonably large parameter space has been covered in order to follow the variation of capacitance with various geometric factors. The present results have been compared with those obtained using empirical parametrized expressions keeping in view the requirement of the speed of computation. The limitations of the empirical expressions have been pointed out and possible approaches of their improvement have been discussed.

  2. International Affairs International Services

    E-Print Network [OSTI]

    Meyers, Steven D.

    Chemistry Business Administration Electrical EngineeringI International Affairs International Services Fall 0.2% Denmark 4 0.3% Dominica 2 0.1% Dominican Republic 3 0.2% Ecuador 10 0.7% Egypt 10 0.7% El

  3. International Policy International Development

    E-Print Network [OSTI]

    Watson, Andrew

    Research Strategy 2006-2009 International Policy Energy Adaptation International Development Coasts Change Research. Our strategy builds upon our previous work on integrated assessment, energy, adaptation of time. In this spirit, the Centre reconfirms its vision statement: "The Tyndall Centre is the UK network

  4. Ultrasensitive measurement of MEMS cantilever displacement sensitivity below the shot noise limit

    SciTech Connect (OSTI)

    Pooser, Raphael C; Lawrie, Benjamin J

    2015-01-01

    The displacement of micro-electro-mechanical-systems (MEMs) cantilevers is used to measure a variety of phe- nomena in devices ranging from force microscopes for single spin detection[1] to biochemical sensors[2] to un- cooled thermal imaging systems[3]. The displacement readout is often performed optically with segmented de- tectors or interference measurements. Until recently, var- ious noise sources have limited the minimum detectable displacement in MEMs systems, but it is now possible to minimize all other sources[4] so that the noise level of the coherent light eld, called the shot noise limit (SNL), becomes the dominant source. Light sources dis- playing quantum-enhanced statistics below this limit are available[5, 6], with applications in gravitational wave astronomy[7] and bioimaging[8], but direct displacement measurements of MEMS cantilevers below the SNL have been impossible until now. Here, we demonstrate the rst direct measurement of a MEMs cantilever displace- ment with sub-SNL sensitivity, thus enabling ultratrace sensing, imaging, and microscopy applications. By com- bining multi-spatial-mode quantum light sources with a simple dierential measurement, we show that sub-SNL MEMs displacement sensitivity is highly accessible com- pared to previous eorts that measured the displacement of macroscopic mirrors with very distinct spatial struc- tures crafted with multiple optical parametric ampliers and locking loops[9]. We apply this technique to a com- mercially available microcantilever in order to detect dis- placements 60% below the SNL at frequencies where the microcantilever is shot-noise-limited. These results sup- port a new class of quantum MEMS sensor whose ulti- mate signal to noise ratio is determined by the correla- tions possible in quantum optics systems.

  5. Improved Design of Optical MEMS Using the SUMMiT Fabrication Process

    SciTech Connect (OSTI)

    Michalicek, M.A.; Comtois, J.H.; Barron, C.C.

    1997-12-31

    This paper describes the design and fabrication of optical Microelectromechanical Systems (MEMS) devices using the Sandia Ultra planar Multilevel MEMS Technology (SUMMiT) fabrication process. This state of the art process, offered by Sandia National Laboratories, provides unique and very advantageous features which make it ideal for optical devices. This enabling process permits the development of micromirror devices with near ideal characteristics which have previously been unrealizable in standard polysilicon processes. This paper describes such characteristics as elevated address electrodes, individual address wiring beneath the device, planarized mirror surfaces, unique post-process metallization, and the best active surface area to date.

  6. Patterning of nanocrystalline diamond films for diamond microstructures useful in MEMS and other devices

    DOE Patents [OSTI]

    Gruen, Dieter M. (Downers Grove, IL); Busmann, Hans-Gerd (Bremen, DE); Meyer, Eva-Maria (Bremen, DE); Auciello, Orlando (Bolingbrook, IL); Krauss, Alan R. (late of Naperville, IL); Krauss, Julie R. (Naperville, IL)

    2004-11-02

    MEMS structure and a method of fabricating them from ultrananocrystalline diamond films having average grain sizes of less than about 10 nm and feature resolution of less than about one micron . The MEMS structures are made by contacting carbon dimer species with an oxide substrate forming a carbide layer on the surface onto which ultrananocrystalline diamond having average grain sizes of less than about 10 nm is deposited. Thereafter, microfabrication process are used to form a structure of predetermined shape having a feature resolution of less than about one micron.

  7. Resolution Limits for Resonant Mems Sensors Based on Discrete Relay Feedback Techniques

    E-Print Network [OSTI]

    Juillard, J; Domínguez, M; Pons, Joan; Ricart, J

    2007-01-01

    This paper is devoted to the analysis of resonant MEMS sensors based on discrete relay feedback techniques. One drawback of such techniques is that some synchronization usually occurs between the discrete part and the continuous part of the system: this results in sensor responses that are very similar to the curves known as devil's staircases, i.e. the frequency does not vary smoothly with the sensor's input. The main contribution of this paper is a theoretical calculation of the resolution of such systems. The resolutions of two existing resonant MEMS architectures are then calculated and these results are discussed.

  8. Stresa, Italy, 26-28 April 2006 RECENT DEVELOPMENTS IN MEMS-BASED MICRO FUEL CELLS

    E-Print Network [OSTI]

    Boyer, Edmond

    Stresa, Italy, 26-28 April 2006 RECENT DEVELOPMENTS IN MEMS-BASED MICRO FUEL CELLS Tristan Pichonat ABSTRACT Micro fuel cells (µ-FC) represent promising power sources for portable applications. Today, one describes the latest developments of a new porous silicon- based miniature fuel cell. Using a silane grafted

  9. Calibration of Multi-Axis MEMS Force Sensors Using the Shape from Motion Method

    E-Print Network [OSTI]

    Sun, Yu

    Calibration of Multi-Axis MEMS Force Sensors Using the Shape from Motion Method Yu Sun, Keekyoung Inst. of Robotics and Intelligent Systems University of Toronto University of Minnesota Swiss Federal systems) capacitive force sensor with strict linearity and a new sensor calibration method for micro-sensors

  10. Intelligent Sensor Validation and Fusion with distributed "MEMS Dust" Sensors Shijun Qiu*

    E-Print Network [OSTI]

    Agogino, Alice M.

    Intelligent Sensor Validation and Fusion with distributed "MEMS Dust" Sensors (Abstract) Shijun Qiu;References 1. Alag, S, K. Goebel, and A.M. Agogino, "A Framework for Intelligent Sensor Validation, Sensor, 1020 2. Alag, S, A.M. Agogino, and M.. Morjaria, " A Methodology for Intelligent Sensor Measurement

  11. The application of nanosecond-pulsed laser welding technology in MEMS packaging with a shadow mask$

    E-Print Network [OSTI]

    Lin, Liwei

    The application of nanosecond-pulsed laser welding technology in MEMS packaging with a shadow mask wiring is not pre- ferred. A comprehensive review on laser welding was given in [6]. The laser welding of laser welding is to create the liquid pool by absorption of incident radiation, allow it to grow

  12. ADAPTIVE MODELING AND DESIGN OF PACKAGING MICROSYSTEMS AND MEMS FOR WIRELESS COMMUNICATION MODULES

    E-Print Network [OSTI]

    Tentzeris, Manos

    ADAPTIVE MODELING AND DESIGN OF PACKAGING MICROSYSTEMS AND MEMS FOR WIRELESS COMMUNICATION MODULES of the most important issues in modern packaging design and simulation of structures for use in wireless. INTRODUCTION Traditional packaging systems are used for both mechanical and thermal stability as well

  13. MEMS-based fuel cells with integrated catalytic fuel processor and method thereof

    SciTech Connect (OSTI)

    Jankowski, Alan F.; Morse, Jeffrey D.; Upadhye, Ravindra S.; Havstad, Mark A.

    2011-08-09

    Described herein is a means to incorporate catalytic materials into the fuel flow field structures of MEMS-based fuel cells, which enable catalytic reforming of a hydrocarbon based fuel, such as methane, methanol, or butane. Methods of fabrication are also disclosed.

  14. MEM 380/800 Mechatronics 2 Mechanisms and Algorithms Lab: Lego Ratchets, Drives and Gearing

    E-Print Network [OSTI]

    Oh, Paul

    MEM 380/800 ­ Mechatronics 2 ­ Mechanisms and Algorithms Lab: Lego Ratchets, Drives and Gearing #12;Lab Experiments 1. Introduction to Lego Gears (example connections) 2. Planetary Gears (outside and inside revolutions) 3. Bevel Gears 4. Worm Gears 5. Friction Drive 6. Rack-and-Pinion 7. Putting it all

  15. Micromachining of non-fouling coatings for bio-MEMS applications Yael Haneina,*

    E-Print Network [OSTI]

    Hanein, Yael

    Micromachining of non-fouling coatings for bio-MEMS applications Yael Haneina,* , Y. Vickie Panb,1 substrates. The coating has excellent non-fouling properties and good adhesion to various substrate materials cultures and to protect metallic electrodes from protein and cell adhesion. We show that the thin coatings

  16. The Potential of MEMS for Advancing Experiments and Modeling in Cell Mechanics

    E-Print Network [OSTI]

    Espinosa, Horacio D.

    The Potential of MEMS for Advancing Experiments and Modeling in Cell Mechanics O. Loh & A. Vaziri # Society for Experimental Mechanics 2007 Abstract Response to mechanical stimuli largely dictates cellular the hierarchical cell structure. As experimental and model-based investigations in cell mechanics advance

  17. Thermal challenges in MEMS applications: phase change phenomena and thermal bonding processes

    E-Print Network [OSTI]

    Lin, Liwei

    Thermal challenges in MEMS applications: phase change phenomena and thermal bonding processes Liwei, MC 1740, Berkeley, CA 94720, USA Abstract Two thermal challenges for current and next generation generate single, spherical and controllable thermal bubbles with diameters between 2 and 500 mm. Both

  18. Electromechanical Modeling and Simulation of RF MEMS Switches Yong Zhu and Horacio D. Espinosa

    E-Print Network [OSTI]

    Espinosa, Horacio D.

    Electromechanical Modeling and Simulation of RF MEMS Switches Yong Zhu and Horacio D. Espinosa the electromechanical behavior of a fixed-fixed switch. However, in some practical applications, multi and discuss their electromechanical performances. The switch, bottom electrode and surrounding air were all

  19. MICROMACHINED 3-D GLASS-BLOWN WINEGLASS STRUCTURES FOR VIBRATORY MEMS APPLICATIONS

    E-Print Network [OSTI]

    Chen, Zhongping

    improvement in time constant over the complete glass-blown sphere. KEYWORDS: 3-D micro-machining, micro glass-blowingMICROMACHINED 3-D GLASS-BLOWN WINEGLASS STRUCTURES FOR VIBRATORY MEMS APPLICATIONS D. Senkal, I level glassblowing and blow molding techniques have a potential to provide low surface roughness, highly

  20. Fabrication of Diffractive Optical Elements for an Integrated Compact Optical-MEMS Laser Scanner

    SciTech Connect (OSTI)

    WENDT,JOEL R.; KRYGOWSKI,T.W.; VAWTER,GREGORY A.; SPAHN,OLGA B.; SWEATT,WILLIAM C.; WARREN,MIAL E.; REYES,DAVID NMN

    2000-07-13

    The authors describe the microfabrication of a multi-level diffractive optical element (DOE) onto a micro-electromechanical system (MEMS) as a key element in an integrated compact optical-MEMS laser scanner. The DOE is a four-level off-axis microlens fabricated onto a movable polysilicon shuttle. The microlens is patterned by electron beam lithography and etched by reactive ion beam etching. The DOE was fabricated on two generations of MEMS components. The first generation design uses a shuttle suspended on springs and displaced by a linear rack. The second generation design uses a shuttle guided by roller bearings and driven by a single reciprocating gear. Both the linear rack and the reciprocating gear are driven by a microengine assembly. The compact design is based on mounting the MEMS module and a vertical cavity surface emitting laser (VCSEL) onto a fused silica substrate that contains the rest of the optical system. The estimated scan range of the system is {+-}4{degree} with a spot size of 0.5 mm.

  1. Residual stress and self-assembly during deposition and etching of MEMS 

    E-Print Network [OSTI]

    Mani, Sathyanarayanan

    2002-01-01

    with no residual stresses. Residual stresses are investigated as a means of self-assembling MEMS and NEMS during material deposition and etching. The assembly of two components is considered: one component is subjected to deposition or etching and is modeled...

  2. Anchor deformations drive limit cycle oscillations in interferometrically transduced MEMS beams

    E-Print Network [OSTI]

    Rand, Richard H.

    Anchor deformations drive limit cycle oscillations in interferometrically transduced MEMS beams, the mechanism by which the thermal stresses drive limit cycle oscillations of initially flat beams was unknown element method Resonator Dynamical systems Limit cycle Hopf a b s t r a c t A micro-scale resonator

  3. Compact standing-wave transform spectrometer based on integrated MEMS mirror and thin-film photodetector

    E-Print Network [OSTI]

    Miller, David A. B.

    Compact standing-wave transform spectrometer based on integrated MEMS mirror and thin an integrated standing-wave Fourier-transform spectrometer, 17 × 13 × 2 mm, with 32 nm spectral resolution spectrometer, based on the 1-D standing-wave transform spectrometer architecture [1], with an integrated

  4. Design and Development of Novel Electroplating Spring Frame Mems Structure Specimens for the Microtensile Testing of Thin Film Materials

    E-Print Network [OSTI]

    Lin, Ming-Tzer; Chiang, Chung-Hsun

    2007-01-01

    Microelectromechanical systems (MEMS) technologies are developing rapidly with increasing study of the design, fabrication and commercialization of microscale systems and devices. Accurate mechanical properties are important for successful design and development of MEMS. We have demonstrated here a novel electroplating spring frame MEMS Structure Specimen integrates pin-pin align holes, misalignment compensate spring structure frame, load sensor beam and freestanding thin film. The specimen can be fit into a specially designed microtensile apparatus which is capable of carrying out a series of tests on sub-micro scale freestanding thin films.

  5. A dynamic system matching technique for improving the accuracy of MEMS gyroscopes

    SciTech Connect (OSTI)

    Stubberud, Peter A.; Stubberud, Stephen C.; Stubberud, Allen R.

    2014-12-10

    A classical MEMS gyro transforms angular rates into electrical values through Euler's equations of angular rotation. Production models of a MEMS gyroscope will have manufacturing errors in the coefficients of the differential equations. The output signal of a production gyroscope will be corrupted by noise, with a major component of the noise due to the manufacturing errors. As is the case of the components in an analog electronic circuit, one way of controlling the variability of a subsystem is to impose extremely tight control on the manufacturing process so that the coefficient values are within some specified bounds. This can be expensive and may even be impossible as is the case in certain applications of micro-electromechanical (MEMS) sensors. In a recent paper [2], the authors introduced a method for combining the measurements from several nominally equal MEMS gyroscopes using a technique based on a concept from electronic circuit design called dynamic element matching [1]. Because the method in this paper deals with systems rather than elements, it is called a dynamic system matching technique (DSMT). The DSMT generates a single output by randomly switching the outputs of several, nominally identical, MEMS gyros in and out of the switch output. This has the effect of 'spreading the spectrum' of the noise caused by the coefficient errors generated in the manufacture of the individual gyros. A filter can then be used to eliminate that part of the spread spectrum that is outside the pass band of the gyro. A heuristic analysis in that paper argues that the DSMT can be used to control the effects of the random coefficient variations. In a follow-on paper [4], a simulation of a DSMT indicated that the heuristics were consistent. In this paper, analytic expressions of the DSMT noise are developed which confirm that the earlier conclusions are valid. These expressions include the various DSMT design parameters and, therefore, can be used as design tools for DSMT systems.

  6. Source: SPIE 11th Annual International Symposium on Smart Structures and Materials, San Diego, CA, USA, March 14-18, 2004

    E-Print Network [OSTI]

    Lynch, Jerome P.

    Source: SPIE 11th Annual International Symposium on Smart Structures and Materials, San Diego, CA testing of the Alamosa Canyon Bridge in southern New Mexico. During testing, the bridge was instrumented with wireless sensing units and MEMS accelerometers to monitor the bridge's response to modal hammer blows

  7. Fundamentals and application of materials integration for low-power piezoelectrically actuated ultra-nanocrystalline diamond MEMS/NEMS.

    SciTech Connect (OSTI)

    Auciello, O.; Srinivasan, S.; Hiller, J.; Kabius, B. (Center for Nanoscale Materials); ( MSD)

    2009-01-01

    Most current micro/nanoelectromechanical systems (MEMS/NEMS) are based on silicon. However, silicon exhibits relatively poor mechanical/tribological properties, compromising applications to several projected MEMS/NEMS devices, particularly those that require materials with high Young's modulus for MEMS resonators or low surface adhesion forces for MEMS/NEMS working in conditions with extensive surface contact. Diamond films with superior mechanical/tribological properties provide an excellent alternative platform material. Ultrananocrystalline diamond (UNCD{cflx W}) in film form with 2-5 nm grains exhibits excellent properties for high-performance MEMS/NEMS devices. Concurrently, piezoelectric Pb(Zr{sub x}Ti{sub 1-x})O{sub 3} (PZT) films provide high sensitivity/low electrical noise for sensing/high-force actuation at relatively low voltages. Therefore, integration of PZT and UNCD films provides a high-performance platform for advanced MEMS/NEMS devices. This paper describes the bases of such integration and demonstration of low voltage piezoactuated hybrid PZT/UNCD cantilevers.

  8. Mechanical behavior simulation of MEMS-based cantilever beam using COMSOL multiphysics

    SciTech Connect (OSTI)

    Acheli, A. Serhane, R.

    2015-03-30

    This paper presents the studies of mechanical behavior of MEMS cantilever beam made of poly-silicon material, using the coupling of three application modes (plane strain, electrostatics and the moving mesh) of COMSOL Multi-physics software. The cantilevers playing a key role in Micro Electro-Mechanical Systems (MEMS) devices (switches, resonators, etc) working under potential shock. This is why they require actuation under predetermined conditions, such as electrostatic force or inertial force. In this paper, we present mechanical behavior of a cantilever actuated by an electrostatic force. In addition to the simplification of calculations, the weight of the cantilever was not taken into account. Different parameters like beam displacement, electrostatics force and stress over the beam have been calculated by finite element method after having defining the geometry, the material of the cantilever model (fixed at one of ends but is free to move otherwise) and his operational space.

  9. Solution-verified reliability analysis and design of bistable MEMS using error estimation and adaptivity.

    SciTech Connect (OSTI)

    Eldred, Michael Scott; Subia, Samuel Ramirez; Neckels, David; Hopkins, Matthew Morgan; Notz, Patrick K.; Adams, Brian M.; Carnes, Brian; Wittwer, Jonathan W.; Bichon, Barron J.; Copps, Kevin D.

    2006-10-01

    This report documents the results for an FY06 ASC Algorithms Level 2 milestone combining error estimation and adaptivity, uncertainty quantification, and probabilistic design capabilities applied to the analysis and design of bistable MEMS. Through the use of error estimation and adaptive mesh refinement, solution verification can be performed in an automated and parameter-adaptive manner. The resulting uncertainty analysis and probabilistic design studies are shown to be more accurate, efficient, reliable, and convenient.

  10. X-ray diffraction characterization of suspended structures forMEMS applications

    SciTech Connect (OSTI)

    Goudeau, P.; Tamura, N.; Lavelle, B.; Rigo, S.; Masri, T.; Bosseboeuf, A.; Sarnet, T.; Petit, J.-A.; Desmarres, J.-M.

    2005-09-15

    Mechanical stress control is becoming one of the major challenges for the future of micro and nanotechnologies. Micro scanning X-ray diffraction is one of the promising techniques that allows stress characterization in such complex structures at sub micron scales. Two types of MEMS structure have been studied: a bilayer cantilever composed of a gold film deposited on poly-silicon and a boron doped silicon bridge. X-ray diffraction results are discussed in view of numerical simulation experiments.

  11. Micro-Hotplates for Thermal Characterisation of Structural Materials of Mems

    E-Print Network [OSTI]

    P. Furjes; P. Csikvari; I. Bársony; Cs. Ducso

    2008-01-07

    Accurate knowledge of mechanical and thermal properties of structural materials used in MEMS is essential for optimum geometric and functional design. The extraction of precise physical properties is rather complicated due to the size effects, the complexity of the structures and the variations of formation processes. This work is intended to determine the thermal properties of silicon-nitride and diamond layers applied in thermal sensor structures by analyzing thermal responses of a multilayer micro-heater structure.

  12. A domain adaptive stochastic collocation approach for analysis of MEMS under uncertainties

    SciTech Connect (OSTI)

    Agarwal, Nitin [Department of Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Avenue, Urbana, IL 61801 (United States); Aluru, N.R. [Department of Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Avenue, Urbana, IL 61801 (United States)], E-mail: aluru@uiuc.edu

    2009-11-01

    This work proposes a domain adaptive stochastic collocation approach for uncertainty quantification, suitable for effective handling of discontinuities or sharp variations in the random domain. The basic idea of the proposed methodology is to adaptively decompose the random domain into subdomains. Within each subdomain, a sparse grid interpolant is constructed using the classical Smolyak construction [S. Smolyak, Quadrature and interpolation formulas for tensor products of certain classes of functions, Soviet Math. Dokl. 4 (1963) 240-243], to approximate the stochastic solution locally. The adaptive strategy is governed by the hierarchical surpluses, which are computed as part of the interpolation procedure. These hierarchical surpluses then serve as an error indicator for each subdomain, and lead to subdivision whenever it becomes greater than a threshold value. The hierarchical surpluses also provide information about the more important dimensions, and accordingly the random elements can be split along those dimensions. The proposed adaptive approach is employed to quantify the effect of uncertainty in input parameters on the performance of micro-electromechanical systems (MEMS). Specifically, we study the effect of uncertain material properties and geometrical parameters on the pull-in behavior and actuation properties of a MEMS switch. Using the adaptive approach, we resolve the pull-in instability in MEMS switches. The results from the proposed approach are verified using Monte Carlo simulations and it is demonstrated that it computes the required statistics effectively.

  13. MEMS Lubrication by In-Situ Tribochemical Reactions From the Vapor Phase.

    SciTech Connect (OSTI)

    Dugger, Michael T.; Asay, David B.; Kim, Seong H.

    2008-01-01

    Vapor Phase Lubrication (VPL) of silicon surfaces with pentanol has been demonstrated. Two potential show stoppers with respect to application of this approach to real MEMS devices have been investigated. Water vapor was found to reduce the effectiveness of VPL with alcohol for a given alcohol concentration, but the basic reaction mechanism observed in water-free environments is still active, and devices operated much longer in mixed alcohol and water vapor environments than with chemisorbed monolayer lubricants alone. Complex MEMS gear trains were successfully lubricated with alcohol vapors, resulting in a factor of 104 improvement in operating life without failure. Complex devices could be made to fail if operated at much higher frequencies than previously used, and there is some evidence that the observed failure is due to accumulation of reaction products at deeply buried interfaces. However, if hypothetical reaction mechanisms involving heated surfaces are valid, then the failures observed at high frequency may not be relevant to operation at normal frequencies. Therefore, this work demonstrates that VPL is a viable approach for complex MEMS devices in conventional packages. Further study of the VPL reaction mechanisms are recommended so that the vapor composition may be optimized for low friction and for different substrate materials with potential application to conventionally fabricated, metal alloy parts in weapons systems. Reaction kinetics should be studied to define effective lubrication regimes as a function of the partial pressure of the vapor phase constituent, interfacial shear rate, substrate composition, and temperature.

  14. Frequency stabilization in nonlinear MEMS and NEMS oscillators

    DOE Patents [OSTI]

    Lopez, Omar Daniel; Antonio, Dario

    2014-09-16

    An illustrative system includes an amplifier operably connected to a phase shifter. The amplifier is configured to amplify a voltage from an oscillator. The phase shifter is operably connected to a driving amplitude control, wherein the phase shifter is configured to phase shift the amplified voltage and is configured to set an amplitude of the phase shifted voltage. The oscillator is operably connected to the driving amplitude control. The phase shifted voltage drives the oscillator. The oscillator is at an internal resonance condition, based at least on the amplitude of the phase shifted voltage, that stabilizes frequency oscillations in the oscillator.

  15. Amnesty International

    SciTech Connect (OSTI)

    None

    2006-04-11

    Martin Ennals est secrétaire général d'Amnesty International et fait un discours sur les droits de l'homme

  16. Amnesty International

    ScienceCinema (OSTI)

    None

    2011-04-25

    Martin Ennals est secrétaire général d'Amnesty International et fait un discours sur les droits de l'homme

  17. ENGINEERING INTERNATIONAL

    E-Print Network [OSTI]

    University of Technology, Sydney

    COURSE GUIDE 2013 UTS: ENGINEERING INTERNATIONAL UNDERGRADUATE w w w.eng.uts.edu.au #12;2 / ENGINEERING IN AUSTRALIA Internationally, Australian universities have a reputation for high quality research developed close links with many international institutions, particularly in Asia. ENGINEERING IN SYDNEY

  18. Fundamentals and technology for monolithically integrated RF MEMS switches with ultra-nanocrystaline diamond dielectric/CMOS devices.

    SciTech Connect (OSTI)

    Auciello, O.; Sumant, A.; Goldsmith, C.; O'Brien, S.; Sampath, S.; Gudeman, C; Wang, W.; Hwang, J.; Swonger, J.; Carlisle, J.; Balachandran, S.; MEMtronics Corp.; Innovative Micro Technology; Lehigh Univ.; Peregrine Semiconductor; Advanced Diamond Technologies

    2010-01-01

    Most current capacitive RF-MEMS switch technology is based on conventional dielectric materials such as SiO{sub 2} and Si{sub 3}N{sub 4}. However, they suffer not only from charging problems but also stiction problems leading to premature failure of an RF-MEMS switch. Ultrananocrystalline diamond (UNCD{sup (R)}) (2-5 nm grains) and nanocrystalline diamond (NCD) (10-100 nm grains) films exhibit one of the highest Young's modulus ({approx} 980-1100 GPa) and demonstrated MEMS resonators with the highest quality factor (Q {ge} 10,000 in air for NCD) today, they also exhibit the lowest force of adhesion among MEMS/NEMS materials ({approx}10 mJ/m{sup 2}-close to van der Waals attractive force for UNCD) demonstrated today. Finally, UNCD exhibits dielectric properties (fast discharge) superior to those of Si and SiO{sub 2}, as shown in this paper. Thus, UNCD and NCD films provide promising platform materials beyond Si for a new generation of important classes of high-performance MEMS/NEMS devices.

  19. Release of MEMS devices with hard-baked polyimide sacrificial Javaneh Boroumand Azad, Imen Rezadad, Janardan Nath, Evan Smith, Robert E. Peale

    E-Print Network [OSTI]

    Peale, Robert E.

    Release of MEMS devices with hard-baked polyimide sacrificial layer Javaneh Boroumand Azad, Imen, Orlando, FL, USA 32816 ABSTRACT Removal of polyimides used as sacrificial layer in fabricating MEMS-step processing. We consider the specific commercial co-developable polyimide ProLift 100 (Brewer Science

  20. http://www.nanowerk.com/news/newsid=6934.php Ads by Google MEMS Design Tata Nano Nano Devices iTrip Nano Nano Optic

    E-Print Network [OSTI]

    Sridhar, Srinivas

    http://www.nanowerk.com/news/newsid=6934.php Ads by Google MEMS Design Tata Nano Nano Devices i generation of combined optical and electronic platforms essential for future computers," added Sridhar-2802 or via email at j.eriksen@neu.edu. Ads by Google MEMS Design Tata Nano Nano Devices iTrip Nano Nano Optic

  1. Presented at ION GNSS 2005 -Long Beach, CA -September 13-16, 2005 Performance Analysis of MEMS IMU/HSGPS/Magnetic

    E-Print Network [OSTI]

    Calgary, University of

    (MEMS) inertial sensor technology constitute an increasingly attractive low cost option for integratedPresented at ION GNSS 2005 - Long Beach, CA - September 13-16, 2005 Performance Analysis of MEMS IMU/HSGPS/Magnetic Sensor Integrated System in Urban Canyons S. Godha, M. G. Petovello, and G

  2. Characterization of A Polymer-Based MEMS Packaging Technique Pejman Monajemi', Paul J. Joseph2, Paul A. Kohl2, Farrokh Ayazi'

    E-Print Network [OSTI]

    Ayazi, Farrokh

    for wafer-level packaging of microelectromechanical systems (MEMS). The packaging process does not impose manufacturing. In many applications, hermiticity is required to isolate the microelectromechanical systems (MEMSCharacterization of A Polymer-Based MEMS Packaging Technique Pejman Monajemi', Paul J. Joseph2

  3. Hybrid connection of RF MEMS and SMT components in an impedance tuner Mehmet Unlu , Kagan Topalli, Halil Ibrahim Atasoy, Simsek Demir, Ozlem Aydin Civi, Tayfun Akin

    E-Print Network [OSTI]

    Akin, Tayfun

    is fabricated on a glass substrate using an in-house surface micromachining process, and the SMT resistors significant as RF MEMS components are strong alternatives of many passive components in a highly integrated RF, the integration of MEMS components with the other active or passive components in the system is unavoidable since

  4. SPICE Level 3 and BSIM3v3.1 characterization of monolithic integrated CMOS-MEMS devices

    SciTech Connect (OSTI)

    Staple, B.D.; Watts, H.A.; Dyck, C.; Griego, A.P.; Hewlett, F.W.; Smith, J.H.

    1998-08-01

    The monolithic integration of MicroElectroMechanical Systems (MEMS) with the driving, controlling, and signal processing electronics promises to improve the performance of micromechanical devices as well as lower their manufacturing, packaging, and instrumentation costs. Key to this integration is the proper interleaving, combining, and customizing of the manufacturing processes to produce functional integrated micromechanical devices with electronics. The authors have developed a MEMS-first monolithic integrated process that first seals the micromechanical devices in a planarized trench and then builds the electronics in a conventional CMOS process. To date, most of the research published on this technology has focused on the performance characteristics of the mechanical portion of the devices, with little information on the attributes of the accompanying electronics. This work attempts to reduce this information void by presenting the results of SPICE Level 3 and BSIM3v3.1 model parameters extracted for the CMOS portion of the MEMS-first process. Transistor-level simulations of MOSFET current, capacitance, output resistance, and transconductance versus voltage using the extracted model parameters closely match the measured data. Moreover, in model validation efforts, circuit-level simulation values for the average gate propagation delay in a 101-stage ring oscillator are within 13--18% of the measured data. In general, the BSIM3v3.1 models provide improved accuracy over the SPICE Level 3 models. These results establish the following: (1) the MEMS-first approach produces functional CMOS devices integrated on a single chip with MEMS devices and (2) the devices manufactured in the approach have excellent transistor characteristics. Thus, the MEMS-first approach renders a solid technology foundation for customers designing in the technology.

  5. Individual addressing of trapped $^{171}$Yb$^+$ ion qubits using a MEMS-based beam steering system

    E-Print Network [OSTI]

    S. Crain; E. Mount; S. Baek; J. Kim

    2014-09-18

    The ability to individually manipulate the increasing number of qubits is one of the many challenges towards scalable quantum information processing with trapped ions. Using micro-mirrors fabricated with micro-electromechanical systems (MEMS) technology, we focus laser beams on individual ions in a linear chain and steer the focal point in two dimensions. We demonstrate sequential single qubit gates on multiple $^{171}$Yb$^+$ qubits and characterize the gate performance using quantum state tomography. Our system features negligible crosstalk to neighboring ions ($< 3\\times 10^{-4}$), and switching speed comparable to typical single qubit gate times ($<$ 2 $\\mu$s).

  6. A New Four States High Deflection Low Actuation Voltage Electrostatic Mems Switch for RF Applications

    E-Print Network [OSTI]

    Robin, Renaud; Segueni, Karim; Millet, Olivier; Buchaillot, Lionel

    2008-01-01

    This paper presents a new electrostatic MEMS (MicroElectroMechanical System) based on a single high reliability totally free flexible membrane. Using four electrodes, this structure enables four states which allowed large deflections (4$\\mu$m) with low actuation voltage (7,5V). This design presents also a good contact force and improve the restoring force of the structure. As an example of application, a Single Pole Double Throw (SPDT) for 24GHz applications, based on this design, has been simulated.

  7. Chopping of Near- and Mid-Infrared Radiation Using a Curled Electrostatic MEMS Actuator

    SciTech Connect (OSTI)

    Dausch, David; Goodwin, Scott; Exarhos, Gregory J.; Andresen, B. F. and Fulop, G. F.

    2003-04-01

    An electrostatic MEMS actuator known as the ''Artificial Eyelid'' can be used as a micromechanical chopper for IR detectors. The actuator structure consists of a curled polymer/metal film stack which is microfabricated and released from an IR transparent substrate. These flexible film actuators can act as IR choppers, providing transmission of radiation to the sensor elements when open (curled) and reflection when closed (uncurled). Arrays of actuators were fabricated on ITO-coated glass substrates and ranged in size from 4 x 4 mm to 7.5 x 15 mm with individual elements ranging from 250 to 500 microns on a side.

  8. Comparison of Two Low-Power Electronic Interfaces for Capacitive Mems Sensors

    E-Print Network [OSTI]

    Nagy, G; Hodossy, S; Rencz, M; Poppe, A

    2008-01-01

    The paper discusses the importance and the issues of interfacing capacitive sensors. Two architectures applicable for interfacing capacitive sensors are presented. The first solution was designed to interface a capacitive humidity sensor designed and built for a humidity-dependent monolithic capacitor developed at Budapest University of Technology and Economics. The second case presents the possible read-out solutions for a SOI-MEMS accelerometer. Both of the architectures were built and tested in a discrete implementation to qualify the methods before the integrated realization. The paper presents a detailed comparison of the two methods

  9. Encapsulants for protecting MEMS devices during post-packaging release etch

    DOE Patents [OSTI]

    Peterson, Kenneth A.

    2005-10-18

    The present invention relates to methods to protect a MEMS or microsensor device through one or more release or activation steps in a "package first, release later" manufacturing scheme: This method of fabrication permits wirebonds, other interconnects, packaging materials, lines, bond pads, and other structures on the die to be protected from physical, chemical, or electrical damage during the release etch(es) or other packaging steps. Metallic structures (e.g., gold, aluminum, copper) on the device are also protected from galvanic attack because they are protected from contact with HF or HCL-bearing solutions.

  10. Individual addressing of trapped $^{171}$Yb$^+$ ion qubits using a MEMS-based beam steering system

    E-Print Network [OSTI]

    Crain, S; Baek, S; Kim, J

    2014-01-01

    The ability to individually manipulate the increasing number of qubits is one of the many challenges towards scalable quantum information processing with trapped ions. Using micro-mirrors fabricated with micro-electromechanical systems (MEMS) technology, we focus laser beams on individual ions in a linear chain and steer the focal point in two dimensions. We demonstrate sequential single qubit gates on multiple $^{171}$Yb$^+$ qubits and characterize the gate performance using quantum state tomography. Our system features negligible crosstalk to neighboring ions ($< 3\\times 10^{-4}$), and switching speed comparable to typical single qubit gate times ($<$ 2 $\\mu$s).

  11. A Small Area In-Situ MEMS Test Structure to Accurately Measure Fracture Strength by Electrostatic Probing

    SciTech Connect (OSTI)

    Bitsie, Fernando; Jensen, Brian D.; de Boer, Maarten

    1999-07-15

    We have designed, fabricated, tested and modeled a first generation small area test structure for MEMS fracture studies by electrostatic rather than mechanical probing. Because of its small area, this device has potential applications as a lot monitor of strength or fatigue of the MEMS structural material. By matching deflection versus applied voltage data to a 3-D model of the test structure, we develop high confidence that the local stresses achieved in the gage section are greater than 1 GPa. Brittle failure of the polycrystalline silicon was observed.

  12. 3rd Int'l Workshop on Micro & Nano Tech. for Power Generation & Energy Conv. (PowerMEMS'03), Makuhari, Japan, 4-5 Dec. 2003. PRELIMINARY DESIGN OF A MEMS STEAM TURBINE POWER PLANT-ON-A-CHIP

    E-Print Network [OSTI]

    Frechette, Luc G.

    ), Makuhari, Japan, 4-5 Dec. 2003. 1 PRELIMINARY DESIGN OF A MEMS STEAM TURBINE POWER PLANT-ON-A-CHIP Luc G. The microfabricated device consists of a steam turbine that drives an integrated micropump and generator. Two, mechanical, then electrical energy. The concept developed herein consists of a microfabricated steam turbine

  13. A Robust MEMS Based Multi-Component Sensor for 3D Borehole Seismic Arrays

    SciTech Connect (OSTI)

    Paulsson Geophysical Services

    2008-03-31

    The objective of this project was to develop, prototype and test a robust multi-component sensor that combines both Fiber Optic and MEMS technology for use in a borehole seismic array. The use such FOMEMS based sensors allows a dramatic increase in the number of sensors that can be deployed simultaneously in a borehole seismic array. Therefore, denser sampling of the seismic wave field can be afforded, which in turn allows us to efficiently and adequately sample P-wave as well as S-wave for high-resolution imaging purposes. Design, packaging and integration of the multi-component sensors and deployment system will target maximum operating temperature of 350-400 F and a maximum pressure of 15000-25000 psi, thus allowing operation under conditions encountered in deep gas reservoirs. This project aimed at using existing pieces of deployment technology as well as MEMS and fiber-optic technology. A sensor design and analysis study has been carried out and a laboratory prototype of an interrogator for a robust borehole seismic array system has been assembled and validated.

  14. Characterization of the embedded micromechanical device approach to the monolithic integration of MEMS with CMOS

    SciTech Connect (OSTI)

    Smith, J.H.; Montague, S.; Sniegowski, J.J.; Murray, J.R. [and others

    1996-10-01

    Recently, a great deal of interest has developed in manufacturing processes that allow the monolithic integration of MicroElectroMechanical Systems (MEMS) with driving, controlling, and signal processing electronics. This integration promises to improve the performance of micromechanical devices as well as lower the cost of manufacturing, packaging, and instrumenting these devices by combining the micromechanical devices with a electronic devices in the same manufacturing and packaging process. In order to maintain modularity and overcome some of the manufacturing challenges of the CMOS-first approach to integration, we have developed a MEMS-first process. This process places the micromechanical devices in a shallow trench, planarizes the wafer, and seals the micromechanical devices in the trench. Then, a high-temperature anneal is performed after the devices are embedded in the trench prior to microelectronics processing. This anneal stress-relieves the micromechanical polysilicon and ensures that the subsequent thermal processing associated with fabrication of the microelectronic processing does not adversely affect the mechanical properties of the polysilicon structures. These wafers with the completed, planarized micromechanical devices are then used as starting material for conventional CMOS processes. The circuit yield for the process has exceeded 98%. A description of the integration technology, the refinements to the technology, and wafer-scale parametric measurements of device characteristics is presented. Additionally, the performance of integrated sensing devices built using this technology is presented.

  15. Dynamic pull-in of parallel plate and torsional electrostatic MEMS actuators.

    SciTech Connect (OSTI)

    Nielson, Gregory N.; Barbastathis, George (Massachusetts Institute of Technology, Cambridge, MA)

    2005-02-01

    An analysis of the dynamic characteristics of pull-in for parallel-plate and torsional electrostatic actuators is presented. Traditionally, the analysis for pull-in has been done using quasi-static assumptions. However, it was recently shown experimentally that a step input can cause a decrease in the voltage required for pull-in to occur. We propose an energy-based solution for the step voltage required for pull-in that predicts the experimentally observed decrease in the pull-in voltage. We then use similar energy techniques to explore pull-in due to an actuation signal that is modulated depending on the sign of the velocity of the plate (i.e., modulated at the instantaneous mechanical resonant frequency). For this type of actuation signal, significant reductions in the pull-in voltage can theoretically be achieved without changing the stiffness of the structure. This analysis is significant to both parallel-plate and torsional electrostatic microelectromechanical systems (MEMS) switching structures where a reduced operating voltage without sacrificing stiffness is desired, as well as electrostatic MEMS oscillators where pull-in due to dynamic effects needs to be avoided.

  16. Extreme Adaptive Optics Testbed: High Contrast Measurements with a MEMS Deformable Mirror

    SciTech Connect (OSTI)

    Evans, J W; Morzinski, K; Reza, L; Severson, S; Poyneer, L; Macintosh, B; Dillon, D; Sommargren, G

    2005-08-16

    ''Extreme'' adaptive optics systems are optimized for ultra-high-contrast applications, such as ground-based extrasolar planet detection. The Extreme Adaptive Optics Testbed at UC Santa Cruz is being used to investigate and develop technologies for high-contrast imaging, especially wavefront control. We use a simple optical design to minimize wavefront error and maximize the experimentally achievable contrast. A phase shifting diffraction interferometer (PSDI) measures wavefront errors with sub-nm precision and accuracy for metrology and wavefront control. Previously, we have demonstrated RMS wavefront errors of <1.5 nm and a contrast of >10{sup 7} over a substantial region using a shaped pupil without a deformable mirror. Current work includes the installation and characterization of a 1024-actuator Micro-Electro-Mechanical-Systems (MEMS) deformable mirror, manufactured by Boston Micro-Machines for active wavefront control. Using the PSDI as the wavefront sensor we have flattened the deformable mirror to <1 nm within the controllable spatial frequencies and measured a contrast in the far field of >10{sup 6}. Consistent flattening required testing and characterization of the individual actuator response, including the effects of dead and low-response actuators. Stability and repeatability of the MEMS devices was also tested. Ultimately this testbed will be used to test all aspects of the system architecture for an extrasolar planet-finding AO system.

  17. Influence of Dzyaloshinshkii-Moriya interaction on quantum correlations in two qubit Werner states and MEMS

    E-Print Network [OSTI]

    Kapil K. Sharma. S. N. Pandey

    2015-01-13

    In this paper we study the influence of Dzyaloshinskii-Moriya (DM) interaction on quantum correlations in two qubit Werner states and maximally entangled mixed states (MEMS). We consider our system as a closed system of a qubits pair and one auxiliary qubit which interact with any one of the qubit of the pair through DM interaction. We show that DM interaction, taken along any direction (x or y or z), does not affect two qubit Werner states. On the other hand the MEMS are affected by x and z components of DM interaction and remain unaffected by the y component. Further, we find that the state (i.e probability amplitude) of auxiliary qubit do not affect the quantum correlations in both the states, only DM interaction strength influences the quantum correlations. So one can avoid the intention to prepare the specific state of auxiliary qubit to manipulate the quantum correlations in both the states. We mention here that avoiding the preparation of state can contribute to cost reduction in quantum information processing. We also observe the phenomenon of entanglement sudden death in the present study.

  18. Method of forming a package for MEMS-based fuel cell

    SciTech Connect (OSTI)

    Morse, Jeffrey D; Jankowski, Alan F

    2013-05-21

    A MEMS-based fuel cell package and method thereof is disclosed. The fuel cell package comprises seven layers: (1) a sub-package fuel reservoir interface layer, (2) an anode manifold support layer, (3) a fuel/anode manifold and resistive heater layer, (4) a Thick Film Microporous Flow Host Structure layer containing a fuel cell, (5) an air manifold layer, (6) a cathode manifold support structure layer, and (7) a cap. Fuel cell packages with more than one fuel cell are formed by positioning stacks of these layers in series and/or parallel. The fuel cell package materials such as a molded plastic or a ceramic green tape material can be patterned, aligned and stacked to form three dimensional microfluidic channels that provide electrical feedthroughs from various layers which are bonded together and mechanically support a MEMS-based miniature fuel cell. The package incorporates resistive heating elements to control the temperature of the fuel cell stack. The package is fired to form a bond between the layers and one or more microporous flow host structures containing fuel cells are inserted within the Thick Film Microporous Flow Host Structure layer of the package.

  19. Combined surface analytical methods to characterize degradative processes in anti-stiction films in MEMS devices.

    SciTech Connect (OSTI)

    Tallant, David Robert; Zavadil, Kevin Robert; Ohlhausen, James Anthony; Hankins, Matthew Granholm; Kent, Michael Stuart

    2005-03-01

    The performance and reliability of microelectromechanical (MEMS) devices can be highly dependent on the control of the surface energetics in these structures. Examples of this sensitivity include the use of surface modifying chemistries to control stiction, to minimize friction and wear, and to preserve favorable electrical characteristics in surface micromachined structures. Silane modification of surfaces is one classic approach to controlling stiction in Si-based devices. The time-dependent efficacy of this modifying treatment has traditionally been evaluated by studying the impact of accelerated aging on device performance and conducting subsequent failure analysis. Our interest has been in identifying aging related chemical signatures that represent the early stages of processes like silane displacement or chemical modification that eventually lead to device performance changes. We employ a series of classic surface characterization techniques along with multivariate statistical methods to study subtle changes in the silanized silicon surface and relate these to degradation mechanisms. Examples include the use of spatially resolved time-of-flight secondary ion mass spectrometric, photoelectron spectroscopic, photoluminescence imaging, and scanning probe microscopic techniques to explore the penetration of water through a silane monolayer, the incorporation of contaminant species into a silane monolayer, and local displacement of silane molecules from the Si surface. We have applied this analytical methodology at the Si coupon level up to MEMS devices. This approach can be generalized to other chemical systems to address issues of new materials integration into micro- and nano-scale systems.

  20. Young's modulus of electroplated Ni thin film for MEMS applications J.K. Luoa,*, A.J. Flewitta

    E-Print Network [OSTI]

    Fleck, Norman A.

    to a less dense coating. D 2004 Elsevier B.V. All rights reserved. Keywords: Young's modulus; ElectroplatedYoung's modulus of electroplated Ni thin film for MEMS applications J.K. Luoa,*, A.J. Flewitta , S online 28 April 2004 Abstract The Young's modulus of an electroplated nickel (Ni) thin film suitable

  1. Mem ber Login site search Gardening Resources Gardening Programs About Us About River Farm Ways to Give JOIN

    E-Print Network [OSTI]

    Isaacs, Rufus

    to Give JOIN Edit This Hom e Gardening Program s Internship Program s Horticu ltu ral Horticultural GrowMem ber Login site search Gardening Resources Gardening Programs About Us About River Farm Ways programs; integrated pest management; seasonal exhibits and displays; and plant identification

  2. EE C247 / ME C218 INTRODUCTION TO MEMS DESIGN FALL 20xx DETAILED COURSE SYLLABUS (TENTATIVE)

    E-Print Network [OSTI]

    Frenklach, Michael

    23 Sensing Circuits II: differential position sensing, MEMS/transistor integration S: §19.1-19.4 J. 15 20 25 Sensor Resolution I: noise sources, noise calculation, min. detectable signal S: §16.1, §16.3-16.6 22 Thanksgiving--Holiday 27 26 Sensor Resolution II: noise calculation examples, gyro example

  3. MEMS-based embedded sensor virtual components for system-on-a-chip (SoC) q

    E-Print Network [OSTI]

    Jacob, Bruce

    Available online 24 June 2004 Abstract The design and implementation of a monolithic micro electro mechanical systems (MEMS)-based gas sensor virtual component is described. The gas sensor virtual component. Introduction Chemical microsensors using microhotplates repre- sent one important application for micro electro

  4. MEMS-based embedded sensor virtual components for system-on-a-chip (SoC) q

    E-Print Network [OSTI]

    Jacob, Bruce

    .40.)e; 85.30.De; 85.30.)z Keywords: MEMS; CMOS; Gas sensor; Microhotplate; Virtual component; SoC 1-gas-sensor system demands an efficient way to measure data from each array element. CMOS technology enables mono

  5. Electrochemistry of Fuel Cells and Batteries (ME/MS 545) Course Description: Electrochemistry of fuel cells, batteries, sensors, membrane

    E-Print Network [OSTI]

    Lin, Xi

    Electrochemistry of Fuel Cells and Batteries (ME/MS 545) Course Description: Electrochemistry of fuel cells, batteries, sensors, membrane separation and electrolytic methods are discussed J. Bard and Larry R. Faulkner, John Wiley. Recommended/reference text: Fuel Cell Handbook 7, DOE

  6. Electrochemistry of Fuel Cells and Batteries (ME/MS 545) Course Description: Fundamental Electrochemistry of fuel cells, batteries, sensors,

    E-Print Network [OSTI]

    Electrochemistry of Fuel Cells and Batteries (ME/MS 545) Course Description: Fundamental Electrochemistry of fuel cells, batteries, sensors, membrane separation and electrolytic methods are discussed. Recommended/reference text: Fuel Cell Handbook 7, DOE-NETL Production and list of related publications Course

  7. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 24, NO. 2, APRIL 2015 289 Vibration-Based Diagnostics for Rotary MEMS

    E-Print Network [OSTI]

    Rubloff, Gary W.

    , and therefore, vibration monitoring provides insight into the mechanical state of the bearings. MicroscaleJOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 24, NO. 2, APRIL 2015 289 Vibration (MEMS) tech- nology to perform vibration-based in situ monitoring, diagnostics, and characterization

  8. 2004 URSI Meeting, 5-8 January 2004, at the University of Colorado, Boulder, Colorado, USA. Polyimide Planarization for RF-MEMS Switch on PCB

    E-Print Network [OSTI]

    De Flaviis, Franco

    Polyimide Planarization for RF-MEMS Switch on PCB Bahram Ghodsian, C. Jung, B. Cetiner and F. De Flaviis it maintains the high RF-performance of switches. The fabrication process uses polyimide to planerize

  9. Design, fabrication, and characterization of a MEMS steam-generating device based on the decomposition of high-test hydrogen peroxide

    E-Print Network [OSTI]

    Eid, Feras

    2010-01-01

    Microscale ejector pumps offer the potential for high flow rate pumping of gases, a functionality that is greatly needed in MEMS technology. These pumps have many additional characteristics, such as their simplicity of ...

  10. Compact MEMS-based Adaptive Optics Optical Coherence Tomography for Clinical Use

    SciTech Connect (OSTI)

    Chen, D; Olivier, S; Jones, S; Zawadzki, R; Evans, J; Choi, S; Werner, J

    2008-02-04

    We describe a compact MEMS-based adaptive optics (AO) optical coherence tomography system with improved AO performance and ease of clinical use. A typical AO system consists of a Shack-Hartmann wavefront sensor and a deformable mirror that measures and corrects the ocular and system aberrations. Because of the limitation on the current deformable mirror technologies, the amount of real-time ocular-aberration compensation is restricted and small in the previous AO-OCT instruments. In this instrument, we proposed to add an optical apparatus to correct the spectacle aberrations of the patients such as myopia, hyperopia and astigmatism. This eliminated the tedious process of the trial lenses in clinical imaging. Different amount of spectacle aberration compensation was achieved by motorized stages and automated with the AO computer for ease of clinical use. In addition, the compact AO-OCT was optimized to have minimum system aberrations to reduce AO registration errors and improve AO performance.

  11. International Journal of Information Acquisition Vol. 1, No. 1 (2004) 2332

    E-Print Network [OSTI]

    Sun, Yu

    2004-01-01

    . MicroElectroMechanical systems (MEMS) devices can play important roles in facilitating single cell

  12. Internal shim

    DOE Patents [OSTI]

    Barth, Clyde H.; Blizinski, Theodore W.

    2003-05-13

    An internal shim used to accurately measure spaces in conjunction with a standard small probe has a shim top and a chassis. The internal shim is adjustably fixed within the space to be measured using grippers that emerge from the chassis and which are controlled by an arm pivotably attached to the shim top. A standard small probe passes through the shim along guides on the chassis and measures the distance between the exterior of the chassis and the boundary. By summing the measurements on each side of the chassis and the width of the chassis, the dimension of the space can be determined to within 0.001 inches.

  13. International Cooperation

    E-Print Network [OSTI]

    Banbara, Mutsunori

    , climate change, civil wars, nuclear disasters, and so on. We must examine these issues from an inter, Political Science, International Relations and Educational Development to address these complicated issues/Law and Development, and Politics and Area Studies. The curriculum in each Program is designed to offer opportunities

  14. Compliant membranes for the development of MEMS dual-backplate capacitive microphone using the SUMMiT V fabrication process.

    SciTech Connect (OSTI)

    Martin, David (University of Florida, Gainesville, FL)

    2005-11-01

    The objective of this project is the investigation of compliant membranes for the development of a MicroElectrical Mechanical Systems (MEMS) microphone using the Sandia Ultraplanar, Multilevel MEMS Technology (SUMMiT V) fabrication process. The microphone is a dual-backplate capacitive microphone utilizing electrostatic force feedback. The microphone consists of a diaphragm and two porous backplates, one on either side of the diaphragm. This forms a capacitor between the diaphragm and each backplate. As the incident pressure deflects the diaphragm, the value of each capacitor will change, thus resulting in an electrical output. Feedback may be used in this device by applying a voltage between the diaphragm and the backplates to balance the incident pressure keeping the diaphragm stationary. The SUMMiT V fabrication process is unique in that it can meet the fabrication requirements of this project. All five layers of polysilicon are used in the fabrication of this device. The SUMMiT V process has been optimized to provide low-stress mechanical layers that are ideal for the construction of the microphone's diaphragm. The use of chemical mechanical polishing in the SUMMiT V process results in extremely flat structural layers and uniform spacing between the layers, both of which are critical to the successful fabrication of the MEMS microphone. The MEMS capacitive microphone was fabricated at Sandia National Laboratories and post-processed, packaged, and tested at the University of Florida. The microphone demonstrates a flat frequency response, a linear response up to the designed limit, and a sensitivity that is close to the designed value. Future work will focus on characterization of additional devices, extending the frequency response measurements, and investigating the use of other types of interface circuitry.

  15. Measured and predicted temperature profiles along MEMS bridges at pressures from 0.05 to 625 torr.

    SciTech Connect (OSTI)

    Gallis, Michail A.; Torczynski, John Robert; Piekos, Edward Stanley; Serrano, Justin Raymond; Gorby, Allen D.; Phinney, Leslie Mary

    2010-10-01

    We will present experimental and computational investigations of the thermal performance of microelectromechanical systems (MEMS) as a function of the surrounding gas pressure. Lowering the pressure in MEMS packages reduces gas damping, providing increased sensitivity for certain MEMS sensors; however, such packaging also dramatically affects their thermal performance since energy transfer to the environment is substantially reduced. High-spatial-resolution Raman thermometry was used to measure the temperature profiles on electrically heated, polycrystalline silicon bridges that are nominally 10 microns wide, 2.25 microns thick, 12 microns above the substrate, and either 200 or 400 microns long in nitrogen atmospheres with pressures ranging from 0.05 to 625 Torr. Finite element modeling of the thermal behavior of the MEMS bridges is performed and compared to the experimental results. Noncontinuum gas effects are incorporated into the continuum finite element model by imposing temperature discontinuities at gas-solid interfaces that are determined from noncontinuum simulations. The experimental and simulation results indicate that at pressures below 0.5 Torr the gas-phase heat transfer is negligible compared to heat conduction through the thermal actuator legs. As the pressure increases above 0.5 Torr, the gas-phase heat transfer becomes more significant. At ambient pressures, gas-phase heat transfer drastically impacts the thermal performance. The measured and simulated temperature profiles are in qualitative agreement in the present study. Quantitative agreement between experimental and simulated temperature profiles requires accurate knowledge of temperature-dependent thermophysical properties, the device geometry, and the thermal accommodation coefficient.

  16. Two- and three-dimensional ultrananocrystalline diamond (UNCD) structures for a high resolution diamond-based MEMS technology.

    SciTech Connect (OSTI)

    Auciello, O.; Krauss, A. R.; Gruen, D. M.; Busmann, H. G.; Meyer, E. M.; Tucek, J.; Sumant, A.; Jayatissa, A.; Moldovan, N.; Mancini, D. C.; Gardos, M. N.

    2000-01-17

    Silicon is currently the most commonly used material for the fabrication of microelectromechanical systems (MEMS). However, silicon-based MEMS will not be suitable for long-endurance devices involving components rotating at high speed, where friction and wear need to be minimized, components such as 2-D cantilevers that may be subjected to very large flexural displacements, where stiction is a problem, or components that will be exposed to corrosive environments. The mechanical, thermal, chemical, and tribological properties of diamond make it an ideal material for the fabrication of long-endurance MEMS components. Cost-effective fabrication of these components could in principle be achieved by coating Si with diamond films and using conventional lithographic patterning methods in conjunction with e. g. sacrificial Ti or SiO{sub 2} layers. However, diamond coatings grown by conventional chemical vapor deposition (CVD) methods exhibit a coarse-grained structure that prevents high-resolution patterning, or a fine-grained microstructure with a significant amount of intergranular non-diamond carbon. The authors demonstrate here the fabrication of 2-D and 3-D phase-pure ultrananocrystalline diamond (UNCD) MEMS components by coating Si with UNCD films, coupled with lithographic patterning methods involving sacrificial release layers. UNCD films are grown by microwave plasma CVD using C{sub 60}-Ar or CH{sub 4}-Ar gas mixtures, which result in films that have 3--5 nm grain size, are 10--20 times smoother than conventionally grown diamond films, are extremely resistant to corrosive environments, and are predicted to have a brittle fracture strength similar to that of single crystal diamond.

  17. HPEC 2005-1 21 Sept. 2005

    E-Print Network [OSTI]

    Kepner, Jeremy

    ... ... #12;MIT Lincoln LaboratoryHPEC 2005-9 21 Sept. 2005 Real-Time FFT Architecture Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem CacheandMUX FPGA Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem Mem FPGA Cacheand

  18. Research and Development of Non-Spectroscopic MEMS-Based Sensor Arrays for Targeted Gas Detection

    SciTech Connect (OSTI)

    Loui, A; McCall, S K

    2011-10-24

    The ability to monitor the integrity of gas volumes is of interest to the stockpile surveillance community. Specifically, the leak detection of noble gases, at relevant concentration ranges and distinguished from other chemical species that may be simultaneously present, is particularly challenging. Aside from the laboratory-based method of gas chromatography-mass spectrometry (GC-MS), where samples may be collected by solid-phase microextraction (SPME) or cryofocusing, the other major approaches for gas-phase detection employ lasers typically operating in the mid-infrared wavelength region. While mass spectrometry can readily detect noble gases - the helium leak detector is an obvious example - laser-based methods such as infrared (IR) or Raman spectroscopy are completely insensitive to them as their monatomic nature precludes a non-zero dipole moment or changes in polarizability upon excitation. Therefore, noble gases can only be detected by one of two methods: (1) atomic emission spectroscopies which require the generation of plasmas through laser-induced breakdown, electrical arcing, or similar means; (2) non-spectroscopic methods which measure one or more physical properties (e.g., mass, thermal conductivity, density). In this report, we present our progress during Fiscal Year 2011 (FY11) in the research and development of a non-spectroscopic method for noble gas detection. During Fiscal Year 2010 (FY10), we demonstrated via proof-of-concept experiments that the combination of thermal conductivity detection (TCD) and coating-free damped resonance detection (CFDRD) using micro-electromechanical systems (MEMS) could provide selective sensing of these inert species. Since the MEMS-based TCD technology was directly adapted from a brassboard prototype commissioned by a previous chemical sensing project, FY11 efforts focused on advancing the state of the newer CFDRD method. This work, guided by observations previously reported in the open literature, has not only resulted in a substantially measureable increase in selectivity but has also revealed a potential method for mitigating or eliminating thermal drift that does not require a secondary reference sensor. The design of an apparatus to test this drift compensation scheme will be described. We will conclude this report with a discussion of planned efforts in Fiscal Year 2012 (FY12).

  19. Reliability of materials in MEMS : residual stress and adhesion in a micro power generation system.

    SciTech Connect (OSTI)

    Moody, Neville Reid; Kennedy, Marian S. (Washington State University, Pullman, WA); Bahr, David F. (Washington State University, Pullman, WA)

    2007-09-01

    The reliability of thin film systems is important to the continued development of microelectronic and micro-electro-mechanical systems (MEMS). The reliability of these systems is often tied to the ability of the films to remain adhered to its substrate. By measuring the amount of energy to separate the film from the substrate, researchers can predicts film lifetimes. Recent work has resulted in several different testing techniques to measure this energy including spontaneous buckling, indentation induced delamination and four point bending. This report focuses on developing quantifiable adhesion measurements for multiple thin film systems used in MEMS and other thin film systems of interest to Sandia programs. First, methods of accurately assessing interfacial toughness using stressed overlayer methods are demonstrated using both the W/Si and Au/Si systems. For systems where fracture only occurs along the interface, such as Au/Si, the calculated fracture energies between different tests are identical if the energy put into the system is kept near the needed strain energy to cause delamination. When the energy in the system is greater than needed to cause delamination, calculated adhesion energies can increase by a factor of three due to plastic deformation. Dependence of calculated adhesion energies on applied energy in the system was also shown when comparisons of four point bending and stressed overlayer test methods were completed on Pt/Si systems. The fracture energies of Pt/Ti/SiO{sub 2} were studied using four-point bending and compressive overlayers. Varying the thickness of the Ti film from 2 to 17 nm in a Pt/Ti/SiO{sub 2} system, both test methods showed an increase of adhesion energy until the nominal Ti thickness was 12nm. Then the adhesion energy began to decrease. While the trends in toughness are similar, the magnitude of the toughness values measured between the test methods is not the same, demonstrating the difficulty in extracting mode I toughness as mixed mode loading approaches mode II conditions.

  20. INTERNATIONAL AGREEMENTS

    Broader source: Energy.gov (indexed) [DOE]

    AFDC Printable Version Share this resource Send a link to EERE: Alternative Fuels Data Center Home Page to someone by E-mail Share EERE: Alternative Fuels Data Center Home Page on Facebook Tweet about EERE: Alternative Fuels Data Center Home Page on Twitter Bookmark EERE: Alternative Fuels Data Center Homesum_a_epg0_fpd_mmcf_m.xls" ,"Available from WebQuantity of Natural GasAdjustmentsShirleyEnergy A plug-inPPLforLDRD Report11,SecurityHome . Form D-4-AILE:Falls - TheINTERNATIONAL