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Typefaces play an important role in identifying the Fermilab brand. For in-house communication, we recommend the use of one of the following typeface combinations: Helvetica...
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Oren, Shmuel S.
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Oren, Shmuel S.
markets was not consistent with ERCOT's deregulated wholesale and retail markets. In the economic Perspectives and Divergent Paths PARVIZ ADIB,1 ERIC SCHUBERT,1 AND SHMUEL OREN2 1 Automated Power Exchange, Santa Clara, California, USA and BP North America Gas and Power, Houston, Texas, USA; 2 University
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operations and demand response. Moreover, the optimal extent of vertical integration is ultimately determined
Zidar, Judith A.; Shaw, Judith H.; Hanfman, Deborah T.; Kirby, Margie D.; Rayburn, Jane D.; Edwards, Shirley J.; Hood, Martha W.
Actornitophilus [sic] och- Brinck, P., 1955 ?, 403-404 raceus (Nitzsch, 1818) sen- all from S. W. Angola su Timmermann, 1954 Squatarola squatarola (S. helvetica) Charadrius venustus rufocinctus Actornithophilus ochraceus (Nitzsch) Charadrius alexandrinus...
Denny, H.W.; Acree, D.W.; Melson, G.B.; Millard, D.P.
The external conductors of a facility, particularly long, above ground types, pose a severe EMP threat. A primary purpose of this program was to investigate the premise that supplemental ground connections in these types of conductors could serve to reduce this threat. To support this investigation an External Collector Analysis Model (ECAM) was developed. ECAM was applied to analyzing the EMP-induced current levels appearing at a facility under various conditions of line length, line height, and number of grounds. From the results, approaches to the treatment of external collector penetrations are suggested. In addition to the external collector assessments, preliminary studies of internal collector responses are reported. Supplemental studies of techniques for measuring the responses of earth electrode systems over the EMP power spectrum are described. A successful technique utilizing currently available instrumentation was used to validate a test probe and to evaluate scaled models of various commonly used earth electrode geometries. From the measurements, observations relating to the behavior of various geometries up to 500 MHz are made.
Hu, C.-K.; Gignac, L. G.; Ohm, J.; Breslin, C. M.; Huang, E.; Bonilla, G.; Liniger, E.; Rosenberg, R. [IBM T. J. Watson Research Center, Yorktown Heights, NY 10598 (United States); Choi, S.; Simon, A. H. [IBM Microelectronic Division, Hopewell Junction, NY 12533 (United States)
Electromigration (EM) lifetimes and void growth of pure Cu, Cu(Mn) alloy, and pure Cu damascene lines with a CoWP cap were measured as a function of grain structure (bamboo, near bamboo, and polycrystalline) and sample temperature. The bamboo grains in a bamboo-polycrystalline grained line play the key role in reducing Cu mass flow. The variation in Cu grain size distribution among the wafers was achieved by varying the metal line height and wafer annealing process step after electroplating Cu and before or after chemical mechanical polishing. The Cu grain size was found to have a large impact on Cu EM lifetime and activation energy, especially for the lines capped with CoWP. The EM activation energy for pure Cu with a CoWP cap from near-bamboo, bamboo-polycrystalline, mostly polycrystalline to polycrystalline only line grain structures was reduced from 2.2 ± 0.2 eV, to 1.7 ± 0.1 eV, to 1.5 ± 0.1 eV, to 0.72 ± 0.05 eV, respectively. The effect of Mn in Cu grain boundary diffusion was found to be dependent on Mn concentration in Cu. The depletion of Cu at the cathode end of the Cu(Mn) line is preceded by an incubation period. Unlike pure Cu lines with void growth at the cathode end and hillocks at the anode end of the line, the hillocks grew at a starting position roughly equal to the Blech critical length from the cathode end of the Cu(Mn) polycrystalline line. The effectiveness of Mn on Cu grain boundary migration can also be qualitatively accounted for by a simple trapping model. The free migration of Cu atoms at grain boundaries is reduced by the presence of Mn due to Cu-solute binding. A large binding energy of 0.5 ± 0.1 eV was observed.