National Library of Energy BETA

Sample records for helvetica sans-serif line-height

  1. ORNL/TM-2008/183 [Flush right, 12 pt. Arial or Helvetica, bold

    E-Print Network [OSTI]

    Pennycook, Steve

    . David L. Greene Oak Ridge National Laboratory Dr. K.G. Duleep Energy and Environmental Analysis, Inc or Helvetica, bold, flush left] Prepared by Dr. David L. Greene Oak Ridge National Laboratory Dr. K. G. Duleep Energy and Environmental Analysis, Inc., an ICF Company [12 pt. Arial or Helvetica, bold, flush left] #12

  2. Dr. Robert M. Ramirez rramirez@sfsu.edu

    E-Print Network [OSTI]

    information, graphs, tables, photos, etc. Allocate the right amount of space on the poster. Allocate TIME to right. Use Left-justification alignment of text. CoSE SPS S'13 sfsu RRamirez 10 #12; Use a simple font (sans serif) throughout. Examples: Sans Serif = Arial (simple) Serif = Times New Roman (less simple

  3. Instructions for the Preparation of a CameraReady Manuscript

    E-Print Network [OSTI]

    Reiff-Marganiec, Stephan

    or other sans­serif fonts. Use Roman as default type and keep italics and/or bold for special text parts of the main text, use italics. Otherwise, use Roman. Start a new paragraph by indenting it from the left in pencil on the back (top right­hand corner) of each sheet (1) your name, and (2) the sheet number. Mark

  4. Macros for Mathematics in Plain TEX A Macro Package by Russell Lyons

    E-Print Network [OSTI]

    Lyons, Russell

    wants to accept small transgressions of the right margin. If one wants* * a different magnification (roman), it (italic), sl (slant), bf (bold), tt (typewriter), ss (sans serif), sc (small ca* *ps), bfi are defined: \\ig and \\igg are roman at 14.* *4pt and 17.28pt, while \\igb and \\iggb are the corresponding bold

  5. Instructions for the Preparation of a Camera-Ready Manuscript

    E-Print Network [OSTI]

    Reiff-Marganiec, Stephan

    or other sans-serif fonts. Use Roman as default type and keep italics and/or bold for special text parts of the main text, use italics. Otherwise, use Roman. Start a new paragraph by indenting it from the left in pencil on the back (top right-hand corner) of each sheet (1) your name, and (2) the sheet number. Mark

  6. Fermilab | Graphic Standards at Fermilab | Fonts

    Broader source: All U.S. Department of Energy (DOE) Office Webpages (Extended Search)

    Typefaces play an important role in identifying the Fermilab brand. For in-house communication, we recommend the use of one of the following typeface combinations: Helvetica...

  7. Els UK Job: CDI Ch06-I047172 13-11-2007 11:15a.m. Page:245 Trim:165240MM Float:Top/Bot TS: Integra, India Fonts: Palatino & Helvetica 9/11 Margins:Top:4PC Gutter:5PC T. W:30PC open recto 1 Color 49 Lines

    E-Print Network [OSTI]

    Oren, Shmuel S.

    Els UK Job: CDI Ch06-I047172 13-11-2007 11:15a.m. Page:245 Trim:165×240MM Float:Top/Bot TS: Integra: CDI Ch06-I047172 13-11-2007 11:15a.m. Page:246 Trim:165×240MM Float:Top/Bot TS: Integra, India Fonts

  8. Els UK Job: CDI ch09-i047172 16-11-2007 4:15p.m. Page:325 Trim:165240MM Float:Top/Bot TS: Integra, India Fonts: Palatino & Helvetica 9/11 Margins:Top:4PC Gutter:5PC T. W:30PC open recto 1 Color 49 Lines

    E-Print Network [OSTI]

    Oren, Shmuel S.

    markets was not consistent with ERCOT's deregulated wholesale and retail markets. In the economic Perspectives and Divergent Paths PARVIZ ADIB,1 ERIC SCHUBERT,1 AND SHMUEL OREN2 1 Automated Power Exchange, Santa Clara, California, USA and BP North America Gas and Power, Houston, Texas, USA; 2 University

  9. Els UK Job: CDI Ch01-I047172 30-10-2007 9:17a.m. Page:25 Trim:165240MM Float:Top/Bot TS: Integra, India Fonts: Palatino & Helvetica 9/11 Margins:Top:4PC Gutter:5PC T. W:30PC open recto 1 Color 49 Lines

    E-Print Network [OSTI]

    Oren, Shmuel S.

    operations and demand response. Moreover, the optimal extent of vertical integration is ultimately determined

  10. Supplement 22, Part 4, Parasite-Subject Catalogue, Parasites: Nematoda and Acanthocephala 

    E-Print Network [OSTI]

    Zidar, Judith A.; Shaw, Judith H.; Hanfman, Deborah T.; Kirby, Margie D.; Rayburn, Jane D.; Edwards, Shirley J.; Hood, Martha W.

    1980-01-01

    Actornitophilus [sic] och- Brinck, P., 1955 ?, 403-404 raceus (Nitzsch, 1818) sen- all from S. W. Angola su Timmermann, 1954 Squatarola squatarola (S. helvetica) Charadrius venustus rufocinctus Actornithophilus ochraceus (Nitzsch) Charadrius alexandrinus...

  11. Supplemental grounding of extended emp collectors. Final report, 1 May 1980-31 January 1982

    SciTech Connect (OSTI)

    Denny, H.W.; Acree, D.W.; Melson, G.B.; Millard, D.P.

    1982-01-31

    The external conductors of a facility, particularly long, above ground types, pose a severe EMP threat. A primary purpose of this program was to investigate the premise that supplemental ground connections in these types of conductors could serve to reduce this threat. To support this investigation an External Collector Analysis Model (ECAM) was developed. ECAM was applied to analyzing the EMP-induced current levels appearing at a facility under various conditions of line length, line height, and number of grounds. From the results, approaches to the treatment of external collector penetrations are suggested. In addition to the external collector assessments, preliminary studies of internal collector responses are reported. Supplemental studies of techniques for measuring the responses of earth electrode systems over the EMP power spectrum are described. A successful technique utilizing currently available instrumentation was used to validate a test probe and to evaluate scaled models of various commonly used earth electrode geometries. From the measurements, observations relating to the behavior of various geometries up to 500 MHz are made.

  12. Microstructure, impurity and metal cap effects on Cu electromigration

    SciTech Connect (OSTI)

    Hu, C.-K.; Gignac, L. G.; Ohm, J.; Breslin, C. M.; Huang, E.; Bonilla, G.; Liniger, E.; Rosenberg, R. [IBM T. J. Watson Research Center, Yorktown Heights, NY 10598 (United States); Choi, S.; Simon, A. H. [IBM Microelectronic Division, Hopewell Junction, NY 12533 (United States)

    2014-06-19

    Electromigration (EM) lifetimes and void growth of pure Cu, Cu(Mn) alloy, and pure Cu damascene lines with a CoWP cap were measured as a function of grain structure (bamboo, near bamboo, and polycrystalline) and sample temperature. The bamboo grains in a bamboo-polycrystalline grained line play the key role in reducing Cu mass flow. The variation in Cu grain size distribution among the wafers was achieved by varying the metal line height and wafer annealing process step after electroplating Cu and before or after chemical mechanical polishing. The Cu grain size was found to have a large impact on Cu EM lifetime and activation energy, especially for the lines capped with CoWP. The EM activation energy for pure Cu with a CoWP cap from near-bamboo, bamboo-polycrystalline, mostly polycrystalline to polycrystalline only line grain structures was reduced from 2.2 ± 0.2 eV, to 1.7 ± 0.1 eV, to 1.5 ± 0.1 eV, to 0.72 ± 0.05 eV, respectively. The effect of Mn in Cu grain boundary diffusion was found to be dependent on Mn concentration in Cu. The depletion of Cu at the cathode end of the Cu(Mn) line is preceded by an incubation period. Unlike pure Cu lines with void growth at the cathode end and hillocks at the anode end of the line, the hillocks grew at a starting position roughly equal to the Blech critical length from the cathode end of the Cu(Mn) polycrystalline line. The effectiveness of Mn on Cu grain boundary migration can also be qualitatively accounted for by a simple trapping model. The free migration of Cu atoms at grain boundaries is reduced by the presence of Mn due to Cu-solute binding. A large binding energy of 0.5 ± 0.1 eV was observed.