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Davis, Rhett - Department of Electrical and Computer Engineering, North Carolina State University
Automated Design Space Exploration for DSP Applications
Exploring Compromises among Timing, Power and Temperature in Three-Dimensional Integrated Circuits
Compact Electrothermal Modeling of an X-band MMIC Sonali Luniya William Batty Vincent Caccamesi Mikael Garcia Carlos Christoffersen
Inter-Die Signaling in Three Dimensional Integrated Circuits
An Architecture For Energy Efficient Sphere Decoding Ravi Jenkal and Rhett Davis
Multi-Parameter Power Minimization of Synthesized Datapaths W. Rhett Davis, Ambarish M. Sule, and Hao Hua
WIRE-DELAY REDUCTION ANALYSIS OF A 3-TIER, 8-POINT FAST FOURIER TRANSFORM 3D-IC
BREAKING RENT'S RULE: OPPORTUNITIES FOR 3D INTERCONNECT NETWORKS W. Rhett Davis and Christopher Mineo
Automated Architectural Exploration for Signal Processing Algorithms
Tool Integration for Signal Processing Architectural Exploration
Demystifying 3D ICs: The pros and cons of going vertical An increasing number of integrated solutions involve the stacking of chips to reduce
Performance Trend in Three-Dimensional Integrated Circuits Author list
Architecture for Energy Efficient Sphere Decoding Ravi Jenkal, Hao Hua, Ambarish Sule, W. Rhett Davis
FreePDK: An Open-Source Variation-Aware Design Kit James E. Stine and Ivan Castellanos and Michael Wood and Jeff Henson and Fred Love
Abstract: Inter-wire coupling continues to become a more significant portion of the total
Design for 3D Integration and Applications Invited Paper
Getting High-Performance Silicon from System-Level Design W. Rhett Davis
DESIGNING FIFO BUFFERS USING 3DIC TECHNOLOGY Ambarish Mukund Sule and William Rhett Davis