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Harvey, Ian R. - Utah Nanofabrication Lab.
Preparing for Nanotech Manufacturing: Broadly building Utah's technology workforce training pipeline
Optimization Case Study of CSP Temperature Cycle and Board Bending Reliability
International Microelectronics And Packaging Society The International Journal of Microcircuits and Electronic Packaging, Volume 23, Number 4, Fourth Quarter, 2000 (ISSN 1063-1674)
Planning for Utah Economic Competitiveness: "Top-10 in the Nation in Science / Engineering Education"
Mechanical Bending Technique for Determining CSP Design and Assembly Mark R. Larsen, Ian R. Harvey Ph.D.,
Class Topic (Projects ~30% of grade) Lab (Lab Activities ~45% of grade) TA/Location 1 H 8/26 Class overview. Definition of class projects. HW 1 reading assigned
