Tu, King-Ning - Department of Materials Science and Engineering, University of California at Los Angeles

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Tu, King-Ning - Department of Materials Science and Engineering, University of California at Los Angeles

Mean-time-to-failure study of flip chip solder joints on CuNi,,V...Al thin-film under-bump-metallization
APPLIED PHYSICS REVIEWS--FOCUSED REVIEW Recent advances on electromigration in very-large-scale-integration