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Thouless, Michael - Departments of Mechanical Engineering & Materials Science and Engineering, University of Michigan
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Rate Effects for Mixed-Mode Fracture of Plastically Deforming, Adhesively-Bonded Structures
A PARAMETRIC STUDY OF THE PEEL TEST M. D. Thouless*
Predicting the Failure of Ultrasonic Spot Welds by Pull-out from Sheet Metal
ELASTIC-PLASTIC MODE-II FRACTURE OF ADHESIVE JOINTS
MIXED-MODE FRACTURE ANALYSES OF PLASTICALLY-DEFORMING ADHESIVE JOINTS
DUCTILE-BRITTLE TRANSITIONS IN THE FRACTURE OF PLASTICALLY-DEFORMING, ADHESIVELY-BONDED STRUCTURES
The mechanical properties of a surface-modified layer on poly(dimethylsiloxane) K. L. Mills1
Indentation of an elastic half space with material properties varying with depth
Competing failure mechanisms in mixed-mode fracture of an adhesively-bonded polymer-matrix composite
Effects of Rate on Crack Growth in a Rubber-Modified Epoxy
MIXED-MODE COHESIVE-ZONE MODELS FOR DELAMINATION AND DEFLECTION IN COMPOSITES
The Effects of Cohesive Strength and Toughness on Mixed-Mode Delamination
Rate Effects in Mode-II Fracture of Plastically Deforming, Adhesively-Bonded Structures
The roles of toughness and cohesive strength on crack deflection at
Mixed-mode cohesive-zone models for fracture of an adhesively-bonded polymer-matrix composite
The effects of shear on delamination in layered materials and M. D. Thouless1,2
Surface instability of an elastic half space with material properties varying with depth
THE EFFECTS OF GEOMETRY AND MATERIAL PROPERTIES ON THE FRACTURE OF SINGLE LAP-SHEAR JOINTS
DUCTILE-BRITTLE TRANSITIONS IN THE FRACTURE OF PLASTICALLY-DEFORMING, ADHESIVELY-BONDED STRUCTURES
Use of mode-I cohesive-zone models to describe the fracture of an adhesively-bonded polymer-matrix composite
The Effects of Transverse Shear on the Delamination of Edge-Notch
For Table of Contents use only External compression-induced fracture patterning on the surface of poly(dimethylsiloxane) cubes
Soft Matter Cite this: DOI: 10.1039/c0xx00000x
CREATED USING THE RSC ARTICLE TEMPLATE (VER. 3.1) -SEE WWW.RSC.ORG/ELECTRONICFILES FOR DETAILS TECHNICAL NOTE www.rsc.org/loc | Lab on a Chip
Periodic cracking of films supported on compliant substrates