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Structural Modal Analysis for Detecting Open Solder Bumps on Flip Chips Dathan S. Erdahl1
 

Summary: Structural Modal Analysis for Detecting Open Solder Bumps on Flip Chips
Dathan S. Erdahl1
, Matthew S. Allen2
, Charles Ume3
and Jerry H. Ginsberg3
1
University of Dayton Research Institute - dathan.erdahl@udri.udayton.edu
2
Dept. of Engineering Physics, University of Wisconsin-Madison - msallen@engr.wisc.edu
3
Georgia Institute of Technology
1 ABSTRACT
Although flip chips have received wide acceptance as an integrated circuit package,
significant manufacturing problems exist with the integrity of the connection between the
package and the printed circuit board (PCB). Conventional x-ray, ultrasonic and electronic
testing systems have been used to assess the integrity of this connection, however, none of these
have proven suitable for detecting open solder bumps between the chip and the board. The
inability to detect open solder bumps with traditional methods merits the investigation of new,
nondestructive methods for detecting defects in a manufacturing environment.
This work assesses the feasibility of monitoring the vibration characteristics of flip chips

  

Source: Allen, Matthew S. - Department of Engineering Physics, University of Wisconsin at Madison

 

Collections: Engineering