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Mechanism for stamp collapse in soft lithography W. Zhou and Y. Huanga
 

Summary: Mechanism for stamp collapse in soft lithography
W. Zhou and Y. Huanga
Department of Mechanical and Industrial Engineering, University of Illinois at Urbana-Champaign,
Urbana, Illinois 61801
E. Menard
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign,
Urbana, Illinois 61801
N. R. Aluru
Department of Mechanical and Industrial Engineering, University of Illinois at Urbana-Champaign,
Urbana, Illinois 61801
J. A. Rogersa
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana,
Illinois 61801
A. G. Alleyne
Department of Mechanical and Industrial Engineering, University of Illinois at Urbana-Champaign,
Urbana, Illinois 61801
Received 5 October 2005; accepted 16 November 2005; published online 14 December 2005
Mechanical collapse of recessed features of relief on elastomeric elements for soft lithography
represents an important phenomena for this lithographic technology. By comparing computed and
measured shapes of partially collapsed structures, we show that the dominant mechanism for

  

Source: Aluru, Narayana R. - Department of Mechanical and Industrial Engineering, University of Illinois at Urbana-Champaign

 

Collections: Engineering; Materials Science