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accepted for publication in J. Materials Research, Jan 23, 2003 Processing and microstructural characterization of sputter-
 

Summary: accepted for publication in J. Materials Research, Jan 23, 2003
Processing and microstructural characterization of sputter-
deposited Ni / Ni3Al multilayered thin films
Evan A. Sperling, Rajarshi Banerjee, Gregory B. Thompson, Jason P. Fain,
Peter M. Anderson and Hamish L. Fraser
Department of Materials Science and Engineering
The Ohio State University, Columbus, OH 43210.
January 13, 2003
Revised January 23, 2003
Abstract
The crystallographic texture, orientation relationships, coherency stress, and thermal stability
of sputter-deposited Ni / Ni3Al multilayered thin films is studied as a function of bi-layer period
(L) as well as processing parameters such as substrate type, deposition temperature, and pre-bake
conditions. Deposition onto oxidized Si or single crystal Cu (001), NaCl (001), or KBr (001)
substrates near room temperature produces multilayers with a [111] crystallographic texture
along the Ni / Ni3Al interface normal, and a disordered fcc structure for the Ni3Al phase. In
contrast, deposition at 673 K onto NaCl (001) or KBr (001) substrates that are pre-baked in
vacuum at 693 K produces a chemically ordered L12 structure for the Ni3Al phase and (001)
epitaxial growth. X-ray diffraction measurements of (001) multilayers with equal volume
fraction of Ni and Ni3Al reveals a transition from a nearly incoherent state at L = 240 nm to a

  

Source: Anderson, Peter M. - Department of Materials Science and Engineering, Ohio State University

 

Collections: Materials Science