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10 March 2007 Electrode Placement Configurations for 3D EIT
 

Summary: 10 March 2007
Electrode Placement Configurations for 3D EIT
BM Graham1
, A Adler2
1School of Information Technology and Engineering (SITE), University of
Ottawa, Canada
2Department of Systems and Computer Engineering, Carleton University,
Canada
E-mail: graham.bm@gmail.com, adler@sce.carleton.ca
Abstract. This paper investigates several configurations for placing electrodes
on a 3D cylindrical medium to reconstruct 3D images using 16 electrode EIT
equipment intended for use with a 2D adjacent drive protocol. Seven different
electrode placement configurations are compared in terms of the following figures
of merit: resolution, radial and vertical position error, image power, immunity
to noise, immunity to electrode placement errors, and qualitative evaluation of
image artefacts. Results show that for ideal conditions, none of the configurations
considered performed significantly better than the others. However, when noise
and electrode placement errors were considered the planar electrode placement
configuration (two rings of vertically aligned electrodes with electrodes placed
sequentially in each ring) had the overall best performance. Based on these results,

  

Source: Adler, Andy - Department of Systems and Computer Engineering, Carleton University

 

Collections: Computer Technologies and Information Sciences