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A numerical investigation on the influence of liquid properties and interfacial heat transfer during microdroplet
 

Summary: A numerical investigation on the influence of liquid
properties and interfacial heat transfer during microdroplet
deposition onto a glass substrate
Rajneesh Bhardwaj a
, Jon P. Longtin b
, Daniel Attinger a,*
a
Laboratory for Microscale Transport Phenomena, Department of Mechanical Engineering, Columbia University, New York, NY 10027, United States
b
Thermal-Laser Laboratory, Department of Mechanical Engineering, State University of New York at Stony Brook, Stony Brook, NY 11794, United States
Received 2 November 2006; received in revised form 18 December 2006
Available online 2 March 2007
Abstract
This work investigates the impingement of a liquid microdroplet onto a glass substrate at different temperatures. A finite-element
model is applied to simulate the transient fluid dynamics and heat transfer during the process. Results for impingement under both iso-
thermal and non-isothermal conditions are presented for four liquids: isopropanol, water, dielectric fluid (FC-72) and eutectic tin­lead
solder (63Sn­37Pb). The objective of the work is to select liquids for a combined numerical and experimental study involving a high
resolution, laser-based interfacial temperature measurement to measure interfacial heat transfer during microdroplet deposition. Appli-
cations include spray cooling, micro-manufacturing and coating processes, and electronics packaging. The initial droplet diameter and
impact velocity are 80 lm and 5 m/s, respectively. For isothermal impact, our simulations with water and isopropanol show very good

  

Source: Attinger, Daniel - Department of Mechanical Engineering, Columbia University

 

Collections: Engineering