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IOP PUBLISHING JOURNAL OF MICROMECHANICS AND MICROENGINEERING J. Micromech. Microeng. 18 (2008) 105002 (8pp) doi:10.1088/0960-1317/18/10/105002
 

Summary: IOP PUBLISHING JOURNAL OF MICROMECHANICS AND MICROENGINEERING
J. Micromech. Microeng. 18 (2008) 105002 (8pp) doi:10.1088/0960-1317/18/10/105002
Metal-organic thin-film encapsulation for
MEMS
J Fang, J Fu and F Ayazi
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30308,
USA
E-mail: jdfang@gatech.edu
Received 27 May 2008, in final form 24 July 2008
Published 26 August 2008
Online at stacks.iop.org/JMM/18/105002
Abstract
This paper demonstrates a metal-organic thin-film encapsulation technique based on the
photolithography of multiple layers of positive-tone photo-definable polymer. This
encapsulation process, performed at low temperatures (<110
C) in a standard basic
developer, leaves no residue. Piezoelectrically-actuated length-extensional bulk acoustic wave
resonators were successfully encapsulated for a proof-of-concept demonstration. Blanket
metallization can lead to complete sealing, which helps exclude moisture and particles from
sensitive MEMS devices such as high frequency resonators, RF filters and inertial transducers.

  

Source: Ayazi, Farrokh - School of Electrical and Computer Engineering, Georgia Institute of Technology

 

Collections: Engineering