Summary: Electromigration-induced surface evolution in bamboo
lines with transgranular and intergranular edge voids
, Amir Averbuchb
, Moshe Israelic
Department of Electrical Engineering - Physical Electronics
Tel Aviv University, Tel Aviv 69978, Israel
School of Computer Science, Tel Aviv University, Tel Aviv 69978, Israel
Faculty of Computer Science, Technion, Haifa 32000, Israel
Corresponding author: email@example.com
The evolution of a surface intersected by transgranular and intergranular edge
voids under isotropic surface diffusion and electric field effects is simulated numer-
ically under both mass-conserving and non-mass-conserving boundary conditions.
A surprising similarity is found in the surface topology of transgranular voids be-
tween our non-mass-conserving model and Schimschak and Krug's (J. Appl. Phys.