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On Quantifying Interfacial Thermal Resistance and Surface Energy during Molten Microdroplet Surface Deposition
 

Summary: On Quantifying Interfacial Thermal Resistance and Surface Energy
during Molten Microdroplet Surface Deposition
D. Attinger
Department of Mechanical Engineering , State University of New York at Stony Brook,
Stony Brook, NY 11794-2300, USA
and
D. Poulikakos
Laboratory of Thermodynamics in Emerging Technologies, Institute of Energy Technology,
Department of Mechanical and Process Engineering
Swiss Federal Institute of Technology, ETH Center, 8092 Zurich, Switzerland.
Abstract
Understanding and controlling the deposition of a molten microdroplet on a colder substrate with simultaneous heat
transfer and solidification is of central importance to a host of technologies, exemplified by novel methods of
electronic microchip manufacturing. The physics of the involved interfacial phenomena is to date only partially
understood. For instance, the transient resistance to heat transfer at the droplet-substrate interface cannot be
quantified theoretically and adequate experimental date are lacking. Serious obstacles to its experimental
determination are the very short time and length scales involved (of the order of microns and microseconds). In the
present paper, a numerical modeling for droplet impact and solidification based on the Navier-Stokes and energy
equations is used in order to reproduce transient measurements of the deposition of a eutectic Pb-Sn microdroplet on
a multilayer wafer. The resistance to heat transfer at the droplet-wafer interface and the surface energy of the molten

  

Source: Attinger, Daniel - Department of Mechanical Engineering, Columbia University

 

Collections: Engineering