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Inhibition and Promotion of Copper Corrosion by CTAB in a Microreactor System
 

Summary: Inhibition and Promotion of Copper Corrosion by CTAB in a
Microreactor System
Caroline M. Murira,
Christian Punckt,
Hannes C. Schniepp,
Boris Khusid,
and
Ilhan A. Aksay*,
Department of Chemical Engineering, Princeton UniVersity, Princeton, New Jersey 08544, and Department
of Chemical, Biological, and Pharmaceutical Engineering, New Jersey Institute of Technology,
UniVersity Heights, Newark, New Jersey 07102
ReceiVed July 31, 2008. ReVised Manuscript ReceiVed September 29, 2008
We report on an optical microscopy technique for the analysis of corrosion kinetics of metal thin films in microreactor
systems and use it to study the role of cetyltrimethylammonium bromide surfactant as a corrosion inhibitor in a
copper-gold galvanic coplanar microsystem. A minimum in the dissolution rate of copper is observed when the
surfactant concentration is 0.8 mM. To explain why the inhibitory role of the surfactant does not extend to higher
concentrations, we use zero resistance ammetry with separated half cells and show that while the surfactant inhibits
cathodic reactions on gold, it also promotes the corrosion of copper because of the catalytic action of bromide
counterions. These two competing processes lead to the observed minimum in the dissolution rate.
Introduction

  

Source: Aksay, Ilhan A. - Department of Chemical Engineering, Princeton University

 

Collections: Materials Science