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Summary: Carbon Nanotube Bundle Interconnect:
Performance Evaluation, Optimum Repeater Size and
Insertion for Global Wire
Dipen Patel
Electrical and Computer Engineering
Northeastern University
Boston, USA
patel.dip@neu.edu
Yong Bin Kim
Electrical and Computer Engineering
Northeastern University
Boston, USA
ybk@ece.neu.edu
Abstract--To remove the bottleneck of the interconnect
especially at semi-global and global level, performance
evaluation of local, semi global, and global interconnect is
presented in this paper based on carbon nanotube (CNT)
interconnect bundle model. For the greater length of the wire, a
methodology is presented to find the optimum insertion and size
of buffer for CNT bundle interconnects. The performance
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