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HERMETIC PACKAGING OF RESONATORS WITH VERTICAL FEEDTHROUGHS USING A GLASS-IN-SILICON REFLOW PROCESS
 

Summary: HERMETIC PACKAGING OF RESONATORS WITH VERTICAL FEEDTHROUGHS USING A
GLASS-IN-SILICON REFLOW PROCESS
R. M. Haque1
, D. E. Serrano2
, X. Gao2
, A. N.-Shirazi2
, V. Keesara3
, F. Ayazi2,3
, and K. D. Wise1
1
The University of Michigan, Ann Arbor, MI, USA
2
Georgia Institute of Technology, Atlanta, GA, USA
3
Qualtré Inc., Marlborough, MA, USA
ABSTRACT
A low-cost, hermetic wafer-level packaging solution
with negligible parasitics suitable for MEMS resonators
is presented. A glass cap with embedded 50!m diameter
vertical single-crystal silicon feedthroughs is anodically

  

Source: Ayazi, Farrokh - School of Electrical and Computer Engineering, Georgia Institute of Technology

 

Collections: Engineering