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A Planar Gyroscope Using a Standard Surface Micromachining Process S. E. Alper1

Summary: A Planar Gyroscope Using a Standard Surface Micromachining Process
S. E. Alper1
and T. Akin1,2
Middle East Technical University, Dept. of Electrical and Electronics Eng., 06531 Ankara, Turkey
TUBITAK-ODTU-BILTEN, Middle East Technical University, 06531 Ankara, Turkey
e-mail:tayfun-akin@metu.edu.tr http://www.eee.metu.edu.tr/~tayfuna
Summary. This paper presents a planar gyroscope based on a standard three-layer polysilicon
surface micromachining process. Structural geometry is designed to minimize the effects of
limitations coming from the standard surface micromachining. Finite element simulations are
carried out, and mismatches of resonant frequencies of the drive and sense mode vibrations are
reduced down to 0.5% in order to achieve increased performance. The third polysilicon layer on
top of outer gimbal is used for feedback control and for tuning of the resonant frequency. The
drive and sense capacitance values are 2.48 pF and 0.58 pF, respectively. The device measures
about 900mx550m area with a 2m thick structural layer. The fabricated structures are tested
and their resonant frequencies are measured as 5119 Hz and 4889 Hz for the drive and sense
vibration modes, respectively. The frequency mismatch is 4.65% for these two modes and the
resonant frequencies can be adjusted by varying the dc bias voltage applied to the proof mass. A
capacitive readout circuit was developed in a 0. 8 m CMOS process to be hybrid connected to the


Source: Akin, Tayfun - Department of Electrical and Electronics Engineering, Middle East Technical University


Collections: Engineering