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1036 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 16, NO. 5, OCTOBER 2007 Sub-Micro-Gravity In-Plane Accelerometers With
 

Summary: 1036 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 16, NO. 5, OCTOBER 2007
Sub-Micro-Gravity In-Plane Accelerometers With
Reduced Capacitive Gaps and Extra Seismic Mass
Reza Abdolvand, Student Member, IEEE, Babak Vakili Amini, Member, IEEE,
and Farrokh Ayazi, Senior Member, IEEE
Abstract--This paper presents a robust fabrication technique
for manufacturing ultrasensitive micromechanical capacitive
accelerometers in thick silicon-on-insulator substrates. The iner-
tial mass of the sensor is significantly increased by keeping the
full thickness of the handle layer attached to the top layer proof
mass. High-aspect-ratio capacitive sense gaps are fabricated by
depositing a layer of polysilicon on the sidewalls of low aspect-
ratio trenches etched in silicon. Using this method, require-
ments on trench etching are relaxed, whereas the performance
is preserved through the gap reduction technique. Therefore, this
process flow can potentially enable accelerometers with capacitive
gap aspect-ratio values of greater than 40 : 1, not easily realizable
using conventional dry etching equipment. Also, no wet-etching
step is involved in this process which in turn facilitates the fabri-
cation of very sensitive motion sensors that utilize very compliant

  

Source: Ayazi, Farrokh - School of Electrical and Computer Engineering, Georgia Institute of Technology

 

Collections: Engineering