Summary: INSTITUTE OF PHYSICS PUBLISHING JOURNAL OF MICROMECHANICS AND MICROENGINEERING
J. Micromech. Microeng. 16 (2006) 742­750 doi:10.1088/0960-1317/16/4/010
Wafer-level MEMS packaging via
thermally released metal-organic
membranes
Pejman Monajemi1, Paul J Joseph2, Paul A Kohl2 and
Farrokh Ayazi1
1
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta,
GA 30332-0250, USA
2
School of Chemical and Biomolecular Engineering, Georgia Institute of Technology,
Atlanta, GA 30332-0250, USA
Received 5 January 2006, in final form 13 February 2006
Published 9 March 2006
Online at stacks.iop.org/JMM/16/742
Abstract
This paper reports on the design, implementation and characterization
of wafer-level packaging technology for a wide range of
microelectromechanical system (MEMS) devices. The encapsulation

Source: Ayazi, Farrokh - School of Electrical and Computer Engineering, Georgia Institute of Technology

Collections: Engineering