Home

About

Advanced Search

Browse by Discipline

Scientific Societies

E-print Alerts

Add E-prints

E-print Network
FAQHELPSITE MAPCONTACT US


  Advanced Search  

 
IEEE SENSORS JOURNAL, VOL. 6, NO. 1, FEBRUARY 2006 39 Design Optimization and Implementation of a
 

Summary: IEEE SENSORS JOURNAL, VOL. 6, NO. 1, FEBRUARY 2006 39
Design Optimization and Implementation of a
Microgravity Capacitive HARPSS Accelerometer
Pejman Monajemi, Student Member, IEEE, and Farrokh Ayazi, Member, IEEE
Abstract--This paper reports on the design optimization and im-
plementation of a lateral capacitive accelerometer with high sensi-
tivity and micro-g resolution, fabricated through the high-aspect
ratio polysilicon and single-crystal silicon process on regular sil-
icon wafers. A new implementation of vertical corrugation in sil-
icon electrodes is developed to reduce the mechanical noise equiva-
lent acceleration of the sensor. The predicted effect of corrugation
on thermomechanical noise and also on static sensitivity is veri-
fied using ANSYS steady-state thermal simulation and FEMLAB
linear stationary electrostatics analysis, respectively. The number
of corrugated electrodes and the sense gap spacing is optimized
to minimize the system (sensor + circuit) noise floor, while satis-
fying process and electronics limits. The open-loop differential sen-
sitivity of a 60- m-thick prototype accelerometer is measured to be
0.25 V/g equivalent to 4.5 pF/g over a 1-g range. The estimated total
noise equivalent acceleration of the system (sensor + circuit) is 0.95

  

Source: Ayazi, Farrokh - School of Electrical and Computer Engineering, Georgia Institute of Technology

 

Collections: Engineering