Home

About

Advanced Search

Browse by Discipline

Scientific Societies

E-print Alerts

Add E-prints

E-print Network
FAQHELPSITE MAPCONTACT US


  Advanced Search  

 
Super-resolution in laser annealing and ablation Ivan Avrutsky,a)
 

Summary: Super-resolution in laser annealing and ablation
Ivan Avrutsky,a)
Daniel G. Georgiev, Dmitry Frankstein, and Gregory Auner
Department of Electrical and Computer Engineering, Wayne State University, Detroit, Michigan 48202
Golam Newaz
Department of Mechanical Engineering, Wayne State University, Detroit, Michigan 48202
Received 22 October 2003; accepted 30 January 2004
This letter reports observation of ablated holes as small as 0.7 m fabricated by single 25 ns pulses
of KrF ( 248 nm) laser focused onto a 5.6 m spot. Samples with high thermal conductivity
films with respect to that of the substrate Si/silica, Al/glass repeatedly showed considerable
reduction in the size of the ablated spot 0.7- and 1.2- m-diam holes, respectively . This letter also
presents a likely mechanism of the observed super-resolution and the criteria necessary to achieve
super-resolution. Due to the nonoptical origin of this effect it is expected that a tightly focused
0.5 m laser beam can be used to ablate with nanoscale 100 nm resolution. 2004
American Institute of Physics. DOI: 10.1063/1.1688995
Excimer laser-based UV ablation is a well-developed
technique for microfabrication. It has many applications in
science and manufacturing technology and can be used to
machine a wide range of materials without a need for a sac-
rificial layer. Current state-of-the-art ablation technology

  

Source: Avrutsky, Ivan - Department of Electrical and Computer Engineering, Wayne State University

 

Collections: Engineering