Summary: Developing EAM Tantalum
Potential Using Force Matching
Method
Youhong Li
Donald J. Siegel
James B. Adams
Motivation:
Improve existing Ta Potential by including
DFT data
­ BCC Ta Analytical Form EAM potential By R.A. Johnson, D. J.
Oh ------Bulk modulus 1.35GPa vs. 1.94 GPa (expt.)
Apply the potential to Simulation of Thin
film Growth
­ Tantalum used as barrier / adhesion layer for Copper film growth
EAM
Embedded Atom Method
· - Developed by Daw and Baskes
­ Embedding energy
­ Pair potential
tot i

Source: Adams, James B - Department of Chemical and Materials Engineering, Arizona State University

Collections: Materials Science