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JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 15, NO. 3, JUNE 2006 471 Quality Factor in Trench-Refilled Polysilicon
 

Summary: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 15, NO. 3, JUNE 2006 471
Quality Factor in Trench-Refilled Polysilicon
Beam Resonators
Reza Abdolvand, Student Member, IEEE, Houri Johari, Gavin K. Ho, Student Member, IEEE, Ahmet Erbil, and
Farrokh Ayazi, Senior Member, IEEE
Abstract--In this paper, thermoelastic damping (TED) in trench-
refilled (TR) polysilicon microelectromechanical beam resonators
is studied as a mechanism for limiting quality factor ( ) at low
frequencies. An approximate model based on Zener's theory is de-
veloped and verified by numerical simulations in FEMLAB. Ac-
cording to the proposed model a double-dip characteristic is ex-
pected for the quality factor versus frequency curve of TR beam
resonators. To verify the model experimentally, equal-width TR
micro-resonators are fabricated in different length to cover a broad
range of frequencies. Frequency response of these devices agrees
well with our model. By using the theoretical and numerical models
developed in this paper, an upper bound for the quality factor in
TR beam resonators or any similar structure such as TR polysil-
icon gyros can be predicted. [1352]
Index Terms--Beam resonators, HARPSS, quality ( ) factor,

  

Source: Ayazi, Farrokh - School of Electrical and Computer Engineering, Georgia Institute of Technology

 

Collections: Engineering