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Summary: On-Chip Copper-Based vs. Optical Interconnects: Delay Uncertainty,
Latency, Power, and Bandwidth Density Comparative Predictions
Guoqing Chen, Hui Chen, Mikhail Haurylau, Nicholas A. Nelson,
David H. Albonesi, Philippe M. Fauchet, and Eby G. Friedman
Department of Electrical and Computer Engineering, University of Rochester, Rochester, New York, 14627
Department of Physics and Astronomy, University of Rochester, Rochester, New York, 14627
Department of Electrical and Computer Engineering,Cornell University, Ithaca, New York, 14853
Abstract-- As CMOS technology is scaled, it has become in-
creasingly difficult for conventional copper interconnect to satisfy
different design requirements. On-chip optical interconnect has
been considered as a potential substitute for electrical intercon-
nect. In this paper, predictions of the performance of CMOS
compatible optical devices are made based on current state-of-
art optical technologies. Based on these predictions, electrical and
optical interconnects are compared for delay uncertainty, latency,
power, and bandwidth density.
I. INTRODUCTION
In deep submicrometer VLSI technologies, it has become
increasingly difficult for conventional copper based electrical
interconnect to satisfy the design requirements of delay, power,
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