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IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING, VOL. 46, NO. 4, APRIL 1999 471 A Modular Micromachined High-Density Connector
 

Summary: IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING, VOL. 46, NO. 4, APRIL 1999 471
A Modular Micromachined High-Density Connector
System for Biomedical Applications
Tayfun Akin, Babak Ziaie,* Associate Member, IEEE, Stefan A. Nikles, and Khalil Najafi, Senior Member, IEEE
Abstract-- This paper presents a high-density, modular, low-
profile, small, and removable connector system developed using
micromachining technologies for biomedical applications. This
system consists of a silicon or polyimide electrode with one end in
contact with the biological tissue and its back-end supported in a
titanium base (12.5 mm in diameter and 2.5 mm in height) that is
fixed on the test subject. An external glass substrate (6 26 20.75
mm3
), which supports a flexible polyimide diaphragm and CMOS
buffers, is attached to the titanium base whenever electrical
contact is required. The polyimide flexible diaphragm contains
high-density gold electroplated pads (32 pads, each having an area
of 100 2100 m2
and separated by 150 m) which match similar
pads on the electrode back-end. When vacuum is applied between
the two, the polyimide diaphragm deflects and the corresponding

  

Source: Akin, Tayfun - Department of Electrical and Electronics Engineering, Middle East Technical University

 

Collections: Engineering