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2540 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 53, NO. 10, OCTOBER 2006 Experimental Method to Thermally Deembed Pads
 

Summary: 2540 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 53, NO. 10, OCTOBER 2006
Experimental Method to Thermally Deembed Pads
From RTH Measurements
James Chingwei Li, Member, IEEE, Donald A. Hitko, Member, IEEE, Marko Sokolich, Senior Member, IEEE,
and Peter M. Asbeck, Fellow, IEEE
Abstract--Both compound semiconductor and silicon-based
bipolar junction transistors or heterojunction bipolar transistors
(HBTs) require the efficient removal of heat in order to achieve a
maximum level of performance and reliability. In order to satisfy
both of these criteria, the electrothermal behavior of each device
must be captured in a compact model. The model parameter
that determines the junction temperature is RTH, the thermal
resistance. Experimental methods to determine RTH often require
a relatively small device with a large RTH to be attached to a set
of relatively large metal pads with a low RTH. The pads act as a
thermal shunt to the substrate and artificially lower the measured
RTH. In order to obtain a suitable RTH value for a device located
in an IC, the pads must be deembedded from the measured data,
much like pad deembedding for an S-parameter measurement.
Test structures with various width metal traces between the emit-

  

Source: Asbeck, Peter M. - Department of Electrical and Computer Engineering, University of California at San Diego

 

Collections: Engineering