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file:///C:/Documents%20and%20Settings/anderk5/My%20Documents/M... 1 of 2 7/31/2007 12:15 PM

Summary: file:///C:/Documents%20and%20Settings/anderk5/My%20Documents/M...
1 of 2 7/31/2007 12:15 PM
20th Reliability, Stress Analysis, and Failure Prevention Conference
( Call for Papers pdf)
The 20th Reliability, Stress Analysis, and Failure Prevention Conference (RSAFP), will be
held at the San Diego Convention Center, in San Diego, California, from August
30-September 2, 2009. ASME/IEEE MESA09 is an integral part of the 2009 ASME
International Design Engineering Technical Conferences and Computers and Information
in Engineering Conferences (2007 IDETC/CIE). This event is the theme of the odd-year
IDETC and is a premier meeting in the fields of reliability, stress analysis, and failure
prevention. This year's RSAFP Conference is expected to have tracks covering
considerations in design process; computer-based (numerical/FEA, etc.) analyses for
RSAFP; material considerations for RSAFP (with possible sessions on nanocomposites,
polymer-based designs, composites, polymer processing, and functional materials); safety
in design, RSAFP issues in adhesive joints, bolted connections and threaded joints, stress
analysis; failure analysis and modeling; and RSAFP issues in microelectromechanical and
nanoelectromechanical Systems.


Source: Anderson, Kurt S. - Department of Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute


Collections: Computer Technologies and Information Sciences