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file:///C:/Documents%20and%20Settings/anderk5/My%20Documents/M... 1 of 2 7/31/2007 12:15 PM
 

Summary: file:///C:/Documents%20and%20Settings/anderk5/My%20Documents/M...
1 of 2 7/31/2007 12:15 PM
20th Reliability, Stress Analysis, and Failure Prevention Conference
(RSAFP)
( Call for Papers pdf)
Description
The 20th Reliability, Stress Analysis, and Failure Prevention Conference (RSAFP), will be
held at the San Diego Convention Center, in San Diego, California, from August
30-September 2, 2009. ASME/IEEE MESA09 is an integral part of the 2009 ASME
International Design Engineering Technical Conferences and Computers and Information
in Engineering Conferences (2007 IDETC/CIE). This event is the theme of the odd-year
IDETC and is a premier meeting in the fields of reliability, stress analysis, and failure
prevention. This year's RSAFP Conference is expected to have tracks covering
considerations in design process; computer-based (numerical/FEA, etc.) analyses for
RSAFP; material considerations for RSAFP (with possible sessions on nanocomposites,
polymer-based designs, composites, polymer processing, and functional materials); safety
in design, RSAFP issues in adhesive joints, bolted connections and threaded joints, stress
analysis; failure analysis and modeling; and RSAFP issues in microelectromechanical and
nanoelectromechanical Systems.
Objectives

  

Source: Anderson, Kurt S. - Department of Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute

 

Collections: Computer Technologies and Information Sciences