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A modular process for integrating thick polysilicon MEMS devices with sub-micron CMOS
 

Summary: A modular process for integrating thick polysilicon MEMS devices
with sub-micron CMOS
John Yasaitisa
, Michael Judya
, Tim Brosnihana
, Peter Garonea
, Nikolay Pokrovskiya
,
Debbie Snidermana
, Scott Limbb
,
Roger Howec
, Bernhard Boserc
, Moorthi Palaniapanc
, Xuesong Jiangc
, Sunil Bhavec
a
Analog Devices, 21 Osborn St, Cambridge, MA 02139
b
Palo Alto Research Center, 3333 Coyote Hill Rd, Palo Alto CA 94304

  

Source: Afshari, Ehsan - School of Electrical and Computer Engineering, Cornell University

 

Collections: Engineering