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INSTITUTE OF PHYSICS PUBLISHING JOURNAL OF MICROMECHANICS AND MICROENGINEERING J. Micromech. Microeng. 16 (2006) 17051719 doi:10.1088/0960-1317/16/8/036
 

Summary: INSTITUTE OF PHYSICS PUBLISHING JOURNAL OF MICROMECHANICS AND MICROENGINEERING
J. Micromech. Microeng. 16 (2006) 17051719 doi:10.1088/0960-1317/16/8/036
Coupling of hierarchical fluid models with
electrostatic and mechanical models for
the dynamic analysis of MEMS
Sudipto K De and N R Aluru
Department of Mechanical Science and Engineering, Beckman Institute for Advanced
Science and Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews
Avenue, Urbana, IL 61801, USA
E-mail: aluru@uiuc.edu
Received 11 January 2006, in final form 12 June 2006
Published 18 July 2006
Online at stacks.iop.org/JMM/16/1705
Abstract
The dynamical behavior of MEMS (micro-electro-mechanical systems) is
often strongly affected by viscous fluid/air damping effects from the
surrounding. These fluid/air damping effects have to be carefully taken into
account during the design and optimization process, in order to get a
realistic and reliable description of the device operation. In this paper, two
hierarchical fluid models (the 2D compressible Reynold's squeeze film

  

Source: Aluru, Narayana R. - Department of Mechanical and Industrial Engineering, University of Illinois at Urbana-Champaign

 

Collections: Engineering; Materials Science