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Summary: 1418 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 17, NO. 6, DECEMBER 2008
A Compact Angular Rate Sensor System Using a
Fully Decoupled Silicon-on-Glass MEMS Gyroscope
Said Emre Alper, Yuksel Temiz, and Tayfun Akin, Member, IEEE
Abstract--This paper presents the development of a compact
single-axis angular rate sensor system employing a 100-m-thick
single-crystal silicon microelectromechanical systems gyroscope
with an improved decoupling arrangement between the drive
and sense modes. The improved decoupling arrangement of the
gyroscope enhances the robustness of sensing frame against drive
mode oscillations and therefore minimizes mechanical crosstalk
between the drive and sense modes, yielding a small bias instabil-
ity. The gyroscope core element is fabricated by through-etching
a 100-m-thick silicon substrate which is anodically bonded to
a recessed glass handling substrate. A patterned metal layer is
included at the bottom of the silicon substrate, both as an etch-stop
layer and a heat sink to prevent heating- and notching-based
structural deformations encountered in deep dry etching in the
silicon-on-glass process. The fabricated-gyroscope core element
has capacitive actuation/sensing gaps of about 5 m yielding
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