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Integration of one-dimensional nanostructures with microsystems: an overview
 

Summary: Integration of one-dimensional nanostructures
with microsystems: an overview
B. Erdem Alaca*
The current state of solutions provided for the issue of integration between micro- and nanoscales
is reviewed for the specific case of nanowires and nanotubes. Such structures serve as field
emitters, transistors or laser sources, digits for manipulation and handling, as sensing elements or
as agents for the modification of surface properties such as the adhesive strength. However, it is
noteworthy that the majority of reported device work remains confined to component level
prototype development without the prospect of full scale system integration due to the lack of
batch compatible fabrication and processing techniques. On the one hand, nanostructures made
by self-assembly do not possess a high level of control on their orientation and numbers, and
hence, their interfacing and integration with a microsystem pose difficulties. On the other hand,
top-down approaches such as manipulation, serial deposition and high resolution lithographic
techniques do not satisfy the needs of large scale fabrication due to their expensive and/or non-
parallel working principles. These techniques along with hybrid approaches taking advantage of
the structural control of self-assembly and geometric control of high resolution lithography will be
discussed and major applications will be highlighted to shed light on the capabilities and
limitations associated with each process.
Keywords: Nanowires, Carbon nanotubes, Self-assembly, Top-down fabrication, Lithography, Batch compatibility, Microsystems, Review
Introduction

  

Source: Alaca, B. Erdem - Department of Mechanical Engineering, Koc University

 

Collections: Engineering